{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853010","patent":{"patent_number":"US-9853010","title":"Method of fabricating a semiconductor package","assignee":null,"inventors":[],"filing_date":"2015-12-03T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser."},"analysis":{"summary":"The Method of Fabricating a Semiconductor Package (US-9853010) is a groundbreaking patent that introduces a novel and highly effective approach to bonding semiconductor chips to package substrates, significantly enhancing the reliability and performance of electronic devices. The core innovation lies in its ability to overcome the pervasive challenge of metal oxide layer formation on solder joints, which traditionally compromises bond integrity.\n\nThis patent solves the critical problem of achieving robust and reliable solder connections in semiconductor packaging, where oxide layers on solder balls and pads hinder proper metallic bonding. Existing solutions often involve aggressive fluxes or high temperatures, which can introduce their own set of reliability issues or thermal stresses on delicate components.\n\nThe key technical approach involves a synergistic combination of a specialized underfill resin and precise laser irradiation. The method entails mounting a semiconductor chip with a solder ball onto a package substrate's pad. Critically, the interstitial space is then filled with an underfill resin that incorporates a reducing agent, specifically one containing a carboxyl group. Subsequently, the semiconductor chip is irradiated with a laser. The heat generated by the laser serves a dual purpose: it melts the solder and, simultaneously, activates the reducing agent. This activated agent chemically transforms the metal oxide layers present on the surfaces of both the solder ball and the pad into pure metal, creating an impeccably clean and conductive interface for a superior solder bond.\n\nThe business value and applications of this technology are substantial. It promises significantly improved device reliability, extended product lifespans, and higher manufacturing yields by reducing defects related to poor solder joints. This approach supports the ongoing trend towards miniaturization and higher integration densities, making it invaluable for advanced packaging techniques in areas like high-performance computing, artificial intelligence hardware, and automotive electronics. The market opportunity is vast, as it addresses a fundamental reliability concern across the entire semiconductor industry, offering a competitive advantage to manufacturers adopting this innovation.","layman_explanation":"### What Problem Does This Solve?\nImagine the intricate dance happening inside your smartphone or laptop. Thousands, even millions, of tiny computer chips are connected to circuit boards with microscopic dots of solder. For these devices to work flawlessly and last a long time, these connections need to be incredibly strong and reliable. The big problem the Method of Fabricating a Semiconductor Package patent solves is a common invisible enemy: 'rust' or, more technically, metal oxide layers that form on these tiny solder connections and the pads they attach to. These oxide layers act like a barrier, preventing the solder from forming a perfect, strong bond. Think of trying to glue two surfaces together, but there’s a thin, flaky layer of dirt in between – the glue won’t hold as well. This leads to weaker connections, which can cause devices to malfunction, slow down, or simply fail sooner than they should. Existing solutions often involve harsh chemicals or excessive heat, which can damage the delicate components or leave residues.\n\n### How Does It Work?\nThis innovation introduces a clever, two-pronged approach to overcome this 'oxide barrier.' Picture a tiny computer chip, which has a small 'solder ball' underneath, being placed onto a specific spot (a 'pad') on a circuit board. Here's where the Method of Fabricating a Semiconductor Package shines:\n1.  **Special 'Goo' (Underfill Resin):** After the chip is placed, a unique liquid material, called an 'underfill resin,' is flowed into the tiny gap between the chip and the circuit board. This isn't just any protective goo; it's specially formulated to contain a 'secret ingredient' – a reducing agent, specifically one with a 'carboxyl group.' You can think of this reducing agent as a tiny, dormant cleaning crew.\n2.  **Precision 'Light Beam' (Laser):** Next, a highly focused laser beam is directed at the computer chip. This laser isn't just melting the solder; it's doing something much more sophisticated. The heat generated by the laser is very precise and localized. This heat activates the 'cleaning crew' (the reducing agent) in the underfill resin.\n3.  **Invisible Transformation:** Once activated, this special cleaner goes to work. It chemically reacts with those problematic metal oxide layers on both the solder ball and the circuit board pad. It essentially 'eats away' the oxygen from the rust, turning the non-conductive oxide layer back into pure, shiny metal. With this clean, metallic surface, the molten solder can now form a truly perfect, strong, and highly conductive bond. It's like wiping away the dirt from the LEGO bricks right before you click them together, ensuring a super-tight fit.\n\n### Why Does This Matter?\nThis patent matters immensely because it directly impacts the reliability and performance of virtually every electronic device we use. For consumers, it means more durable smartphones, laptops, and smart home gadgets that last longer and perform more consistently. For industries, it's a game-changer:\n*   **Enhanced Reliability:** Devices built with this technology will have significantly stronger internal connections, leading to fewer failures, reduced warranty claims, and higher customer satisfaction.\n*   **Miniaturization and Performance:** The ability to create such robust bonds without aggressive chemicals or excessive heat enables manufacturers to design even smaller, more complex, and more powerful chips (like those in advanced AI systems or autonomous vehicles) with greater confidence in their long-term performance.\n*   **Manufacturing Efficiency:** By ensuring better bond quality from the outset, manufacturers can achieve higher production yields (fewer defective chips) and potentially streamline their processes, leading to cost savings and faster time-to-market. It's a foundational improvement that touches everything from basic consumer electronics to critical aerospace components.\n\n### What's Next?\nThis innovation paves the way for the next generation of electronics. We can expect to see devices that are not only smaller and faster but also incredibly robust, even in challenging environments. This technology could accelerate the development of advanced packaging techniques like 3D chip stacking, where layers of chips are built on top of each other, demanding absolute precision and reliability in every connection. For investors, this represents a significant opportunity in the semiconductor manufacturing and advanced materials sectors, as companies will seek to integrate this superior bonding method to gain a competitive edge and meet the escalating demands for high-performance, ultra-reliable electronics.","technical_analysis":"The Method of Fabricating a Semiconductor Package, as detailed in US-9853010, represents a significant advancement in semiconductor assembly, specifically addressing the critical challenge of achieving robust and reliable solder interconnections. The technical architecture of this innovation centers on a synergistic integration of material science and precision energy delivery, targeting the in-situ reduction of deleterious metal oxide layers.\n\n**Technical Architecture and Process Flow:**\nThe system comprises a package substrate, a semiconductor chip, a solder ball, a specialized underfill resin, and a laser irradiation unit. The process unfolds in several key steps:\n1.  **Substrate and Chip Preparation:** A package substrate, equipped with a conductive pad, is provided. A semiconductor chip, typically featuring a solder ball (e.g., made of Sn-Ag-Cu alloy) for electrical and mechanical connection, is prepared for mounting.\n2.  **Mounting:** The semiconductor chip is precisely mounted onto the package substrate, ensuring the solder ball is accurately positioned on the corresponding pad.\n3.  **Underfill Application:** A critical step involves filling the space between the package substrate and the semiconductor chip with a unique underfill resin. Unlike conventional underfills that primarily provide mechanical support and thermal stress relief, this specialized resin is engineered to include a reducing agent. The patent specifically highlights a reducing agent comprising a carboxyl (–COOH) functional group, known for its ability to donate electrons and facilitate reduction reactions.\n4.  **Laser Irradiation and Bonding:** The assembled unit is then subjected to laser irradiation. The laser is directed at the semiconductor chip, generating highly localized heat. This thermal energy serves a dual purpose: it causes the solder ball to melt, facilitating the physical connection, and simultaneously activates the carboxyl group-containing reducing agent within the underfill. The activated reducing agent chemically reacts with the metal oxide layers (e.g., tin oxides on solder, copper oxides on pads) that naturally form on the surfaces of the solder ball and the pad. This reaction transforms these insulating metal oxides back into pure, conductive metal. With the oxide barrier removed, the molten solder can form a direct, clean, and strong metallurgical bond with the pad through interdiffusion and alloying.\n\n**Implementation Details and Algorithm Specifics:**\nThe efficacy of this method hinges on several precise implementation details:\n*   **Reducing Agent Chemistry:** The choice of a carboxyl group-containing reducing agent is crucial. Carboxyl groups are capable of acting as mild reducing agents, particularly when thermally activated. Their presence in the underfill ensures intimate contact with the oxide layers. The concentration and specific formulation of the reducing agent within the underfill must be carefully optimized to achieve efficient oxide reduction without introducing undesirable side reactions or residues.\n*   **Laser Parameters:** The laser system requires precise control over wavelength, power density, pulse duration (for pulsed lasers), and scan speed. These parameters are critical for generating sufficient localized heat to melt the solder and activate the reducing agent, while simultaneously minimizing thermal stress on the surrounding delicate semiconductor structures. The absorption characteristics of the chip and solder materials influence the choice of laser wavelength (e.g., infrared lasers for selective heating).\n*   **Heat Generation and Oxide Reduction Mechanism:** The laser-induced localized heating causes the underfill to reach a temperature where the carboxyl group becomes chemically reactive. The reducing agent then donates electrons to the metal oxide, reducing it to its metallic state (ee.g., SnO2 + reducing agent -> Sn + H2O + CO2). This in-situ, flux-free reduction ensures that the molten solder interfaces with a pristine metal surface, leading to superior wetting and metallurgical bonding.\n\n**Integration Patterns and Performance Characteristics:**\nThis approach seamlessly integrates into existing semiconductor assembly lines with the addition of a laser bonding station. It is particularly well-suited for fine-pitch interconnections and advanced packaging schemes such as 2.5D/3D integration, wafer-level chip-scale packages (WLCSP), and flip-chip bonding, where traditional fluxing and global reflow methods present significant challenges.\n\nThe performance characteristics are markedly improved:\n*   **Enhanced Bond Strength:** The removal of oxide layers results in stronger, more reliable metallurgical bonds, significantly increasing shear strength and fatigue resistance of the solder joints.\n*   **Improved Electrical Conductivity:** A clean metal-to-metal interface reduces contact resistance, leading to better electrical performance.\n*   **Reduced Defects:** The in-situ, localized process minimizes defects such as voids, non-wetting, and delamination commonly associated with oxide presence or flux residues.\n*   **Thermal Management:** Localized laser heating reduces overall thermal budget and stress on the package, allowing for more sensitive components and materials.\n\n**Code-Level Implications:**\nWhile this patent is hardware and materials-focused, its implementation necessitates sophisticated software for laser control. This includes algorithms for precise laser beam steering, power modulation, temperature feedback control, and vision systems for accurate alignment and defect detection. Optimization routines would be critical for determining optimal laser parameters based on material properties and package geometries. This Method of Fabricating a Semiconductor Package represents a robust, scalable, and high-performance solution for next-generation semiconductor packaging.","business_analysis":"The Method of Fabricating a Semiconductor Package (US-9853010) represents a pivotal innovation with substantial business implications across the semiconductor industry and its vast downstream markets. As the demand for smaller, faster, and more reliable electronic devices continues its exponential growth, the integrity of semiconductor packaging becomes an ever more critical differentiator. This patent directly addresses a fundamental weakness in traditional chip assembly, unlocking significant market opportunities and competitive advantages.\n\n**Market Opportunity Size and Growth:**\nThe global semiconductor packaging market is a multi-billion dollar industry, projected to grow significantly, driven by trends like 5G, AI, IoT, automotive electronics, and high-performance computing. Advanced packaging, which includes flip-chip, 2.5D, and 3D integration, is a particularly fast-growing segment. The core problem this patent solves – reliable, high-integrity solder bonding – is universal across nearly all semiconductor devices. Any technology that enhances reliability and yield in this foundational process taps into a massive addressable market. The increased demand for mission-critical applications (e.g., autonomous vehicles, medical devices) further amplifies the value of robust packaging solutions, expanding the premium segment of this market.\n\n**Competitive Advantages:**\nCompanies adopting the Method of Fabricating a Semiconductor Package will gain distinct competitive advantages:\n1.  **Superior Product Reliability:** The ability to form consistently strong, oxide-free solder bonds translates directly into products with higher reliability and longer operational lifespans. This reduces warranty claims, enhances brand reputation, and allows for premium pricing in critical applications.\n2.  **Improved Manufacturing Yields:** By mitigating defects caused by poor solder wetting and oxide layers, manufacturers can achieve higher yields, reducing scrap and rework costs. This directly impacts the bottom line and improves manufacturing efficiency.\n3.  **Enabling Advanced Packaging:** The precision of laser-assisted bonding and the in-situ oxide reduction are ideal for fine-pitch interconnections and complex 2.5D/3D packaging architectures, which are key to future high-performance chips. This innovation allows companies to lead in the development and production of next-generation devices.\n4.  **Reduced Environmental Impact:** By minimizing or eliminating the need for harsh chemical fluxes, this method can contribute to a cleaner manufacturing process, aligning with increasing environmental regulations and corporate sustainability goals.\n\n**Revenue Potential and Business Models:**\nRevenue generation from this patent could manifest through several business models:\n*   **Licensing:** The patent holder could license the technology to major semiconductor manufacturers (fabs, OSATs – Outsourced Semiconductor Assembly and Test companies) for integration into their production lines.\n*   **Equipment Sales:** Developing and selling specialized laser bonding equipment integrated with underfill dispensing systems that leverage this patented method.\n*   **Material Sales:** Commercializing the specialized underfill resin containing the carboxyl group reducing agent.\n*   **Foundry Services:** Offering advanced packaging services that utilize this technology to customers seeking high-reliability solutions.\n\n**Strategic Positioning:**\nThis innovation strategically positions companies at the forefront of advanced semiconductor packaging. It offers a powerful differentiator in a highly competitive market where incremental gains in performance and reliability are highly valued. Companies leveraging this approach can target high-growth segments such as AI accelerators, edge computing, high-bandwidth memory (HBM), and automotive microcontrollers, where robust interconnects are non-negotiable.\n\n**ROI Projections:**\nThe return on investment (ROI) for adopting this technology can be substantial. Quantifiable benefits include reduced defect rates (leading to lower scrap costs), increased throughput from streamlined processes, enhanced product performance justifying higher average selling prices (ASPs), and reduced warranty and recall expenses due to improved reliability. For a company producing millions of chips, even a fractional percentage increase in yield or reliability can translate into millions of dollars in savings and increased revenue. The long-term ROI also includes strengthening market position and fostering innovation in future product development. The Method of Fabricating a Semiconductor Package is not merely a technical improvement; it is a strategic asset that promises significant economic returns.","faqs":[{"answer":"The Method of Fabricating a Semiconductor Package (US-9853010) is a patented innovation in semiconductor manufacturing that describes a novel process for creating highly reliable solder bonds between a semiconductor chip and its package substrate. This invention addresses the long-standing challenge of metal oxide layers forming on solder and pad surfaces, which typically hinder robust electrical and mechanical connections.\n\nAt its core, this method involves providing a package substrate with a pad, mounting a semiconductor chip with a solder ball onto that pad, and then filling the interstitial space with a specialized underfill resin. Crucially, this underfill resin contains a reducing agent, specifically one comprising a carboxyl group. The final step is to irradiate the semiconductor chip with a laser.\n\nThe genius of this approach lies in the laser-induced heat. This heat not only melts the solder but also activates the reducing agent within the underfill. This activated agent then chemically transforms the problematic metal oxide layers on both the solder ball and the pad surfaces back into pure metal. The result is a pristine metallic interface, allowing the molten solder to form an exceptionally strong, reliable, and electrically conductive bond.\n\nThis technology is set to significantly enhance the longevity and performance of electronic devices by ensuring superior internal connections, making it a critical advancement in microelectronics fabrication. It offers a cleaner and more precise alternative to traditional flux-based soldering methods.","question":"What is Method of Fabricating a Semiconductor Package?"},{"answer":"The Method of Fabricating a Semiconductor Package operates through an innovative, synergistic process that combines advanced materials with precision energy delivery to achieve superior solder bonding. Here’s a step-by-step breakdown:\n\nFirst, a package substrate, which features a conductive pad, is prepared. A semiconductor chip, equipped with a solder ball (the tiny metallic sphere that forms the connection), is then precisely mounted onto this substrate, ensuring the solder ball is correctly positioned on the pad.\n\nNext, a critical material is introduced: a specialized underfill resin. This resin is flowed into the tiny gap between the semiconductor chip and the package substrate. Unlike conventional underfills that primarily provide mechanical support, this particular resin is engineered to contain a reducing agent. The patent specifically highlights a reducing agent comprising a carboxyl group, which is a chemical compound capable of facilitating reduction reactions.\n\nThe final and most innovative step involves laser irradiation. The semiconductor chip is precisely targeted and irradiated with a laser. The heat generated by this laser serves a dual purpose: it melts the solder ball, allowing it to become molten, and simultaneously activates the carboxyl group-containing reducing agent within the underfill. This activated reducing agent then chemically reacts with the metal oxide layers that naturally form on the surfaces of both the solder ball and the pad. This reaction effectively converts these insulating metal oxide layers back into pure, conductive metal.\n\nBy transforming the metal oxide layers into pure metal at the precise moment of soldering, the molten solder encounters a perfectly clean and unoxidized metallic surface. This enables the formation of an exceptionally strong, reliable, and electrically efficient metallurgical bond, free from the interference of detrimental oxide barriers. This Method of Fabricating a Semiconductor Package is a sophisticated solution that ensures high-quality interconnections for modern electronics. Keywords: laser bonding, underfill resin, reducing agent, metal oxide reduction, solder ball, package substrate.","question":"How does Method of Fabricating a Semiconductor Package work?"},{"answer":"The Method of Fabricating a Semiconductor Package patent directly solves a pervasive and costly problem in semiconductor manufacturing: the formation of metal oxide layers on solder joints, which severely compromises the reliability and performance of electronic devices.\n\nTraditionally, when metallic surfaces like those on solder balls and package pads are exposed to air, they naturally form a thin, insulating layer of metal oxide (often referred to as 'rust'). This oxide layer acts as a barrier, preventing the molten solder from forming a direct, strong, and highly conductive metallurgical bond with the underlying metal. The result is weaker connections, increased electrical resistance, and a higher propensity for device failures, especially under thermal or mechanical stress.\n\nPrior art solutions typically rely on aggressive chemical fluxes to remove these oxides. However, fluxes come with their own set of challenges, including leaving corrosive residues that require extensive cleaning, contributing to environmental concerns, and potentially causing damage to delicate components. Furthermore, traditional reflow soldering often involves heating the entire package, which can induce thermal stresses and warpage.\n\nThis innovation circumvents these issues by integrating a reducing agent into the underfill and activating it with a laser. This approach precisely and cleanly removes the oxide layers in situ, ensuring a pristine metallic interface for bonding without the drawbacks of conventional methods. By solving this fundamental problem, the Method of Fabricating a Semiconductor Package significantly boosts the reliability, longevity, and manufacturing efficiency of semiconductor packages. Keywords: metal oxide problem, solder joint reliability, semiconductor manufacturing challenges, flux-free bonding, device failure.","question":"What problem does Method of Fabricating a Semiconductor Package solve?"},{"answer":"The patent for Method of Fabricating a Semiconductor Package (US-9853010) lists inventors, but the provided data does not specify their names. Similarly, the assignee (the company or entity that owns the patent) is also not specified in the provided information. In the patent world, inventors are the individuals who conceived the invention, while the assignee is the party to whom the patent rights are legally transferred, typically an employer.\n\nWhile the specific individuals and company are not provided in this dataset, the innovation itself stems from expert research and development in the field of semiconductor packaging. Such advancements are usually the result of dedicated teams within leading technology companies or research institutions focused on microelectronics and materials science.\n\nUnderstanding the innovation, the Method of Fabricating a Semiconductor Package, is more critical than knowing specific names for its impact. The technology's contribution to improving solder joint reliability and manufacturing efficiency speaks volumes about the expertise involved in its creation. Further details regarding the inventors and assignee would typically be found in the full patent document available through official patent databases. Keywords: patent inventors, patent assignee, US-9853010, semiconductor research, microelectronics development.","question":"Who invented Method of Fabricating a Semiconductor Package?"},{"answer":"The Method of Fabricating a Semiconductor Package offers a multitude of significant benefits that address long-standing challenges in microelectronics manufacturing and enhance the overall quality of electronic devices. These advantages position this innovation as a critical advancement for the industry.\n\nFirstly, it delivers **superior solder joint reliability and strength**. By effectively removing problematic metal oxide layers at the bonding interface through an activated reducing agent, this method ensures a pristine metal-to-metal connection. This results in significantly stronger, more durable, and more electrically conductive solder bonds, drastically reducing the risk of device failure due to compromised interconnections.\n\nSecondly, the process is **flux-free and cleaner**. It eliminates the need for traditional, often aggressive, chemical fluxes that can leave corrosive residues, necessitate extensive cleaning steps, and pose environmental concerns. This leads to a more streamlined and environmentally friendly manufacturing process, preventing potential long-term reliability issues associated with flux residues.\n\nThirdly, it enables **localized thermal processing**. The use of laser irradiation provides highly localized heat, which minimizes the overall thermal budget and stress on the entire semiconductor package. This is crucial for integrating thermally sensitive components and materials, reducing warpage, and improving the manufacturing yield of complex assemblies.\n\nFinally, the Method of Fabricating a Semiconductor Package supports **advanced packaging and miniaturization**. Its precision and ability to create robust bonds without aggressive chemicals make it ideal for ultra-fine-pitch interconnections required by next-generation packaging technologies like flip-chip, 2.5D, and 3D integration. This innovation is pivotal for creating smaller, more powerful, and more reliable electronic devices across various applications. Keywords: semiconductor benefits, chip reliability, flux-free bonding, localized heating, advanced packaging, manufacturing efficiency, electronics performance.","question":"What are the key benefits of Method of Fabricating a Semiconductor Package?"},{"answer":"The Method of Fabricating a Semiconductor Package distinguishes itself significantly from prior art in semiconductor solder bonding by introducing an integrated, in-situ, and highly precise approach to eliminate metal oxide barriers. Traditional methods primarily fall into a few categories, each with limitations that this patent overcomes.\n\n**Traditional Reflow Soldering** relies heavily on chemical fluxes to remove surface oxides. While effective to some extent, these fluxes often leave corrosive residues that require post-cleaning, can be environmentally hazardous, and may not fully clear oxides on very fine-pitch connections. The global heating in reflow ovens also subjects the entire package to high temperatures, potentially causing thermal stress and warpage. The Method of Fabricating a Semiconductor Package, conversely, is **flux-free**, avoiding these issues entirely by chemically reducing oxides with an agent embedded in the underfill, activated by localized laser heat.\n\n**Thermocompression Bonding (TCB)** is a flux-less method that uses heat and pressure. While it can achieve fine pitches and strong bonds, it often requires significant mechanical force, which can damage delicate components, and still needs pre-cleaning or inert atmospheres to manage oxides. This patent, however, performs **in-situ oxide reduction** during the actual bonding, eliminating the need for external pre-cleaning or high pressures, making it gentler on components.\n\n**Mass Reflow in Inert Atmospheres** attempts to prevent oxide formation. While effective, it requires expensive vacuum or inert gas chambers and still involves global heating. The Method of Fabricating a Semiconductor Package uses **localized laser heating**, reducing the overall thermal budget and the need for complex atmospheric control, making it more efficient and cost-effective for targeted bonding.\n\nIn essence, the Method of Fabricating a Semiconductor Package's novelty lies in its synergistic combination of a specialized underfill resin with a carboxyl group reducing agent and precision laser irradiation. This allows for the **real-time chemical transformation of metal oxides back into pure metal at the exact bonding interface**, leading to superior, cleaner, and more reliable connections that surpass the capabilities and mitigate the drawbacks of existing methods. Keywords: prior art comparison, flux-free bonding, laser bonding, underfill innovation, metal oxide reduction, advanced manufacturing, semiconductor differences.","question":"How is Method of Fabricating a Semiconductor Package different from prior art?"},{"answer":"The Method of Fabricating a Semiconductor Package is poised to have a profound impact across a wide array of industries that rely heavily on high-performance, reliable, and miniaturized electronic components. Its ability to create exceptionally strong and reliable solder bonds addresses a fundamental need that spans numerous technological sectors.\n\n**Consumer Electronics:** This includes smartphones, tablets, laptops, wearables, and smart home devices. Enhanced reliability means longer product lifespans, fewer defects, and improved overall user experience, leading to stronger brand loyalty and reduced warranty costs.\n\n**Automotive Electronics:** With the rapid rise of electric vehicles (EVs), autonomous driving systems, and advanced driver-assistance systems (ADAS), the demand for highly reliable and robust semiconductors is critical. Failures in these systems can have severe consequences. The Method of Fabricating a Semiconductor Package ensures the integrity of connections in critical control units, sensors, and infotainment systems, enhancing safety and performance.\n\n**High-Performance Computing (HPC) and Artificial Intelligence (AI):** Data centers, AI accelerators, and supercomputers require densely packed, high-bandwidth memory (HBM) and multi-chip modules (MCMs). The precision and reliability offered by this patent are crucial for these complex architectures, enabling faster data transfer and more efficient processing for demanding computational tasks.\n\n**Medical Devices:** Life-critical medical equipment, from implantable devices to diagnostic tools, demands the highest levels of reliability and miniaturization. The Method of Fabricating a Semiconductor Package can ensure the integrity of connections in pacemakers, monitors, and surgical instruments, where failure is not an option.\n\n**Aerospace and Defense:** Equipment used in aircraft, satellites, and defense systems operates in extreme environments and requires uncompromising reliability. This technology can provide the robust interconnections necessary for mission-critical applications where long-term performance under harsh conditions is paramount.\n\n**Internet of Things (IoT) and Edge Computing:** The proliferation of IoT devices, often operating in challenging environments with limited power, benefits immensely from reliable, compact semiconductor packages. This patent supports the development of more durable and efficient edge devices. Keywords: industry impact, automotive electronics, AI hardware, medical devices, consumer electronics, aerospace, IoT, semiconductor applications.","question":"What industries will Method of Fabricating a Semiconductor Package impact?"},{"answer":"The patent for Method of Fabricating a Semiconductor Package, identified by the number US-9853010, has specific dates associated with its journey through the patent process.\n\nAccording to the provided patent data:\n\n*   **Filing Date:** The patent application for Method of Fabricating a Semiconductor Package was filed on **2015-12-03** (December 3, 2015). This is the date when the inventors or their assignee submitted the initial application to the patent office, formally initiating the patent examination process.\n\n*   **Publication Date:** The patent was published on **2017-12-26** (December 26, 2017). This date typically refers to when the patent office officially publishes the granted patent, making its full details publicly available. The publication signifies that the patent has passed examination and has been officially issued, granting the patent holder exclusive rights to the invention for a specified period.\n\nThese dates are crucial for understanding the patent's lifecycle, its priority date, and the duration of its protection. The time between the filing and publication dates reflects the period during which the patent office conducted its examination, including prior art searches and substantive reviews, before granting the patent for Method of Fabricating a Semiconductor Package. Keywords: patent filing date, patent publication date, US-9853010, patent timeline, intellectual property, semiconductor patent history.","question":"When was Method of Fabricating a Semiconductor Package filed/granted?"},{"answer":"The commercial applications of the Method of Fabricating a Semiconductor Package are extensive and diverse, spanning virtually every sector that relies on advanced electronics. This innovation's ability to create superior, highly reliable solder bonds addresses a fundamental need across numerous product categories.\n\n**High-Performance Computing (HPC) and Data Centers:** This includes server processors, specialized AI accelerators, and high-bandwidth memory (HBM) modules. The patent's method is ideal for densely packed multi-chip modules (MCMs) and 2.5D/3D stacked packages, where reliable, fine-pitch interconnections are critical for maximizing computational power and data throughput in commercial data centers.\n\n**Consumer Electronics:** From flagship smartphones and tablets to high-end laptops, gaming consoles, and smart wearables, the enhanced reliability ensures longer product lifespans, fewer warranty claims, and a premium user experience. This translates to stronger brand reputation and customer loyalty in a highly competitive market.\n\n**Automotive Industry:** Modern vehicles are essentially computers on wheels, with complex electronic control units (ECUs) for engine management, infotainment, safety systems (ADAS), and autonomous driving. The Method of Fabricating a Semiconductor Package provides the robust, long-lasting connections essential for the extreme reliability and safety demands of commercial automotive applications.\n\n**Medical Technology:** Commercial medical devices, including diagnostic equipment, imaging systems, and implantable devices (e.g., pacemakers, neurostimulators), require uncompromising reliability. This technology can ensure the integrity of critical internal connections, contributing to patient safety and device efficacy.\n\n**Industrial and IoT Devices:** Industrial control systems, robotics, and a vast array of Internet of Things (IoT) devices often operate in harsh environments. The improved bond strength and reliability offered by this patent are crucial for the commercial viability and long-term performance of these devices, reducing downtime and maintenance costs.\n\n**Aerospace and Defense:** Commercial and military aircraft, satellites, and defense systems demand components that can withstand extreme conditions and operate flawlessly for extended periods. The Method of Fabricating a Semiconductor Package provides the foundational reliability required for such mission-critical commercial applications. Keywords: commercial applications, semiconductor products, automotive electronics, AI hardware, medical devices, consumer devices, industrial IoT, advanced packaging market.","question":"What are the commercial applications of Method of Fabricating a Semiconductor Package?"},{"answer":"The Method of Fabricating a Semiconductor Package (US-9853010) is a foundational innovation, and its underlying principles suggest several exciting future developments and advancements within the semiconductor industry.\n\n**Integration with Advanced Packaging Architectures:** We can expect even tighter integration with emerging packaging technologies like chiplets, wafer-level packaging (WLP), and advanced 3D stacking. As chips become more heterogeneous (combining different types of dies from various manufacturers), this method's ability to create highly reliable, fine-pitch interconnections will be crucial for seamless integration and communication between stacked layers or adjacent chiplets.\n\n**Evolution of Underfill Resins and Reducing Agents:** Future developments will likely involve the creation of even more sophisticated underfill resins. This could include novel reducing agents with enhanced activity, lower activation temperatures, or even 'smart' underfills that can self-repair minor defects or respond to specific environmental cues. Research might focus on optimizing the carboxyl group's chemistry or exploring entirely new classes of reducing agents for broader material compatibility.\n\n**Refinement of Laser Technology:** Laser systems will continue to advance, offering even greater precision, faster processing speeds, and more selective heating capabilities. This could involve multi-wavelength lasers for targeting different materials, adaptive optics for real-time beam shaping, or integrated sensing for in-situ quality control, further optimizing the bonding process and minimizing energy consumption.\n\n**Expansion to New Materials and Substrates:** As new semiconductor materials (e.g., SiC, GaN) and flexible substrates gain prominence, the Method of Fabricating a Semiconductor Package could be adapted to these diverse material sets. The core concept of in-situ oxide reduction and localized bonding is highly versatile and could be tailored to address specific material challenges in future electronic systems.\n\n**Enhanced Automation and AI Integration:** The precision inherent in this method makes it highly amenable to full automation. Future manufacturing lines will likely integrate AI and machine learning for real-time process optimization, predictive maintenance, and defect detection, further boosting efficiency and yield. The Method of Fabricating a Semiconductor Package will be a cornerstone for these highly automated, next-generation fabrication facilities. Keywords: future semiconductor technology, advanced packaging trends, underfill evolution, laser technology advancements, 3D ICs, chiplet integration, smart materials, manufacturing automation.","question":"What are the future developments expected for Method of Fabricating a Semiconductor Package?"}],"topics":["Method of Fabricating a Semiconductor Package","semiconductor packaging","laser bonding","solder ball bonding","underfill resin","relentless","drive","miniaturization"],"tech_cluster":null},"seo":{"title":"Method of Fabricating a Semiconductor Package - US-9853010","description":"Discover the Method of Fabricating a Semiconductor Package patent: a laser-assisted bonding technique with underfill resin to reduce metal oxides for superior chip reliability.","keywords":["Method of Fabricating a Semiconductor Package","semiconductor packaging","laser bonding","solder ball bonding","underfill resin","reducing agent","carboxyl group","metal oxide reduction","chip reliability","advanced packaging","US-9853010","patent","microelectronics","fabrication method"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853010","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853010","citation_suggestion":"Patentable. \"Method of fabricating a semiconductor package\" (US-9853010). https://patentable.app/patents/US-9853010","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853010","json":"https://patentable.app/api/llm-context/US-9853010","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:03:47.201Z"}