{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853002","patent":{"patent_number":"US-9853002","title":"Semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-10-17T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor device with enhanced performance. The semiconductor device has a high speed transmission path which includes a first coupling part to couple a semiconductor chip and an interposer electrically, a second coupling part to couple the interposer and a wiring substrate, and an external terminal formed on the bottom surface of the wiring substrate. The high speed transmission path includes a first transmission part located in the interposer to couple the first and second coupling parts electrically and a second transmission part located in the wiring substrate to couple the second coupling part and the external terminal electrically. The high speed transmission path is coupled with a correction circuit in which one edge is coupled with a branching part located midway in the second transmission part and the other edge is coupled with a capacitative element, and the capacitative element is formed in the interposer."},"analysis":{"summary":"The Semiconductor Device patent (US-9853002) introduces a groundbreaking architecture designed to significantly enhance high-speed data transmission within microelectronic devices. At its core, this innovation addresses the pervasive challenge of signal degradation in complex chip packaging by optimizing the pathway from a semiconductor chip to an external terminal.\n\nThe problem this invention solves is the loss of signal integrity and speed as data traverses multiple layers—specifically, from a semiconductor chip, through an interposer, and onto a wiring substrate. Traditional designs often suffer from attenuation, crosstalk, and impedance mismatches, limiting overall device performance and reliability.\n\nThe key technical approach involves a meticulously engineered high-speed transmission path. This path connects the chip to an interposer via a first coupling part, and the interposer to a wiring substrate via a second coupling part. Crucially, the system integrates a correction circuit which is coupled to a branching part midway in the transmission path within the wiring substrate. The other end of this correction circuit is connected to a capacitative element, which is uniquely formed within the interposer itself. This on-interposer integration allows for highly localized and effective real-time signal conditioning.\n\nThe business value and applications are substantial. This technology enables the development of faster, more reliable, and more compact electronic devices. Industries such as high-performance computing, AI, 5G telecommunications, and automotive electronics will benefit from improved data throughput, reduced power consumption, and enhanced system stability. Manufacturers can leverage this approach to create next-generation processors, memory modules, and communication components that meet escalating market demands.\n\nThis patent opens up significant market opportunities by providing a foundational improvement for advanced semiconductor packaging. It offers a competitive advantage to companies that adopt its principles, allowing them to differentiate products based on superior speed, efficiency, and reliability. The ability to push the boundaries of high-speed interconnects will be critical for driving innovation across the entire technology sector.","layman_explanation":"### What Problem Does This Solve?\nImagine your company relies heavily on data — perhaps you're running complex AI models, managing vast cloud infrastructure, or developing next-gen communication systems. The speed at which data moves within and between your critical hardware components directly impacts your operational efficiency and competitive edge. Currently, as electronic devices become smaller and more powerful, the tiny electrical signals carrying this data face significant hurdles. They can degrade, slow down, or get 'noisy' as they travel through the intricate layers of a microchip package, from the main processing unit to the external connections. This signal degradation acts like a bottleneck, limiting the overall speed and reliability of your entire system. Existing solutions often add complexity, cost, or bulk, making it difficult to achieve both high performance and compact design.\n\n### How Does It Work?\nThe Semiconductor Device patent introduces an ingenious way to create a 'super-highway' for these high-speed electrical signals. Think of it like a carefully engineered multi-lane expressway that connects your computer's brain (the semiconductor chip) to its main memory and external ports (the wiring substrate). In between these, there's a special intermediary layer called an 'interposer.' The innovation here is not just in making the lanes smooth, but in building a 'traffic controller' and a 'signal booster' directly into the road system. Specifically, there's a 'correction circuit' that monitors the data flow. If it detects any 'wobbles' or degradation in the signal, it instantly corrects it. And the power for this correction comes from a 'capacitative element' that's fabricated right within the interposer layer itself, very close to where the data is traveling. This integrated, localized approach means the signals are cleaned up and boosted precisely when and where they need it, ensuring they arrive at their destination clear and fast, without relying on bulky, external components.\n\n### Why Does This Matter?\nThis invention matters because it directly addresses one of the most pressing challenges in modern electronics: achieving both extreme speed and unwavering reliability in a compact form factor. For businesses, this translates into several critical advantages. Firstly, it enables the creation of products that are fundamentally faster and more efficient, whether they are server processors, 5G base stations, or embedded AI systems. This performance edge can lead to reduced processing times, lower energy consumption, and increased data throughput, all of which directly impact your bottom line. Secondly, the enhanced signal integrity means greater system stability and fewer errors, reducing maintenance costs and improving customer satisfaction. Finally, by pushing the boundaries of what's possible in chip packaging, companies utilizing this patent can develop cutting-edge products that differentiate them in highly competitive markets, opening up new revenue streams and investment opportunities.\n\n### What's Next?\nThe future implications of this Semiconductor Device are vast. We can expect to see this technology underpinning the next generation of high-performance computing systems, accelerating advancements in artificial intelligence, machine learning, and big data analytics. It will be crucial for the widespread adoption and performance of 5G and future wireless communication standards, enabling truly instantaneous connectivity. In autonomous vehicles, where real-time sensor data processing is critical, this innovation will contribute to safer and more reliable systems. For investors, this patent signals a significant technological leap that could drive substantial growth in companies focused on advanced semiconductor manufacturing and high-end electronics. Its adoption will likely become a key differentiator for industry leaders pushing the envelope of digital performance.","technical_analysis":"The Semiconductor Device patent (US-9853002) presents a sophisticated solution for enhancing high-speed data transmission in microelectronic components, specifically addressing signal integrity challenges inherent in multi-layer packaging. The core technical contribution lies in its meticulously designed high-speed transmission path and an integrated, localized correction mechanism.\n\n**Technical Architecture:**\nThe architecture begins with a semiconductor chip electrically coupled to an interposer via a 'first coupling part'. The interposer, acting as an intermediary layer, then connects to a 'wiring substrate' through a 'second coupling part'. The signal ultimately exits the device via an 'external terminal' located on the bottom surface of the wiring substrate. This layered structure is common in advanced packaging (e.g., 2.5D or 3D integration), but the innovation is in how the signal path is managed across these layers.\n\nWithin the interposer, a 'first transmission part' electrically connects the first and second coupling parts. Similarly, a 'second transmission part' resides within the wiring substrate, linking the second coupling part to the external terminal. These transmission parts are essentially optimized signal traces or lines designed for high-frequency propagation, minimizing impedance discontinuities and signal loss.\n\n**Implementation Details & Algorithm Specifics:**\nThe crucial inventive step is the integration of a 'correction circuit'. This circuit is not external but is embedded within the system's signal flow. One edge of this correction circuit is coupled to a 'branching part' located midway along the 'second transmission part' within the wiring substrate. This branching point allows the circuit to tap into the high-speed signal flow at a critical juncture where signal degradation might start to become significant.\n\nThe other edge of the correction circuit is coupled to a 'capacitative element'. What makes this particularly innovative is that this capacitative element is 'formed in the interposer'. This means the capacitor is not a discrete component externally connected, but rather an integrated structure fabricated within the interposer layer itself. This integration minimizes parasitic inductance and resistance that would typically be introduced by longer traces or external components. The correction circuit, in conjunction with this integrated capacitative element, likely functions as a form of active or passive equalization, compensating for frequency-dependent losses, reflections, or crosstalk that occur along the transmission path.\n\nWhile the patent abstract does not detail the specific algorithm, the correction circuit would typically employ techniques such as: \n*   **Pre-emphasis/De-emphasis:** Boosting or attenuating certain frequency components to counteract channel loss. \n*   **Equalization:** Using filters (e.g., FIR filters, DFE) to compensate for inter-symbol interference (ISI) caused by channel dispersion. \n*   **Impedance matching:** The capacitative element could be part of a tuning network to ensure optimal impedance matching at critical interfaces, thereby reducing reflections.\n\nThe placement of the capacitative element within the interposer suggests a design focused on providing localized, precise correction close to the source of potential signal integrity issues, particularly those arising from the transition between the interposer and the wiring substrate, or within the interposer itself.\n\n**Integration Patterns & Performance Characteristics:**\nThis approach represents an advanced integration pattern, moving beyond simple routing to active signal conditioning within the package. The close proximity of the correction elements to the high-speed path significantly improves performance characteristics:\n*   **Enhanced Signal-to-Noise Ratio (SNR):** By actively correcting distortions, the SNR of the transmitted signal is improved, leading to lower bit error rates (BER).\n*   **Higher Bandwidth and Data Rates:** The ability to maintain signal integrity allows for operation at higher frequencies and thus higher data throughput.\n*   **Reduced Power Consumption:** Efficient signal transmission with less re-transmission due to errors, and potentially optimized impedance matching, can lead to overall power savings.\n*   **Miniaturization:** Integrating components within the interposer and substrate reduces the need for external discrete components, contributing to smaller form factors.\n\n**Code-Level Implications:**\nWhile this patent primarily describes hardware architecture, its principles have implications for firmware and software managing high-speed interfaces. Drivers and communication protocols would need to be designed to take full advantage of the improved physical layer characteristics. For instance, less robust error correction coding might be needed at higher layers, or faster clock recovery circuits could be employed due to cleaner signals. The design of the correction circuit itself, if programmable, would involve firmware control for calibration and adaptation to different operating conditions.","business_analysis":"The Semiconductor Device patent (US-9853002) introduces a critical advancement in microelectronics packaging that has profound business implications across several high-growth industries. By addressing a fundamental bottleneck in high-speed data transmission, this invention unlocks significant market opportunities and provides a powerful competitive advantage.\n\n**Market Opportunity Size:**\nThe global semiconductor market is projected to reach well over a trillion dollars in the coming years, with advanced packaging and high-speed interconnects being critical growth segments. The demand for faster, more efficient, and smaller electronic devices is relentless, driven by trends in AI, 5G/6G, IoT, autonomous vehicles, and high-performance computing (HPC). Signal integrity at multi-gigabit speeds is no longer a luxury but a necessity, creating a massive addressable market for solutions like the one described in this patent. Every new generation of processors, memory, and communication chips will require superior interconnects, making this technology highly relevant to a multi-hundred-billion-dollar segment of the semiconductor industry.\n\n**Competitive Advantages:**\nCompanies adopting the principles of the Semiconductor Device patent will gain several distinct competitive advantages:\n1.  **Superior Performance:** Products incorporating this technology can boast higher data throughput, lower latency, and improved reliability compared to competitors using conventional packaging. This translates directly into faster processing, quicker response times, and more stable systems.\n2.  **Miniaturization and Integration:** The integrated correction circuit and on-interposer capacitative element reduce the need for external components, leading to smaller, lighter, and more power-efficient devices. This is crucial for mobile, wearable, and embedded applications.\n3.  **Cost Efficiency:** While initial R&D and manufacturing setup might incur costs, the long-term benefits of reduced component count, improved yield due to better signal integrity, and potentially simpler board designs can lead to overall cost savings.\n4.  **Future-Proofing:** By addressing signal integrity challenges at a foundational level, this invention provides a robust platform for future generations of chips operating at even higher frequencies, offering a competitive edge in rapidly evolving markets.\n\n**Revenue Potential:**\nRevenue potential can be realized through various business models:\n*   **Licensing:** Semiconductor IP firms or technology companies could license the patent to chip manufacturers and packaging houses.\n*   **Product Differentiation:** Companies manufacturing their own chips or modules can integrate this technology to create premium products that command higher prices and capture greater market share.\n*   **Foundry Services:** Advanced foundries could offer specialized packaging services incorporating this technology, attracting high-value clients.\n*   **New Product Development:** The enhanced capabilities enabled by this patent could lead to entirely new categories of high-performance devices or systems that were previously unfeasible.\n\n**Strategic Positioning:**\nThis patent allows companies to strategically position themselves as leaders in high-performance computing, advanced AI hardware, and next-generation communication infrastructure. By solving a core technical challenge, it enables the creation of products that are faster, more reliable, and more compact, which are key differentiators in competitive markets. It also strengthens a company's intellectual property portfolio, providing a defensive moat and potential for cross-licensing opportunities.\n\n**ROI Projections:**\nInvestment in implementing this technology can yield substantial ROI through:\n*   **Increased Market Share:** Capturing a larger portion of the premium segment of the semiconductor and electronics markets.\n*   **Reduced Development Cycles:** By providing a reliable high-speed interconnect solution, it can shorten design cycles for new products, accelerating time-to-market.\n*   **Enhanced Brand Reputation:** Being associated with cutting-edge, high-performance technology builds brand loyalty and attracts top talent.\n*   **Long-Term Revenue Streams:** Sustained competitive advantage and potential for licensing fees can generate consistent revenue over the patent's lifetime.\n\nIn essence, the Semiconductor Device patent is not merely a technical improvement; it is a strategic asset that can drive significant business growth and market leadership for those who harness its potential.","faqs":[{"answer":"The Semiconductor Device patent (US-9853002) introduces a novel and advanced architecture for semiconductor devices designed to significantly enhance high-speed data transmission. It addresses critical signal integrity issues that arise when data travels through complex microelectronic packages.\n\nEssentially, this invention describes a highly optimized internal pathway for electrical signals, connecting a semiconductor chip to an interposer, and then to a wiring substrate, ultimately leading to an external terminal. This pathway is engineered to maintain signal quality even at extremely high frequencies.\n\nA key aspect of the Semiconductor Device is its integrated correction mechanism. It incorporates a correction circuit coupled with a capacitative element that is formed directly within the interposer. This strategic placement allows for efficient, localized compensation of signal distortions, ensuring data is transmitted accurately and at maximum speed.\n\nThis technology is crucial for next-generation electronics that demand faster processing, lower latency, and higher reliability, such as those found in AI, high-performance computing, and advanced communication systems. The patent aims to overcome the physical limitations that typically bottleneck the performance of modern microchips.","question":"What is Semiconductor Device (US-9853002)?"},{"answer":"The Semiconductor Device improves data transmission through a meticulously designed high-speed pathway and an integrated signal correction system. First, it establishes a robust electrical connection from the semiconductor chip to an interposer, and then from the interposer to a wiring substrate, which eventually leads to an external terminal.\n\nWithin this pathway, the invention includes a 'first transmission part' in the interposer and a 'second transmission part' in the wiring substrate. These parts are optimized for high-frequency signal propagation. The ingenious part is the integration of a correction circuit. This circuit is coupled to a branching point midway along the second transmission part in the wiring substrate.\n\nCrucially, the other end of this correction circuit is connected to a capacitative element that is formed directly within the interposer. This on-interposer capacitative element, in conjunction with the correction circuit, actively monitors and adjusts the signal characteristics. It helps to compensate for signal degradations like attenuation, reflections, and crosstalk in real-time, ensuring the signal remains clear and strong throughout its journey. This localized, embedded correction is far more efficient than external solutions, leading to superior signal integrity and higher achievable data rates.","question":"How does Semiconductor Device work to improve data transmission?"},{"answer":"The Semiconductor Device patent primarily solves the critical problem of signal degradation in high-speed data transmission within complex microelectronic packages. As electronic devices become smaller and more powerful, data signals must travel at increasingly higher frequencies across multiple layers and interfaces (chip, interposer, wiring substrate).\n\nTraditional packaging methods often introduce challenges such as signal attenuation (loss of strength), impedance mismatches (causing reflections), dispersion (signal spreading), and crosstalk (interference from adjacent signals). These issues lead to inter-symbol interference, increased bit error rates, higher power consumption, and ultimately limit the overall speed and reliability of the device. This creates a bottleneck that prevents chips from realizing their full potential.\n\nThe Semiconductor Device addresses this by providing an integrated, localized mechanism to actively correct these signal distortions. By doing so, it ensures that data can be transmitted at very high speeds with exceptional clarity and reliability, overcoming a fundamental physical limitation in modern electronics. This enables the development of truly high-performance, compact, and energy-efficient systems.","question":"What problem does Semiconductor Device solve?"},{"answer":"The patent data provided does not list the inventors. However, the Semiconductor Device patent (US-9853002) would have been filed by specific individuals or a team of inventors who conceived this innovative architecture. The assignee, which is also not listed in the provided data, is typically the company or organization that owns the patent rights.\n\nIn the context of patent filings, inventors are the individuals who contribute to the conception of the invention, while the assignee is the legal entity to whom the patent rights are transferred or assigned. This patent represents a significant intellectual contribution to the field of microelectronics and advanced packaging.\n\nTo find the specific inventors, one would typically refer to the full patent document available from patent offices like the USPTO (United States Patent and Trademark Office) or through patent databases. These documents provide detailed information about the inventors, the assignee, and the full legal claims of the Semiconductor Device invention.","question":"Who invented Semiconductor Device?"},{"answer":"The Semiconductor Device patent offers several key benefits that are transformative for modern electronics:\n\n1.  **Enhanced High-Speed Data Transmission:** The primary benefit is the ability to transmit data at significantly higher speeds with superior integrity. This is crucial for applications demanding massive data throughput, such as AI, HPC, and 5G/6G communications.\n2.  **Superior Signal Integrity:** By integrating a correction circuit and an on-interposer capacitative element, the invention actively mitigates signal degradation, reflections, and crosstalk. This leads to lower bit error rates and more reliable system operation.\n3.  **Compact and Efficient Design:** The embedded nature of the correction components reduces the need for external discrete parts, allowing for smaller, lighter, and more densely packed semiconductor packages. This is ideal for miniaturization trends in mobile, IoT, and embedded devices.\n4.  **Reduced Power Consumption:** Cleaner signals require less power for transmission and minimize re-transmissions due to errors, contributing to overall energy efficiency and cooler device operation.\n5.  **Future-Proof Performance:** By solving a fundamental challenge in interconnects, the Semiconductor Device provides a robust foundation for future generations of chips operating at even higher frequencies, ensuring long-term relevance and scalability for advanced electronic systems.","question":"What are the key benefits of Semiconductor Device?"},{"answer":"The Semiconductor Device patent differentiates itself from prior art by integrating a highly localized and efficient signal correction mechanism directly within the semiconductor package's high-speed transmission path. Prior art solutions often relied on less integrated or less effective approaches.\n\nMany traditional methods involved using external discrete components on the main PCB for signal conditioning. These external components typically introduce longer trace lengths and associated parasitic effects, which degrade high-frequency performance and increase package size. Other solutions might have implemented basic passive routing optimization or integrated equalization onto the chip itself, consuming valuable silicon area or failing to address degradation occurring outside the die.\n\nIn contrast, the Semiconductor Device uniquely places a capacitative element directly within the interposer and couples it to a correction circuit that branches from the wiring substrate. This strategic, embedded integration minimizes parasitics, allows for precise real-time compensation of signal distortions very close to where they occur, and achieves superior signal integrity without adding significant bulk or complexity to the overall package. This represents a significant leap in how high-speed interconnect challenges are addressed.","question":"How is Semiconductor Device different from prior art?"},{"answer":"The Semiconductor Device patent has the potential to impact a wide range of industries that rely heavily on high-speed, reliable data processing and transmission:\n\n1.  **High-Performance Computing (HPC) and Data Centers:** Enables faster processors, memory modules, and inter-server communication, crucial for scientific simulations, big data analytics, and cloud infrastructure.\n2.  **Artificial Intelligence (AI) and Machine Learning (ML):** Accelerates data transfer between AI accelerators (GPUs, TPUs) and memory, leading to faster model training, more efficient inference, and the development of more sophisticated AI systems.\n3.  **Telecommunications (5G/6G):** Improves the performance and reliability of base stations, network equipment, and user devices, facilitating ultra-low latency and high-bandwidth wireless communication.\n4.  **Automotive Electronics:** Enhances the speed and integrity of data transfer for autonomous driving systems, sensor fusion, and in-vehicle infotainment, contributing to safer and more advanced vehicles.\n5.  **Consumer Electronics:** Leads to faster, more responsive, and more energy-efficient smartphones, laptops, gaming consoles, and other smart devices.\n6.  **Aerospace and Defense:** Provides robust and high-performance electronic components for critical applications where reliability and speed are paramount.\n\nEssentially, any industry where the speed and integrity of data flow within electronic devices are crucial will benefit from the advancements offered by the Semiconductor Device.","question":"What industries will Semiconductor Device impact?"},{"answer":"The Semiconductor Device patent, identified as US-9853002, was filed on **October 17, 2016**. The filing date is when the patent application was officially submitted to the patent office.\n\nIt was subsequently published on **December 26, 2017**. The publication date refers to when the patent application or granted patent becomes publicly accessible. In the US, patent applications are typically published about 18 months after their earliest filing date, though the granted patent itself is also published.\n\nThis timeline indicates the period of innovation and the formal process of intellectual property protection for the Semiconductor Device. The invention was conceived and documented prior to its filing, and it underwent examination by patent authorities before its eventual publication and grant, ensuring its novelty, non-obviousness, and utility.","question":"When was Semiconductor Device filed/granted?"},{"answer":"The commercial applications of the Semiconductor Device patent are extensive, primarily focused on enhancing the performance and efficiency of high-speed electronic systems across various sectors:\n\n1.  **Processor and Memory Modules:** Enables the development of faster CPUs, GPUs, and specialized AI/ML accelerators, as well as high-bandwidth memory (HBM) stacks, by ensuring clean, high-speed data transfer between components.\n2.  **Network Infrastructure:** Improves the performance of routers, switches, servers, and base stations, crucial for cloud computing, data centers, and 5G/6G communication networks.\n3.  **Consumer Devices:** Leads to more powerful and responsive smartphones, tablets, laptops, and smart home devices with enhanced multimedia capabilities and faster processing.\n4.  **Automotive and Industrial Electronics:** Facilitates reliable, high-speed data processing for advanced driver-assistance systems (ADAS), infotainment, industrial automation, and robotics.\n5.  **Aerospace and Defense Systems:** Applicable in high-reliability computing and communication systems where signal integrity and performance are mission-critical.\n\nBy overcoming signal integrity bottlenecks, the Semiconductor Device allows manufacturers to create smaller, more power-efficient, and significantly higher-performing products, driving innovation and market competitiveness in these high-growth areas.","question":"What are the commercial applications of Semiconductor Device?"},{"answer":"Looking ahead, the Semiconductor Device patent lays a crucial foundation for several future developments in microelectronics:\n\n1.  **Increased Integration and Miniaturization:** The principles of embedded correction will likely lead to even tighter integration of active and passive components within interposers and substrates, further reducing package size and increasing density. This could enable more complex chiplet architectures.\n2.  **Adaptive Signal Correction:** Future iterations may involve more sophisticated, adaptive correction circuits that can dynamically adjust to varying operating conditions, temperatures, and data patterns, optimizing performance in real-time for diverse workloads.\n3.  **Higher Frequency Operation:** As the demand for speed continues, the robust signal integrity offered by this innovation will allow for reliable operation at even higher frequencies (e.g., terahertz ranges), pushing the boundaries of data transmission.\n4.  **Heterogeneous Integration:** The improved interconnects will be vital for heterogeneous integration, where different types of chips (e.g., logic, memory, sensors) are combined into a single package, requiring seamless high-speed communication between disparate components.\n5.  **Optical Interconnect Integration:** While currently focused on electrical signals, the principles of localized, integrated correction could be extended or adapted to facilitate the eventual integration of optical interconnects within packages, which is a long-term goal for ultra-high-speed data transfer.\n\nThe Semiconductor Device represents an evolving paradigm towards 'smart packaging' where the package itself plays an active role in optimizing system performance, rather than just providing passive interconnections. This will be key to unlocking the full potential of future computing and communication technologies.","question":"What are the future developments expected for Semiconductor Device?"}],"topics":["semiconductor device","high-speed transmission","interposer technology","signal integrity","microelectronics patent","relentless","demand","higher"],"tech_cluster":null},"seo":{"title":"Semiconductor Device - Enhanced High-Speed Data Transmission Patent US-9853002","description":"Discover the Semiconductor Device patent (US-9853002) for enhanced high-speed data transmission. Features integrated correction circuit and interposer-based capacitative element for superior signal integrity.","keywords":["semiconductor device","high-speed transmission","interposer technology","signal integrity","microelectronics patent","correction circuit","capacitative element","advanced packaging","data throughput","US-9853002","patent US-9853002"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853002","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853002","citation_suggestion":"Patentable. \"Semiconductor device\" (US-9853002). https://patentable.app/patents/US-9853002","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853002","json":"https://patentable.app/api/llm-context/US-9853002","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:52:44.304Z"}