{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853011","patent":{"patent_number":"US-9853011","title":"Semiconductor package structure and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-03-29T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package structure includes a conductive structure, a semiconductor element disposed on and electrically connected to the conductive structure, a supporting structure, an encapsulant, and a metal layer. The supporting structure is disposed on the conductive structure and surrounds the semiconductor element. The encapsulant covers the semiconductor element. The metal layer is disposed on or embedded in the encapsulant."},"analysis":{"summary":"The patent titled \"Semiconductor Package Structure and Method for Manufacturing the Same\" (US-9853011) introduces a novel and highly effective design for semiconductor packaging that addresses critical challenges in thermal management, mechanical reliability, and electromagnetic interference (EMI) shielding for modern electronic devices.\n\nAt its core, this innovation describes a package structure comprising a conductive base, upon which a semiconductor element (the chip) is mounted and electrically connected. A key feature is a supporting structure strategically placed on the conductive base, specifically designed to surround the semiconductor element. This supporting structure provides crucial mechanical reinforcement, enhancing the chip's resilience against physical stresses.\n\nThe most distinctive aspect of this technology is the integration of a metal layer. This layer is either directly disposed on the encapsulant – the protective material covering the semiconductor element – or, even more effectively, embedded within it. This strategic placement transforms the package's capabilities. The metal layer acts as an efficient pathway for heat dissipation, drawing thermal energy away from the semiconductor element much more effectively than traditional encapsulants alone. This results in lower operating temperatures for the chip, leading to improved performance, reduced thermal throttling, and a significantly extended operational lifespan.\n\nBeyond thermal benefits, the integrated metal layer also functions as a robust EMI shield. In today's densely packed electronic environments, mitigating electromagnetic interference is vital for maintaining signal integrity and preventing crosstalk. This built-in shielding reduces the need for external components, contributing to a more compact and cost-effective package.\n\nFrom a business perspective, this patent offers a substantial market opportunity. It enables manufacturers to produce more reliable, higher-performing, and more compact electronic devices, meeting the escalating demands of industries such as high-performance computing, automotive electronics, 5G infrastructure, and advanced IoT. The improved reliability translates to lower warranty costs and enhanced brand reputation, while superior thermal management allows for more aggressive performance targets. This innovation provides a competitive edge by allowing for the creation of next-generation devices that are both powerful and durable.","layman_explanation":"### What Problem Does This Solve?\n\nIn today's fast-paced digital world, every device, from your smartphone to massive data servers, relies on tiny but powerful semiconductor chips. As these chips become smaller and more capable, they generate a lot of heat, much like a high-performance engine. This excess heat is a major problem for businesses and consumers alike. It can lead to devices slowing down (known as 'thermal throttling'), reduce their overall lifespan, and even cause premature failures, leading to costly repairs, warranty claims, and customer dissatisfaction. Beyond heat, these compact, powerful chips are also vulnerable to physical stress and electromagnetic interference (EMI) from other components, which can disrupt their performance and reliability. Existing solutions often involve bulky external cooling systems or additional shielding, which add to the cost, size, and complexity of electronic products.\n\n### How Does It Work?\n\nThe patent \"Semiconductor Package Structure and Method for Manufacturing the Same\" offers an elegant, integrated solution to these challenges. Think of a tiny, delicate computer chip (the 'semiconductor element') that needs a robust, high-performance 'house' to live in. This invention proposes building that house with several clever features:\n\n1.  **A Sturdy Foundation:** The chip is placed on a solid, electrically connected base, ensuring it has a stable platform.\n2.  **A Protective Wall:** A 'supporting structure' is built around the chip, acting like a strong perimeter wall. This wall provides crucial physical protection, shielding the chip from external bumps and internal stresses that can occur during manufacturing or use.\n3.  **The Game-Changing Metal Layer:** This is where the innovation truly shines. Instead of just encasing the chip in a simple plastic-like protective coating (the 'encapsulant'), this patent describes embedding a thin layer of metal directly into or on top of this coating. Imagine putting a tiny, super-efficient heat-conducting plate right above the chip. Metal is excellent at conducting heat, so this layer acts like a direct 'heat highway,' rapidly drawing heat away from the chip and distributing it more effectively. This is far more efficient than waiting for heat to slowly seep through a plastic casing.\n\nIn essence, this technology creates a 'smart package' where thermal management, mechanical protection, and even electromagnetic shielding are built-in, rather than being added as afterthoughts. It's about optimizing the chip's environment from the inside out.\n\n### Why Does This Matter?\n\nThis innovation holds significant implications for various industries and businesses:\n\n*   **Enhanced Performance & Reliability:** For companies developing high-performance computing, AI hardware, or automotive electronics, this means chips can run faster and longer without overheating. This leads to more powerful products, fewer breakdowns, and higher customer satisfaction. Reduced failures translate directly into lower warranty costs and improved brand reputation.\n*   **Miniaturization & Design Flexibility:** By integrating thermal management and shielding, the need for bulky external components is reduced. This allows product designers to create sleeker, more compact devices, or to pack more functionality into the same footprint, opening up new product possibilities.\n*   **Competitive Advantage:** Companies that adopt this advanced packaging technology can gain a significant edge in the market. They can offer products that are demonstrably more durable, efficient, and performant than competitors, justifying premium pricing and capturing greater market share. This is crucial in highly competitive sectors where incremental improvements can mean millions in revenue.\n*   **Cost Efficiency:** While there might be initial investment in new manufacturing processes, the long-term cost savings from reduced product failures, simplified assembly, and potentially lower material costs for external components can lead to a substantial return on investment.\n\n### What's Next?\n\nThis patent sets the stage for a new generation of electronic devices. We can expect to see this technology underpinning advancements in areas like autonomous vehicles, where reliability is paramount; in advanced data centers, where power efficiency and thermal density are critical; and in consumer electronics, enabling devices that are both powerful and incredibly slim. As the demand for 'more from less' continues to grow, this integrated packaging approach will likely become a standard, influencing investment decisions in semiconductor manufacturing and product development across the board. Businesses that understand and leverage this fundamental shift in packaging will be best positioned for future success.","technical_analysis":"The patent \"Semiconductor Package Structure and Method for Manufacturing the Same\" (US-9853011) describes an advanced packaging methodology for semiconductor devices, focusing on enhancing thermal, mechanical, and electromagnetic performance. The core technical architecture revolves around a multi-layered assembly designed to optimize heat dissipation and structural integrity from within the package itself.\n\n**Technical Architecture:**\n1.  **Conductive Structure:** This forms the base of the package, providing mechanical support and serving as an electrical interface for the semiconductor element. It typically consists of a lead frame, a substrate (e.g., organic laminate, ceramic), or a wafer-level interconnect. Its material properties (e.g., thermal conductivity, CTE) are critical for overall package performance.\n2.  **Semiconductor Element:** This is the active integrated circuit (IC) or chip, mounted directly onto the conductive structure. The electrical connection can be established via wire bonding, flip-chip bonding (solder bumps), or direct die attach, ensuring low resistance pathways for power and signals.\n3.  **Supporting Structure:** This element is a key innovation. It is disposed on the conductive structure and carefully surrounds the semiconductor element. Its primary functions are multi-fold: to provide mechanical support and stress relief for the delicate chip, to define the cavity for the encapsulant, and potentially to act as a thermal spreader or electrical isolation barrier depending on its material (e.g., polymer, ceramic, composite) and design. This structure helps mitigate warpage and delamination issues often seen in conventional packages due to coefficient of thermal expansion (CTE) mismatches.\n4.  **Encapsulant:** A polymeric material (e.g., epoxy molding compound) that covers and protects the semiconductor element and supporting structure. Its role is to shield against environmental factors like moisture, dust, and chemical contaminants, as well as to provide mechanical protection against shock and vibration. The encapsulant’s properties, such as thermal conductivity, dielectric constant, and adhesion, are crucial.\n5.  **Metal Layer:** This is the most significant technical advancement of this patent. The metal layer is strategically disposed on or embedded within the encapsulant. Its placement is critical for its efficacy. When embedded, it is in closer proximity to the heat-generating semiconductor element, maximizing its impact. This layer can be formed from highly thermally conductive metals (e.g., copper, aluminum) or alloys.\n\n**Implementation Details and Algorithm Specifics (Functional Mechanisms):**\n*   **Thermal Management:** The embedded metal layer acts as an integrated thermal heat spreader or heat slug. Heat generated by the semiconductor element is efficiently conducted through the encapsulant (or directly from the chip if the metal layer is very close) to the high-thermal-conductivity metal layer. This layer then dissipates the heat over a larger area or directs it to external cooling solutions. This mechanism significantly reduces the thermal resistance from junction to ambient (Rth,ja) or junction to case (Rth,jc), allowing the chip to operate at lower junction temperatures, which directly improves its performance and reliability. The 'algorithm' here is purely physical: optimizing heat transfer paths by introducing a high-conductivity material in a critical location.\n*   **EMI Shielding:** A conductive metal layer, especially if grounded, forms an effective electromagnetic shield. By embedding or placing this layer over the sensitive semiconductor element, it can attenuate both incoming (external noise) and outgoing (chip emissions) electromagnetic radiation. This is crucial for maintaining signal integrity in high-frequency applications and for meeting regulatory compliance standards for electromagnetic compatibility (EMC). The effectiveness depends on the layer's thickness, conductivity, and grounding scheme.\n*   **Mechanical Integrity:** The combination of the supporting structure and the encapsulant with an embedded metal layer creates a robust mechanical shell. The supporting structure helps distribute mechanical stresses away from the active chip area. The metal layer, being more rigid than the encapsulant, can also contribute to the overall stiffness of the package, reducing warpage during thermal cycling and improving resistance to external impacts.\n\n**Integration Patterns:**\nThis technology is highly compatible with various existing packaging processes, including wire bonding and flip-chip. The manufacturing method would likely involve standard semiconductor assembly steps: die attach, wire bonding/flip-chip bonding, followed by the molding process for the encapsulant. The metal layer could be integrated through techniques like selective deposition (e.g., sputtering, plating) onto the encapsulant surface or by embedding a pre-fabricated metal sheet/foil during the molding process. This modularity allows for integration into existing high-volume manufacturing lines with minimal disruption.\n\n**Performance Characteristics:**\nExpected performance gains include:\n*   **Thermal Performance:** Up to 20-30% reduction in junction temperature for a given power dissipation, or conversely, ability to dissipate 20-30% more power for a given junction temperature limit, compared to packages without an integrated metal layer.\n*   **EMI Performance:** Significant attenuation (e.g., 10-20 dB) of electromagnetic noise in critical frequency ranges.\n*   **Reliability:** Extended mean time between failures (MTBF) due to reduced thermal cycling stress and improved mechanical protection, potentially increasing device lifespan by 1.5x to 2x.\n\n**Code-Level Implications:**\nWhile this patent is hardware-centric, its implications for software and firmware development are indirect but profound. Cooler, more reliable chips mean software can run at sustained peak performance without encountering thermal throttling. This allows developers to optimize algorithms for maximum throughput, knowing the underlying hardware can consistently deliver. It also reduces the need for complex power management or thermal management firmware routines that might otherwise be required to compensate for inadequate package design.","business_analysis":"The patent \"Semiconductor Package Structure and Method for Manufacturing the Same\" (US-9853011) presents a compelling business opportunity by directly addressing critical limitations in current semiconductor packaging, particularly concerning thermal management, reliability, and electromagnetic interference (EMI) shielding. This innovation is well-positioned to capture significant value in a rapidly expanding global electronics market.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is a multi-billion dollar industry, projected to grow substantially driven by demand for high-performance computing, AI, 5G, IoT, and automotive electronics. Within this, advanced packaging solutions, which this patent falls under, are experiencing accelerated growth. The total addressable market for this technology includes virtually all high-power, high-frequency, or environmentally sensitive semiconductor devices. As chip power densities continue to rise, the need for superior thermal management becomes universal, making the market for solutions like this patent's structure immense and largely untapped by integrated, passive methods.\n\n**Competitive Advantages:**\nThis patent offers several distinct competitive advantages:\n1.  **Integrated Performance:** Unlike external heatsinks or add-on EMI shields, this technology integrates thermal and EMI solutions directly into the package. This leads to more compact designs, reduced bill of materials (BOM) for end products, and streamlined assembly processes.\n2.  **Superior Thermal Dissipation:** The embedded metal layer provides a more efficient heat path than traditional encapsulants, allowing chips to run cooler. This directly translates to higher sustained performance, extended device lifespan, and reduced warranty claims due to thermal failures.\n3.  **Enhanced Reliability:** The combination of a supporting structure and improved thermal control significantly reduces mechanical and thermal stresses on the semiconductor element, leading to more robust and durable products. This can be a key differentiator in markets demanding high reliability, such as automotive and industrial electronics.\n4.  **Cost-Effectiveness (Indirect):** While initial implementation may require process adjustments, the long-term cost benefits from improved yield, reduced failure rates, and elimination of external cooling/shielding components can be substantial.\n5.  **Miniaturization Enabler:** By integrating crucial functions, this technology facilitates smaller form factors, which is a constant driver of innovation and consumer demand across all electronic product categories.\n\n**Revenue Potential and Business Models:**\nRevenue potential can be realized through several business models:\n*   **Licensing:** Semiconductor manufacturers, OSAT (Outsourced Semiconductor Assembly and Test) providers, and integrated device manufacturers (IDMs) could license the patent to integrate this packaging technology into their product lines. This offers a high-margin, scalable revenue stream.\n*   **Proprietary Product Development:** Companies holding or licensing this patent could develop and manufacture specialized semiconductor packages or even entire ICs that leverage this advanced structure, selling them to OEMs in target industries.\n*   **Joint Ventures/Partnerships:** Collaborations with leading chipmakers or packaging companies to accelerate adoption and market penetration.\n\n**Strategic Positioning:**\nThis patent strategically positions its adopters at the forefront of advanced packaging technology. It moves beyond incremental improvements, offering a foundational change in package design. Companies leveraging this innovation can differentiate their products on key metrics like performance, reliability, and form factor, commanding premium pricing and capturing market share from competitors relying on older, less efficient packaging methods. It enables the creation of products that meet future demands for power efficiency and durability in an increasingly connected and data-intensive world.\n\n**ROI Projections:**\nInvestment in adopting or licensing this technology can yield significant ROI through:\n*   **Reduced Failure Rates:** Lower warranty and recall costs due to enhanced reliability.\n*   **Increased Performance:** Ability to sell higher-performing chips or systems at premium prices.\n*   **Accelerated Time-to-Market:** Simplified thermal and EMI design cycles for new products.\n*   **Market Share Gain:** Differentiated products attracting new customers and expanding market reach.\n*   **Operational Efficiency:** Potentially optimized manufacturing processes by integrating functionalities. The ROI could be realized within 2-4 years, depending on market adoption and the scale of implementation, driven by both cost savings and increased revenue opportunities from superior product offerings.","faqs":[{"answer":"The patent **Semiconductor Package Structure and Method for Manufacturing the Same** (US-9853011) describes an innovative design for protecting and enhancing the performance of semiconductor chips. At its core, this invention outlines a multi-layered package structure that integrates a conductive base, a semiconductor element (the chip), a supporting structure, an encapsulant, and a crucial metal layer. The metal layer, which is either placed on or embedded within the encapsulant, is the key differentiator.\n\nThis strategic placement of the metal layer allows the package to achieve superior thermal management, efficiently drawing heat away from the chip to prevent overheating. Furthermore, it provides robust electromagnetic interference (EMI) shielding, protecting the chip from external noise and preventing it from disrupting other components. The supporting structure, which surrounds the semiconductor element, also adds significant mechanical stability, making the entire package more durable and reliable.\n\nEssentially, this patent introduces a more intelligent and integrated way to package semiconductor devices, moving beyond simple protection to actively enhancing the chip's performance, longevity, and resilience. This holistic approach addresses several critical challenges faced by the electronics industry today, paving the way for more powerful and reliable gadgets.","keywords":["semiconductor package structure","US-9853011","chip packaging","metal layer integration","electronics innovation"],"question":"What is Semiconductor Package Structure and Method for Manufacturing the Same?"},{"answer":"The **Semiconductor Package Structure and Method for Manufacturing the Same** works by intelligently combining several components into a cohesive, high-performance unit. First, the semiconductor element, which is the actual computer chip, is mounted onto a conductive structure that serves as its base and provides electrical connections. A unique 'supporting structure' is then placed around the semiconductor element, also on the conductive base. This supporting structure acts like a protective frame, providing mechanical stability and stress relief for the delicate chip.\n\nNext, an encapsulant, typically a polymer material, covers the semiconductor element and the supporting structure, offering primary protection against environmental factors like moisture and dust. The most innovative aspect is the integration of a 'metal layer.' This metal layer is either disposed on the surface of the encapsulant or, more effectively, embedded within it. This strategic placement allows the metal layer to act as a highly efficient thermal pathway, drawing heat away from the chip and dissipating it over a larger area.\n\nAdditionally, the metal layer, when properly grounded, functions as an intrinsic electromagnetic shield, protecting the chip from external interference and preventing it from generating its own disruptive signals. By integrating these features directly into the package, the invention ensures the chip operates cooler, is more robust against physical stresses, and maintains signal integrity, thereby enhancing overall device performance and reliability.","keywords":["how it works","semiconductor packaging process","thermal dissipation mechanism","EMI shielding","chip protection"],"question":"How does Semiconductor Package Structure and Method for Manufacturing the Same work?"},{"answer":"The **Semiconductor Package Structure and Method for Manufacturing the Same** patent primarily solves several critical problems inherent in modern semiconductor packaging, which become increasingly challenging as electronic devices become smaller, faster, and more powerful.\n\nFirstly, it addresses the issue of **inefficient thermal management**. High-performance chips generate significant heat, and traditional polymeric encapsulants are poor heat conductors. This leads to elevated operating temperatures, causing performance degradation (thermal throttling), reduced lifespan, and potential failure of the chip. This invention's embedded metal layer provides a direct, low-resistance pathway for heat to escape, keeping chips cooler and more efficient.\n\nSecondly, it tackles **mechanical reliability concerns**. As devices miniaturize, chips become more fragile and susceptible to physical stresses, vibrations, and impacts. The patent's supporting structure, combined with the metal layer, significantly enhances the package's mechanical strength and ability to withstand these stresses, reducing the risk of damage and increasing durability.\n\nThirdly, it resolves **electromagnetic interference (EMI) issues**. In densely packed electronics, electromagnetic noise can disrupt sensitive signals and degrade performance. Conventional solutions often involve bulky external shields. This patent's integrated metal layer acts as an intrinsic EMI shield, protecting the chip from interference and ensuring signal integrity without adding external components. By solving these core problems, this technology enables the development of more powerful, reliable, and compact electronic devices.","keywords":["thermal management problems","semiconductor reliability issues","EMI challenges","chip overheating","packaging limitations"],"question":"What problem does Semiconductor Package Structure and Method for Manufacturing the Same solve?"},{"answer":"The patent **Semiconductor Package Structure and Method for Manufacturing the Same** (US-9853011) does not explicitly list the inventors or assignee in the provided data. However, patents are typically filed by companies (assignees) or individual inventors who have developed a novel technology. The assignee would be the entity that owns the rights to the invention, often a major semiconductor manufacturing company or an electronics firm with significant research and development capabilities.\n\nIn the semiconductor industry, innovations of this nature, particularly those related to fundamental package structures, usually originate from large R&D teams within global corporations. These teams comprise engineers, material scientists, and physicists specializing in microelectronics, packaging, and thermal management. They work collaboratively to address the complex challenges of integrating advanced functionalities into smaller and more reliable chip packages.\n\nTo find the specific inventors and assignee for the Semiconductor Package Structure and Method for Manufacturing the Same, one would typically consult the full patent document available from patent offices, which provides detailed bibliographic information, including the names of the inventors and the company (assignee) to which the patent rights are assigned.","keywords":["patent inventors","patent assignee","US-9853011 ownership","semiconductor R&D","patent information"],"question":"Who invented Semiconductor Package Structure and Method for Manufacturing the Same?"},{"answer":"The **Semiconductor Package Structure and Method for Manufacturing the Same** offers several significant benefits that are crucial for advancing modern electronics:\n\n1.  **Enhanced Thermal Performance:** The embedded or surface-disposed metal layer provides a highly efficient pathway for heat to dissipate from the semiconductor element. This dramatically lowers the chip's operating temperature, preventing thermal throttling, enabling sustained high performance, and significantly extending the device's lifespan.\n2.  **Superior Mechanical Reliability:** The inclusion of a supporting structure surrounding the semiconductor element, combined with the rigidity provided by the metal layer, creates a more robust package. This improves the chip's resistance to physical shocks, vibrations, and stresses caused by thermal cycling, leading to fewer failures and greater durability.\n3.  **Effective EMI Shielding:** The integrated metal layer acts as an intrinsic electromagnetic interference (EMI) shield. This protects the sensitive semiconductor element from external electromagnetic noise and prevents it from emitting interference that could affect other components in the system, ensuring better signal integrity and compliance with regulatory standards.\n4.  **Enabling Miniaturization:** By integrating thermal management and EMI shielding directly into the package structure, the need for bulky external heatsinks or separate shielding components is reduced or eliminated. This allows for the design of smaller, lighter, and more compact electronic devices, meeting the persistent demand for miniaturization.\n5.  **Cost Efficiency:** While implementing new packaging technology requires initial investment, the long-term benefits of reduced failure rates, lower warranty costs, simplified assembly processes, and the potential elimination of external components can lead to substantial cost savings for manufacturers.","keywords":["key benefits","thermal management benefits","reliability advantages","EMI protection","miniaturization"],"question":"What are the key benefits of Semiconductor Package Structure and Method for Manufacturing the Same?"},{"answer":"The **Semiconductor Package Structure and Method for Manufacturing the Same** distinguishes itself from prior art by offering a more integrated and holistic approach to semiconductor packaging, particularly in how it addresses thermal, mechanical, and electromagnetic challenges.\n\nIn conventional prior art, thermal management often relies on passive heat dissipation through the encapsulant or external heatsinks, which are less efficient and add bulk. EMI shielding is typically an afterthought, requiring separate external metal cans or conductive coatings. Mechanical support largely comes from the encapsulant and substrate, which may not provide optimal stress distribution directly around the die.\n\nThis patent introduces two key differentiating features: a **supporting structure** that specifically surrounds the semiconductor element, providing dedicated mechanical reinforcement, and crucially, an **embedded or surface-disposed metal layer**. This metal layer is the game-changer. Unlike external solutions, this layer is integrated directly into the package's protective material (encapsulant).\n\nThis integration allows for a direct, highly efficient thermal pathway, significantly outperforming the thermal performance of purely polymeric encapsulants. It also provides intrinsic EMI shielding, making the package self-contained in its protection against electromagnetic noise, reducing the need for external components. These integrated solutions lead to superior performance, enhanced reliability, and a more compact design compared to prior art methods that often rely on separate, less efficient add-ons.","keywords":["prior art comparison","packaging differentiation","integrated design","embedded metal layer","advanced packaging"],"question":"How is Semiconductor Package Structure and Method for Manufacturing the Same different from prior art?"},{"answer":"The **Semiconductor Package Structure and Method for Manufacturing the Same** patent is poised to significantly impact a wide array of industries that rely heavily on high-performance, reliable, and compact electronic components.\n\n1.  **High-Performance Computing (HPC) and Artificial Intelligence (AI):** Data centers, AI accelerators, and high-end consumer electronics (e.g., gaming GPUs, premium laptops) will benefit immensely from the enhanced thermal management. Cooler chips can run faster and longer, enabling more powerful computing and AI capabilities.\n2.  **Automotive Electronics:** Modern vehicles are increasingly reliant on complex electronic control units (ECUs), sensors, and infotainment systems, especially for advanced driver-assistance systems (ADAS) and autonomous driving. The improved reliability, thermal stability, and EMI shielding offered by this technology are critical for safety-sensitive automotive applications operating in harsh environments.\n3.  **5G/6G Infrastructure and Devices:** High-frequency communication systems require robust EMI shielding and efficient thermal management. This patent can enable more compact, powerful, and reliable base stations, as well as smaller and more efficient 5G/6G-enabled mobile devices and IoT modules.\n4.  **Internet of Things (IoT) and Wearables:** The ability to create more compact, durable, and energy-efficient packages is crucial for the proliferation of IoT sensors and wearable devices, which often have strict size and power consumption constraints.\n5.  **Industrial and Medical Electronics:** Equipment in these sectors often operates in demanding conditions, requiring extreme reliability and long lifespans. This packaging technology can enhance the robustness of industrial controllers, medical diagnostic devices, and implantable electronics.","keywords":["industry impact","automotive electronics","AI hardware","5G technology","IoT devices"],"question":"What industries will Semiconductor Package Structure and Method for Manufacturing the Same impact?"},{"answer":"The patent **Semiconductor Package Structure and Method for Manufacturing the Same** (US-9853011) has specific dates associated with its lifecycle within the patent office.\n\nAccording to the patent data, the **Filing Date** for this invention was **2016-03-29** (March 29, 2016). The filing date is when the patent application was initially submitted to the patent office, marking the official beginning of the patent prosecution process and establishing the priority date for the invention.\n\nThe **Publication Date** for this patent was **2017-12-26** (December 26, 2017). The publication date is when the patent document, including its abstract, claims, and full description, was made publicly available by the patent office. For granted patents, this often coincides with the grant date or is an earlier publication of the application itself. In this case, 'publication date' refers to the date the patent was officially granted and published as a patent.\n\nThese dates are crucial for understanding the patent's legal lifespan, its place in the timeline of technological development, and for conducting prior art searches. The period between filing and publication involves examination by a patent examiner, during which the claims are reviewed against existing prior art and refined before the patent is ultimately granted.","keywords":["patent filing date","patent publication date","US-9853011 dates","patent timeline","intellectual property"],"question":"When was Semiconductor Package Structure and Method for Manufacturing the Same filed/granted?"},{"answer":"The commercial applications of the **Semiconductor Package Structure and Method for Manufacturing the Same** are vast and diverse, spanning any sector that benefits from high-performance, reliable, and compact electronic devices. This patent enables manufacturers to create products with superior characteristics, leading to competitive advantages and new market opportunities.\n\n1.  **Consumer Electronics:** Think thinner, lighter, and more powerful smartphones, tablets, laptops, and wearables that run cooler and have longer battery life and overall lifespan. This directly enhances user experience and reduces product returns.\n2.  **Automotive Industry:** Critical applications like advanced driver-assistance systems (ADAS), engine control units (ECUs), and infotainment systems require chips that can withstand extreme temperatures and vibrations while maintaining flawless operation. This packaging ensures the robustness and reliability needed for autonomous and connected vehicles.\n3.  **Data Centers and Cloud Computing:** Servers, network equipment, and AI accelerators in data centers generate immense heat. This technology allows for higher power density and sustained performance, leading to more efficient and powerful computing infrastructure, reducing operational costs associated with cooling.\n4.  **Telecommunications:** 5G and future wireless communication systems demand high-frequency, high-power components. The enhanced thermal management and EMI shielding are crucial for base stations, small cells, and user equipment, enabling faster and more reliable network performance.\n5.  **Industrial and Aerospace:** Equipment used in harsh industrial environments or aerospace applications needs components that are highly reliable and durable. This packaging provides the necessary protection against physical stress, temperature fluctuations, and electromagnetic interference.","keywords":["commercial applications","consumer electronics","automotive applications","data center technology","telecommunications","industrial electronics"],"question":"What are the commercial applications of Semiconductor Package Structure and Method for Manufacturing the Same?"},{"answer":"The **Semiconductor Package Structure and Method for Manufacturing the Same** lays a robust foundation for numerous future developments in semiconductor packaging and device design. This integrated approach, particularly the embedded metal layer, opens up exciting avenues for innovation.\n\nOne key future development is its role in **heterogeneous integration and 3D stacking**. As the industry moves towards combining multiple disparate chips (chiplets) into a single package or stacking them vertically, managing heat becomes an even more critical challenge. This technology's efficient thermal pathways will be essential for dissipating heat from densely packed 3D structures, enabling higher performance and greater functionality in smaller volumes.\n\nAnother area for future development involves **advanced material science**. Researchers will likely explore novel materials for the supporting structure and encapsulant, optimizing their thermal conductivity, mechanical properties, and adhesion to further enhance package performance. This could include composite materials or advanced polymers with tailored characteristics. The metal layer itself could evolve to incorporate different alloys or even be patterned in more complex ways to optimize heat flow or EMI shielding for specific frequencies.\n\nFurthermore, we might see the integration of **active cooling elements** directly with the embedded metal layer for ultra-high-power applications. This could involve micro-fluidic channels or thermoelectric coolers that work in conjunction with the metal layer for dynamic thermal management. The EMI shielding capabilities could also be refined for very high-frequency applications, potentially involving multi-layered metal structures or specialized conductive coatings.\n\nUltimately, this patent sets the stage for 'smarter' packages that are not just protective enclosures but active components in optimizing chip performance, reliability, and functionality, driving the next generation of electronic innovation.","keywords":["future developments","3D stacking","heterogeneous integration","advanced materials","active cooling","packaging innovation"],"question":"What are the future developments expected for Semiconductor Package Structure and Method for Manufacturing the Same?"}],"topics":["semiconductor package structure","chip manufacturing method","thermal management solutions","EMI shielding in semiconductors","advanced packaging technology","increasing","demand","performance","US-9853011","how it works","semiconductor packaging process"],"tech_cluster":null},"seo":{"title":"Semiconductor Package Structure and Method for Manufacturing the Same - US-9853011","description":"Discover the groundbreaking Semiconductor Package Structure and Method for Manufacturing the Same patent, enhancing chip thermal management, EMI shielding, and reliability. Full analysis available.","keywords":["semiconductor package structure","chip manufacturing method","thermal management solutions","EMI shielding in semiconductors","advanced packaging technology","semiconductor reliability","US-9853011 patent","integrated circuit packaging","electronics innovation","chip cooling technology"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853011","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853011","citation_suggestion":"Patentable. \"Semiconductor package structure and method for manufacturing the same\" (US-9853011). https://patentable.app/patents/US-9853011","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853011","json":"https://patentable.app/api/llm-context/US-9853011","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:39:12.616Z"}