{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853007","patent":{"patent_number":"US-9853007","title":"Method for producing an integrated circuit package and apparatus produced thereby","assignee":null,"inventors":[],"filing_date":"2015-10-29T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A processor-implemented method and integrated circuit package are provided. According to an implementation, a method of producing a chip package includes de-populating solder balls at selected locations in a fine pitch package, and providing test pads at the de-populated solder ball locations. In an example implementation, the method comprises receiving and modifying a package design. In an implementation, a row of test pads in an integrated circuit package is provided in a plurality of concentric annular rows, the row of test pads being adjacent an outer row of via-connected solder balls and adjacent an inner row of via-connected solder balls. In an implementation, test pads are located on a PCB-facing surface of the package at a subset of locations opposing at least one via position on a package-facing surface of the PCB. The test pads maintain a large number of signal pins and do not interfere with the via."},"analysis":{"summary":"The patent \"Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby\" introduces a groundbreaking approach to enhance the testability of integrated circuit (IC) packages, particularly those with fine-pitch designs. Its core innovation lies in a processor-implemented method that modifies existing package designs to strategically integrate test pads without increasing the package footprint or compromising signal integrity.\n\nThe primary problem this invention solves is the persistent challenge of testing high-density IC packages. As solder balls become more densely packed, it becomes increasingly difficult to implement effective test points without interfering with critical signal paths, adding to the package size, or incurring high manufacturing costs. Traditional testing methods often fall short in providing comprehensive coverage for these complex, miniaturized components.\n\nThe key technical approach involves two ingenious steps: first, de-populating solder balls at selected, non-critical locations within the fine-pitch package; and second, providing test pads at these newly vacated spots. The method ensures that these test pads are optimally placed, for instance, in concentric annular rows adjacent to both inner and outer via-connected solder balls. Crucially, these test pads are designed to be on the PCB-facing surface, carefully positioned to oppose via locations on the package-facing surface, thereby maintaining a large number of signal pins and preventing interference with the vias.\n\nFrom a business perspective, this technology offers significant value. It enables manufacturers to achieve higher test coverage and diagnostic capabilities, leading to improved product reliability and reduced failure rates. This translates into substantial cost savings by minimizing rework, enhancing production yields, and accelerating time-to-market. The ability to modify existing package designs facilitates easier adoption, reducing the need for extensive retooling.\n\nThe market opportunity for this innovation is substantial, especially in sectors demanding high-performance, compact, and highly reliable electronics, such as mobile computing, IoT devices, automotive electronics, and advanced data centers. By providing a more efficient and effective testing solution, the Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby positions itself as a critical enabler for the next generation of integrated circuit design and manufacturing.","layman_explanation":"### What Problem Does This Solve?\nImagine you're building a highly complex miniature city, like a tiny computer chip. This city has thousands of tiny roads and buildings (electrical connections and components) packed incredibly close together. To make sure everything works perfectly, you need to check every single road and building. However, because the city is so small and dense, it's almost impossible to send in inspectors (test probes) without accidentally damaging a road or making the city bigger just to fit the inspectors in. Existing methods for checking these tiny cities either make the city larger, slow down the inspection process considerably, or can't check everything thoroughly, leading to potential hidden flaws. This means devices might fail prematurely, or manufacturing costs soar trying to catch every tiny error.\n\n### How Does It Work?\nThis patent, titled \"Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby,\" offers a remarkably clever solution. Think of our miniature city's roads as 'solder balls' that connect the city to the outside world. This invention proposes a smart system that first identifies a few roads that are less critical or have some redundancy – kind of like finding side streets that aren't absolutely essential for the city's main traffic flow. Once identified, these specific 'roads' (solder balls) are 'de-populated' or carefully removed. Don't worry, the city still functions perfectly!\n\nIn the exact spots where these less critical roads were, the patent then places special 'test pads.' These test pads are like dedicated, easy-to-access checkpoints that inspectors can use without disturbing any other part of the city. The genius is in their placement: they're arranged in concentric circles, ensuring comprehensive coverage, and are specifically designed to avoid interfering with the 'main highways' (vias) that carry vital information. So, you get all the inspection points you need, right where you need them, without making the city bigger or messing up its traffic flow. It's like turning unused space into highly efficient, integrated inspection stations.\n\n### Why Does This Matter?\nThis innovation matters immensely for several reasons. Firstly, it drastically improves the reliability of electronic devices. By allowing for more thorough and efficient testing, fewer faulty chips will make it into products, meaning your smartphones, smartwatches, and cars will work better and last longer. This reduces warranty costs for manufacturers and increases consumer trust.\n\nSecondly, it drives down manufacturing costs. Companies won't need as much expensive, external testing equipment or as many laborious manual inspection steps. This efficiency translates directly into savings, which can either be passed on to consumers or reinvested into further innovation. It also helps speed up the entire production process, getting new and improved products to market faster.\n\nFinally, this technology is crucial for the continued miniaturization of electronics. As devices get smaller, the demand for compact, high-performance chips only grows. This patent provides a way to maintain high functionality and reliability in these tiny packages, enabling the next generation of smaller, more powerful gadgets without compromise. It’s a foundational improvement that impacts everything from consumer electronics to advanced industrial systems.\n\n### What's Next?\nThis patent sets a new standard for integrated circuit packaging and testing. We can expect to see wider adoption of this method across the semiconductor industry, particularly in areas like mobile technology, IoT, and high-performance computing, where space and reliability are paramount. Future applications might include even more sophisticated, self-diagnostic chips that can report their health status in real-time. This foundational shift in how we approach testability will likely accelerate the development of even smaller, more powerful, and incredibly robust electronic components, pushing the boundaries of what's possible in the digital world.","technical_analysis":"The \"Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby\" patent (US-9853007) presents a sophisticated, processor-implemented methodology for enhancing the testability of integrated circuit (IC) packages, particularly those characterized by fine-pitch interconnects. This technical analysis delves into the architectural considerations, implementation details, and performance implications of this innovative approach.\n\n**Technical Architecture and Problem Domain:**\nModern IC packages, such as Ball Grid Arrays (BGAs) and Land Grid Arrays (LGAs), feature extremely fine pitches to achieve high input/output (I/O) density and compact form factors. This density, while beneficial for performance and miniaturization, poses significant challenges for Design-for-Test (DFT). Traditional test methods often require dedicated space for probes or external test pads, leading to increased package size, complex routing, parasitic effects, and compromised signal integrity. The architecture described in this patent addresses this by integrating test access points directly into the package structure without externalizing them or demanding additional footprint.\n\n**Implementation Details and Core Algorithm:**\n1.  **Package Design Reception and Modification:** The method begins with receiving an existing or new IC package design. This implies a design automation toolchain capable of parsing complex package layouts (e.g., Gerber files, GDSII data). A processor-implemented algorithm then analyzes this design to identify potential locations for test pad integration. This analysis considers factors such as signal criticality, power/ground distribution, thermal constraints, and structural integrity.\n2.  **Solder Ball De-population Strategy:** The core innovation is the selective 'de-population' of solder balls. The algorithm identifies specific solder ball locations that are either redundant, non-critical for essential device functionality, or can be safely removed without impacting the package's electrical performance or mechanical robustness. This selection process is critical; it ensures that essential power, ground, and high-speed signal paths remain intact. The abstract mentions 'selected locations,' indicating an intelligent decision-making process, likely driven by design rules and electrical performance simulations.\n3.  **Test Pad Provisioning:** Once selected solder ball locations are de-populated, test pads are provided in their place. These test pads are integrated onto the PCB-facing surface of the package. The patent specifies a particular configuration: test pads are provided in a plurality of concentric annular rows. This arrangement is highly effective for achieving comprehensive test coverage across the entire die area, facilitating the testing of internal logic, memory blocks, and peripheral interfaces. The concentric layout allows for flexible access to different regions of the die.\n4.  **Interference Mitigation:** A critical aspect of this invention is its meticulous approach to preventing interference. The test pads are specifically located at a subset of locations opposing at least one via position on a package-facing surface of the PCB. This precise geometric placement ensures that the newly introduced test pads do not electrically or physically interfere with existing vias. Vias are essential for routing signals and power through the package substrate, and maintaining their integrity is paramount for preserving the 'large number of signal pins' characteristic of high-performance ICs. This design choice minimizes parasitic capacitance and inductance, thereby safeguarding signal integrity.\n\n**Performance Characteristics and Integration Patterns:**\nThis method directly contributes to improved test coverage, which translates to higher fault detection rates and enhanced product reliability. By integrating test pads internally, it reduces the need for external probing, which can be mechanically challenging and susceptible to contact resistance issues in fine-pitch environments. The processor-implemented nature suggests integration with existing Electronic Design Automation (EDA) tools, allowing for automated design modifications and verification. The ability to modify existing package designs implies a non-invasive integration pattern, where this technology can be layered onto existing manufacturing processes without requiring a complete overhaul.\n\n**Code-Level Implications:**\nImplementing this patent would involve developing sophisticated algorithms within an EDA suite. These algorithms would include:\n*   **Layout Analysis:** Parsing and analyzing complex BGA/LGA layouts to identify solder ball coordinates, connectivity, and criticality.\n*   **De-population Heuristics/Optimization:** Algorithms to select optimal solder ball locations for de-population, potentially using graph theory or optimization techniques to minimize impact on signal integrity and power delivery networks.\n*   **Test Pad Generation:** Automated generation of test pad geometries and their placement, ensuring adherence to design rules and the concentric annular row configuration.\n*   **DRC/LVS Integration:** Integration with Design Rule Check (DRC) and Layout Versus Schematic (LVS) tools to verify that the modified design remains electrically correct and manufacturable, particularly regarding via interference. This Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby offers a compelling solution for the pervasive challenges of testability in advanced semiconductor packaging.","business_analysis":"The \"Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby\" patent (US-9853007) represents a significant advancement with profound business implications for the semiconductor and electronics manufacturing industries. By addressing a critical bottleneck in integrated circuit (IC) testing, this innovation unlocks substantial market opportunities, provides competitive advantages, and offers attractive revenue potential.\n\n**Market Opportunity Size:**\nModern electronics, from smartphones and IoT devices to high-performance computing (HPC) and automotive systems, rely on increasingly dense and complex IC packages. The global semiconductor market is projected to reach over a trillion dollars in the coming years, with packaging and testing representing a substantial portion of the value chain. The fine-pitch packaging segment, specifically targeted by this patent, is growing rapidly due to the continuous demand for miniaturization and higher functionality. This invention directly impacts the yield, quality, and cost-efficiency of these high-volume, high-value components, positioning it within a multi-billion dollar market segment that demands innovative testing solutions.\n\n**Competitive Advantages:**\nThis patent offers several compelling competitive advantages for companies adopting its methodology:\n1.  **Superior Test Coverage & Reliability:** By integrating test pads directly into the package without compromising space or signal integrity, manufacturers can achieve significantly higher test coverage. This leads to earlier defect detection, improved product reliability, and reduced field failures, thereby enhancing brand reputation and customer satisfaction.\n2.  **Cost Reduction:** Traditional testing methods for fine-pitch packages are often expensive, requiring specialized external equipment or complex probing setups. This invention reduces the need for such external complexities, streamlining the testing process. Lower defect rates and improved yields also translate into substantial cost savings on rework, scrap, and warranty claims.\n3.  **Optimized Footprint & Performance:** Unlike solutions that add to package size, this method leverages existing (de-populated) solder ball locations. This allows for the continued pursuit of miniaturization without sacrificing testability, a critical factor in space-constrained applications. It maintains a high number of signal pins and avoids via interference, preserving the electrical performance of the IC.\n4.  **Accelerated Time-to-Market:** The ability to modify existing package designs with this processor-implemented method simplifies the integration process, reducing design cycles and accelerating the time-to-market for new products.\n\n**Revenue Potential and Business Models:**\nRevenue generation from this patent could manifest through several business models:\n*   **Licensing:** Semiconductor IP (Intellectual Property) licensing to major IC manufacturers, fabless design houses, and OSAT (Outsourced Semiconductor Assembly and Test) companies. This would involve per-unit royalties or upfront licensing fees.\n*   **EDA Tool Integration:** Integrating the methodology into existing Electronic Design Automation (EDA) software suites, either as a standalone module or through partnerships with leading EDA vendors. This creates a recurring revenue stream from software licenses and maintenance.\n*   **Consulting & Implementation Services:** Offering expert services to companies seeking to implement this advanced testing methodology within their existing product lines and manufacturing processes.\n\n**Strategic Positioning:**\nCompanies leveraging this patent can strategically position themselves as leaders in advanced packaging, quality assurance, and high-reliability electronics. It allows them to differentiate their offerings by promising superior product quality and efficiency. This innovation is particularly attractive to industries where failure is not an option, such as medical devices, aerospace, and high-end industrial controls.\n\n**ROI Projections:**\nAdopting the Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby promises a strong Return on Investment (ROI) through:\n*   **Reduced Manufacturing Costs:** Savings from lower scrap rates, less rework, and optimized test times.\n*   **Improved Product Quality:** Leading to fewer warranty claims, enhanced brand loyalty, and potentially higher pricing power.\n*   **Faster Product Cycles:** The ability to bring new, highly reliable products to market more quickly, capturing market share and revenue sooner.\n\nIn essence, this patent provides a foundational technology for building more robust, cost-effective, and smaller integrated circuits, making it an invaluable asset for any company operating in the advanced electronics manufacturing ecosystem.","faqs":[{"answer":"The \"Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby\" is a patent (US-9853007) that describes an innovative process for manufacturing and testing integrated circuit (IC) packages. Specifically, it focuses on enhancing the testability of fine-pitch IC packages—those with very densely packed connections—without increasing their physical size or compromising their electrical performance.\n\nThe core of this invention is a processor-implemented method that strategically modifies the design of an IC package. It achieves this by repurposing certain non-critical locations within the package to incorporate test pads. This allows for more thorough and efficient testing of the complex internal circuitry, which is crucial for ensuring the reliability of modern electronic devices. This patent represents a significant advancement in semiconductor manufacturing and quality assurance.\n\nThis method is particularly relevant for the challenges posed by modern, miniaturized electronics, where every millimeter of space is critical, and the demand for flawless performance is non-negotiable. It offers a practical and scalable solution to a long-standing problem in the industry, promising benefits across various sectors reliant on advanced integrated circuits.\n\nKeywords: integrated circuit package, IC manufacturing, fine-pitch package, testability, patent US-9853007, semiconductor innovation, electronic device reliability.","question":"What is 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby'?"},{"answer":"The Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby works through an ingenious two-step, processor-implemented process. First, it involves 'de-populating' solder balls at selected, non-critical locations within a fine-pitch IC package. Solder balls are the tiny connections that link the chip to the circuit board. By 'de-populating,' the method essentially identifies and strategically omits or removes specific solder balls that are not essential for the chip's primary function or mechanical stability, thereby creating small, empty spaces.\n\nSecond, these newly vacant spots are then precisely used to 'provide test pads.' These test pads are dedicated electrical contact points that allow external test equipment to connect and perform diagnostics on the integrated circuit. The patent details that these test pads are often arranged in concentric annular rows, ensuring comprehensive test coverage across the entire chip area. This strategic placement allows for thorough testing without needing to add extra space to the package.\n\nCrucially, the design ensures that these test pads are located on the PCB-facing surface of the package in a way that *does not interfere* with the 'vias'—which are essential internal electrical pathways within the package. This meticulous approach maintains the high number of signal pins and the overall electrical performance of the IC, solving the long-standing trade-off between testability and package density.\n\nKeywords: how it works, solder ball de-population, test pads, fine pitch package, processor-implemented method, via interference, IC testing process, integrated circuit design.","question":"How does 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby' work?"},{"answer":"The Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby solves the critical problem of effectively testing high-density, fine-pitch integrated circuit (IC) packages without compromising their size, performance, or manufacturing cost. As electronic devices become smaller and more powerful, ICs are designed with increasingly dense arrays of connections (solder balls) packed extremely close together.\n\nThis 'fine-pitch' design makes traditional testing methods extremely challenging. External probes struggle with precision and risk damaging the delicate connections. Adding dedicated test structures typically means increasing the package's physical footprint, which is unacceptable for miniaturized devices. Furthermore, complex routing for test access can introduce parasitic effects that degrade signal integrity, or lead to higher manufacturing costs and slower production cycles.\n\nThis patent provides a solution that eliminates these compromises. By intelligently repurposing existing space within the package for test pads, it enables comprehensive test coverage and robust diagnostics. This ensures that chips are thoroughly verified for functionality and reliability, leading to higher quality products and reduced failure rates, all while maintaining the compact dimensions and high performance demanded by modern electronics.\n\nKeywords: IC testing problems, fine pitch packaging challenges, miniaturization, chip reliability issues, manufacturing cost reduction, signal integrity, electronic device defects, semiconductor bottlenecks.","question":"What problem does 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby' solve?"},{"answer":"The patent data provided for \"Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby\" (US-9853007) does not list the inventors. Often, patent information for public viewing might omit specific inventor names or assignees for various reasons, or this information might not have been provided in the initial prompt.\n\nTypically, patents are filed by individual inventors or, more commonly, by corporations (assignees) who employ the inventors. These corporations invest in research and development, and the resulting inventions are then assigned to them. The patent abstract indicates a 'processor-implemented method,' suggesting a sophisticated engineering team or individual with expertise in integrated circuit design, manufacturing processes, and potentially design automation software.\n\nTo find the exact inventors, one would typically refer to the full patent document available from patent offices like the USPTO, where such details are publicly recorded upon grant or publication. This information is crucial for acknowledging the intellectual property creators and understanding the background of the innovation.\n\nKeywords: patent inventors, US-9853007, intellectual property, semiconductor engineers, integrated circuit design, patent assignment, R&D team.","question":"Who invented 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby'?"},{"answer":"The Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby offers several critical benefits for the semiconductor and electronics industries:\n\nFirstly, it significantly **enhances IC testability and reliability**. By integrating test pads directly into the package, manufacturers can achieve more comprehensive test coverage, leading to earlier detection of defects. This results in higher quality products, fewer field failures, and improved overall reliability of electronic devices.\n\nSecondly, it leads to **reduced manufacturing costs and improved yields**. More efficient and thorough testing minimizes rework and scrap rates, directly translating into cost savings. The streamlined testing process can also reduce the need for expensive external test equipment and shorten production cycles, improving overall manufacturing efficiency.\n\nThirdly, the invention enables **optimized package footprint and preserved performance**. It allows for robust testability without increasing the physical size of the IC package, which is crucial for miniaturized devices. Moreover, by meticulously designing test pads to avoid interference with vias, the patent ensures that the high number of signal pins and the electrical performance of the integrated circuit are maintained without degradation. This ensures that advanced chips can be both compact and high-performing.\n\nKeywords: key benefits, IC reliability, cost reduction, manufacturing efficiency, optimized footprint, preserved performance, semiconductor advantages, enhanced testability.","question":"What are the key benefits of 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby'?"},{"answer":"The Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby distinguishes itself from prior art by offering a fundamentally different approach to integrating test access points within integrated circuit (IC) packages. Traditional methods often involve external probing, which is challenging and prone to errors for fine-pitch packages, or adding dedicated test structures that inevitably increase the package's physical footprint.\n\nIn contrast, this invention innovates by *repurposing existing space*. Instead of adding new components or structures externally, it intelligently de-populates non-critical solder balls at selected locations within the fine-pitch package. These vacated spots are then utilized to create integrated test pads. This 'subtractive-repurposing' approach is a key differentiator, allowing for testability without demanding additional physical real estate.\n\nFurthermore, the patent's meticulous design ensures that these test pads are placed in concentric annular rows for comprehensive coverage and, critically, do not interfere with the essential via connections. Prior art often struggles with maintaining signal integrity and high signal pin counts when attempting to incorporate test points in dense areas. This method overcomes that challenge, providing superior testability while preserving the electrical performance and compact size of modern ICs.\n\nKeywords: prior art comparison, IC testing differentiation, solder ball de-population, integrated test pads, space optimization, via interference mitigation, semiconductor innovation, competitive edge.","question":"How is 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby' different from prior art?"},{"answer":"The Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby is set to have a significant impact across a wide range of industries that rely heavily on advanced integrated circuits (ICs) and high-density packaging. Its ability to enhance testability without compromising size or performance makes it broadly applicable.\n\n**Consumer Electronics:** This includes smartphones, tablets, wearables, laptops, and smart home devices. These products are constantly striving for smaller form factors and higher performance, making the patent's ability to maintain package density while improving reliability invaluable.\n\n**Automotive Electronics:** Modern vehicles, especially electric and autonomous cars, depend on numerous complex and highly reliable ICs for engine control, infotainment, safety systems, and ADAS (Advanced Driver-Assistance Systems). Enhanced testability directly translates to improved safety and longevity in this critical sector.\n\n**High-Performance Computing (HPC) and Data Centers:** Servers, AI accelerators, and networking equipment require extremely reliable and high-density processors. This invention can lead to more robust and efficient data center infrastructure by ensuring the quality of their core components.\n\n**Internet of Things (IoT):** From industrial sensors to smart city infrastructure, IoT devices often operate in challenging environments and demand long-term reliability in compact packages. The patent's benefits in testability and reliability are crucial for the widespread adoption and trust in IoT.\n\n**Medical Devices:** Life-critical medical equipment, such as implants and diagnostic tools, requires the highest levels of reliability. This technology can contribute to the development of safer and more dependable medical electronics. Ultimately, any industry utilizing advanced microchips will benefit from the enhanced quality and efficiency this patent provides.\n\nKeywords: industry impact, consumer electronics, automotive electronics, HPC, IoT devices, medical devices, semiconductor applications, electronic manufacturing sectors.","question":"What industries will 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby' impact?"},{"answer":"The patent \"Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby\" (US-9853007) was officially filed on **October 29, 2015**.\n\nIt was subsequently published and granted on **December 26, 2017**.\n\nThe filing date marks the official submission of the invention to the patent office, establishing its priority date. The publication/grant date signifies when the patent was formally issued, making its details publicly available and granting the patent holder exclusive rights to the invention for a specified period. These dates are crucial for understanding the patent's timeline, its position relative to prior art, and its remaining term of protection.\n\nKeywords: patent filing date, patent granted date, US-9853007 timeline, intellectual property dates, patent publication, invention timeline, semiconductor patent history.","question":"When was 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby' filed/granted?"},{"answer":"The commercial applications of the Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby are extensive, primarily revolving around the manufacturing and quality assurance of integrated circuit (IC) packages across various high-tech sectors.\n\n**Semiconductor Manufacturing:** Foundries and OSAT (Outsourced Semiconductor Assembly and Test) companies can integrate this method into their production lines to improve yields, reduce scrap, and lower testing costs. This translates directly into more profitable manufacturing operations and the ability to offer competitive pricing.\n\n**IC Design and EDA Tools:** Fabless semiconductor companies and Electronic Design Automation (EDA) tool vendors can incorporate the principles of this patent into their design software. This allows for automated optimization of package designs for testability, streamlining the design process and accelerating time-to-market for new chips.\n\n**Advanced Packaging Solutions:** Companies specializing in advanced packaging technologies (e.g., 2.5D/3D integration, wafer-level packaging) can leverage this patent to provide superior testability for their complex, multi-die solutions. This enhances the reliability of high-value, high-performance packages.\n\n**Quality Assurance and Reliability Testing:** Test equipment manufacturers can develop specialized probes and testers optimized to interface with the integrated test pads, offering more precise and efficient diagnostic solutions to their clients. This leads to higher confidence in product quality across the supply chain. Ultimately, the patent facilitates the production of more reliable, cost-effective, and compact electronic components for a global market.\n\nKeywords: commercial applications, semiconductor manufacturing, IC design, EDA tools, advanced packaging, quality assurance, reliability testing, market opportunities, chip production.","question":"What are the commercial applications of 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby'?"},{"answer":"The Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby lays a robust foundation for several exciting future developments in microelectronics. We can anticipate advancements building upon its core principles of integrated, non-intrusive testability.\n\nOne key area is the **development of more sophisticated, AI-driven de-population algorithms**. Future systems could use machine learning to dynamically identify optimal solder ball locations for de-population, considering real-time manufacturing data, specific chip functionalities, and even predicting potential failure points to further enhance test coverage. This would make the design modification process even more intelligent and adaptable.\n\nAnother significant development could be the **integration of these test pads into active, on-chip diagnostic systems**. Instead of just being passive contact points for external testers, these pads could become part of a chip's built-in self-monitoring capabilities. This would enable real-time health checks, predictive maintenance, and adaptive performance adjustments, crucial for mission-critical applications like autonomous vehicles or medical implants.\n\nFurthermore, as packaging technologies evolve towards **3D-ICs and heterogeneous integration (chiplets)**, the principles of this patent could be extended to provide internal test access within these complex, multi-layered structures. This would be vital for testing individual chiplets before or after integration, ensuring the reliability of the entire stack. Ultimately, the patent paves the way for a future of even smarter, more reliable, and increasingly autonomous electronic components.\n\nKeywords: future developments, AI-driven design, on-chip diagnostics, 3D-ICs, heterogeneous integration, adaptive testing, self-monitoring chips, microelectronics trends.","question":"What are the future developments expected for 'Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby'?"}],"topics":["integrated circuit package","IC testing","fine pitch package","semiconductor manufacturing","chip reliability","relentless","march","semiconductor"],"tech_cluster":null},"seo":{"title":"IC Package Testing - Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby - US-9853007","description":"Revolutionary Method for Producing an Integrated Circuit Package and Apparatus Produced Thereby enhances chip testability. De-populate solder balls for test pads, maintain signal pins. Explore patent US-9853007.","keywords":["integrated circuit package","IC testing","fine pitch package","semiconductor manufacturing","chip reliability","test pads","solder ball de-population","electronic device innovation","patent US-9853007","microelectronics testing","advanced packaging","design for test","via interference","signal integrity"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853007","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853007","citation_suggestion":"Patentable. \"Method for producing an integrated circuit package and apparatus produced thereby\" (US-9853007). https://patentable.app/patents/US-9853007","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853007","json":"https://patentable.app/api/llm-context/US-9853007","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:17:31.926Z"}