{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853014","patent":{"patent_number":"US-9853014","title":"Electronic component, electronic apparatus, and method of manufacturing electronic apparatus","assignee":null,"inventors":[],"filing_date":"2016-09-26T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface; a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity; a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface."},"analysis":{"summary":"The patent \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" (US-9853014) introduces a novel and highly efficient approach to thermal management within electronic components. At its core, the innovation describes an electronic component featuring a specialized substrate. This substrate comprises a first portion with high thermal conductivity, designed to effectively spread heat, and a second portion, strategically embedded within the first, which exhibits lower thermal conductivity. This dual-conductivity design allows for precise control over heat flow pathways within the component.\n\nThe primary problem this patent addresses is the persistent challenge of heat dissipation in modern electronic devices. As components become smaller and more powerful, managing localized hotspots and overall thermal loads becomes critical for maintaining performance, reliability, and device longevity. Existing solutions often involve bulky external cooling or less sophisticated internal heat spreading, leading to inefficiencies and limitations in design.\n\nThe key technical approach involves engineering the substrate's material properties at a micro-level to create an optimal thermal gradient. A first terminal is configured on one surface, corresponding to the lower-conductivity portion, while a second terminal is on the opposite surface. This arrangement facilitates the efficient extraction of heat from the active regions through the high-conductivity material to an external interface, while the lower-conductivity portion can serve to thermally manage specific areas or act as a buffer. The patent also details a method of manufacturing this electronic apparatus, ensuring the precise formation of these distinct thermal regions.\n\nThe business value and applications are substantial. This innovation can lead to significantly smaller, more powerful, and more reliable electronic apparatuses. Industries such as high-performance computing, automotive electronics, consumer electronics, and telecommunications (e.g., 5G infrastructure) stand to benefit immensely from improved thermal stability, reduced energy consumption for cooling, and enhanced device lifespan. It enables higher integration densities and new product form factors.\n\nThe market opportunity for this technology is vast, given the universal need for better thermal management across all electronic sectors. Companies adopting this approach can gain a significant competitive advantage through superior product performance, reduced warranty costs, and the ability to innovate in device miniaturization and power delivery. This patent provides a foundational technology for the next generation of high-performance and energy-efficient electronics.","layman_explanation":"### What Problem Does This Solve?\n\nIn today's world, almost every device we use, from our smartphones to powerful data servers, relies on tiny electronic components that generate heat. As we demand more speed and power from these devices, they get hotter and hotter. This isn't just uncomfortable; excessive heat is the silent killer of electronics. It slows them down, makes them unreliable, and drastically shortens their lifespan. Think of a car engine overheating – it loses power and eventually breaks down. Our electronic 'engines' face the same challenge. Current solutions, like adding fans or bulky heat sinks, are often external, inefficient, or simply can't keep up with the concentrated heat generated in ever-shrinking components. This creates a bottleneck that limits how powerful and compact our devices can truly be.\n\n### How Does It Work?\n\nThe patent \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" introduces a clever solution that tackles this heat problem from the inside out. Imagine an electronic component's base, called a substrate, isn't just one uniform material but is engineered with two different types of heat-conducting properties. Picture a high-tech sponge that's super good at soaking up and spreading water (heat) quickly, but right in the middle, there's a smaller, slightly denser part of the sponge that's a bit slower at absorbing. When a hot chip sits on this slower-absorbing part, the heat doesn't just blast through one small area. Instead, it gently spreads into the surrounding, super-absorbent part of the sponge, which then rapidly wicks the heat away to the outside of the component. This creates a controlled pathway for heat, preventing it from building up in one critical spot and instead distributing it efficiently across the component's surface before it's expelled. It's like having an internal, self-regulating cooling system built directly into the component's DNA, rather than just sticking a fan on top.\n\n### Why Does This Matter?\n\nThis innovation has profound implications for businesses and consumers alike. For companies, it means they can design and build electronic apparatuses that are significantly more powerful, reliable, and compact. Imagine smartphones that never throttle due to heat, servers that operate more efficiently with less energy wasted on cooling, or electric vehicle components that withstand extreme temperatures longer. This translates directly into competitive advantages: products with superior performance, reduced warranty costs due to fewer failures, and the ability to miniaturize devices further. It opens up new market opportunities in sectors like AI hardware, 5G infrastructure, and advanced robotics where thermal constraints are currently a major hurdle. Early adopters of this technology can gain a significant lead, offering products that are not just incrementally better, but fundamentally more robust and efficient.\n\n### What's Next?\n\nThe \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" patent lays a foundational brick for the next generation of electronics. We can expect to see this kind of integrated thermal management become standard in high-performance computing, specialized IoT devices, and critical automotive and aerospace systems. Its adoption will likely accelerate the development of even smaller and more powerful chips, enabling new functionalities and form factors we can only begin to imagine. For investors, this represents a key trend in semiconductor innovation, signaling opportunities in companies focused on advanced materials science and manufacturing processes that can implement this intelligent thermal architecture. It's a clear path towards an era of cooler, faster, and more reliable technology.","technical_analysis":"The patent \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" (US-9853014) describes a sophisticated approach to integrated thermal management within electronic components, moving beyond passive heat spreading to engineered thermal pathways. The core innovation lies in the design of a heterogeneous substrate and the method for its fabrication, directly addressing the limitations of uniform material properties in high-power-density applications.\n\n**Technical Architecture:**\n\nThe electronic component's architecture centers on a substrate divided into two principal thermal regions. A 'first portion' of the substrate is characterized by high thermal conductivity (k1), forming the bulk or enveloping structure. Embedded within this first portion is a 'second portion' exhibiting lower thermal conductivity (k2), where k2 < k1. This second portion is strategically positioned to correspond with a 'first terminal' on one surface of the substrate. A 'second terminal' is located on the opposite surface. This configuration implies that heat generated near the first terminal, particularly within the vicinity of the lower-conductivity second portion, is intended to be managed and directed through the surrounding higher-conductivity first portion towards the second terminal for efficient dissipation.\n\n**Implementation Details and Algorithm Specifics (Thermal Flow):**\n\nThe 'algorithm' or operating principle for thermal management in this invention is based on creating a controlled thermal impedance network. When a heat-generating element (e.g., a semiconductor die) is mounted on or connected to the first terminal, heat initially propagates into the lower-conductivity second portion. However, because this second portion is encapsulated by the higher-conductivity first portion, heat rapidly diffuses laterally into the more conductive material. This lateral diffusion acts as an efficient heat spreader, preventing the formation of localized hotspots directly beneath the heat source and distributing the thermal load over a larger area of the high-conductivity material. From there, the heat is channeled vertically through the high-conductivity first portion to the second surface, where the second terminal facilitates its transfer to an external cooling system (e.g., a heat sink, cold plate).\n\nThis design effectively leverages the benefits of both high and low thermal conductivity. The low-conductivity region can provide a localized thermal barrier or a controlled thermal resistance, allowing for temperature gradients to be established or protecting sensitive adjacent components. The high-conductivity region then serves as the primary conduit for bulk heat removal, ensuring efficient overall dissipation. This is a significant improvement over monolithic substrates where heat spreading is less controlled and hotspots are more prone to develop.\n\n**Integration Patterns:**\n\nThis technology is highly amenable to integration with various advanced packaging techniques. For example, in 2.5D or 3D IC stacks, where multiple dies are vertically integrated, the substrate described in this patent could serve as an interposer or a base component. The lower-conductivity region could be aligned with high-power dies to manage their direct thermal output, while the surrounding high-conductivity material efficiently transfers heat away from the stack. It also integrates well with flip-chip bonding, where the first terminal directly interfaces with the solder bumps of a die, and the second terminal provides the thermal path to the package or board.\n\n**Performance Characteristics:**\n\nThe expected performance characteristics include:\n\n*   **Reduced Thermal Resistance:** Overall thermal resistance from the heat source to the ambient environment can be significantly reduced due to more effective heat spreading and channeling.\n*   **Improved Temperature Uniformity:** Mitigation of hotspots leads to more uniform temperature distribution across the active area of the component, enhancing performance and reliability.\n*   **Higher Power Handling:** The ability to dissipate heat more efficiently allows for higher power densities and increased operating frequencies without thermal throttling.\n*   **Enhanced Reliability:** Lower operating temperatures and reduced thermal gradients lead to less material degradation and improved long-term reliability of the electronic apparatus.\n\n**Code-Level Implications (Conceptual):**\n\nWhile not directly impacting 'code-level' software, this thermal innovation has profound implications for hardware architects and firmware developers. It enables the design of processors and other high-performance components that can operate at their theoretical maximums for longer durations. Software can be optimized to take advantage of these improved thermal envelopes, potentially allowing for more aggressive power management profiles or sustained turbo frequencies. Thermal models used in EDA tools would need to incorporate this heterogeneous thermal conductivity profile for accurate simulations, potentially requiring new modeling primitives for such engineered substrates. This patent lays the groundwork for hardware that can truly unlock the full potential of advanced software algorithms.","business_analysis":"The patent \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" (US-9853014) represents a pivotal advancement in thermal management, offering substantial business opportunities and strategic advantages across the electronics industry. Its core innovation—an electronic component with an engineered dual-conductivity substrate—directly addresses one of the most pressing challenges in modern device design: efficient heat dissipation.\n\n**Market Opportunity Size:**\n\nThe market for thermal management solutions in electronics is enormous and continuously expanding, driven by the increasing power density in processors, memory, power electronics, and LED technologies. This patent targets a critical, underserved segment within this market: integrated, component-level thermal control. With the global semiconductor market valued at hundreds of billions and projected to grow, any innovation that enhances performance and reliability at the fundamental component level has a multi-billion dollar market opportunity. Key sectors like high-performance computing (HPC), AI accelerators, 5G infrastructure, automotive electronics, data centers, and advanced consumer electronics are all constrained by thermal limits, making this technology universally relevant.\n\n**Competitive Advantages:**\n\nThis innovation offers several distinct competitive advantages:\n\n1.  **Superior Performance:** Products incorporating this technology can achieve higher operating frequencies, sustained peak performance, and better overall efficiency compared to competitors relying on traditional thermal solutions. This translates directly to faster, more powerful devices.\n2.  **Enhanced Reliability and Lifespan:** By mitigating hotspots and reducing thermal stress, the electronic apparatuses built with this patent's principles will exhibit significantly longer operational lifespans and lower failure rates, leading to reduced warranty costs and improved brand reputation.\n3.  **Miniaturization and Form Factor Reduction:** The ability to manage heat more effectively internally reduces the reliance on bulky external heat sinks and fans, enabling smaller, lighter, and more aesthetically pleasing device designs. This is crucial for mobile, wearable, IoT, and aerospace applications.\n4.  **Cost Efficiency:** While initial manufacturing might involve specialized processes, the long-term cost benefits from reduced component count (fewer external cooling parts), lower power consumption (less energy for cooling), and improved yields can be substantial.\n5.  **Strategic IP Positioning:** Owning or licensing this patent provides a strong intellectual property barrier, giving early adopters a significant lead in integrated thermal management technology.\n\n**Revenue Potential and Business Models:**\n\nRevenue generation could stem from multiple avenues:\n\n*   **Direct Manufacturing and Sales:** Companies specializing in semiconductor fabrication or component manufacturing could integrate this technology into their product lines, selling advanced electronic components to OEMs.\n*   **Licensing:** The patent holders could license the technology to major semiconductor companies, fabless designers, or system integrators, generating significant royalty income.\n*   **Module Sales:** Developing and selling specialized thermal management modules or substrates that integrate this design for specific high-performance applications.\n*   **Consulting and Design Services:** Offering expertise in designing and implementing electronic apparatuses that leverage this advanced thermal architecture.\n\n**Strategic Positioning:**\n\nThis patent allows companies to strategically position themselves as leaders in high-performance and high-reliability electronics. It enables differentiation in markets where thermal constraints are paramount. For example, an automotive component supplier could offer control units with unmatched reliability in extreme temperatures, or a data center hardware provider could market servers with superior power-per-rack-unit due to efficient cooling. This technology fosters innovation in product roadmaps, enabling the development of entirely new product categories previously limited by thermal issues.\n\n**ROI Projections:**\n\nThe return on investment for companies adopting this technology is projected to be high due to:\n\n*   **Increased Market Share:** Capturing a larger share of high-value segments due to superior product offerings.\n*   **Reduced Operational Costs:** Lower warranty costs from fewer failures, and reduced energy consumption for cooling in end products.\n*   **Faster Time to Market:** Streamlined design processes by solving thermal issues at the component level.\n*   **Premium Pricing:** Ability to command higher prices for advanced, high-performance, and reliable electronic apparatuses.\n\nIn essence, the Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus patent is not just a technical improvement; it's a commercial enabler, poised to unlock new levels of performance and efficiency across the entire electronics value chain.","faqs":[{"answer":"The \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" (US-9853014) is a patent describing an innovative solution for thermal management within electronic devices. At its core, it introduces an electronic component featuring a specialized substrate with two distinct regions of thermal conductivity. One portion exhibits high thermal conductivity, designed for efficient heat spreading, while a second, embedded portion has lower thermal conductivity, allowing for precise control over heat flow pathways.\n\nThis intelligent design aims to address the persistent challenge of heat dissipation in modern electronics, which impacts device performance, reliability, and lifespan. The patent also outlines the specific method of manufacturing such an electronic apparatus, detailing how these unique thermal properties can be integrated during production.\n\nEssentially, this invention provides a blueprint for building electronic components that can manage their own heat much more effectively from the inside out, rather than relying solely on external cooling solutions. This enables the creation of smaller, more powerful, and more reliable electronic apparatuses across various industries. This thermal control technology is poised to be a cornerstone for future high-performance computing and compact device designs.\n\nKeywords: electronic component, thermal management, electronic apparatus, heat dissipation, patent US-9853014, manufacturing method","question":"What is Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus?"},{"answer":"The Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus works by ingeniously engineering the thermal properties of the component's substrate. The substrate is designed with two key parts: a 'first portion' that is highly conductive to heat, and a 'second portion' that has lower thermal conductivity, embedded within the first.\n\nWhen a heat-generating element (like a microchip) is placed on or near the 'first terminal' which corresponds to the lower-conductivity 'second portion,' the heat initially spreads into this area. This controlled spreading then allows the heat to diffuse into the surrounding, highly conductive 'first portion.' This 'first portion' acts like a superhighway, rapidly channeling the heat away from the sensitive areas and towards the 'second terminal' on the opposite surface, where it can be efficiently dissipated to an external cooling system.\n\nThis process ensures that localized hotspots are mitigated by diffusing heat over a larger area before it's quickly removed. The dual-conductivity design provides precise control over thermal pathways, optimizing overall heat extraction and preventing thermal stress within the electronic apparatus. This internal thermal regulation is a significant advancement over traditional uniform substrate designs.\n\nKeywords: how it works, thermal conductivity, substrate design, heat flow, electronic component operation, integrated cooling","question":"How does Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus work?"},{"answer":"The Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus patent primarily solves the critical problem of inefficient heat dissipation in modern electronic devices. As electronic components become increasingly smaller and more powerful, they generate intense, concentrated heat, leading to 'hotspots.' These hotspots are detrimental, causing a cascade of negative effects.\n\nSpecifically, this innovation addresses:\n1.  **Performance Degradation:** Excessive heat forces devices to 'throttle' (slow down) to prevent damage, limiting their processing power and speed.\n2.  **Reduced Reliability and Lifespan:** High temperatures accelerate material degradation, leading to premature failures and a shorter operational life for electronic apparatuses.\n3.  **Design Constraints:** The need for bulky external cooling solutions (fans, large heat sinks) limits device miniaturization and design flexibility, especially in compact devices like smartphones, wearables, and advanced automotive electronics.\n\nBy providing an integrated, internal solution for managing and directing heat, this patent enables components to run cooler, thereby unlocking higher performance, extending reliability, and allowing for more compact and innovative electronic apparatus designs. It fundamentally addresses the 'thermal bottleneck' that has long constrained advancements in electronics.\n\nKeywords: overheating electronics, thermal bottleneck, device reliability, performance degradation, heat problem, electronic apparatus challenges","question":"What problem does Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus solve?"},{"answer":"The patent data provided does not specify the names of the inventors or the assignee for \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" (US-9853014). In many patent filings, particularly early in their public lifecycle or depending on the database, this information might be withheld or not immediately available in a summary abstract.\n\nTypically, inventors are the individuals who conceived the inventive subject matter, while the assignee is the entity (often a company or research institution) to whom the patent rights are legally transferred. These details are crucial for understanding the intellectual property landscape and the commercial entities driving such innovations.\n\nHowever, the absence of this specific information in the provided abstract does not diminish the technical merit or potential impact of the innovation itself. The focus remains on the groundbreaking thermal management solution described within the patent, regardless of the specific individuals or organizations behind its inception. For complete details, including inventor and assignee information, one would typically consult the full patent document directly from official patent databases.\n\nKeywords: inventors, assignee, patent ownership, intellectual property, patent US-9853014, electronic component innovation","question":"Who invented Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus?"},{"answer":"The Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus offers several transformative benefits for electronic components and the devices they power:\n\n1.  **Enhanced Performance:** By efficiently dissipating heat and mitigating hotspots, this technology allows electronic apparatuses to operate at higher power levels and sustained peak frequencies without thermal throttling, leading to faster and more responsive devices.\n2.  **Improved Reliability and Lifespan:** Reduced thermal stress on critical internal components significantly extends their operational life and lowers the likelihood of premature failure, leading to more durable products and reduced warranty costs.\n3.  **Greater Miniaturization Potential:** The ability to manage heat effectively from within the component reduces the need for bulky external cooling solutions, enabling the design of smaller, lighter, and more compact electronic apparatuses.\n4.  **Energy Efficiency:** More effective heat dissipation means less energy is wasted as heat, potentially reducing the overall power consumption of cooling systems in larger applications like data centers.\n5.  **Design Flexibility:** Engineers gain more freedom in component layout and system design, as thermal constraints are addressed at a fundamental level, opening doors for innovative product architectures.\n\nThese benefits collectively position the Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus as a critical enabler for the next generation of high-performance and reliable electronics across diverse applications.\n\nKeywords: key benefits, enhanced performance, improved reliability, device miniaturization, energy efficiency, design flexibility, electronic component advantages","question":"What are the key benefits of Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus?"},{"answer":"The Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus distinguishes itself from prior art by integrating a novel, heterogeneous thermal management system directly into the component's substrate, rather than relying solely on external or uniform solutions.\n\nPrior art typically uses:\n1.  **Uniform Substrates:** Most electronic components use substrates with homogeneous thermal properties, where heat spreading is less controlled, often leading to localized hotspots.\n2.  **External Cooling:** Solutions like heat sinks, fans, or liquid cooling are usually added externally to the package, increasing bulk and complexity without fundamentally altering the internal heat flow dynamics.\n3.  **Passive Thermal Interface Materials (TIMs):** While TIMs reduce thermal resistance between surfaces, they don't actively engineer the thermal pathways within the component itself.\n\nIn contrast, this patent's innovation lies in its dual-conductivity substrate: a high-conductivity portion encompassing a lower-conductivity portion. This design actively creates an internal thermal gradient and engineered pathways, precisely diffusing and channeling heat away from sources. This approach offers a more precise, efficient, and integrated solution for managing heat right at its origin, leading to superior performance, reliability, and miniaturization capabilities compared to conventional methods. It's a shift from reactive external cooling to proactive internal thermal engineering within the electronic apparatus.\n\nKeywords: prior art comparison, thermal management innovation, heterogeneous substrate, integrated cooling, electronic component differentiation, heat flow engineering","question":"How is Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus different from prior art?"},{"answer":"The Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus patent has the potential to significantly impact a wide array of industries that rely heavily on high-performance and reliable electronic components. Its ability to revolutionize thermal management makes it universally applicable.\n\nKey impacted industries include:\n1.  **High-Performance Computing (HPC) and Data Centers:** For servers, AI accelerators, and supercomputers, efficient cooling directly translates to higher processing power, reduced energy consumption for cooling infrastructure, and greater rack density.\n2.  **Consumer Electronics:** Smartphones, laptops, tablets, and wearables will benefit from cooler operation, extended battery life, enhanced performance during demanding tasks, and even smaller, sleeker designs.\n3.  **Automotive Electronics:** Electric vehicles, autonomous driving systems, and advanced driver-assistance systems (ADAS) require extremely reliable components that can withstand harsh thermal environments. This innovation ensures stable operation and longevity.\n4.  **Telecommunications (e.g., 5G Infrastructure):** 5G base stations and network equipment demand robust components capable of handling high power and operating reliably in various outdoor conditions.\n5.  **Aerospace and Defense:** Mission-critical systems require components with exceptional reliability and resistance to thermal stress, often in extremely compact packages.\n6.  **Industrial IoT and Robotics:** Edge computing devices and industrial control systems benefit from robust, long-lasting components that can operate reliably in challenging industrial settings.\n\nThis technology provides a foundational improvement that will enable the next generation of electronic apparatuses across these and many other sectors.\n\nKeywords: industry impact, high-performance computing, consumer electronics, automotive electronics, 5G infrastructure, aerospace defense, industrial IoT","question":"What industries will Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus impact?"},{"answer":"The patent \"Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus\" (US-9853014) was filed on **September 26, 2016**. This date marks when the application for the invention was officially submitted to the patent office, initiating the examination process.\n\nIt was subsequently published and granted on **December 26, 2017**. The publication date typically signifies when the patent document becomes publicly accessible, offering transparency into the innovation. The grant date confirms that the patent office has recognized the novelty, non-obviousness, and utility of the invention, officially granting the patent rights.\n\nThese dates are important milestones in the lifecycle of intellectual property. The filing date establishes the priority date for the invention, while the publication and grant dates signify its official recognition and the commencement of its enforceable period. This timeline shows a relatively quick progression from filing to grant, indicating the patent office's recognition of the innovation's clear distinctiveness and utility in the field of electronic component design and manufacturing of electronic apparatuses.\n\nKeywords: filing date, publication date, patent grant, US-9853014 timeline, intellectual property dates, electronic component patent","question":"When was Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus filed/granted?"},{"answer":"The commercial applications of the Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus (US-9853014) are extensive, driven by the universal need for improved thermal management in electronics. This innovation's ability to create more efficient, reliable, and compact electronic apparatuses opens up numerous market opportunities:\n\n1.  **High-Performance Processors and GPUs:** Enabling CPUs, GPUs, and specialized AI accelerators to operate at higher clock speeds and power densities, leading to faster computers and more efficient data centers.\n2.  **Power Electronics:** Improving the reliability and power handling capability of power modules used in electric vehicles, renewable energy systems, and industrial motor drives.\n3.  **Compact Consumer Devices:** Facilitating the design of thinner, lighter, and more powerful smartphones, tablets, smartwatches, and other wearables that maintain performance without overheating.\n4.  **5G and Telecommunications Equipment:** Enhancing the thermal stability and lifespan of components in 5G base stations, routers, and other network infrastructure, crucial for robust connectivity.\n5.  **Automotive and Aerospace Systems:** Providing more reliable electronic control units (ECUs) and sensors for autonomous vehicles and avionic systems, where consistent performance in extreme temperatures is critical.\n6.  **Medical Devices:** Enabling smaller, more powerful, and reliable implantable or portable medical electronics where space and heat dissipation are paramount.\n\nThis patent provides a foundational technology that can be licensed or integrated into a wide range of products, offering a significant competitive advantage to manufacturers focusing on performance, reliability, and miniaturization in their electronic apparatuses.\n\nKeywords: commercial applications, electronic apparatus markets, high-performance computing, power electronics, consumer electronics, automotive applications, medical devices","question":"What are the commercial applications of Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus?"},{"answer":"The Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus (US-9853014) lays a robust foundation for numerous future developments in thermal management and electronic component design. We can anticipate several key evolutionary paths for this innovative technology:\n\n1.  **Advanced Material Integration:** Future iterations may explore novel materials with even more extreme thermal conductivity differentials or anisotropic properties, further enhancing heat flow control. This could include advanced ceramics, composite materials, or even nanoscale engineered structures.\n2.  **Dynamic Thermal Management:** Integrating active control elements (e.g., micro-heaters or micro-coolers) with the passive dual-conductivity substrate to enable real-time, dynamic adjustment of thermal pathways based on operational load. This would allow for even more precise temperature regulation within the electronic apparatus.\n3.  **3D Integration and Chiplets:** The principles of this patent are highly adaptable to 3D integrated circuits (3D-ICs) and chiplet architectures. Future developments will likely involve optimizing the heterogeneous substrate for multi-layered stacks, managing inter-die heat transfer, and enabling ultra-dense computing modules.\n4.  **AI-Driven Thermal Design:** Leveraging artificial intelligence and machine learning algorithms to rapidly optimize the geometry, material composition, and placement of the high and low thermal conductivity regions for specific applications, reducing design cycles and maximizing efficiency.\n5.  **Cost Reduction and Scalability:** As the technology matures, manufacturing processes for creating these complex substrates will become more streamlined and cost-effective, leading to broader adoption across high-volume consumer electronic apparatuses.\n\nUltimately, this patent is a stepping stone towards an era where integrated thermal management is a standard, enabling unprecedented levels of performance, reliability, and miniaturization across all electronic systems. These future developments will solidify the Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus as a cornerstone of next-generation technology.\n\nKeywords: future developments, advanced materials, dynamic thermal management, 3D integration, AI thermal design, cost reduction, electronic apparatus evolution","question":"What are the future developments expected for Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus?"}],"topics":["electronic component","electronic apparatus","thermal management","heat dissipation","semiconductor cooling","relentless","demand","higher"],"tech_cluster":null},"seo":{"title":"Electronic Component Thermal Management - Patent US-9853014","description":"Discover the Electronic Component, Electronic Apparatus, and Method of Manufacturing Electronic Apparatus patent (US-9853014) for advanced thermal management in electronics. Learn how its dual-conductivity substrate enables cooler, faster, and more reliable devices.","keywords":["electronic component","electronic apparatus","thermal management","heat dissipation","semiconductor cooling","substrate thermal conductivity","manufacturing electronic apparatus","patent US-9853014","integrated cooling","high-performance electronics","device reliability","thermal control"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853014","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853014","citation_suggestion":"Patentable. \"Electronic component, electronic apparatus, and method of manufacturing electronic apparatus\" (US-9853014). https://patentable.app/patents/US-9853014","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853014","json":"https://patentable.app/api/llm-context/US-9853014","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:35:46.428Z"}