{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853004","patent":{"patent_number":"US-9853004","title":"Interconnections for a substrate associated with a backside reveal","assignee":null,"inventors":[],"filing_date":"2016-10-18T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member."},"analysis":{"summary":"The patent titled \"Interconnections for a Substrate Associated with a Backside Reveal\" (US-9853004) introduces a novel apparatus designed to significantly enhance the reliability and performance of electrical interconnections within a substrate, particularly relevant for advanced microelectronic devices.\n\nAt its core, the invention addresses the persistent industry problem of fragile and thermally unstable interconnects in high-density electronic packaging. Traditional connection methods often suffer from signal degradation, poor thermal dissipation, and mechanical vulnerability, leading to reduced device longevity and performance limitations. This patent provides a sophisticated solution to these challenges.\n\nThe key technical approach involves a uniquely structured post that extends from the substrate. This post comprises a central conductor member, which is the primary electrical pathway. Crucially, an upper portion of this post is enveloped by a dielectric layer, forming a 'dielectric collar.' This collar provides essential electrical insulation and structural support. Surrounding this dielectric collar is a conductor layer, creating a 'metal collar' that further enhances mechanical strength and facilitates efficient thermal dissipation. The entire multi-layered assembly is topped with a unified bond structure, ensuring a robust and reliable connection point for external components.\n\nThe business value and applications of this technology are substantial. It promises to enable the development of more durable, higher-performing, and smaller electronic devices across various sectors, including consumer electronics, automotive, aerospace, and medical implants. By improving the fundamental reliability of interconnections, this patent reduces failure rates, extends product lifespans, and supports higher power densities and operating frequencies.\n\nThis innovation opens up significant market opportunities in the advanced semiconductor packaging industry. It provides a competitive advantage for manufacturers seeking to produce next-generation integrated circuits and 3D stacked devices where interconnect integrity is paramount. The enhanced thermal management and mechanical robustness offered by this system directly translate into higher ROI for products incorporating this technology, positioning it as a critical enabler for future electronic advancements.","layman_explanation":"### What Problem Does This Solve?\nImagine the intricate network of roads in a bustling city. Now imagine those roads are microscopic, carrying vital information and power, and they're constantly under stress from heavy traffic (electrical signals) and extreme weather (heat). In the world of advanced electronics, these tiny 'roads' are called interconnections, and ensuring their reliability is a monumental challenge. Traditional methods of connecting components on a circuit board often result in fragile links that are susceptible to heat damage, signal interference, and physical wear and tear. This leads to devices that fail prematurely, perform inconsistently, or can't be made as small and powerful as we'd like. For businesses, this means higher warranty costs, reduced customer satisfaction, and slower innovation cycles.\n\n### How Does It Work?\nThe patent, \"Interconnections for a Substrate Associated with a Backside Reveal,\" offers an elegant solution to these critical problems. Think of it like a new, super-engineered type of bridge support for those microscopic roads. Instead of a simple pillar, this invention describes a sophisticated, multi-layered 'post' that extends from the main circuit board, or 'substrate.' At its core is a central 'conductor member,' which is the actual pathway for electricity. But what makes it revolutionary is what's built around it.\n\nFirst, an insulating layer, called a 'dielectric collar,' wraps around the conductor. This collar acts like a protective sleeve, preventing electrical signals from leaking or interfering with adjacent connections, much like how insulated wires keep electricity on its intended path. This is crucial for maintaining crystal-clear signal integrity, especially in high-speed applications. Then, on the outside of this insulating collar, there's a 'metal collar.' This outer metal layer serves a dual purpose: it acts as a robust physical shield, making the entire connection much stronger and less prone to breaking, and it also helps to dissipate heat away from the sensitive core, keeping the connection cool and stable. Finally, the very top of this entire multi-layered post is prepared with a 'bond structure,' a perfectly shaped surface designed to securely attach to other components, ensuring a reliable and long-lasting connection. It's an integrated system designed for maximum resilience and performance.\n\n### Why Does This Matter?\nThis innovation is a game-changer for any industry relying on advanced electronics. For consumer electronics, it means more durable smartphones, longer-lasting laptops, and smaller, more powerful wearables. In the automotive sector, it translates to more reliable control systems for autonomous vehicles, where failure is not an option. For medical devices, it enables more robust and compact implants. The ability to create these highly reliable and thermally stable interconnections unlocks significant market opportunities. Companies adopting this technology can differentiate their products through superior quality and performance, potentially commanding higher price points and reducing costly product recalls. It also accelerates the development of next-generation devices that require higher component density and power, driving innovation and competitive advantage.\n\n### What's Next?\nThe \"Interconnections for a Substrate Associated with a Backside Reveal\" patent lays a foundational brick for the future of microelectronics. We can expect to see this technology integrated into a wide array of advanced semiconductor packages, from 3D stacked integrated circuits to high-density modules. Its principles could inspire further innovations in materials science and manufacturing processes, leading to even more efficient and robust connections. For investors, this patent highlights a critical area of growth within the semiconductor industry, signaling opportunities in companies that are either developing or licensing such foundational interconnect technologies. Its widespread adoption will be a key enabler for the ever-increasing performance demands of our digital world.","technical_analysis":"The patent, \"Interconnections for a Substrate Associated with a Backside Reveal\" (US-9853004), details an innovative apparatus for creating robust and high-performance electrical interconnections within a substrate. This technology is particularly pertinent to advanced microelectronic packaging, addressing critical challenges related to signal integrity, thermal management, and mechanical reliability in high-density environments.\n\n**Technical Architecture and Core Components:**\nAt the heart of this invention is a meticulously engineered post structure that protrudes from the substrate. This post is not a monolithic entity but a composite assembly designed for multi-functional performance:\n1.  **Conductor Member:** This forms the central core of the post, serving as the primary electrical conduit. Typically, this would be a high-conductivity metal like copper (Cu) or a refractory metal such as tungsten (W), chosen for its electrical characteristics and compatibility with semiconductor fabrication processes. Its dimensions are crucial for current carrying capacity and impedance matching.\n2.  **Dielectric Collar:** An upper portion of the conductor member is surrounded by a dielectric layer, which is precisely disposed on the upper surface of the substrate and adjacent to the post. This forms what the patent refers to as a 'dielectric collar.' The material for this collar would likely be silicon dioxide (SiO2), silicon nitride (Si3N4), or a low-k dielectric polymer. The primary function of this layer is electrical isolation, preventing short circuits between the conductor member and any surrounding conductive elements, as well as mitigating parasitic capacitance that can degrade high-frequency signals.\n3.  **Metal Collar:** Encircling the dielectric collar is a conductor layer, termed the 'metal collar.' This outer metallic layer provides several key benefits. Mechanically, it acts as a reinforcing structure, significantly improving the post's resistance to thermomechanical stresses and external forces, which are common failure modes in densely packed electronic systems. Thermally, it serves as an efficient heat spreader, drawing heat away from the central conductor member and the bond interface, thereby improving the overall thermal dissipation of the interconnect. Electrically, it can function as a ground plane or an electromagnetic shield, further enhancing signal integrity.\n4.  **Bond Structure:** The uppermost surface of this entire composite post—encompassing the top surfaces of the conductor member, the dielectric collar, and the metal collar—is configured with a unified bond structure. This structure is designed to facilitate reliable interconnection with external components, such as solder bumps, micro-bumps, or direct copper-to-copper bonding in 3D integrated circuits. The integrity and planarity of this bond surface are critical for achieving high-yield, reliable assembly.\n\n**Implementation Details and Fabrication:**\nThe fabrication of this intricate structure would likely involve advanced semiconductor manufacturing techniques. The conductor member could be formed using electroplating, chemical vapor deposition (CVD), or physical vapor deposition (PVD) followed by patterning. The dielectric collar would then be deposited using techniques like plasma-enhanced CVD (PECVD) or spin-on dielectric processes, followed by anisotropic etching to define the collar shape. The metal collar would similarly be formed via deposition (e.g., sputtering, electroplating) and subsequent patterning. Planarization techniques, such as chemical mechanical polishing (CMP), would be essential to create the uniform top surface required for the bond structure.\n\n**Performance Characteristics and Advantages:**\n*   **Enhanced Reliability:** The multi-layered design provides superior resistance to thermal cycling, mechanical shock, and moisture ingress compared to conventional interconnects. This is crucial for automotive, aerospace, and medical applications.\n*   **Improved Signal Integrity:** The dielectric collar minimizes crosstalk and parasitic effects, ensuring cleaner and faster signal transmission, which is vital for high-speed digital and RF circuits.\n*   **Superior Thermal Management:** The integrated metal collar significantly enhances heat dissipation from the interconnection point, contributing to lower operating temperatures and extended device lifespan.\n*   **Robust Mechanical Stability:** The combined structural support from the dielectric and metal collars makes the posts more resilient to external stresses, preventing delamination or fracture.\n\n**Code-Level Implications (Conceptual):**\nWhile this patent describes a physical apparatus, its principles influence hardware design that software engineers interact with. For example, improved thermal characteristics might allow for higher clock frequencies or continuous operation at peak performance, enabling more complex algorithms or higher data throughput. Enhanced signal integrity could simplify error correction protocols in communication interfaces, leading to more efficient data transfer and potentially less overhead in driver implementations. The reliability improvements reduce hardware-related failures, simplifying system-level error handling and improving overall software stability in embedded systems.\n\nIn essence, the Interconnections for a Substrate Associated with a Backside Reveal patent represents a significant advancement in the fundamental building blocks of modern electronics, enabling future generations of more powerful, reliable, and compact devices.","business_analysis":"The patent \"Interconnections for a Substrate Associated with a Backside Reveal\" (US-9853004) introduces a critical innovation in semiconductor packaging that holds substantial business implications across the microelectronics industry. This technology addresses fundamental reliability and performance bottlenecks, positioning itself as an enabler for next-generation electronic devices and systems.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is projected to reach well over $50 billion annually, driven by the insatiable demand for smaller, faster, and more powerful electronic devices. Within this, the advanced packaging segment, which this patent directly influences, is growing even faster, with compound annual growth rates often exceeding 10%. This innovation is particularly relevant for high-growth areas such as 3D ICs, System-in-Package (SiP), and high-performance computing (HPC), where reliable and efficient interconnections are paramount. The market for interconnect solutions within these segments alone represents a multi-billion dollar opportunity.\n\n**Competitive Advantages:**\nThis technology offers several compelling competitive advantages:\n1.  **Enhanced Product Reliability:** By providing superior mechanical, thermal, and electrical robustness, the invention significantly reduces failure rates and extends the lifespan of electronic products. This translates directly into lower warranty costs, improved brand reputation, and increased customer satisfaction for manufacturers adopting this technology.\n2.  **Performance Enabler:** The improved signal integrity and thermal management allow for higher operating frequencies and power densities, pushing the boundaries of what integrated circuits can achieve. This enables companies to develop cutting-edge products with superior performance characteristics, gaining an edge in highly competitive markets.\n3.  **Miniaturization and Integration:** The robust nature of these interconnections facilitates higher density packaging, enabling smaller form factors and greater integration of functionalities within a single package. This is crucial for portable devices, wearables, and compact embedded systems.\n4.  **Cost Efficiency through Yield Improvement:** While the manufacturing process might seem complex, the inherent reliability of the design can lead to higher manufacturing yields and reduced rework, ultimately lowering overall production costs in high-volume scenarios.\n\n**Revenue Potential and Business Models:**\nCompanies that license or integrate this patent's technology could realize revenue through:\n*   **Product Differentiation:** Offering devices with superior reliability and performance, commanding premium pricing.\n*   **Foundry Services:** Semiconductor foundries and OSAT (Outsourced Semiconductor Assembly and Test) providers could offer this advanced interconnection technology as a high-value service to their clients.\n*   **IP Licensing:** The patent holder could license the technology to various semiconductor manufacturers, packaging companies, and original equipment manufacturers (OEMs), generating significant royalty revenues.\n*   **Component Sales:** Developing and selling specialized substrates or interconnect components incorporating this technology.\n\n**Strategic Positioning:**\nThis patent allows companies to strategically position themselves at the forefront of advanced packaging technology. By adopting the Interconnections for a Substrate Associated with a Backside Reveal system, businesses can:\n*   **Lead in High-Reliability Markets:** Dominate sectors where failure is not an option, such as aerospace, medical, and automotive electronics.\n*   **Enable Future Technologies:** Become a key supplier or partner for companies developing AI hardware, 5G infrastructure, IoT devices, and quantum computing components that require highly stable interconnections.\n*   **Mitigate Supply Chain Risks:** By offering a more robust solution, companies can reduce the impact of component failures on their supply chain and end-product reputation.\n\n**ROI Projections:**\nThe return on investment for implementing this technology would be realized through a combination of factors: reduced warranty costs (due to fewer field failures), increased market share (due to superior product performance and reliability), premium pricing opportunities, and potentially faster time-to-market for innovative products. For a company producing millions of devices, even a small percentage reduction in failure rates can translate into millions of dollars in savings and increased profitability. Furthermore, the ability to develop entirely new product categories enabled by this robust interconnection technology offers exponential growth potential.\n\nIn conclusion, the Interconnections for a Substrate Associated with a Backside Reveal patent is more than a technical curiosity; it's a strategic asset with the potential to unlock significant value, drive innovation, and reshape competitive landscapes in the multi-billion dollar microelectronics industry.","faqs":[{"answer":"Interconnections for a Substrate Associated with a Backside Reveal (US-9853004) is a patent describing a novel apparatus for creating highly reliable and efficient electrical connections within a substrate, particularly in microelectronic devices. It introduces a unique, multi-layered post structure designed to overcome common limitations of traditional interconnects.\n\nAt its core, this invention features a post that extends from the substrate. This post isn't just a simple conductor; it's engineered with a central conductor member, an insulating dielectric collar, and a reinforcing metal collar. These layers work together to provide superior electrical isolation, mechanical strength, and thermal dissipation, culminating in a robust bond structure for connecting components.\n\nThe innovation aims to enhance the overall durability and performance of electronic devices by ensuring that the fundamental connections are stable under various stresses, including thermal cycling, mechanical shock, and signal interference. This makes it a crucial development for advanced semiconductor packaging and high-density integration in modern electronics.\n\nKeywords: Interconnections for a Substrate Associated with a Backside Reveal, patent US-9853004, substrate interconnections, microelectronics, advanced packaging.","question":"What is Interconnections for a Substrate Associated with a Backside Reveal?"},{"answer":"The Interconnections for a Substrate Associated with a Backside Reveal patent works by employing a sophisticated, multi-layered post design for electrical connections. Instead of a single, exposed conductive pillar, this invention constructs a composite post with specific functional layers.\n\nFirst, there's a central 'conductor member' that carries the electrical signals. Around the upper portion of this conductor, a 'dielectric layer' is applied, forming an insulating collar. This dielectric collar prevents electrical leakage and signal interference, ensuring clean and efficient data transmission. Finally, an outer 'conductor layer' forms a 'metal collar' around the dielectric collar. This metal collar provides robust mechanical support to the entire structure and acts as an efficient heat spreader, drawing heat away from the sensitive connection point.\n\nAll these layers – the conductor member, dielectric collar, and metal collar – are topped with a unified 'bond structure.' This bond structure is designed for highly reliable attachment to other electronic components, ensuring a stable and long-lasting connection. This integrated approach addresses electrical, mechanical, and thermal challenges simultaneously, leading to significantly improved interconnect performance and reliability.\n\nKeywords: How it works, dielectric collar, metal collar, conductor member, bond structure, electrical isolation, thermal management, mechanical strength.","question":"How does Interconnections for a Substrate Associated with a Backside Reveal work?"},{"answer":"The Interconnections for a Substrate Associated with a Backside Reveal patent primarily solves the critical problem of unreliable and performance-limiting interconnections in modern microelectronic devices. As electronics become smaller, faster, and more complex, traditional connection methods struggle to cope with the increased demands.\n\nSpecifically, this invention addresses issues such as: 1) **Thermal Degradation:** High power densities generate significant heat, which can damage exposed interconnects and reduce device lifespan. The integrated metal collar in this patent provides superior heat dissipation. 2) **Mechanical Fragility:** Tiny connections are prone to breakage from physical stress, vibrations, or thermal expansion mismatches. The multi-layered, reinforced structure offers enhanced mechanical robustness. 3) **Signal Integrity Issues:** In dense circuits, electrical signals can interfere with each other (crosstalk) or leak, leading to errors and slower performance. The dielectric collar ensures excellent electrical isolation, maintaining signal purity.\n\nBy providing a comprehensive solution to these challenges, this patent enables the creation of more durable, higher-performing, and smaller electronic devices, overcoming limitations that have historically hindered innovation in advanced packaging.\n\nKeywords: Problem solved, interconnect reliability, thermal management, signal integrity, mechanical stress, electronic device failures, advanced packaging challenges.","question":"What problem does Interconnections for a Substrate Associated with a Backside Reveal solve?"},{"answer":"The patent for Interconnections for a Substrate Associated with a Backside Reveal (US-9853004) does not list specific inventors or an assignee in the provided data. Typically, such information is available in the full patent document published by the patent office.\n\nIn the context of patent filings, the 'inventors' are the individuals who conceived the inventive subject matter. The 'assignee' is the entity (often a corporation or university) to whom the patent rights are legally transferred or assigned, which is common practice for employee-generated inventions.\n\nWithout the full patent document, the specific individuals or company responsible for this innovation cannot be identified from the provided abstract and metadata. However, the nature of the invention suggests it likely originated from an R&D team within a semiconductor manufacturing company, a research institution focused on microelectronics, or an advanced packaging specialist firm.\n\nKeywords: Inventors, assignee, patent ownership, microelectronics research, semiconductor industry, patent US-9853004.","question":"Who invented Interconnections for a Substrate Associated with a Backside Reveal?"},{"answer":"The Interconnections for a Substrate Associated with a Backside Reveal patent offers several key benefits that are crucial for the advancement of modern electronics.\n\nFirstly, it significantly enhances **reliability and durability**. The multi-layered post design, with its robust dielectric and metal collars, provides superior protection against thermal stress, mechanical shock, and environmental factors, leading to longer-lasting electronic components and devices. Secondly, it ensures **improved electrical performance** by maintaining excellent signal integrity. The dielectric collar effectively isolates the conductor, minimizing crosstalk and parasitic capacitance, which is vital for high-speed data transmission and cleaner signals. Thirdly, the invention provides **superior thermal management**; the integrated metal collar acts as an efficient heat spreader, drawing heat away from critical connection points and preventing localized overheating, thereby extending device lifespan and enabling higher power densities.\n\nFinally, this approach facilitates **greater miniaturization and integration**. By creating highly reliable and robust connections, it enables engineers to pack more components into smaller spaces without compromising performance or reliability, accelerating the development of compact and powerful next-generation devices. These benefits collectively translate into higher quality products, reduced failure rates, and enhanced capabilities across various electronic applications.\n\nKeywords: Key benefits, reliability, durability, electrical performance, signal integrity, thermal management, miniaturization, integration, electronic devices.","question":"What are the key benefits of Interconnections for a Substrate Associated with a Backside Reveal?"},{"answer":"The Interconnections for a Substrate Associated with a Backside Reveal patent distinguishes itself from prior art by offering a uniquely integrated and comprehensive solution to interconnect challenges, rather than addressing them in isolation.\n\nTraditional interconnects, such as simple solder bumps or bare copper pillars, often provide electrical connections but lack robust integrated features for thermal management and complete electrical isolation. For example, bare copper pillars, while good conductors, are susceptible to oxidation and may require separate underfill materials for mechanical stability, which don't always offer optimal thermal or electrical properties. Other methods might focus on one aspect, like signal integrity, but neglect mechanical robustness or thermal dissipation.\n\nThis invention, however, integrates a central conductor, a dedicated insulating dielectric collar, and a reinforcing, heat-dissipating metal collar into a single, cohesive post structure. This multi-functional design simultaneously optimizes electrical isolation, mechanical strength, and thermal performance. The unified bond structure across these disparate materials also simplifies subsequent assembly and enhances overall reliability, making it a more holistic and advanced solution compared to piecemeal prior art approaches.\n\nKeywords: Prior art, competitive analysis, unique advantages, dielectric collar, metal collar, solder bumps, copper pillars, integrated design, holistic solution.","question":"How is Interconnections for a Substrate Associated with a Backside Reveal different from prior art?"},{"answer":"The Interconnections for a Substrate Associated with a Backside Reveal patent is poised to have a significant impact across a wide array of industries that rely heavily on advanced, reliable, and compact electronic devices.\n\n**Consumer Electronics:** From smartphones and tablets to wearables and smart home devices, this technology will enable more durable products with enhanced performance and smaller form factors. **Automotive:** It is critical for the reliability of advanced driver-assistance systems (ADAS), autonomous driving platforms, and electric vehicle (EV) power electronics, where components operate under harsh conditions and require fail-safe operation. **Aerospace and Defense:** High-reliability interconnections are paramount for avionics, satellite systems, and defense electronics, where extreme environmental conditions and long operational lifespans are non-negotiable.\n\n**Medical Devices:** Compact, long-lasting, and highly reliable interconnections are essential for implantable medical devices, diagnostic equipment, and portable health monitors. **High-Performance Computing (HPC) and Data Centers:** This innovation will enable more powerful, energy-efficient servers and AI accelerators by improving interconnect density, signal integrity, and thermal management. Essentially, any sector demanding cutting-edge microelectronics with superior performance and unwavering reliability will benefit from the Interconnections for a Substrate Associated with a Backside Reveal technology.\n\nKeywords: Industry impact, consumer electronics, automotive, aerospace, medical devices, HPC, AI, IoT, microelectronics sectors.","question":"What industries will Interconnections for a Substrate Associated with a Backside Reveal impact?"},{"answer":"The patent for Interconnections for a Substrate Associated with a Backside Reveal (US-9853004) was filed on **October 18, 2016**.\n\nIt was subsequently published and granted on **December 26, 2017**. The filing date marks the official submission of the patent application to the patent office, establishing the priority date for the invention. The publication date, or in this case, the grant date, signifies when the patent was formally issued, making its details publicly available and granting the patent holder exclusive rights to the invention.\n\nThis timeline indicates a relatively swift examination process, suggesting the innovation was recognized for its novelty and significance within the field of microelectronics and semiconductor packaging. Understanding these dates is crucial for assessing the patent's lifecycle, prior art considerations, and its potential market impact from a legal and business perspective.\n\nKeywords: Filing date, publication date, patent granted, US-9853004 timeline, patent lifecycle, intellectual property.","question":"When was Interconnections for a Substrate Associated with a Backside Reveal filed/granted?"},{"answer":"The commercial applications of the Interconnections for a Substrate Associated with a Backside Reveal patent are extensive, primarily driven by its ability to deliver superior reliability, performance, and miniaturization in electronic devices.\n\nOne major application area is **advanced semiconductor packaging**, including 3D ICs and System-in-Package (SiP) solutions. This technology enables more robust and denser vertical interconnections, crucial for stacking multiple chips. In **high-performance computing (HPC) and artificial intelligence (AI) hardware**, it supports the creation of more powerful and thermally stable processors and accelerators. For **automotive electronics**, it is vital for highly reliable control units, sensors, and power modules in electric and autonomous vehicles, where extreme conditions are common.\n\nFurthermore, the patent has significant applications in **consumer electronics**, leading to more durable and efficient smartphones, wearables, and augmented/virtual reality (AR/VR) devices. In **medical devices**, it facilitates the development of smaller, more reliable implants and diagnostic tools. Lastly, it will bolster **aerospace and defense systems** by providing connections that can withstand harsh environments and ensure long operational lifespans. Its broad applicability stems from addressing fundamental challenges common across virtually all modern electronic systems.\n\nKeywords: Commercial applications, 3D ICs, SiP, HPC, AI hardware, automotive electronics, consumer electronics, medical devices, aerospace, defense, market opportunities.","question":"What are the commercial applications of Interconnections for a Substrate Associated with a Backside Reveal?"},{"answer":"The Interconnections for a Substrate Associated with a Backside Reveal patent provides a robust foundation upon which numerous future developments in microelectronics can be built. Its integrated design opens doors for further innovation in materials, processes, and applications.\n\nOne key area of future development is **material optimization**. This could involve exploring novel low-k dielectric materials for the collar to further reduce parasitic capacitance or integrating advanced high-thermal-conductivity metals for even more efficient heat dissipation. Another aspect is **process refinement and scalability**, focusing on developing more cost-effective and high-throughput fabrication techniques to enable mass production across diverse foundries and packaging houses. This could include self-aligned processes or advanced lithography techniques.\n\nFurthermore, we can expect **integration into more complex architectures**, such as heterogeneous integration where different types of chiplets (e.g., CPU, GPU, memory, specialized accelerators) are combined into a single package. The robust nature of these interconnections will be crucial for the reliability of such complex systems. Research may also extend to **active thermal management**, potentially integrating microfluidic cooling channels or thermoelectric devices directly within or adjacent to the collar structures for dynamic temperature control. Ultimately, the principles of integrated electrical, thermal, and mechanical robustness laid out in this patent will continue to inspire and enable future generations of high-performance and ultra-reliable electronic systems.\n\nKeywords: Future developments, material optimization, process refinement, heterogeneous integration, active thermal management, 3D packaging, microelectronics innovation, scalability.","question":"What are the future developments expected for Interconnections for a Substrate Associated with a Backside Reveal?"}],"topics":["Interconnections for a Substrate Associated with a Backside Reveal","patent US-9853004","substrate interconnections","backside reveal technology","dielectric collar","relentless","march","moore"],"tech_cluster":null},"seo":{"title":"Interconnections for a Substrate Associated with a Backside Reveal - Patent US-9853004","description":"Discover the Interconnections for a Substrate Associated with a Backside Reveal patent. Learn about this apparatus for robust substrate interconnections with dielectric and metal collars.","keywords":["Interconnections for a Substrate Associated with a Backside Reveal","patent US-9853004","substrate interconnections","backside reveal technology","dielectric collar","metal collar","semiconductor packaging","electronic reliability","advanced interconnects","microelectronics patent"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853004","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853004","citation_suggestion":"Patentable. \"Interconnections for a substrate associated with a backside reveal\" (US-9853004). https://patentable.app/patents/US-9853004","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853004","json":"https://patentable.app/api/llm-context/US-9853004","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:28:08.576Z"}