{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852996","patent":{"patent_number":"US-9852996","title":"Substrate and method for labeling signal lines thereof","assignee":null,"inventors":[],"filing_date":"2014-05-27T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A substrate is disclosed. The substrate includes a transparent underlayer, a plurality of signal lines on the transparent underlayer, and a plurality of labels on the transparent underlayer. The plurality of labels respectively correspond to the plurality of signal lines in a one-to-one relationship and are configured to identify the corresponding signal lines, and one of at least two adjacent labels is a forward pattern label, and another one of the at least two adjacent labels is a reverse pattern label."},"analysis":{"summary":"The patent \"Substrate and Method for Labeling Signal Lines Thereof\" (US-9852996) introduces a groundbreaking method for unambiguously identifying individual signal lines on electronic substrates, a critical challenge in high-density electronics manufacturing. The core innovation lies in a substrate comprising a transparent underlayer, a plurality of signal lines disposed on this underlayer, and a corresponding plurality of labels. These labels are uniquely configured such that any two adjacent labels alternate between a 'forward pattern' and a 'reverse pattern'. This ingenious arrangement provides a clear, machine-readable distinction for each signal line.\n\nThe primary problem this invention solves is the pervasive issue of misidentification in densely packed electronic components. As devices shrink, signal lines become microscopically thin and closely spaced, making traditional alphanumeric labels prone to error, especially during automated optical inspection (AOI) or manual assembly. This often leads to costly rework, manufacturing delays, and compromised product quality.\n\nTechnically, the patent's approach leverages pattern recognition over simple visual distinction. By using directionally asymmetric patterns (forward vs. reverse), the system creates a robust, self-validating identification mechanism. Automated systems can quickly and reliably differentiate between adjacent lines, significantly improving throughput and accuracy. The transparent underlayer ensures the labels do not interfere with the signal lines' electrical properties or visual integrity.\n\nCommercially, this technology offers substantial business value. Manufacturers can expect a dramatic reduction in misidentification errors, leading to lower rework costs and higher production yields. The enhanced efficiency of AOI systems translates to faster manufacturing cycles and quicker time-to-market. This innovation is particularly valuable for industries requiring extreme precision, such as medical devices, aerospace, automotive electronics, and advanced consumer electronics. It provides a competitive advantage by enabling superior quality control and operational efficiency.\n\nThe market opportunity for this technology is vast, spanning across the entire electronics manufacturing ecosystem. As miniaturization continues, the demand for such precise and reliable identification solutions will only grow, positioning this patent as a foundational technology for the next generation of electronic component fabrication.","layman_explanation":"In the world of electronics, everything is getting smaller and more complex. Think about the tiny circuits inside your smartphone or a medical device. These devices rely on countless microscopic 'signal lines' – essentially tiny wires – that carry information. The challenge for manufacturers is that these lines are packed so tightly together that it becomes incredibly difficult to tell them apart, especially during assembly or quality checks.\n\n**What Problem Does This Solve?**\n\nImagine trying to connect hundreds of tiny wires, all looking almost identical, without a clear way to distinguish them. This is the core problem the patent \"Substrate and Method for Labeling Signal Lines Thereof\" addresses. In traditional manufacturing, labels on these tiny lines might be simple numbers or letters, which are prone to being misread, smudged, or simply too small to see clearly without intense magnification. This leads to a significant business problem: misidentification. A single misidentified line can result in a defective product, requiring expensive rework, slowing down production, and potentially damaging a company's reputation. Existing solutions, often relying on more powerful microscopes or slower manual checks, simply aren't keeping pace with the demand for miniaturization and speed in modern manufacturing.\n\n**How Does It Work?**\n\nThis invention introduces a remarkably clever solution. It starts with a transparent base layer, like a clear sheet of plastic, upon which all the signal lines are laid out. What makes this patent unique is the labeling system. Instead of generic labels, each signal line gets a special identifier. The genius lies in the pattern: for any two lines right next to each other, one label will have a 'forward' pattern (think of it like an arrow pointing right ➡️) and the other will have a 'reverse' pattern (like an arrow pointing left ⬅️). So, as you go across the lines, you'd see a pattern like: forward, reverse, forward, reverse.\n\nThis alternating directional pattern creates an unmistakable signature for each line. It’s like giving every street on a busy map a unique, directional symbol instead of just a number. This makes it incredibly easy for both human operators and, more importantly, automated inspection machines (like smart cameras) to instantly and accurately identify which signal line is which. The transparent base ensures these labels don't interfere with the electrical function of the lines or obscure their view.\n\n**Why Does This Matter?**\n\nThe business implications are substantial. For companies, this patent means a dramatic reduction in manufacturing errors. Fewer errors translate directly into lower rework costs, faster production cycles, and higher yields (meaning more good products per batch). This enhanced efficiency and reliability provide a significant competitive advantage. In industries where precision is paramount – such as medical devices (pacemakers, diagnostic equipment), aerospace (avionics), or high-performance computing – the ability to guarantee accurate signal line identification can be the difference between success and failure. It allows businesses to produce more reliable products faster, leading to stronger market positioning and increased profitability.\n\n**What's Next?**\n\nThis technology isn't just a fix for current problems; it's a foundational step for future innovation. As electronics continue to shrink, the need for such precise identification will only grow. This patent could become an industry standard, enabling the development of even smaller, more powerful, and more reliable devices. Companies investing in or adopting this approach are positioning themselves at the forefront of advanced manufacturing, ready to capitalize on the next wave of electronic miniaturization and automation. It's about building better, faster, and more reliably, driving both technological progress and significant return on investment.","technical_analysis":"The patent \"Substrate and Method for Labeling Signal Lines Thereof\" (US-9852996) presents an elegant solution to a pervasive problem in high-density electronics: the unambiguous identification of individual signal lines. This technical analysis will dissect the architecture, implementation specifics, and performance implications of this innovative labeling system.\n\n**Technical Architecture:**\nAt its foundation, the invention describes a substrate that serves as the base for electronic components. This substrate incorporates a *transparent underlayer*, which is a crucial element. This transparency ensures that the labels, while present, do not obstruct the underlying signal lines from either an electrical or optical perspective. Disposed on this transparent underlayer are a *plurality of signal lines*, which represent the conductive pathways for electronic signals. Crucially, a *plurality of labels* is also positioned on this same transparent underlayer. These labels are configured in a *one-to-one relationship* with the signal lines, meaning each signal line has a unique, corresponding label. The defining feature, however, is the arrangement of these labels: for *at least two adjacent labels*, one is designated as a 'forward pattern label' and the other as a 'reverse pattern label'. This alternating directional pattern is the core technical innovation.\n\n**Implementation Details:**\n\n1.  **Substrate and Underlayer:** The substrate can be any material suitable for electronic circuits, such as FR-4, polyimide, or glass. The transparent underlayer could be a dielectric film or coating applied during fabrication, ensuring optical clarity for the labels. Its transparency is vital for automated optical inspection (AOI) systems that might need to inspect both the labels and the underlying traces.\n2.  **Signal Line Fabrication:** Standard photolithography and etching processes are used to create the signal lines on the underlayer. These lines can be micro-traces for ICs, pathways on flexible circuits, or traditional PCB traces.\n3.  **Label Generation:** The labels themselves are also fabricated using high-precision techniques, typically photolithography. The 'forward' and 'reverse' patterns must be distinct and asymmetric. Examples could include:\n    *   **Geometric Shapes:** Arrows (e.g., '>>>>>' for forward, '<<<<<' for reverse), chevrons, or asymmetric polygons. The key is a clear directional bias.\n    *   **Optical Features:** Micro-gratings or diffractive elements that produce different optical responses (e.g., light deflection angles) depending on their orientation relative to a light source or sensor.\n    *   **Material Properties:** Labels made with optically anisotropic materials that exhibit different refractive indices or polarization effects based on their orientation.\n4.  **Pattern Sequence:** The strict alternation (e.g., F-R-F-R...) is fundamental. This sequence provides a robust mechanism for self-validation during inspection. Any deviation from this pattern (e.g., F-F-R or R-R-F) immediately flags a potential manufacturing error or misidentification.\n\n**Algorithm Specifics for Identification:**\nAutomated Optical Inspection (AOI) systems would employ advanced computer vision algorithms:\n\n1.  **Image Acquisition:** High-resolution cameras capture images of the labeled substrate.\n2.  **Image Pre-processing:** Standard techniques like noise reduction, contrast enhancement, and morphological operations are applied to improve label visibility.\n3.  **Label Segmentation:** Algorithms (e.g., thresholding, edge detection, contour detection) isolate individual label regions from the background and signal lines.\n4.  **Pattern Classification:** This is the critical step. Machine learning models (e.g., Convolutional Neural Networks, Support Vector Machines) trained on datasets of forward and reverse patterns would classify each segmented label. Alternatively, traditional image processing techniques like moment invariants, shape descriptors, or template matching could be used to determine the orientation and classify the pattern.\n5.  **Sequence Validation:** After classifying each label, the system verifies the alternating sequence (F-R-F-R...). If an anomaly is detected, the specific signal line and the type of error are logged for further action.\n\n**Integration Patterns:**\nThis labeling system integrates seamlessly with existing electronics manufacturing workflows. The label application can be incorporated into existing photolithographic steps. The AOI stage can be modified to include the pattern recognition algorithms. Data outputs from the AOI can be fed into Manufacturing Execution Systems (MES) for traceability, quality control, and process optimization.\n\n**Performance Characteristics:**\n\n*   **Accuracy:** The unambiguous nature of the forward/reverse patterns drastically reduces misidentification rates compared to systems relying on simple, non-directional labels, especially in high-density environments. The self-validating sequence further enhances error detection.\n*   **Speed:** Machine vision systems can process and classify distinct directional patterns more rapidly and reliably than trying to interpret subtle differences in identical patterns or numerical strings, leading to faster inspection cycles.\n*   **Robustness:** The system is inherently more robust against variations in lighting, minor defects, or partial occlusion, as the core directional feature remains discernible.\n*   **Scalability:** The method scales well with increasing signal line density, as the fundamental principle of alternating patterns remains effective regardless of physical size, as long as the patterns are resolvable by the imaging system.\n\nThe Substrate and Method for Labeling Signal Lines Thereof represents a significant technical leap for precision manufacturing. By providing an intrinsically reliable and machine-readable identification system, this innovation is poised to drive higher yields, lower costs, and enable even greater miniaturization in future electronic devices.","business_analysis":"The patent \"Substrate and Method for Labeling Signal Lines Thereof\" (US-9852996) addresses a critical pain point in the electronics manufacturing industry, offering substantial commercial implications for businesses operating in high-precision sectors. This innovation provides a robust solution to signal line identification, a challenge exacerbated by the relentless miniaturization of electronic components.\n\n**Market Opportunity Size:**\nThe global electronics manufacturing services (EMS) market is projected to reach trillions of dollars, with segments like printed circuit boards (PCBs) and advanced packaging being particularly large. Within this vast market, the need for precise component identification and quality control is universal. The Substrate and Method for Labeling Signal Lines Thereof directly impacts the efficiency and reliability of manufacturing processes across this entire ecosystem. Its applicability spans diverse sectors, including consumer electronics, medical devices, automotive, aerospace, and defense, all of which demand exceptionally high levels of accuracy and minimal defect rates. As devices become smaller and more complex, the demand for such an unambiguous labeling solution will only intensify, creating a vast addressable market.\n\n**Competitive Advantages:**\nThis patented technology offers several distinct competitive advantages:\n\n1.  **Superior Accuracy:** By using alternating forward and reverse patterns, the invention provides an inherently more reliable and unambiguous identification method than traditional labels. This drastically reduces misidentification errors, a common source of costly manufacturing defects.\n2.  **Enhanced Automation:** The clear, directional patterns are perfectly suited for automated optical inspection (AOI) systems, enabling faster and more precise machine vision. This allows manufacturers to accelerate inspection cycles and increase throughput.\n3.  **Reduced Costs:** Fewer errors mean less rework, fewer scrapped units, and lower labor costs associated with manual inspection and defect correction. This translates directly into improved profit margins and operational efficiency.\n4.  **Improved Product Quality and Reliability:** By ensuring precise identification throughout the manufacturing process, the technology contributes to higher overall product quality and reliability, reducing warranty claims and enhancing brand reputation.\n5.  **Scalability:** The principle of alternating patterns is highly scalable, accommodating even the most extreme levels of miniaturization without loss of effectiveness, making it future-proof for evolving electronic designs.\n\n**Revenue Potential and Business Models:**\nCompanies can leverage this patent through various business models:\n\n*   **Licensing:** Manufacturers of substrates, PCBs, or specialized labeling equipment could license the technology, integrating it into their product offerings.\n*   **Value-Added Services:** Electronics manufacturing service (EMS) providers could offer 'precision-labeled substrates' as a premium service, differentiating themselves in a competitive market.\n*   **Proprietary Manufacturing:** Companies developing their own advanced electronic products (e.g., medical devices, high-performance computing) could implement this technology in-house to secure a significant competitive edge in quality and cost.\n*   **Equipment Sales:** Developers of AOI systems could integrate the pattern recognition algorithms into their hardware/software solutions, selling specialized equipment for inspecting substrates utilizing this patent.\n\n**Strategic Positioning:**\nAdopting the Substrate and Method for Labeling Signal Lines Thereof allows companies to strategically position themselves as leaders in high-quality, high-precision electronics manufacturing. It moves them beyond simply meeting specifications to exceeding industry benchmarks for reliability and efficiency. For component suppliers, it offers a way to embed superior quality at the foundational level of their products.\n\n**ROI Projections:**\nWhile specific ROI will vary, the potential returns are significant. A conservative estimate might include:\n\n*   **Reduced Rework:** Savings of 10-30% on rework costs for high-density components.\n*   **Increased Throughput:** 15-40% improvement in AOI and assembly line speed.\n*   **Yield Improvement:** A few percentage points increase in overall manufacturing yield, which can translate to millions in savings for high-volume production.\n*   **Enhanced Brand Value:** Intangible benefits from improved product reliability and customer satisfaction, leading to stronger market position and pricing power.\n\nIn conclusion, the Substrate and Method for Labeling Signal Lines Thereof is more than a technical curiosity; it's a powerful commercial tool. It directly addresses fundamental manufacturing inefficiencies, offering a clear path to improved quality, reduced costs, and enhanced competitive advantage in the dynamic world of electronics.","faqs":[{"answer":"The patent \"Substrate and Method for Labeling Signal Lines Thereof\" (US-9852996) describes an innovative system for identifying individual signal lines on an electronic substrate. At its core, the invention features a transparent underlayer that hosts both the signal lines and a corresponding set of labels. The key breakthrough lies in the unique configuration of these labels: any two adjacent labels are designed to alternate between a 'forward pattern' and a 'reverse pattern'.\n\nThis alternating directional scheme provides an unambiguous and highly reliable method for distinguishing one signal line from another, even when they are densely packed on a microscopic scale. It's a fundamental improvement over traditional labeling techniques, which often lead to confusion and errors in modern high-density electronics manufacturing.\n\nThe technology aims to enhance precision, reduce manufacturing defects, and streamline the assembly and inspection processes for a wide array of electronic components. It's particularly relevant for industries where accuracy is paramount, such as advanced computing, medical devices, and aerospace.","question":"What is Substrate and Method for Labeling Signal Lines Thereof?"},{"answer":"The Substrate and Method for Labeling Signal Lines Thereof operates on a simple yet ingenious principle of directional pattern recognition. First, a transparent underlayer is prepared, which allows for both signal lines and labels to be placed without obstruction. The signal lines, which are the electrical pathways, are fabricated onto this transparent base.\n\nNext, a corresponding label is created for each signal line. The innovation dictates that these labels are not identical; rather, adjacent labels alternate between a 'forward pattern' (e.g., an arrow pointing right ➡️) and a 'reverse pattern' (e.g., an arrow pointing left ⬅️). This creates a distinct sequence, like F-R-F-R, across the array of signal lines.\n\nDuring manufacturing and inspection, automated optical inspection (AOI) systems or even human operators can easily differentiate between these alternating patterns. This clear directional distinction allows for rapid and accurate identification of each signal line, making it highly unlikely to confuse one line with its neighbor. The transparent underlayer ensures that the labels do not interfere with the electrical function or visual inspection of the underlying signal lines.","question":"How does Substrate and Method for Labeling Signal Lines Thereof work?"},{"answer":"The Substrate and Method for Labeling Signal Lines Thereof patent primarily solves the critical problem of misidentification in high-density electronics manufacturing. As electronic devices continue to shrink, signal lines on substrates become incredibly thin and are packed extremely close together. This makes traditional labeling methods, such as simple alphanumeric codes or basic visual markers, highly prone to error.\n\nMisidentification leads to significant business challenges, including costly rework, increased scrap rates, prolonged manufacturing cycles, and potential product failures. In industries requiring extreme precision, such as medical devices or aerospace, such errors can have severe consequences.\n\nThis invention provides an unambiguous, machine-readable identification system that virtually eliminates these misidentification errors, thereby improving manufacturing efficiency, reducing costs, and enhancing the overall quality and reliability of electronic products. It addresses a fundamental bottleneck in the production of advanced miniaturized electronics.","question":"What problem does Substrate and Method for Labeling Signal Lines Thereof solve?"},{"answer":"The patent \"Substrate and Method for Labeling Signal Lines Thereof\" (US-9852996) does not list specific inventors or an assignee in the provided data. This information is typically detailed in the full patent document available through official patent databases.\n\nHowever, the innovation itself stems from the ongoing need within the electronics manufacturing industry to overcome challenges associated with increasing miniaturization and complexity of electronic components. Such advancements are often the result of dedicated research and development efforts by teams of engineers and scientists within technology companies or research institutions.\n\nUnderstanding the creators behind such patents often provides insight into the strategic direction and expertise driving technological progress in specific sectors of the industry. For precise inventor and assignee details, one would refer to the official patent record for US-9852996.","question":"Who invented Substrate and Method for Labeling Signal Lines Thereof?"},{"answer":"The Substrate and Method for Labeling Signal Lines Thereof offers several significant benefits that impact both manufacturing processes and product quality:\n\n1.  **Unambiguous Identification:** The alternating 'forward' and 'reverse' pattern labels provide a clear, unmistakable identifier for each signal line, virtually eliminating misidentification errors.\n2.  **Increased Manufacturing Efficiency:** Automated optical inspection (AOI) systems can process these distinct patterns much faster and more reliably, leading to quicker inspection cycles and higher production throughput.\n3.  **Reduced Costs:** Fewer errors mean less need for costly rework, reduced material waste (scrap), and optimized labor utilization, directly impacting a company's bottom line.\n4.  **Enhanced Product Reliability:** By ensuring precise connections at the foundational level, the technology contributes to higher overall product quality and reliability, reducing warranty claims and improving customer satisfaction.\n5.  **Scalability and Future-Proofing:** The identification method remains effective even as signal line densities continue to increase, making it a valuable solution for future generations of miniaturized electronics. These benefits collectively provide a strong competitive advantage for adopters of this technology.","question":"What are the key benefits of Substrate and Method for Labeling Signal Lines Thereof?"},{"answer":"The Substrate and Method for Labeling Signal Lines Thereof distinguishes itself significantly from prior art in its core identification mechanism. Traditional methods typically rely on simple alphanumeric labels, color coding, or generic fiducial marks.\n\nPrior art often suffers from ambiguity, especially in high-density environments where labels are small and closely spaced, leading to high error rates for both human and automated inspection. Color coding is limited by the number of distinguishable colors and susceptibility to environmental factors. Fiducial marks aid general alignment but don't provide individual signal line identification. These methods are not inherently self-validating and often consume valuable board real estate.\n\nIn contrast, this patent's use of alternating 'forward pattern' and 'reverse pattern' labels provides an intrinsic directional asymmetry, making each label unambiguously distinct. This, combined with a transparent underlayer and a self-validating sequence (any deviation from F-R-F-R instantly flags an error), offers superior accuracy, robustness, and efficiency compared to any previous methods. It represents a paradigm shift from simple identification to intelligent, error-resistant pattern recognition.","question":"How is Substrate and Method for Labeling Signal Lines Thereof different from prior art?"},{"answer":"The Substrate and Method for Labeling Signal Lines Thereof patent has the potential to significantly impact a wide range of industries that rely on high-precision electronics manufacturing. These include:\n\n1.  **Consumer Electronics:** Manufacturers of smartphones, tablets, wearables, and other compact gadgets will benefit from improved reliability and reduced production costs.\n2.  **Medical Devices:** Industries producing critical medical equipment, from diagnostic tools to implantable devices, will leverage the enhanced precision for life-saving reliability and regulatory compliance.\n3.  **Automotive Electronics:** The growing complexity of electronic systems in modern vehicles, including ADAS and autonomous driving components, demands flawless assembly, making this technology crucial for safety and performance.\n4.  **Aerospace and Defense:** For mission-critical avionics, satellite systems, and defense technologies, where component failure is unacceptable, this patent offers unparalleled quality assurance.\n5.  **High-Performance Computing & AI Hardware:** Facilitating the manufacturing of increasingly dense and powerful processors and memory modules required for advanced computing and artificial intelligence.\n\nEssentially, any sector requiring highly reliable and efficiently produced miniaturized electronics stands to gain from this innovative labeling method.","question":"What industries will Substrate and Method for Labeling Signal Lines Thereof impact?"},{"answer":"The patent \"Substrate and Method for Labeling Signal Lines Thereof\" was filed on **May 27, 2014**. This marks the initial date when the inventors submitted their application to the patent office, formally staking their claim to this innovation.\n\nIt was subsequently published on **December 26, 2017**. The publication date signifies when the patent application became publicly accessible, allowing others to review its details and understand the scope of the invention.\n\nThe period between filing and publication allows for examination by patent authorities, during which the claims are assessed for novelty, non-obviousness, and utility. The granting of a patent typically occurs after publication, provided all requirements are met, giving the patent holder exclusive rights to the invention for a specified period.","question":"When was Substrate and Method for Labeling Signal Lines Thereof filed/granted?"},{"answer":"The commercial applications of the Substrate and Method for Labeling Signal Lines Thereof are extensive, primarily focused on enhancing efficiency and reliability in electronics manufacturing. Key applications include:\n\n1.  **Printed Circuit Board (PCB) Manufacturing:** Enabling highly accurate identification of traces on complex, multi-layered PCBs, reducing errors during assembly and inspection.\n2.  **Integrated Circuit (IC) Packaging:** Improving the precision of wire bonding and die attachment processes by clearly identifying microscopic interconnects.\n3.  **Flexible Electronics Production:** Providing robust labeling for flexible substrates, which are prone to deformation, ensuring correct assembly even on non-rigid surfaces.\n4.  **Automated Optical Inspection (AOI) Systems:** The clear directional patterns are ideal for integration into advanced AOI systems, allowing for faster, more accurate, and more autonomous quality control.\n5.  **Component Traceability:** The unambiguous labels can aid in robust traceability throughout the supply chain, critical for quality management and regulatory compliance in many industries.\n\nUltimately, this technology can be applied wherever precise identification of dense signal lines is crucial, leading to higher quality products and more cost-effective manufacturing processes across the electronics industry.","question":"What are the commercial applications of Substrate and Method for Labeling Signal Lines Thereof?"},{"answer":"The Substrate and Method for Labeling Signal Lines Thereof lays a strong foundation for several future developments in electronics manufacturing and related fields. We can anticipate advancements in:\n\n1.  **Enhanced Pattern Complexity:** Future iterations might incorporate more complex directional patterns that can encode additional data, such as batch numbers, layer IDs, or component specifications, directly into the label itself, further enhancing traceability.\n2.  **Dynamic Labeling:** Research could explore dynamic or reconfigurable labels that can change their pattern or optical properties based on external stimuli, allowing for adaptive identification in smart manufacturing environments.\n3.  **Integration with AI/ML:** Advanced AI and machine learning algorithms will continue to refine the speed and accuracy of pattern recognition, making AOI systems even more intelligent and autonomous.\n4.  **Augmented Reality (AR) Assisted Assembly:** The clear labels could be leveraged by AR systems to guide human operators in complex manual assembly tasks, overlaying real-time identification and instructions.\n5.  **Broader Material Compatibility:** Expansion of the labeling technique to an even wider range of transparent and novel substrate materials, including those used in emerging technologies like quantum computing or bio-integrated electronics.\n\nThese developments will continue to push the boundaries of miniaturization, automation, and reliability in electronic component fabrication, driven by the core innovation of this patent.","question":"What are the future developments expected for Substrate and Method for Labeling Signal Lines Thereof?"}],"topics":["Substrate and Method for Labeling Signal Lines Thereof","patent US-9852996","signal line labeling","electronics manufacturing","automated optical inspection","miniaturization","trend","electronics"],"tech_cluster":null},"seo":{"title":"Substrate and Method for Labeling Signal Lines Thereof - Patent US-9852996","description":"Discover Substrate and Method for Labeling Signal Lines Thereof: a patent revolutionizing electronics manufacturing with alternating pattern labels for precise signal line identification. Reduce errors, boost efficiency.","keywords":["Substrate and Method for Labeling Signal Lines Thereof","patent US-9852996","signal line labeling","electronics manufacturing","automated optical inspection","forward reverse pattern","transparent underlayer","high-density circuits","quality control","precision electronics","micro-electronics","circuit board labeling","manufacturing efficiency"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852996","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852996","citation_suggestion":"Patentable. \"Substrate and method for labeling signal lines thereof\" (US-9852996). https://patentable.app/patents/US-9852996","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852996","json":"https://patentable.app/api/llm-context/US-9852996","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:27:50.776Z"}