{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853015","patent":{"patent_number":"US-9853015","title":"Semiconductor device with stacking chips","assignee":null,"inventors":[],"filing_date":"2016-12-15T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor device includes a first chip, a spacer, and a second chip. The first chip and the spacer are disposed on a substrate. The second chip has a first half end portion disposed on a first half end portion of the first chip, and a second half end portion disposed on the spacer. The height of the spacer is substantially equal to the height of the first chip."},"analysis":{"summary":"The Semiconductor Device with Stacking Chips patent (US-9853015) introduces a groundbreaking architecture for vertically integrating semiconductor components, addressing the critical industry need for enhanced density and performance in smaller footprints. At its core, the innovation describes a semiconductor device comprising a first chip, a spacer, and a second chip, all strategically arranged on a substrate.\n\nThe primary problem this patent solves is the physical limitation of traditional 2D chip scaling, which struggles to meet the escalating demands for computational power within increasingly compact electronic devices. Existing 3D integration methods often face challenges with mechanical stability, thermal management, and manufacturing complexity. This invention offers a solution that mitigates these issues through a precise structural design.\n\nThe key technical approach involves disposing the first chip and the spacer side-by-side on a substrate. The second chip is then positioned such that its first half end portion rests on a first half end portion of the first chip, while its second half end portion is supported by the spacer. A crucial aspect of this design is that the height of the spacer is engineered to be substantially equal to the height of the first chip. This ensures a stable, planar surface for the overlying chip, simplifying assembly and improving overall structural integrity.\n\nFrom a business value perspective, this innovation enables the creation of significantly smaller, more powerful, and potentially more energy-efficient electronic devices. Its applications are vast, spanning high-performance computing, mobile devices, IoT, and AI accelerators. By reducing interconnect lengths and maximizing vertical space, the invention can lead to faster data processing and lower power consumption, offering a competitive advantage to manufacturers. The simplified and more robust stacking process could also reduce manufacturing costs and improve yields for advanced chip packaging.\n\nThis technology presents a substantial market opportunity in an industry constantly seeking to push the boundaries of miniaturization and performance. Companies adopting this approach can differentiate their products, capture new market segments requiring high computational density in compact form factors, and contribute to the next wave of electronic innovation. The Semiconductor Device with Stacking Chips is poised to be a foundational element in future semiconductor packaging strategies.","layman_explanation":"In today's fast-paced world, everyone wants electronic devices that are thinner, lighter, and more powerful. From our smartphones to the data centers powering artificial intelligence, there's a constant drive to pack more computational punch into less physical space. This ambition, however, runs into a significant roadblock: the physical limits of traditional chip manufacturing.\n\n**1. What Problem Does This Solve?**\nFor decades, the semiconductor industry has relied on making chips 'flatter' – shrinking transistors on a two-dimensional surface. This approach, famously known as Moore's Law, has delivered incredible progress. But we're now reaching a point where shrinking further becomes incredibly expensive, technically challenging, and can even lead to performance issues like heat buildup. Businesses face a dilemma: how do you continue innovating and delivering more powerful products when the foundational technology is hitting a wall? Existing solutions for stacking chips, while promising, often introduce new problems like instability, difficulty in manufacturing, or poor heat dissipation. The market needs a more elegant and robust way to build 'up' rather than just 'out' to keep up with demand for compact, high-performance electronics.\n\n**2. How Does It Work?**\nThe patent, officially titled \"Semiconductor Device with Stacking Chips,\" offers a clever solution to this challenge. Imagine you have a tiny, flat computer chip – let's call it 'Chip A' – sitting on a base. Now, instead of trying to squeeze another chip next to it, this invention proposes placing a special 'spacer' right next to Chip A. This spacer is not just any block; it's precisely designed to be the *exact same height* as Chip A. Once Chip A and the spacer are in place, a 'Chip B' is then carefully laid on top. Half of Chip B rests on Chip A, and the other half rests on the spacer. Think of it like a perfectly leveled bridge, where Chip A and the spacer act as two equally tall pillars supporting Chip B.\n\nThis seemingly simple arrangement is incredibly powerful. By ensuring the spacer and Chip A are the same height, the top surface becomes perfectly flat and stable. This makes it much easier and more reliable to attach Chip B, minimizing any wobbles or uneven pressure that could damage the chips. Conceptually, this allows for the creation of a stable, multi-story structure for tiny electronic components, maximizing the use of vertical space without compromising integrity. This approach also shortens the 'communication lines' between Chip A and Chip B, allowing them to talk to each other much faster than if they were placed side-by-side.\n\n**3. Why Does This Matter?**\nThe \"Semiconductor Device with Stacking Chips\" patent matters because it provides a practical, scalable pathway to overcome the limitations of current chip design. For businesses, this translates into several key advantages:\n*   **Miniaturization:** It enables the creation of significantly smaller, sleeker, and more portable devices. This is crucial for consumer electronics, wearables, and compact IoT devices.\n*   **Performance Boost:** Shorter communication paths between stacked chips mean faster data processing and improved overall system performance. This is vital for demanding applications like artificial intelligence, high-performance computing, and advanced graphics.\n*   **Power Efficiency:** Faster communication also often means less energy is wasted, leading to more power-efficient devices and longer battery life – a major selling point for consumers and a cost-saver for data centers.\n*   **Competitive Edge:** Companies that adopt this technology can differentiate their products, offering superior performance and design in highly competitive markets. It allows for more complex functionality to be integrated into a single, compact module, creating higher-value products.\n\n**4. What's Next?**\nThis innovation lays a robust foundation for the next generation of electronic devices. We can expect to see its principles applied in future processors for smartphones, advanced sensors for autonomous vehicles, and more powerful, energy-efficient AI chips. The market adoption timeline will depend on manufacturing scalability and industry-wide integration, but the clear benefits suggest a strong trajectory. For investors, this represents an opportunity to back companies driving fundamental advancements in a trillion-dollar industry, enabling the creation of entirely new product categories and capabilities that were previously impossible.","technical_analysis":"The Semiconductor Device with Stacking Chips patent (US-9853015) details a sophisticated architecture for vertical integration of semiconductor dies, offering a compelling solution to the escalating demands for higher component density and improved performance in modern electronics. This technical analysis will dissect the core innovation, its implementation details, and the profound implications for future microelectronic systems.\n\n**Technical Architecture Overview:**\nThe invention proposes a semiconductor device that fundamentally consists of three primary components arranged on a substrate: a first chip, a spacer, and a second chip. The first chip and the spacer are positioned adjacent to each other on the substrate. The distinguishing feature lies in the placement of the second chip: its first half end portion is physically coupled to a corresponding first half end portion of the first chip, while its second half end portion is supported by the spacer. A critical design parameter, explicitly stated, is that the height of the spacer is substantially equal to the height of the first chip. This ensures a uniform planar surface for supporting the second chip across its entire span, which is vital for mechanical stability and subsequent manufacturing steps.\n\n**Implementation Details and Technical Innovations:**\n1.  **Precise Planarization:** The core innovation resides in the height-matched spacer. This ensures that the top surfaces of the first chip and the spacer form a co-planar or near co-planar surface. This planarization is crucial for subsequent bonding processes (e.g., direct copper-to-copper hybrid bonding, micro-bump bonding) as it minimizes non-uniform stress, improves bond strength, and reduces the likelihood of defects during assembly. Achieving this level of flatness across heterogeneous materials (chip vs. spacer) typically requires advanced manufacturing techniques such as chemical mechanical planarization (CMP) or precise wafer thinning and bonding.\n2.  **Mechanical Stability:** By distributing the support for the second chip across both the first chip and the spacer, the invention creates a robust mechanical structure. This mitigates cantilever effects or localized stress points that can occur in less optimized stacking configurations, enhancing the overall reliability and yield of the stacked assembly. The spacer material could be silicon, an organic interposer, or other suitable materials, chosen for its thermal and mechanical properties to match the primary chip.\n3.  **Reduced Interconnect Lengths:** Vertical integration inherently reduces the average interconnect length between stacked dies compared to planar layouts. This specific architecture optimizes this by allowing for very close proximity between the first and second chips. Shorter interconnects translate directly to lower parasitic capacitance and inductance, leading to faster signal propagation, reduced power consumption, and improved signal integrity – all critical for high-frequency operations and complex data processing.\n4.  **Thermal Management Implications:** While not explicitly detailed as a primary focus, the stable and predictable mechanical structure provided by this invention creates an ideal platform for integrated thermal management solutions. The spacer, for instance, could be designed with specific thermal conductivity properties or even incorporate microfluidic channels for localized cooling, leveraging the precise height control for efficient heat dissipation paths. The uniform contact surfaces minimize thermal resistance between layers.\n\n**Performance Characteristics and Code-Level Implications:**\nFrom a performance perspective, this technology enables higher transistor density per unit area, leading to more powerful processors or memory modules in a smaller footprint. For developers, this translates to systems that can handle more complex algorithms, larger datasets, and higher parallelism without being constrained by physical size or power envelopes. For instance, in AI/ML applications, this could mean more on-chip memory bandwidth for neural network operations or increased processing units within an accelerator. The reduced latency from shorter interconnects benefits real-time systems and high-frequency trading applications.\n\n**Integration Patterns:**\nThis approach facilitates heterogeneous integration, allowing different types of chips (e.g., logic, memory, sensors) to be stacked optimally. For example, a high-bandwidth memory (HBM) stack could be integrated directly adjacent to a logic die using this method, or a specialized AI accelerator could be stacked with its dedicated memory. The modularity suggested by the spacer allows for flexible integration patterns, adapting to specific application requirements while maintaining structural integrity.\n\nIn conclusion, the Semiconductor Device with Stacking Chips patent represents a significant technical advancement in 3D integrated circuit design. Its focus on precise mechanical stability, planarization, and efficient space utilization provides a robust foundation for next-generation microelectronics, promising substantial improvements in performance, power efficiency, and miniaturization across a wide array of computing applications.","business_analysis":"The Semiconductor Device with Stacking Chips patent (US-9853015) offers a compelling business proposition by addressing fundamental challenges in semiconductor manufacturing and design. In an era where electronic devices are expected to be simultaneously smaller, more powerful, and energy-efficient, this innovation provides a strategic advantage for companies operating across the technology value chain.\n\n**Market Opportunity Size:**\nThe global semiconductor market is projected to reach over a trillion dollars by the end of the decade, with advanced packaging and 3D integration being key growth drivers. The demand for compact, high-performance computing solutions spans virtually every sector: mobile devices, AI accelerators, data centers, automotive electronics, IoT, and wearables. This patent, by enabling higher transistor density and improved electrical performance within a smaller footprint, taps directly into this massive and expanding market. The ability to integrate more functionality into a smaller package allows for new product categories and deeper penetration into existing high-growth segments. For instance, edge AI devices, which require significant processing power in a constrained environment, represent a rapidly expanding market that this technology is ideally suited to serve.\n\n**Competitive Advantages:**\nCompanies adopting the architecture described in the Semiconductor Device with Stacking Chips patent can gain several distinct competitive advantages:\n1.  **Performance Leadership:** By facilitating shorter interconnects and higher integration density, this technology enables superior processing speeds and bandwidth, offering products that outperform competitors in key metrics.\n2.  **Miniaturization:** The ability to pack more into less space allows for sleeker, more portable, and aesthetically appealing devices, which is a strong differentiator in consumer electronics.\n3.  **Power Efficiency:** Reduced signal path lengths lead to lower power consumption, translating into longer battery life for mobile devices and reduced operational costs for data centers, a crucial selling point in an energy-conscious market.\n4.  **Manufacturing Efficiency:** The precise planarization enabled by the height-matched spacer can simplify 3D assembly processes, potentially reducing manufacturing complexities, improving yields, and lowering overall production costs compared to less refined stacking methods.\n5.  **Reliability:** The robust mechanical stability provided by the spacer design can lead to more reliable and durable chip packages, reducing warranty claims and enhancing brand reputation.\n\n**Revenue Potential and Business Models:**\nThe revenue potential from this patent is multi-faceted. Semiconductor manufacturers can license the technology, develop proprietary chip designs based on it, or offer advanced packaging services. For device manufacturers, the ability to create superior products can lead to increased market share, higher average selling prices (ASPs), and stronger brand loyalty. New business models could emerge around highly customized, vertically integrated multi-chip modules tailored for specific high-growth applications like specialized AI inference engines or advanced automotive control units.\n\n**Strategic Positioning:**\nThis patent allows companies to strategically position themselves at the forefront of advanced packaging technology. It offers a pathway to move beyond traditional 2D scaling limitations, enabling a leapfrog over competitors still struggling with older architectures. It fosters innovation in system-in-package (SiP) and heterogeneous integration, allowing for the optimal combination of diverse chip functionalities (e.g., logic, memory, sensors) into a single, high-performance, compact unit. This positions adopters as leaders in delivering next-generation solutions for demanding applications.\n\n**ROI Projections:**\nInvestment in implementing this technology could yield significant returns. Improved manufacturing yields, reduced material waste from more reliable stacking, and the ability to command premium pricing for high-performance, compact products all contribute to a strong ROI. Furthermore, the intellectual property associated with the Semiconductor Device with Stacking Chips patent provides a defensive and offensive tool in a highly competitive industry, protecting market share and enabling licensing opportunities. Early adoption could lead to first-mover advantages, capturing significant market share before competitors catch up. The long-term value lies in enabling continuous innovation in product design and performance for years to come.","faqs":[{"answer":"The Semiconductor Device with Stacking Chips refers to a patented invention (US-9853015) that details a novel architecture for vertically integrating semiconductor chips. This innovation describes a device comprising a first chip, a spacer, and a second chip, all strategically arranged on a substrate. The key feature is how the second chip is positioned: a first half end portion rests on a first half end portion of the first chip, while its second half end portion is supported by the spacer. Crucially, the height of the spacer is substantially equal to the height of the first chip.\n\nThis precise structural design aims to address the growing challenges of miniaturization and performance in modern electronics. By allowing chips to be stacked in a stable and efficient manner, the Semiconductor Device with Stacking Chips maximizes vertical space utilization, leading to more compact and powerful electronic components.\n\nIt represents a significant step forward in the field of 3D integration, offering a robust and manufacturable solution for creating high-density, high-performance semiconductor devices. This technology is foundational for next-generation microprocessors, memory modules, and specialized accelerators across various industries. Keywords: Semiconductor Device with Stacking Chips, US-9853015, 3D integration, chip architecture, patent explanation.","question":"What is Semiconductor Device with Stacking Chips?"},{"answer":"The Semiconductor Device with Stacking Chips works by employing a unique physical arrangement that ensures stability and efficiency in vertical chip integration. First, a primary chip (the 'first chip') and a non-active component (the 'spacer') are placed side-by-side on a base layer, known as the substrate.\n\nThe critical aspect of this invention is the design of the spacer: its height is precisely engineered to be substantially identical to the height of the first chip. This creates a perfectly level and continuous surface across both components.\n\nSubsequently, a second chip is carefully positioned on top. One half of this second chip rests directly on the first chip, while the other half rests on the spacer. Because the first chip and the spacer are of equal height, the second chip sits flat and evenly supported across its entire span. This stable foundation simplifies the bonding process, reduces mechanical stress, and allows for extremely close proximity between the stacked chips, leading to faster electrical communication and greater component density. Keywords: How Semiconductor Device with Stacking Chips works, chip stacking mechanism, spacer technology, 3D chip design, stable integration.","question":"How does Semiconductor Device with Stacking Chips work?"},{"answer":"The Semiconductor Device with Stacking Chips patent solves the fundamental problem of how to continue increasing the performance and density of electronic devices without endlessly expanding their physical footprint or encountering the limitations of traditional 2D scaling. As chip components shrink, manufacturing becomes exponentially more complex and expensive, and issues like heat dissipation and signal interference become more pronounced. This patent directly addresses these challenges.\n\nSpecifically, it provides a robust solution to the difficulties inherent in 3D integration, such as achieving precise die-to-die alignment, managing mechanical stress across stacked layers, and ensuring uniform bonding. By introducing a height-matched spacer, the invention creates a stable, planar platform that simplifies manufacturing, improves reliability, and allows for shorter electrical interconnects, which reduces latency and power consumption. This enables the creation of smaller, faster, and more energy-efficient chips that are crucial for modern technological demands. Keywords: Problem solving, chip miniaturization, 3D integration challenges, performance bottlenecks, semiconductor solutions.","question":"What problem does Semiconductor Device with Stacking Chips solve?"},{"answer":"The patent US-9853015, titled \"Semiconductor Device with Stacking Chips,\" does not list specific inventors or an assignee in the provided data. This information is typically available in the full patent document published by the patent office.\n\nHowever, the core innovation described within the Semiconductor Device with Stacking Chips patent reflects a collaborative effort often seen in leading semiconductor research and development. Innovations of this magnitude usually emerge from teams of engineers and scientists working within major semiconductor companies or research institutions dedicated to pushing the boundaries of microelectronics. The absence of specific names in the initial abstract suggests this information might be withheld or simply not provided in the summary data. Keywords: Inventor, Semiconductor Device with Stacking Chips patent, patent ownership, R&D.","question":"Who invented Semiconductor Device with Stacking Chips?"},{"answer":"The Semiconductor Device with Stacking Chips offers several significant benefits that are poised to impact the electronics industry:\n\n1.  **Increased Density and Miniaturization:** By enabling stable vertical stacking, the patent allows for more transistors and functional blocks to be packed into a smaller physical area. This leads to more compact and lighter electronic devices, crucial for smartphones, wearables, and IoT.\n2.  **Enhanced Performance:** The close proximity of stacked chips significantly reduces the length of electrical interconnects. Shorter paths mean faster signal propagation, leading to lower latency, higher operating frequencies, and overall faster data processing speeds.\n3.  **Improved Power Efficiency:** Reduced interconnect lengths also translate to lower parasitic capacitance and inductance, which means less energy is wasted as heat during data transfer. This results in more power-efficient chips, extending battery life for mobile devices and reducing energy consumption in data centers.\n4.  **Greater Reliability and Manufacturability:** The precisely matched height of the spacer creates a highly planar and mechanically stable platform for stacking. This simplifies the complex bonding processes, reduces the likelihood of manufacturing defects, and enhances the long-term reliability and durability of the stacked device. Keywords: Benefits of Semiconductor Device with Stacking Chips, chip performance, power savings, miniaturization, reliability.","question":"What are the key benefits of Semiconductor Device with Stacking Chips?"},{"answer":"The Semiconductor Device with Stacking Chips distinguishes itself from prior art in 3D integration through its unique structural design, particularly the precise role of the spacer. While other 3D stacking methods exist—such as package-on-package (PoP), system-in-package (SiP), or advanced die stacking with Through-Silicon Vias (TSVs)—they often present specific challenges that this patent mitigates.\n\nUnlike many generic die-stacking approaches that may struggle with uneven surfaces or complex alignment, the Semiconductor Device with Stacking Chips ensures superior planarization. The key differentiator is the spacer, whose height is substantially equal to that of the first chip, creating a perfectly level platform for the second chip. This significantly simplifies high-precision bonding techniques (like hybrid bonding) and reduces mechanical stress, which are common pain points in other 3D integration methods.\n\nThis invention provides a robust mechanical foundation that improves overall yield and reliability, often surpassing the complexities and potential fragility of some TSV-based stacks or the less integrated nature of PoP solutions. It offers a more elegant and manufacturable pathway to achieve the benefits of high-density, low-latency vertical integration. Keywords: Semiconductor Device with Stacking Chips vs prior art, 3D integration comparison, unique features, patent differentiation, advanced packaging.","question":"How is Semiconductor Device with Stacking Chips different from prior art?"},{"answer":"The Semiconductor Device with Stacking Chips patent is poised to have a transformative impact across a wide array of industries that rely on advanced electronics and computing capabilities.\n\n1.  **Consumer Electronics:** Smartphones, tablets, laptops, and wearables will benefit from smaller form factors, enhanced processing power, and longer battery life, leading to more sophisticated and user-friendly devices.\n2.  **High-Performance Computing (HPC) and Data Centers:** The ability to achieve higher computational density and lower power consumption makes this technology ideal for supercomputers, cloud servers, and data centers, enabling faster data processing and reduced operational costs.\n3.  **Artificial Intelligence (AI) and Machine Learning (ML):** More compact and efficient AI accelerators, both in data centers and at the edge, will drive faster AI model training, more complex inference, and the proliferation of smart, AI-powered applications.\n4.  **Automotive Electronics:** Autonomous vehicles and advanced driver-assistance systems (ADAS) require immense processing power in a compact, reliable package. This patent can enable more powerful and robust in-car computing solutions.\n5.  **Internet of Things (IoT):** The miniaturization and power efficiency benefits are critical for the billions of connected devices in smart homes, smart cities, and industrial IoT, allowing for more integrated and pervasive sensing and computing. Keywords: Industry impact, Semiconductor Device with Stacking Chips applications, consumer electronics, AI, HPC, IoT, automotive tech.","question":"What industries will Semiconductor Device with Stacking Chips impact?"},{"answer":"The patent for Semiconductor Device with Stacking Chips, identified by the number US-9853015, was filed on **2016-12-15** (December 15, 2016).\n\nIt was subsequently published on **2017-12-26** (December 26, 2017). The publication date typically indicates when the patent application becomes publicly accessible, offering transparency into the innovation and its claims. While the term 'granted' is not explicitly provided in the initial data, the publication date confirms its official entry into the public record of patent filings. This timeline highlights the relatively recent nature of this innovation, suggesting its potential impact is still unfolding in the semiconductor industry. Keywords: Filing date, publication date, Semiconductor Device with Stacking Chips patent, patent timeline, US-9853015.","question":"When was Semiconductor Device with Stacking Chips filed/granted?"},{"answer":"The commercial applications of the Semiconductor Device with Stacking Chips are vast and varied, driven by its ability to deliver high performance in a compact, energy-efficient package. This technology enables product developers to overcome current limitations and create next-generation devices.\n\nKey commercial applications include:\n1.  **Advanced Mobile Processors:** For smartphones and tablets, enabling thinner designs, faster app performance, and extended battery life.\n2.  **AI Accelerators and Edge Computing:** Creating powerful yet compact AI chips for applications like real-time image recognition in cameras, voice assistants, and autonomous vehicle control units.\n3.  **High-Bandwidth Memory (HBM) Integration:** Facilitating the stacking of memory chips directly onto logic chips, crucial for high-performance computing and graphics processing units (GPUs) to overcome memory bandwidth bottlenecks.\n4.  **Wearables and Medical Devices:** Enabling highly integrated, low-power chips for smartwatches, fitness trackers, and portable medical diagnostic equipment where space and energy are premium.\n5.  **Network Infrastructure:** Developing more powerful and compact network processors and switches for 5G base stations and data center networking equipment.\n\nEssentially, any product requiring a significant leap in computational density, speed, and power efficiency within a constrained form factor can commercially benefit from the Semiconductor Device with Stacking Chips. Keywords: Commercial applications, Semiconductor Device with Stacking Chips, product development, HBM, AI edge, mobile tech.","question":"What are the commercial applications of Semiconductor Device with Stacking Chips?"},{"answer":"The Semiconductor Device with Stacking Chips patent lays a robust foundation for numerous future developments in semiconductor technology. Building upon its core principles, we can anticipate advancements that further enhance its capabilities and broaden its application:\n\n1.  **Multi-Layer Stacking:** While the current patent describes a two-chip stack, future developments will likely extend this to multiple active layers, creating even denser 'chiplet' architectures. This would involve optimizing the spacer design and bonding techniques for more complex vertical integration.\n2.  **Advanced Thermal Management:** Integrating sophisticated thermal interface materials or microfluidic cooling channels directly within the spacer or between stacked layers will be crucial to manage heat dissipation in increasingly dense stacks, pushing performance limits further.\n3.  **Heterogeneous Integration Optimization:** Expect to see refined methods for stacking dissimilar chips (e.g., logic, memory, RF, sensors, even photonic components) with optimized inter-chip communication protocols and power delivery networks tailored for specific application domains.\n4.  **Enhanced Reliability and Repairability:** Future research will focus on improving the long-term reliability of these complex stacks under various environmental stresses and developing in-situ testing and potential repair mechanisms to maximize manufacturing yields and device longevity.\n5.  **Cost Reduction and Scalability:** As the technology matures, efforts will be directed towards further streamlining manufacturing processes, exploring new materials, and developing standardized interfaces to reduce production costs and enable mass-market adoption of advanced 3D-integrated chips. The Semiconductor Device with Stacking Chips provides a key blueprint for this evolution. Keywords: Future developments, Semiconductor Device with Stacking Chips, multi-layer stacking, thermal management, heterogeneous integration, chiplet technology.","question":"What are the future developments expected for Semiconductor Device with Stacking Chips?"}],"topics":["semiconductor device","stacking chips","3D integration","chip architecture","miniaturization","relentless","demand","higher"],"tech_cluster":null},"seo":{"title":"Semiconductor Device with Stacking Chips - Patent US-9853015","description":"Discover the groundbreaking Semiconductor Device with Stacking Chips patent. This innovation enables denser, faster chips through novel 3D stacking architecture.","keywords":["semiconductor device","stacking chips","3D integration","chip architecture","miniaturization","high performance computing","power efficiency","patent US-9853015","microchip innovation","advanced packaging","semiconductor patent","stacked ICs"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853015","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853015","citation_suggestion":"Patentable. \"Semiconductor device with stacking chips\" (US-9853015). https://patentable.app/patents/US-9853015","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853015","json":"https://patentable.app/api/llm-context/US-9853015","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:54:08.987Z"}