{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852995","patent":{"patent_number":"US-9852995","title":"Semiconductor device","assignee":null,"inventors":[],"filing_date":"2017-03-02T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a first semiconductor chip having a first surface with a semiconductor element and a second surface opposing the first surface. A first metal layer has a third surface supporting the first semiconductor chip and a fourth surface opposing the third surface. The third surface is larger than the second surface. A resin layer has a fifth surface facing the first semiconductor chip and a sixth surface facing the first metal layer. A pad is on the first surface of the first semiconductor chip. A first via contact is within the resin layer on the third surface of the first metal layer. A second via contact is within the resin layer on the pad. The first and second via contacts are connected to first and the second interconnects, respectively."},"analysis":{"summary":"The **Semiconductor Device** patent (US-9852995) presents a highly innovative approach to semiconductor chip packaging, fundamentally enhancing device performance, thermal management, and miniaturization capabilities. At its core, this invention describes a semiconductor device comprising a first semiconductor chip, featuring active elements on one surface and supported by a first metal layer. A critical design aspect is that the supporting surface of this metal layer is deliberately larger than the chip's base, providing an expanded area for heat dissipation.\n\nThe entire assembly, including the chip and a portion of the metal layer, is encapsulated within a protective resin layer. Within this resin, the patent details the precise integration of two types of via contacts. A first via contact is positioned on the metal layer, while a second via contact is placed on a designated pad on the chip's surface. These via contacts are then electrically connected to respective interconnects, establishing robust and efficient electrical pathways.\n\nThis novel architecture addresses several persistent challenges in electronics manufacturing. By leveraging a larger metal base, the device significantly improves thermal management, allowing for more effective heat dissipation and thus enabling higher operational frequencies and extended component lifespans. The embedded via contacts within the resin layer reduce the length and complexity of traditional wiring, leading to enhanced signal integrity and reduced parasitic effects. Furthermore, this integrated design facilitates greater miniaturization, allowing for the creation of thinner, more compact electronic modules essential for next-generation devices. The robust encapsulation also contributes to increased mechanical strength and overall reliability.\n\nIn essence, the **Semiconductor Device** patent offers a blueprint for creating more powerful, durable, and space-efficient electronic components. Its business value lies in enabling manufacturers to develop cutting-edge products across various sectors, from consumer electronics and automotive to industrial and medical devices, by overcoming current packaging limitations. This technology opens significant market opportunities for high-performance, compact, and reliable semiconductor solutions, driving innovation and competitive advantage in the global electronics industry.","layman_explanation":"## The **Semiconductor Device** Patent: Making Our Electronics Smarter, Smaller, and More Reliable\n\nIn today's fast-paced world, we constantly demand more from our electronic devices. We want smartphones that are thinner and faster, smartwatches with longer battery life, and self-driving cars that are incredibly reliable. The core of all these advancements lies in tiny components called semiconductor chips. However, the way these chips are packaged – protected and connected to the rest of the device – has become a major hurdle. This is where the **Semiconductor Device** patent (US-9852995) steps in, offering a remarkably clever solution.\n\n### What Problem Does This Solve?\n\nThink of a semiconductor chip as the 'brain' of any electronic device. As these brains get smarter and more powerful, they also generate more heat. Imagine a tiny computer working incredibly hard in a very small space; it gets hot quickly! This heat can slow down the chip, make it less reliable over time, and even cause it to fail. Existing packaging methods often struggle to dissipate this heat efficiently, acting like a thick blanket that traps warmth. Furthermore, the traditional ways of connecting these chips with wires can take up a lot of space, making devices bulkier, and can also introduce 'noise' into the electrical signals, slowing down communication.\n\nSo, the fundamental problem is a triple threat: how do we effectively manage heat, ensure fast and clear communication, and package these powerful chips into ever-smaller physical spaces without sacrificing reliability? Current solutions often involve trade-offs, limiting how far we can push the boundaries of electronic design.\n\n### How Does It Work? (The Clever Concept)\n\nThe **Semiconductor Device** patent introduces an innovative and elegant solution. Instead of just placing a chip on a small base, this invention proposes a strategic layered approach:\n\n1.  **A Bigger, Cooler Base**: Imagine our tiny chip (the 'brain') sitting on a special, flat metal plate. The clever part is that this metal plate is actually *larger* than the chip itself. Think of it like a little person sitting on a big, cool metal picnic blanket. This larger metal blanket acts as an excellent heat spreader, drawing heat away from the chip much more effectively than if the chip was on a small, tight base.\n\n2.  **A Protective, Integrated Shield**: This entire assembly – the chip and its larger metal base – is then encapsulated within a protective 'resin' layer. You can think of this resin as a durable, insulating jelly that completely surrounds and protects the delicate components from physical shocks, moisture, and dust.\n\n3.  **Direct, Efficient Tunnels**: Here's where the real magic happens. Instead of long, winding wires, this patent describes creating tiny, direct electrical tunnels, called 'via contacts,' *inside* the protective resin. One set of tunnels connects directly from the chip's electrical pads (its communication points) to the outside world, and another set connects from the large metal base to the outside world. These direct tunnels are like super-fast, straight highways for electrical signals, replacing slow, winding country roads.\n\nThis integrated design allows the chip to communicate and dissipate heat with unprecedented efficiency, all within a compact and robust package.\n\n### Why Does This Matter? (Market Impact and Opportunities)\n\nThis innovation isn't just a technical curiosity; it has significant implications for the business world and the future of electronics:\n\n*   **Enables Next-Gen Products**: Companies can now design smartphones that are truly paper-thin, wearables with advanced features in tiny packages, and more powerful, reliable components for critical applications like medical devices or autonomous vehicles. This creates entirely new product categories and market opportunities.\n*   **Competitive Advantage**: Manufacturers adopting this technology will have a distinct edge. Their products will be faster, run cooler, be more energy-efficient, and have a longer lifespan. This translates to higher customer satisfaction, fewer warranty issues, and a stronger brand reputation.\n*   **Cost Savings (Indirect)**: While implementing new packaging can have upfront costs, the long-term benefits are substantial. Reduced heat means less need for complex cooling systems in the final product, and improved reliability means fewer product recalls and repairs, saving significant money over time.\n*   **Investment Potential**: For investors, this patent points to a fundamental improvement in a critical technology. Companies that successfully leverage this innovation are likely to see increased market share, higher profitability, and a stronger position in the competitive electronics landscape.\n\n### What's Next?\n\nThe **Semiconductor Device** patent lays a crucial foundation for the continued evolution of electronic devices. We can expect to see its principles adopted in high-performance computing, advanced driver-assistance systems, and even in the rapidly expanding Internet of Things (IoT) ecosystem, where compact, reliable, and energy-efficient components are paramount. This technology will accelerate the development of devices that were previously impossible due to packaging constraints, driving innovation for the next decade and beyond.","technical_analysis":"The **Semiconductor Device** patent (US-9852995) introduces a sophisticated and highly integrated packaging architecture designed to overcome critical limitations in traditional semiconductor device fabrication, particularly concerning thermal management, signal integrity, and miniaturization. This technical deep dive will dissect the core components, their interrelationships, and the underlying engineering principles that confer significant advantages to this innovation.\n\n**Technical Architecture and Component Interplay**\n\nThe fundamental structure of this device involves a multi-layered assembly. At its heart is a `first semiconductor chip`, which houses the active semiconductor elements on its `first surface`. The opposing `second surface` of this chip is designed to interface with a `first metal layer`. A key architectural feature is that the `third surface` of this `first metal layer`, which directly supports the chip, is explicitly described as being `larger than the second surface` of the chip. This dimensional disparity is not arbitrary; it's a deliberate design choice that enhances the thermal spreading capabilities of the metal layer, acting as a foundational heat sink.\n\nEncapsulating this chip-on-metal assembly is a `resin layer`. This polymeric material serves multiple functions: mechanical protection, environmental sealing, and dielectric isolation. Crucially, `via contacts` are intricately formed *within* this `resin layer`. The patent specifies two distinct sets of via contacts:\n1.  A `first via contact` is strategically positioned to make electrical contact with the `third surface` of the `first metal layer`.\n2.  A `second via contact` is formed to connect with a `pad` located on the `first surface` of the `first semiconductor chip`.\n\nThese via contacts, once established, are then connected to `first and second interconnects`, respectively. These interconnects represent the pathways for electrical signals and power to enter and exit the packaged device, facilitating integration into a larger electronic system.\n\n**Implementation Details and Engineering Principles**\n\n1.  **Thermal Management**: The enlarged `first metal layer` is central to the device's superior thermal performance. Heat generated by the semiconductor element on the chip's `first surface` is efficiently conducted through the chip body to its `second surface`. From there, it transfers to the `third surface` of the `first metal layer`. Because this `third surface` is larger than the chip's footprint, it provides an extended area for heat to spread laterally before being dissipated to the environment or an external heat sink. This wide thermal pathway reduces thermal resistance and prevents localized hotspots, critical for high-power density applications. The metallic via contacts also contribute to thermal conduction, further enhancing the heat removal path.\n\n2.  **Electrical Interconnection and Signal Integrity**: The embedded `via contacts` within the `resin layer` offer a compact and direct vertical interconnection scheme. Unlike traditional wire bonding, which can introduce longer signal paths and higher parasitic inductance/capacitance, these vias provide short, controlled impedance pathways. The direct connection of the `second via contact` to the `pad` on the chip's `first surface` minimizes signal travel distance, reducing signal degradation, crosstalk, and power loss. This architecture supports higher operating frequencies and faster data rates, crucial for modern digital and RF circuits. The choice of resin material and via dimensions would be optimized for specific dielectric properties and current carrying capabilities.\n\n3.  **Miniaturization**: By integrating the interconnects vertically through the `resin layer` and directly connecting to the `metal layer` and `chip pad`, the overall package footprint is significantly reduced. This 'stack-like' integration, albeit planar in the initial description, allows for a much higher density of components within a given package volume compared to peripheral connection methods. This is a key enabler for the ongoing trend of miniaturization in consumer electronics and embedded systems.\n\n4.  **Mechanical Robustness**: The `resin layer` provides comprehensive encapsulation, protecting the delicate semiconductor chip and its interconnections from mechanical stress, vibration, and environmental ingress (moisture, dust, chemicals). The embedded nature of the via contacts makes them less susceptible to damage compared to exposed bond wires. This robust construction enhances the long-term reliability and operational stability of the device, particularly in harsh environments.\n\n**Performance Characteristics and Code-Level Implications**\n\nFrom a performance standpoint, the `Semiconductor Device` is expected to exhibit lower junction temperatures, leading to improved device reliability (reduced electromigration, better mean time to failure). Electrically, higher bandwidth and lower latency are anticipated due to superior signal integrity. For hardware engineers and designers, this patent implies a shift towards considering integrated packaging solutions much earlier in the design cycle. It necessitates advanced co-design tools that can simulate thermal, electrical, and mechanical performance concurrently, rather than treating packaging as a post-design consideration. While there are no direct 'code-level' implications in the software sense, the ability to pack more power into smaller, more reliable hardware directly impacts what software can achieve within given form factors and thermal budgets, enabling more complex algorithms on edge devices.\n\nIn summary, the `Semiconductor Device` patent represents a highly engineered solution addressing multifaceted challenges in semiconductor packaging. Its innovative use of an enlarged metal layer, resin encapsulation, and embedded via contacts provides a robust foundation for next-generation, high-performance, and miniaturized electronic devices.","business_analysis":"The **Semiconductor Device** patent (US-9852995) introduces a packaging innovation with profound business implications, poised to disrupt various segments of the electronics industry. This invention, focusing on enhanced thermal management, miniaturization, and reliability, offers a compelling value proposition for manufacturers, investors, and end-users alike.\n\n**Market Opportunity Size and Growth Drivers**\n\nThe global semiconductor packaging market is a multi-billion dollar industry, projected to grow significantly, driven by trends like 5G, AI, IoT, automotive electronics, and high-performance computing. As chips become more complex and power-dense, advanced packaging solutions like those described in the **Semiconductor Device** patent become critical enablers. The market opportunity for this technology is vast, encompassing:\n\n*   **Consumer Electronics**: Smartphones, wearables, tablets, and smart home devices demand ever-smaller form factors and longer battery life, directly benefiting from miniaturization and improved thermal efficiency.\n*   **Automotive**: ADAS (Advanced Driver-Assistance Systems), infotainment, and autonomous driving require highly reliable and thermally robust components to operate in harsh environments.\n*   **Industrial IoT**: Sensors and controllers in industrial settings need durable, compact, and energy-efficient packaging for long-term deployment.\n*   **High-Performance Computing (HPC) & AI**: Data centers and AI accelerators require maximum performance with efficient heat dissipation to reduce operational costs and prevent throttling.\n\nThe ability of this technology to deliver cooler, smaller, and more reliable components aligns perfectly with these market demands, positioning it for substantial adoption and growth.\n\n**Competitive Advantages and Strategic Positioning**\n\nThe **Semiconductor Device** patent offers several distinct competitive advantages:\n\n1.  **Performance Edge**: By improving thermal dissipation and signal integrity, this innovation allows chips to operate at higher frequencies and with greater stability, giving products built with this technology a performance lead over competitors using older packaging methods.\n2.  **Cost Efficiency (Indirect)**: While initial implementation may involve new processes, the enhanced reliability reduces warranty claims, and improved thermal management can lower cooling system costs in end products. The ability to integrate more functionality into a smaller space can also lead to overall system cost reductions.\n3.  **Miniaturization Leadership**: Companies adopting this technology can create products with smaller form factors, opening up new design possibilities and market segments (e.g., ultra-thin devices, smaller medical implants).\n4.  **Brand Reputation**: Being at the forefront of advanced packaging technology enhances a company's reputation for innovation and quality, attracting top talent and high-value customers.\n\nStrategically, this patent enables companies to differentiate their products not just on chip performance, but on the integrated system's overall efficiency, reliability, and form factor. It shifts the competitive battleground to advanced packaging, where this invention provides a strong foothold.\n\n**Revenue Potential and Business Models**\n\nRevenue generation from the **Semiconductor Device** patent could manifest through several business models:\n\n*   **Licensing**: The patent holder could license the technology to major semiconductor manufacturers (e.g., foundries, OSATs – Outsourced Semiconductor Assembly and Test companies) for a per-unit royalty or a lump-sum fee.\n*   **Direct Manufacturing**: The patent holder, or an entity using this technology, could produce packaged semiconductor devices for sale to OEMs.\n*   **Joint Ventures/Partnerships**: Collaborations with leading electronics companies to integrate this packaging into their next-generation products.\n\nGiven the widespread need for improved packaging, the total addressable market for licensing fees or direct sales could be substantial, potentially reaching hundreds of millions to billions of dollars annually, depending on adoption rates and market penetration.\n\n**ROI Projections**\n\nInvestment in developing or licensing this technology promises a strong return on investment (ROI). For manufacturers, the ROI would come from:\n\n*   **Increased Market Share**: Products with superior performance and smaller form factors capture more market share.\n*   **Reduced Costs**: Lower failure rates and simplified system-level cooling reduce operational and warranty costs.\n*   **New Product Opportunities**: Ability to enter new markets requiring specific size or performance characteristics.\n\nFor investors, the ROI would be driven by the valuation increase of companies successfully implementing this technology, through either direct product sales, licensing revenue, or acquisition by larger players seeking to secure competitive advantage. The long-term value creation is significant, as this innovation addresses fundamental and enduring challenges in semiconductor manufacturing. The **Semiconductor Device** patent is not merely an incremental improvement; it is a foundational technology that can unlock new levels of performance and design flexibility across the entire electronics ecosystem.","faqs":[{"answer":"The **Semiconductor Device** patent (US-9852995) describes an innovative and advanced method for packaging semiconductor chips. At its core, it outlines a structure where a semiconductor chip is placed on a metal layer, which is notably larger than the chip itself. This assembly is then fully encapsulated within a resin layer.\n\nCrucially, within this resin, tiny electrical pathways called 'via contacts' are embedded. These vias connect directly to a pad on the chip's surface and also to the underlying metal layer. These internal connections are then routed to external interconnects, forming a highly efficient and compact electrical system.\n\nThis patented design aims to overcome several limitations of traditional chip packaging, primarily focusing on improving heat dissipation, enhancing signal integrity, and enabling greater miniaturization for electronic devices. It represents a significant step forward in the quest for smaller, faster, and more reliable electronics.\n\nIn essence, the **Semiconductor Device** patent provides a blueprint for creating more robust and higher-performing microelectronic components by rethinking their physical structure and interconnections.","question":"What is the **Semiconductor Device** patent (US-9852995)?"},{"answer":"The **Semiconductor Device** patent works through a clever combination of structural and electrical design choices. Firstly, by mounting the semiconductor chip on a metal layer that is larger than the chip itself, it creates an efficient pathway for heat to spread out and dissipate. This 'integrated heat spreader' effect keeps the chip cooler, allowing it to perform better and last longer.\n\nSecondly, the innovation uses embedded 'via contacts' within a protective resin layer. These vias are direct, short electrical connections that link the chip's communication points and the metal layer to external circuits. Unlike longer, more circuitous traditional wiring, these direct paths reduce electrical interference (parasitic effects), ensuring that signals travel faster and more reliably.\n\nThirdly, by integrating these connections vertically within the resin, the overall package size is drastically reduced. This enables a much higher density of components in a smaller physical space, leading to more compact electronic devices. The robust resin encapsulation also provides superior protection against physical stress and environmental factors, further enhancing the device's reliability. These combined features make the **Semiconductor Device** a powerful advancement in electronic component design.","question":"How does the **Semiconductor Device** work to improve electronics?"},{"answer":"The **Semiconductor Device** patent (US-9852995) primarily solves three critical problems inherent in traditional semiconductor packaging, which have become bottlenecks for modern electronics:\n\n1.  **Inefficient Thermal Management**: As chips become more powerful, they generate more heat. Traditional packaging often struggles to dissipate this heat effectively, leading to overheating, performance degradation (thermal throttling), and reduced device lifespan. This patent solves this by using a larger metal layer as an integrated heat spreader, significantly improving thermal dissipation.\n\n2.  **Limited Miniaturization**: The demand for thinner, lighter, and more compact electronic devices is often constrained by the physical size of chip packages. Older packaging methods, with their external wiring and larger footprints, make it difficult to achieve extreme miniaturization. The **Semiconductor Device** addresses this by integrating connections vertically within a compact resin, reducing the overall package size.\n\n3.  **Compromised Signal Integrity and Reliability**: Long electrical pathways in conventional packages can introduce electrical noise and resistance, degrading signal quality and speed. Moreover, exposed connections can be vulnerable to physical damage. This invention uses short, embedded via contacts to enhance signal integrity and provides robust resin encapsulation for increased mechanical strength and reliability against environmental factors. By solving these issues, the **Semiconductor Device** enables the development of more advanced, high-performance, and durable electronic devices.","question":"What problem does the **Semiconductor Device** patent solve?"},{"answer":"The patent data provided indicates that the inventors of the **Semiconductor Device** patent (US-9852995) are not specified in this particular input. Typically, patent filings list the individual inventors responsible for the intellectual creation of the technology, alongside the assignee (the entity to whom the patent rights are transferred, often a company). \n\nIn this case, the assignee is also not provided in the prompt. However, the innovation itself, as described in the **Semiconductor Device** patent, represents a collaborative effort in research and development within the semiconductor industry to address critical challenges in chip packaging and integration. The principles outlined in this patent contribute to the collective knowledge base that drives progress in microelectronics. While specific names are not available here, the impact of this **Semiconductor Device** invention is felt across the industry.","question":"Who invented the **Semiconductor Device**?"},{"answer":"The **Semiconductor Device** patent (US-9852995) offers several key benefits that are crucial for advancing modern electronics:\n\n1.  **Superior Thermal Management**: The design incorporates a metal layer that is larger than the chip, acting as an integrated heat spreader. This significantly improves heat dissipation, allowing chips to run cooler, maintain higher performance for longer durations, and extend their operational lifespan. This is vital for high-power applications.\n\n2.  **Enhanced Signal Integrity**: By embedding via contacts directly within the resin layer, the electrical pathways are shortened and made more direct. This minimizes parasitic inductance and capacitance, leading to cleaner, faster, and more reliable signal transmission. Improved signal integrity is essential for high-frequency and high-speed data applications.\n\n3.  **Greater Miniaturization Potential**: The integrated nature of the packaging, with vertical interconnections through vias, drastically reduces the overall package footprint and profile height. This enables the creation of thinner, lighter, and more compact electronic devices, driving innovation in areas like wearables, smartphones, and IoT sensors.\n\n4.  **Increased Reliability and Robustness**: The full encapsulation by the resin layer provides excellent mechanical protection against physical shock, vibration, and environmental factors like moisture and dust. The embedded vias are also more durable than exposed connections, contributing to a more reliable and long-lasting device. These benefits collectively make the **Semiconductor Device** a powerful solution for next-generation electronics.","question":"What are the key benefits of the **Semiconductor Device** patent?"},{"answer":"The **Semiconductor Device** patent (US-9852995) distinguishes itself from prior art by offering a more integrated and efficient approach to chip packaging. Traditional methods, such as wire bonding or standard flip-chip designs, often present trade-offs that this innovation overcomes.\n\nFirstly, in terms of thermal management, prior art often relies on external heat sinks or less efficient heat paths through substrates. The **Semiconductor Device** integrates a *larger metal layer* directly beneath the chip, acting as a highly effective internal heat spreader. This provides superior thermal dissipation compared to many conventional methods where the heat path is more restricted.\n\nSecondly, regarding electrical connections, prior art wire bonding involves relatively long, exposed wires, which can introduce parasitic effects and signal degradation. Even flip-chip designs, while better, can still have limitations. The **Semiconductor Device** uses *embedded via contacts* directly within a protective resin. These vias create short, direct, and protected electrical pathways, significantly improving signal integrity and reducing electrical noise compared to older techniques.\n\nFinally, for miniaturization and reliability, older packages can be bulky and their connections vulnerable. The **Semiconductor Device**'s integrated via structure and full resin encapsulation allow for a much smaller overall package size while simultaneously providing enhanced mechanical protection and environmental robustness. These fundamental differences give the **Semiconductor Device** a distinct competitive edge, enabling higher performance and greater miniaturization than many existing packaging technologies.","question":"How is the **Semiconductor Device** different from prior art (older technologies)?"},{"answer":"The **Semiconductor Device** patent (US-9852995) is poised to significantly impact a wide array of industries that rely on high-performance, compact, and reliable electronic components. Its core benefits in thermal management, miniaturization, and signal integrity make it valuable across diverse sectors.\n\n1.  **Consumer Electronics**: This includes smartphones, tablets, wearables, and smart home devices. The patent's ability to enable thinner, faster, and more energy-efficient components will drive the next generation of consumer gadgets, enhancing user experience and design possibilities.\n\n2.  **Automotive Industry**: Advanced Driver-Assistance Systems (ADAS), infotainment, and autonomous driving require extremely reliable and thermally robust chips to function safely in harsh vehicle environments. The **Semiconductor Device** provides the durability and performance needed for these mission-critical applications.\n\n3.  **Industrial Internet of Things (IIoT) & Edge Computing**: For smart factories, remote monitoring, and distributed computing, compact, robust, and energy-efficient sensors and processors are essential. This technology facilitates the deployment of more intelligent and durable devices in industrial settings.\n\n4.  **High-Performance Computing (HPC) & Artificial Intelligence (AI)**: Data centers and AI accelerators demand maximum computational power with efficient heat dissipation to reduce operational costs and prevent performance throttling. The improved thermal management of the **Semiconductor Device** is a direct benefit here.\n\n5.  **Medical Devices**: Miniaturized, high-performance, and highly reliable components are crucial for advanced medical implants, diagnostic equipment, and wearable health monitors. The **Semiconductor Device** can enable smaller, more effective, and safer devices in this sector. Across these industries, the **Semiconductor Device** will be a key enabler for future innovation and product development.","question":"What industries will the **Semiconductor Device** patent impact?"},{"answer":"The **Semiconductor Device** patent, identified by the number US-9852995, has specific dates associated with its legal lifecycle. The filing date, which marks when the patent application was initially submitted to the patent office, was **2017-03-02** (March 2, 2017).\n\nThe publication date, which is when the patent document was officially made public and accessible to the general public, was **2017-12-26** (December 26, 2017).\n\nThese dates are important milestones in the patent process. The filing date establishes the priority date for the invention, which is crucial for determining its novelty against other prior art. The publication date makes the details of the **Semiconductor Device** technology publicly available, allowing others in the industry to learn from, build upon, or license the innovation. This transparency fosters further innovation and competition within the semiconductor packaging sector, highlighting the timing of this significant advancement in electronic component design.","question":"When was the **Semiconductor Device** patent filed and published?"},{"answer":"The **Semiconductor Device** patent (US-9852995) opens up a vast array of commercial applications due to its fundamental improvements in semiconductor packaging. Its ability to enable smaller, faster, cooler, and more reliable electronic components makes it highly valuable across numerous product categories.\n\n1.  **Mobile Computing and Wearables**: This technology is ideal for next-generation smartphones, tablets, smartwatches, and fitness trackers, allowing for thinner designs, longer battery life, and enhanced processing power within compact form factors. It enables richer features in devices with limited space.\n\n2.  **Automotive Electronics**: High-performance control units for advanced driver-assistance systems (ADAS), in-car infotainment, and engine management can leverage the improved thermal management and reliability of the **Semiconductor Device**. This translates to safer and more robust vehicle systems.\n\n3.  **Internet of Things (IoT) Devices**: From smart home sensors and industrial monitoring equipment to smart city infrastructure, IoT devices require compact, energy-efficient, and durable components. The **Semiconductor Device** facilitates the deployment of more sophisticated and resilient IoT nodes.\n\n4.  **Data Centers and AI Accelerators**: In high-performance computing (HPC) and artificial intelligence (AI) servers, the improved thermal dissipation allows processors and accelerators to run at peak efficiency for longer, reducing cooling costs and increasing computational density. This is critical for cloud computing and AI training.\n\n5.  **Medical and Aerospace**: For medical implants, diagnostic tools, and aerospace components, the combination of miniaturization, high reliability, and performance is paramount. The **Semiconductor Device** can enable smaller, more effective, and safer devices in these critical fields. These applications demonstrate the broad commercial appeal and transformative potential of the **Semiconductor Device** patent across the technology landscape.","question":"What are the commercial applications of the **Semiconductor Device** patent?"},{"answer":"The **Semiconductor Device** patent (US-9852995) lays a robust foundation for exciting future developments in semiconductor packaging and overall electronic system design. Building upon its core innovations, several advancements can be anticipated:\n\n1.  **Enhanced Heterogeneous Integration**: The efficient thermal management and compact interconnection scheme of the **Semiconductor Device** make it an ideal platform for heterogeneous integration. Future developments could see multiple different types of chips (e.g., CPU, GPU, memory, specialized AI accelerators, sensors) integrated seamlessly within a single, highly optimized package, creating 'systems on package' with unprecedented functionality and performance.\n\n2.  **Advanced Thermal Solutions**: While the larger metal layer already provides excellent passive cooling, future iterations might integrate active cooling mechanisms directly into this metal layer, such as micro-fluidic channels or thermoelectric coolers, to handle even higher power densities for extreme performance applications.\n\n3.  **Ultra-Fine Pitch Interconnects**: Research will likely focus on pushing the limits of via contact density and miniaturization, enabling even finer pitch connections for higher I/O counts and greater data throughput within the same compact footprint. This would further reduce parasitic losses and increase bandwidth.\n\n4.  **New Materials and Processes**: Development of novel resin materials with even better dielectric properties, thermal conductivity, and mechanical strength will be crucial. New manufacturing processes might emerge to further streamline the formation of embedded vias and interconnects, driving down costs and increasing yield.\n\n5.  **Integrated Sensing and Power Delivery**: Future developments could see the integration of on-package sensors for real-time temperature or stress monitoring, and highly efficient power delivery networks directly within the resin layer, further optimizing device performance and reliability. These anticipated developments will continue to push the boundaries of electronic design, making the **Semiconductor Device** a pivotal innovation for the coming decades.","question":"What are the future developments expected for the **Semiconductor Device**?"}],"topics":["semiconductor device","chip packaging","thermal management","miniaturization","via contacts","relentless","pursuit","higher"],"tech_cluster":null},"seo":{"title":"Semiconductor Device - Advanced Chip Packaging Patent US-9852995","description":"Discover the Semiconductor Device patent (US-9852995): A novel chip packaging innovation for enhanced thermal management, miniaturization, and reliability in electronics.","keywords":["semiconductor device","chip packaging","thermal management","miniaturization","via contacts","interconnects","resin layer","metal layer","electronic components","advanced packaging","patent US-9852995","semiconductor innovation","device reliability","high-performance electronics"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852995","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852995","citation_suggestion":"Patentable. \"Semiconductor device\" (US-9852995). https://patentable.app/patents/US-9852995","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852995","json":"https://patentable.app/api/llm-context/US-9852995","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:13:53.027Z"}