{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853003","patent":{"patent_number":"US-9853003","title":"Fan-out semiconductor package","assignee":null,"inventors":[],"filing_date":"2017-04-06T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the first connection member includes a coil pattern layer electrically connected to the connection pads of the semiconductor chip."},"analysis":{"summary":"The Fan-out Semiconductor Package (US-9853003) patent introduces an innovative architecture for advanced chip packaging, specifically designed to address the challenges of miniaturization, high-density interconnections, and thermal management in modern electronics. At its core, this invention describes a semiconductor chip precisely disposed within a through-hole of a first connection member.\n\nThe primary problem this technology solves is the limitation of traditional packaging methods that struggle to accommodate the increasing number of I/O connections and power demands of advanced chips within shrinking form factors. Conventional 'fan-in' approaches often lead to larger packages, longer electrical paths, and less efficient heat dissipation, thereby hindering device performance and miniaturization efforts.\n\nThe key technical approach involves embedding the semiconductor chip within the first connection member, which is then partially encapsulated. Both the first and a subsequent second connection member incorporate redistribution layers (RDLs) that electrically connect to the chip's connection pads. These RDLs fan out beyond the chip's footprint, enabling a higher density of external connections. A distinctive feature is the inclusion of a coil pattern layer within the first connection member, also connected to the chip's pads, which offers novel opportunities for integrating inductive components directly into the package.\n\nFrom a business perspective, this innovation offers substantial value across various sectors. It enables the creation of significantly smaller, faster, and more energy-efficient electronic devices, appealing to consumer electronics, high-performance computing, automotive, and IoT markets. The integrated coil pattern reduces component count and simplifies board design, potentially leading to cost savings and faster time-to-market for manufacturers. This approach provides a competitive advantage by allowing for superior power delivery and signal integrity within a compact form factor.\n\nThe market opportunity for this technology is vast, driven by the continuous demand for advanced packaging solutions that can support heterogeneous integration and the 'More than Moore' scaling roadmap. This patent positions itself as a foundational technology for next-generation system-in-package (SiP) solutions, promising to unlock new capabilities and drive significant advancements in the global semiconductor industry.","layman_explanation":"### What Problem Does This Solve?\nIn today's world, we constantly demand smaller, faster, and more powerful electronic devices – from the smartphone in your pocket to the advanced systems powering self-driving cars. The biggest hurdle isn't just making the tiny computer chips themselves, but how to package them effectively. Traditional methods of connecting these chips to the outside world are starting to hit their limits. They often result in packages that are too big, make the electrical signals travel too far (which slows things down), and struggle to get rid of the heat generated by powerful chips. This 'packaging bottleneck' is slowing down innovation and making it harder to create truly miniaturized, high-performance electronics.\n\n### How Does It Work?\nThe Fan-out Semiconductor Package patent (US-9853003) offers a clever solution that fundamentally changes how chips are packaged. Imagine a tiny, high-tech sandwich. Instead of placing a chip *on top* of a circuit board, this invention places the semiconductor chip *inside* a custom-made slot (a 'through-hole') within a foundational connection layer. This embedded approach is key to its compactness. A protective material, an 'encapsulant,' then seals the chip in place, protecting it from the environment and helping manage heat.\n\nThe real ingenuity comes with how the chip connects. The chip has many tiny connection points. This patent uses 'redistribution layers' (RDLs) – essentially very fine, flat electrical pathways – that fan out from these tiny chip connections to a larger area on both the top and bottom connection layers. This 'fanning out' provides more space for connections, making them shorter, more efficient, and allowing for many more connections than traditional methods. What's truly unique is that one of these connection layers also has a 'coil pattern' built right into it. Think of it like a tiny, flat spring made of metal, which can act as an inductor – a component crucial for managing power or filtering signals, usually found as a separate, bulky part. Integrating it directly into the package saves space and improves performance.\n\n### Why Does This Matter?\nThis technology is a game-changer for several reasons. Firstly, it allows for significantly smaller and thinner electronic devices, which is critical for consumer products like smartwatches and ultra-thin laptops. Secondly, by making electrical connections shorter and more efficient, it boosts device performance, leading to faster processing speeds and lower power consumption. Thirdly, the integrated coil pattern reduces the need for external components, simplifying manufacturing, reducing costs, and further shrinking the overall size of electronic modules. This means higher reliability and potentially faster product development cycles.\n\nFor businesses, this translates into a powerful competitive advantage. Companies adopting this packaging method can create products that are superior in form factor, speed, and energy efficiency. It enables advanced 'system-in-package' solutions, where multiple different chips (like a processor, memory, and a sensor) can be seamlessly combined into one super-compact module. This is vital for emerging technologies like AI hardware, 5G communications, and advanced automotive systems, where space and performance are at a premium. The potential return on investment for companies leveraging this patent is substantial, as it opens doors to new product categories and market leadership.\n\n### What's Next?\nThis Fan-out Semiconductor Package is a foundational technology that will likely become standard in high-performance and miniaturized electronics. We can expect to see it enabling the next generation of wearable tech, more powerful and efficient data centers, and sophisticated medical devices. Its ability to integrate more functionality into a smaller footprint will accelerate the trend towards highly integrated, 'smart' modules. For investors, this patent points to a growth area in advanced semiconductor manufacturing, offering opportunities in licensing, specialized component production, and product development that leverages this cutting-edge packaging.","technical_analysis":"The Fan-out Semiconductor Package (US-9853003) patent details a sophisticated packaging architecture designed to overcome the inherent limitations of conventional semiconductor packaging, particularly in the context of high-density integration and advanced thermal management. This invention focuses on a fan-out wafer-level packaging (FOWLP) approach, distinguished by its unique embedding and interconnection scheme.\n\n**Technical Architecture and Core Components:**\nThe fundamental structure comprises a first connection member, which serves as a foundational substrate. A key feature is the precisely formed through-hole within this first connection member. A semiconductor chip, typically a bare die, is accurately disposed within this through-hole. The chip presents an active surface, populated with fine-pitch connection pads, and an opposing inactive surface. This 'chip-in-hole' configuration is critical for achieving a very thin overall package profile and for optimizing thermal pathways.\n\nAn encapsulant material is then applied to encapsulate at least portions of the first connection member and the inactive surface of the semiconductor chip. This encapsulant provides mechanical protection, structural integrity, and often contributes to thermal dissipation by acting as a heat spreader or transfer medium. The choice of encapsulant material (e.g., epoxy molding compound, liquid encapsulant) is crucial for reliability and manufacturability.\n\nPositioned on the first connection member and the active surface of the semiconductor chip is a second connection member. This layering creates a robust sandwich-like structure. Both the first and second connection members are equipped with redistribution layers (RDLs). These RDLs are fine-line metallization patterns, typically fabricated using thin-film processing techniques (e.g., sputtering, electroplating, photolithography), that fan out from the dense, micron-scale connection pads of the semiconductor chip to larger, more manageable pad arrays. This 'fanning out' allows for more relaxed routing rules on subsequent layers or external substrates, thereby increasing I/O density and enabling complex interconnections without increasing the overall chip footprint.\n\n**Implementation Details and Algorithm Specifics:**\nManufacturing this package involves several critical steps. Precision die placement into the through-hole is paramount, often employing automated pick-and-place equipment with sub-micron accuracy. The subsequent encapsulation process must ensure void-free filling around the chip and strong adhesion to the connection members. RDL fabrication involves multiple lithography, deposition, and etching steps to create multi-layered interconnects with controlled impedance. The design of RDLs follows specific routing algorithms to minimize signal loss, crosstalk, and power distribution network (PDN) impedance.\n\n**Integrated Coil Pattern Layer:**\nA distinctive technical innovation of this patent is the integration of a coil pattern layer within the first connection member, electrically connected to the connection pads of the semiconductor chip. This coil layer is essentially a metallization pattern designed to function as an inductor. Its integration directly into the package offers several advantages: \n1. **Miniaturization:** Eliminates the need for discrete off-package inductors, saving significant board space.\n2. **Performance:** Reduces parasitic inductance and resistance associated with external connections to discrete components, leading to improved power delivery network efficiency and better RF performance.\n3. **Cost Reduction:** Simplifies the bill of materials and assembly processes.\n\nThis coil can be utilized for various functions, such as DC-DC converters within power management units (PMUs), RF matching networks, or filters, directly supporting the chip's operation within the same compact package.\n\n**Integration Patterns and Performance Characteristics:**\nThis Fan-out Semiconductor Package is highly amenable to heterogeneous integration, allowing for the stacking or side-by-side placement of multiple dies (e.g., logic, memory, sensors, RF) within a single package, leveraging the high-density RDLs for inter-die communication. The embedded nature of the chip and the surrounding encapsulant provide excellent thermal pathways, often superior to flip-chip designs, leading to better heat dissipation and improved long-term reliability. Electrical performance is enhanced by shorter signal paths and controlled impedance RDLs, reducing signal propagation delays and enabling higher operating frequencies. The integration of passive components like the coil further optimizes the overall system-in-package (SiP) performance.\n\nIn essence, this patent describes a robust and versatile fan-out packaging solution that not only addresses current industry demands for miniaturization and performance but also lays a strong foundation for future advancements in integrated circuit design and manufacturing.","business_analysis":"The Fan-out Semiconductor Package (US-9853003) patent represents a pivotal advancement in semiconductor packaging, poised to significantly impact various market segments due to its compelling technical advantages. This innovation addresses critical pain points in the electronics industry, translating directly into substantial business opportunities and strategic positioning.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is projected to reach over $70 billion by 2027, with advanced packaging segments, including fan-out wafer-level packaging (FOWLP), experiencing the highest growth rates. The demand for FOWLP is driven by high-growth sectors such as 5G infrastructure, artificial intelligence (AI) hardware, high-performance computing (HPC), automotive electronics (ADAS), and consumer electronics (smartphones, wearables). This patent specifically targets these segments by enabling smaller, faster, and more power-efficient devices. The integration of a coil pattern layer further expands its market reach into applications requiring integrated power management or RF functionalities, potentially capturing a share of the discrete passive components market.\n\n**Competitive Advantages:**\nThis Fan-out Semiconductor Package offers several distinct competitive advantages:\n1.  **Superior Miniaturization:** The embedded chip design and fan-out RDLs enable ultra-compact packages, providing a critical edge in space-constrained applications.\n2.  **Enhanced Performance:** Shorter electrical paths, improved signal integrity, and better thermal dissipation lead to higher operating frequencies and lower power consumption.\n3.  **Cost Efficiency:** By reducing the need for separate substrates and simplifying assembly processes compared to some 3D stacking solutions, this technology can offer a more cost-effective pathway to advanced integration.\n4.  **Functional Integration:** The unique inclusion of a coil pattern layer within the package allows for the integration of inductive components, reducing bill-of-materials (BOM), board space, and assembly complexity, a significant differentiator.\n5.  **Heterogeneous Integration Enabler:** Provides a flexible and robust platform for combining diverse dies (logic, memory, RF, analog) into a single System-in-Package (SiP), accelerating product development cycles for complex systems.\n\n**Revenue Potential and Business Models:**\nCompanies leveraging this patent can generate revenue through several models:\n*   **Licensing:** Semiconductor foundries and OSATs (Outsourced Semiconductor Assembly and Test) could license the patented technology for their advanced packaging services.\n*   **Product Differentiation:** Chip designers and OEMs can integrate this packaging into their products to offer superior performance, smaller form factors, and unique features, commanding premium pricing.\n*   **IP Sales/Acquisition:** The patent itself could be a valuable asset for acquisition by major semiconductor players looking to strengthen their advanced packaging portfolio.\n*   **Value-Added Manufacturing:** Companies specializing in complex packaging could offer specialized manufacturing services based on this technology.\n\n**Strategic Positioning:**\nThis patent positions its assignee at the forefront of advanced packaging innovation. It allows for strategic partnerships with leading fabless semiconductor companies seeking next-generation packaging solutions. By offering a solution that addresses both physical constraints and functional integration needs, this technology can become a de facto standard for certain high-performance, compact applications. It enables a 'More than Moore' strategy, focusing on packaging innovation to drive system-level performance gains rather than solely relying on transistor scaling.\n\n**ROI Projections:**\nInvestment in this technology, either through licensing, R&D, or manufacturing adoption, is likely to yield significant ROI. Reduced manufacturing costs (due to simplified assembly and fewer discrete components), increased market share from superior product offerings, and the ability to unlock new product categories (e.g., ultra-thin IoT devices with integrated power management) all contribute to a strong return. The long-term value lies in its foundational role for future electronic systems, ensuring sustained relevance and demand.","faqs":[{"answer":"The Fan-out Semiconductor Package (US-9853003) is an advanced chip packaging technology designed to create more compact, higher-performing, and functionally integrated electronic devices. Unlike traditional methods where a chip is placed on top of a substrate, this innovation embeds the semiconductor chip directly into a specially designed through-hole within a foundational connection member.\n\nThis unique 'chip-in-hole' structure is then secured by an encapsulant, which protects the chip and helps manage heat. The package leverages sophisticated redistribution layers (RDLs) that fan out electrical connections from the chip's dense pads to a wider area, enabling more connections and shorter electrical pathways.\n\nA key distinguishing feature of the Fan-out Semiconductor Package is its integration of a coil pattern layer directly within the first connection member. This coil, an inductive component, is electrically connected to the chip's pads, allowing for on-package power management or other inductive functionalities. This level of integration significantly reduces the need for external discrete components, saving space and improving efficiency.\n\nEssentially, this patent provides a blueprint for building more powerful and miniaturized electronic systems by rethinking how chips are physically housed and interconnected, making it a critical advancement in modern electronics manufacturing and design.","question":"What is Fan-out Semiconductor Package?"},{"answer":"The Fan-out Semiconductor Package operates on a principle of embedded die technology combined with advanced interconnection and integrated passive components. First, a semiconductor chip is precisely placed into a pre-formed through-hole within a 'first connection member.' This embedding ensures maximum compactness and creates efficient thermal pathways.\n\nOnce the chip is in place, an encapsulant material is applied to surround and protect the chip's inactive surface and parts of the first connection member. This material provides mechanical stability and helps dissipate heat. A 'second connection member' is then positioned over the chip's active surface and the first connection member.\n\nBoth the first and second connection members contain 'redistribution layers' (RDLs). These are ultra-fine electrical pathways that fan out from the chip's tiny connection pads to a larger area on the package. This 'fanning out' allows for a higher density of connections than the chip's footprint alone, resulting in shorter electrical paths, improved signal integrity, and faster performance. Uniquely, the first connection member also incorporates a 'coil pattern layer' – an inductive component – directly connected to the chip. This integrated coil can be used for on-package power management or other specific electrical functions, further enhancing the package's functionality and reducing external component count. This innovative combination allows for a highly integrated, compact, and efficient semiconductor package.","question":"How does Fan-out Semiconductor Package work?"},{"answer":"The Fan-out Semiconductor Package (US-9853003) primarily solves several critical challenges faced by the modern semiconductor industry in its pursuit of miniaturization and enhanced performance. Traditional chip packaging methods, such as wire bonding and flip-chip, are increasingly becoming bottlenecks.\n\nOne major problem is the **limitation of I/O density**. As chips become more complex, they require more electrical connections (I/Os). Old packaging methods struggle to fan out these connections efficiently without significantly increasing the package size or extending electrical path lengths, which degrades performance. This patent's fan-out redistribution layers directly address this by creating more space for connections beyond the chip's footprint.\n\nAnother key issue is **thermal management**. High-performance chips generate substantial heat, and inefficient packaging can lead to thermal hotspots, reduced reliability, and performance throttling. The embedded chip design of this invention, combined with the encapsulant and connection members, provides superior thermal dissipation paths.\n\nFinally, the patent tackles the challenge of **functional integration and component count**. By uniquely integrating a coil pattern layer directly into the package, it reduces the need for external discrete inductive components. This not only saves valuable board space and lowers the bill of materials but also improves electrical efficiency by minimizing parasitic effects associated with off-package components. In essence, it enables smaller, faster, cooler, and more integrated electronic devices.","question":"What problem does Fan-out Semiconductor Package solve?"},{"answer":"The patent for the Fan-out Semiconductor Package (US-9853003) lists the inventor(s) as not specified in the provided data. However, the assignee, which is the entity or company to whom the patent rights are assigned, is also not specified in the provided data. Typically, such innovations are developed by teams of engineers and researchers within leading semiconductor manufacturing companies, research institutions, or specialized packaging firms.\n\nThese organizations invest heavily in research and development to push the boundaries of semiconductor technology. The development of advanced packaging solutions like the Fan-out Semiconductor Package requires expertise across various disciplines, including materials science, electrical engineering, mechanical engineering, and manufacturing process control. The patent reflects a significant collaborative effort to address pressing industry needs.\n\nWhile specific individual inventors are not listed in the provided abstract, the innovation itself stems from the ongoing drive within the semiconductor industry to create more efficient, compact, and powerful electronic components. The assignee, once known, would typically be a major player in the semiconductor ecosystem, leveraging their extensive R&D capabilities to secure such groundbreaking intellectual property. The innovation demonstrates a forward-thinking approach to solving complex engineering challenges in chip packaging.","question":"Who invented Fan-out Semiconductor Package?"},{"answer":"The Fan-out Semiconductor Package (US-9853003) offers a multitude of key benefits that are crucial for the advancement of modern electronics. These advantages address the growing demands for smaller, faster, and more integrated devices across various industries.\n\nFirstly, it provides **superior miniaturization and compactness**. The 'chip-in-hole' embedded design allows for an ultra-thin package profile, significantly reducing the overall footprint compared to traditional packaging. This is vital for space-constrained applications like smartphones, wearables, and compact IoT devices.\n\nSecondly, the technology delivers **enhanced electrical performance**. By utilizing redistribution layers (RDLs) that fan out connections and create shorter electrical paths, it minimizes parasitic capacitance and inductance. This leads to faster signal propagation, improved signal integrity, lower power consumption, and the ability to operate at higher frequencies, directly boosting device speed and efficiency.\n\nThirdly, it offers **better thermal management**. The embedded chip, surrounded by encapsulant and connection members, provides efficient pathways for heat dissipation. This helps to keep the chip cooler during operation, improving reliability and extending the lifespan of the electronic device.\n\nFinally, a standout benefit is **integrated functionality** through its unique coil pattern layer. This allows for on-package inductive components, reducing the need for external discrete parts. This not only saves valuable board space and lowers the bill of materials (BOM) but also simplifies system design and improves power delivery network efficiency. Overall, the Fan-out Semiconductor Package is a highly versatile and efficient solution for next-generation electronic systems.","question":"What are the key benefits of Fan-out Semiconductor Package?"},{"answer":"The Fan-out Semiconductor Package (US-9853003) differentiates itself from prior art packaging methods through several key innovations, offering distinct advantages over traditional and even some other advanced packaging solutions.\n\nCompared to **wire bonding** and **flip-chip** technologies, this patent offers significantly higher I/O density, shorter electrical paths, and superior thermal management. Wire bonding is bulky and slow, while flip-chip, though better, can struggle with very fine pitches and heat dissipation from the active side. The Fan-out Semiconductor Package's embedded design and extensive RDLs directly address these limitations.\n\nWhen compared to earlier **fan-in wafer-level packages (FI-WLP)**, which confine connections within the chip's footprint, this innovation excels by fanning out connections beyond the chip. This allows for a much greater number of I/Os and more flexible routing. Its unique 'chip-in-hole' embedding technique also provides better mechanical robustness and thermal performance than many simple molded-on-carrier FOWLP approaches.\n\nThe most significant differentiator from a wide range of prior art, including many other **fan-out wafer-level packaging (FOWLP)** solutions, is the **integration of a coil pattern layer** directly within the first connection member. While some FOWLP designs integrate passive components, the specific inclusion of an inductive coil within the foundational connection member, electrically connected to the chip, is a unique and powerful feature. This enables on-package power management or RF functionalities, eliminating the need for separate, bulky discrete inductors, simplifying design, reducing cost, and improving electrical performance. This functional integration sets the Fan-out Semiconductor Package apart as a highly advanced and versatile packaging solution.","question":"How is Fan-out Semiconductor Package different from prior art?"},{"answer":"The Fan-out Semiconductor Package (US-9853003) is poised to have a transformative impact across a wide array of industries that rely on advanced electronic components. Its ability to enable smaller, faster, and more power-efficient devices makes it critical for numerous high-growth sectors.\n\n**Consumer Electronics** will be profoundly affected, leading to even thinner, lighter, and more powerful smartphones, tablets, wearables, and other portable gadgets. The enhanced performance and longer battery life provided by this technology will drive the next generation of personal devices. For example, smartwatches can become more feature-rich while maintaining or reducing their size.\n\n**High-Performance Computing (HPC) and Artificial Intelligence (AI) hardware** stand to gain significantly. The improved thermal management and superior electrical performance of this package can unlock new levels of processing power for data centers, cloud computing infrastructure, and specialized AI accelerators, enabling more complex computations and faster data processing for machine learning algorithms.\n\n**Automotive Electronics**, particularly for Advanced Driver-Assistance Systems (ADAS) and autonomous vehicles, will benefit from the compact and robust nature of this technology. The ability to integrate more functionality into a smaller, more reliable package is crucial for the stringent requirements of in-vehicle systems. This includes sensors, control units, and infotainment systems.\n\nFurthermore, the **Internet of Things (IoT)** sector will leverage this innovation for creating smaller, more energy-efficient, and robust sensors and connected devices. The integrated coil pattern is particularly beneficial for low-power IoT applications requiring efficient power management. The Fan-out Semiconductor Package is a foundational technology that will drive innovation across these and other technology-dependent industries.","question":"What industries will Fan-out Semiconductor Package impact?"},{"answer":"The patent for the Fan-out Semiconductor Package, identified as US-9853003, was officially filed on **2017-04-06** (April 6, 2017). This date marks the official submission of the patent application to the patent office, initiating the examination process.\n\nFollowing a period of examination, which involves thorough review by patent examiners to ensure the invention meets all patentability requirements (novelty, non-obviousness, utility, etc.), the patent was subsequently granted and published. The publication date for this patent is **2017-12-26** (December 26, 2017).\n\nIt's important to note that the publication date typically refers to the date the patent document is made publicly available, often coinciding with the grant date in the U.S. patent system for utility patents. The relatively short time frame between filing and publication (less than a year) suggests a streamlined examination process or that the application may have been a continuation of a prior application. The grant of this patent signifies that the claims describing the Fan-out Semiconductor Package were deemed novel, non-obvious, and useful by the patent office, establishing legal protection for this innovative semiconductor packaging technology. These dates are crucial for understanding the intellectual property landscape and the timeline of this technological advancement.","question":"When was Fan-out Semiconductor Package filed/granted?"},{"answer":"The Fan-out Semiconductor Package (US-9853003) has a wide range of commercial applications due to its ability to enable highly compact, high-performance, and functionally integrated electronic modules. Its impact is particularly strong in markets demanding advanced miniaturization and efficiency.\n\nIn **Consumer Electronics**, this technology will be critical for next-generation smartphones, tablets, smartwatches, and other wearables. It allows for thinner devices, longer battery life (due to improved power efficiency), and more powerful processors in smaller form factors. For example, it can enable more advanced features in a smartwatch without increasing its size.\n\nFor **High-Performance Computing (HPC) and Data Centers**, it facilitates the creation of more powerful and energy-efficient processors for servers, AI accelerators, and graphics processing units (GPUs). The improved thermal management and electrical performance lead to higher computational density and lower operational costs in data centers. It's also key for specialized **AI at the Edge** devices where power and size constraints are paramount.\n\nIn the **Automotive Industry**, the Fan-out Semiconductor Package is ideal for advanced driver-assistance systems (ADAS), infotainment systems, and autonomous vehicle control units. Its robustness, compactness, and ability to integrate various functionalities make it suitable for the demanding environmental and reliability requirements of automotive applications.\n\nFurthermore, the **Internet of Things (IoT)** sector benefits significantly. It enables the development of smaller, more power-efficient sensors and communication modules, crucial for smart homes, industrial IoT, and medical devices. The integrated coil pattern is particularly valuable for efficient power delivery in battery-operated IoT devices. Overall, any application requiring high-density integration, superior performance, and a compact form factor can leverage the commercial benefits of this advanced packaging solution.","question":"What are the commercial applications of Fan-out Semiconductor Package?"},{"answer":"The Fan-out Semiconductor Package (US-9853003) lays a strong foundation for numerous future developments in semiconductor packaging and electronic system design. Its innovative architecture provides a flexible platform for ongoing advancements.\n\nOne major area of development is **enhanced heterogeneous integration**. We can expect to see this packaging method increasingly used to combine diverse dies – such as logic, memory, RF, and analog components – into even more complex and functionally rich 'System-in-Packages' (SiPs). This will lead to highly integrated modules that offer unprecedented performance and efficiency for specialized applications like AI accelerators and 5G/6G communication systems.\n\nFurther advancements in **material science** are anticipated, focusing on encapsulants and redistribution layer (RDL) dielectrics with improved thermal conductivity, lower dielectric constants, and enhanced mechanical properties. This will push the boundaries of thermal management and electrical performance even further. New metallization schemes for RDLs could also emerge, offering better conductivity or finer line widths.\n\n**Advanced integration of passive components** will also likely evolve. Beyond the coil pattern layer described, future iterations might integrate other passive components like capacitors and resistors directly into the package. This 'passive integration' will further reduce the need for external discrete components, leading to even smaller and more efficient modules. There's also potential for integrating micro-electromechanical systems (MEMS) or optical components directly into the package.\n\nFinally, **cost optimization and manufacturing scalability** will be continuous areas of focus. As the technology matures, advancements in manufacturing processes will aim to reduce production costs, increase yield rates, and enable higher volume production, making this advanced packaging more accessible for a broader range of applications. The Fan-out Semiconductor Package will continue to evolve as a key enabler for the next generation of high-performance and miniaturized electronics.","question":"What are the future developments expected for Fan-out Semiconductor Package?"}],"topics":["Fan-out Semiconductor Package","semiconductor packaging","fan-out wafer-level packaging","FOWLP","chip embedding","semiconductor","industry","quest"],"tech_cluster":null},"seo":{"title":"Fan-out Semiconductor Package - Advanced Chip Integration US-9853003","description":"Discover the Fan-out Semiconductor Package patent (US-9853003) revolutionizing chip design. Features embedded chips, RDLs, and integrated coils for ultra-compact, high-performance electronics.","keywords":["Fan-out Semiconductor Package","semiconductor packaging","fan-out wafer-level packaging","FOWLP","chip embedding","redistribution layers","RDLs","integrated coil","system-in-package","SiP","advanced packaging","microchip technology","electronics innovation","patent US-9853003","high-performance computing"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853003","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853003","citation_suggestion":"Patentable. \"Fan-out semiconductor package\" (US-9853003). https://patentable.app/patents/US-9853003","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853003","json":"https://patentable.app/api/llm-context/US-9853003","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:38:58.530Z"}