{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853016","patent":{"patent_number":"US-9853016","title":"Systems and methods for high-speed, low-profile memory packages and pinout designs","assignee":null,"inventors":[],"filing_date":"2017-02-17T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides."},"analysis":{"summary":"The patent, \"Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs,\" introduces a groundbreaking approach to designing stacked semiconductor memory packages. At its core, this innovation provides an integrated circuit (IC) package substrate engineered to overcome traditional limitations in data transmission speed and physical footprint for memory modules.\n\nThe primary problem this patent addresses is the persistent challenge of achieving both high-speed data transfer and a compact, low-profile design in stacked memory architectures. Conventional methods often face signal integrity issues, crosstalk, and increased bulkiness as memory density and speed requirements escalate, hindering the performance and miniaturization of electronic devices.\n\nThis technology's key technical approach lies in its unique dual-channel data transmission system. The IC package substrate is designed to route data to the stacked memory dies over two distinct channels. Crucially, each channel is strategically located on one side of the IC package substrate, allowing signals to be routed from their respective sides. This spatial separation and optimized pinout significantly enhance signal integrity, reduce interference, and facilitate higher data throughput compared to single-channel or less optimized routing strategies.\n\nThe business value and applications of this invention are substantial. It enables the development of next-generation electronic devices that demand both high performance and a compact form factor, such as advanced smartphones, AI accelerators, high-performance computing (HPC) systems, and edge computing devices. By providing a solution for faster, more reliable, and smaller memory packages, this patent offers a critical competitive advantage to semiconductor manufacturers and device makers.\n\nThe market opportunity for this innovation is vast, spanning across consumer electronics, enterprise hardware, automotive, and industrial sectors. As the demand for data processing continues to surge, the ability to integrate high-speed, low-profile memory becomes an indispensable component for future technological advancements, making this patent a pivotal intellectual property asset in the evolving semiconductor landscape.","layman_explanation":"In today's fast-paced digital world, the demand for electronic devices that are both powerful and incredibly compact is relentless. From the latest smartphones to advanced AI servers, everything needs to process more data, faster, and within smaller physical footprints. However, achieving this balance, especially with memory components, has been a significant engineering challenge. This is precisely the problem that the patent, \"Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs,\" seeks to solve.\n\n**1. What Problem Does This Solve?**\nImagine trying to fit a super-powerful engine into a sleek, sports car chassis. That's the challenge facing memory designers. Modern electronic devices require memory chips that can store vast amounts of data (high density) and retrieve it at lightning speed (high bandwidth). To achieve high density, memory chips are often stacked on top of each other, like a multi-story building. The problem is, when you stack chips, all the electrical signals (data) have to travel through very small pathways, which can lead to interference, slowdowns, and make the entire package thicker. This 'bottleneck' forces device manufacturers to often choose between speed, size, or cost, limiting the potential of next-generation products. Existing solutions often struggle with signal clarity in these dense stacks, leading to errors or requiring bulky error-correction systems, further adding to the size or cost.\n\n**2. How Does It Work?**\nThis innovative patent introduces a smarter way to connect these stacked memory chips. Think of the base of the memory stack, called an Integrated Circuit (IC) package substrate, as a central highway interchange. In older designs, all the data traffic might try to merge onto one main highway. This patent redesigns this interchange to have *two* dedicated, high-speed highways, each located on a different 'side' of the substrate. So, instead of one congested path, data can flow more freely and cleanly through two separate, optimized routes. Signals from the memory chips above are routed to their specific side-channel, ensuring a smoother, faster journey to the main processor. This is akin to building a two-lane express road system for data, where each lane has its own entrance and exit ramps, dramatically reducing traffic jams and speeding up delivery.\n\n**3. Why Does This Matter?**\nThis approach matters because it allows for the creation of memory packages that are simultaneously faster, more reliable, and much thinner. For businesses, this translates into several key advantages:\n\n*   **Competitive Edge:** Manufacturers can build devices that outperform competitors in speed and sleekness, capturing market share in high-demand segments like premium smartphones, AI accelerators, and high-performance computing.\n*   **New Product Opportunities:** The ability to pack more performance into smaller spaces opens doors for entirely new product categories, such as ultra-miniature AI devices, advanced wearables, or even new forms of augmented and virtual reality hardware.\n*   **Improved Efficiency and Reliability:** Cleaner signal paths mean fewer data errors, leading to more reliable devices and potentially lower manufacturing costs by reducing the need for extensive error correction. This also contributes to better power efficiency, a critical factor for battery-powered devices and data centers looking to reduce energy consumption.\n*   **Investment Value:** For investors, this patent represents a foundational technology that addresses a critical and growing need in the semiconductor industry. It offers a clear path to commercialization with significant potential for market disruption and long-term revenue generation through product sales or licensing.\n\n**4. What's Next?**\nThe implications for this technology are far-reaching. We can expect to see its principles adopted in future generations of memory standards, enabling even more powerful and compact devices across consumer, enterprise, and industrial sectors. As the world becomes increasingly reliant on data and AI, innovations like this patent will be indispensable, driving advancements in everything from autonomous vehicles to smart cities. Companies that embrace and integrate this technology will be well-positioned to lead the charge in the next wave of electronic innovation, shaping the future of digital experiences.","technical_analysis":"The patent, \"Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs,\" outlines a sophisticated solution for enhancing the performance and physical integration of stacked semiconductor memory packages. This technical analysis will dissect the proposed architecture, implementation nuances, and the underlying principles that contribute to its efficacy.\n\n**Technical Architecture and Core Innovation**\nAt the heart of this invention is a meticulously designed integrated circuit (IC) package substrate. This substrate serves as the foundational interface between the underlying system (e.g., a motherboard or interposer) and the vertically stacked memory dies. The primary innovation lies in its capability to support data transmission to these stacked memory dies via two distinct, spatially separated channels. Specifically, each channel is situated on one side of the IC package substrate, and signals are routed from these respective sides directly to the memory dies.\n\nThis architecture contrasts with more traditional designs where signal routing might be centralized or less optimized for high-speed, multi-layer communication. By segregating the data pathways to opposing sides of the substrate, the system inherently mitigates common electrical challenges in dense packaging:\n\n1.  **Crosstalk Reduction:** Physical separation of high-speed differential signal pairs, or even single-ended signals, minimizes inductive and capacitive coupling. This reduction in crosstalk is paramount for maintaining signal integrity at increasing data rates, preventing data errors, and allowing for tighter timing margins.\n2.  **Optimized Signal Path Lengths:** Routing from two sides can allow for more direct and potentially shorter signal paths to various sections of the stacked memory. Shorter paths mean less attenuation, lower impedance discontinuities, and reduced propagation delay, all contributing to higher operational frequencies and lower latency.\n3.  **Enhanced Power Delivery Network (PDN):** While not explicitly detailed in the abstract, the dual-sided channel approach often implies a more robust and distributed power and ground plane design within the substrate. A cleaner PDN is vital for suppressing simultaneous switching noise (SSN) and ensuring stable voltage delivery to the high-speed I/O buffers of the memory dies.\n\n**Implementation Details**\nImplementing this technology would involve advanced semiconductor packaging techniques. The IC package substrate itself would likely be a multi-layer organic or silicon interposer, fabricated with high-density interconnects (HDIs) and potentially incorporating through-substrate vias (TSVs) for vertical connections. The memory dies, which are stacked atop this substrate, would be interconnected using micro-bumps (e.g., C4 bumps) or hybrid bonding techniques, providing high-bandwidth, low-resistance connections.\n\nThe pinout design is critical. It would involve a careful allocation of data, address, and control signals such that they leverage the two distinct side channels. This could necessitate a symmetrical or asymmetrical pin assignment strategy, depending on the specific memory interface (e.g., DDR, HBM, LPDDR) and the number of dies in the stack. The routing would prioritize minimizing trace lengths and avoiding sharp turns that introduce impedance mismatches.\n\n**Performance Characteristics and Implications**\n*   **Increased Bandwidth:** The two independent channels enable parallel data processing, effectively doubling the potential data throughput compared to a single-channel equivalent, assuming the memory dies can support such parallel access.\n*   **Lower Latency:** Optimized signal paths and reduced signal degradation contribute to faster data access times.\n*   **Improved Reliability:** Enhanced signal integrity directly translates to a lower bit error rate (BER), which is crucial for mission-critical applications and reduces the need for complex error correction schemes.\n*   **Thermal Efficiency (Indirect):** While the patent doesn't explicitly detail thermal solutions, more efficient electrical routing and reduced signal loss can lead to lower power dissipation within the signal paths, indirectly contributing to better thermal management within the dense stack.\n*   **Low-Profile Form Factor:** The efficiency of the pinout and routing allows for a more compact vertical stacking, supporting the development of thinner and smaller electronic devices without sacrificing performance.\n\n**Integration Patterns and Code-Level Implications**\nFrom a system integration perspective, this memory package would present itself as a high-bandwidth, low-latency memory block. Software developers and firmware engineers would benefit from the increased memory performance, enabling more complex algorithms, larger datasets, and faster execution times for memory-bound applications. For example, in GPU programming, kernels could access textures and buffers more rapidly, leading to higher frames per second or faster AI model training. The underlying operating system and device drivers would interact with the memory controller, which would be designed to fully exploit the dual-channel capabilities of this innovative package, abstracting the physical routing details from higher-level software. This patent provides a robust hardware foundation for optimizing software performance in data-intensive applications.","business_analysis":"The patent, \"Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs,\" represents a significant leap in semiconductor memory technology, poised to unlock substantial business opportunities and reshape competitive landscapes across various industries. This innovation addresses fundamental challenges in memory performance and packaging, critical for the next generation of electronic devices.\n\n**Market Opportunity Size and Growth Drivers**\nThe global semiconductor memory market is a multi-billion dollar industry, driven by insatiable demand for data storage and processing across diverse sectors. Key growth drivers include:\n\n*   **Artificial Intelligence (AI) and Machine Learning (ML):** These applications require immense memory bandwidth and capacity for model training and inference.\n*   **High-Performance Computing (HPC):** Supercomputers and data centers continuously seek faster and denser memory solutions.\n*   **5G/6G and Edge Computing:** The proliferation of connected devices and real-time data processing at the network edge demands compact, high-speed memory.\n*   **Consumer Electronics:** Smartphones, laptops, gaming consoles, and wearables are constantly pushing for thinner form factors combined with enhanced performance.\n*   **Automotive:** Autonomous driving systems and advanced infotainment require robust, high-speed, and reliable memory.\n\nThe Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent directly caters to these trends by enabling memory solutions that are both high-speed and low-profile. This positions the technology to capture significant market share in premium and performance-critical segments.\n\n**Competitive Advantages and Strategic Positioning**\nThis patent offers several distinct competitive advantages:\n\n1.  **Performance Leadership:** By facilitating dual-channel, side-routed data transmission, the invention significantly enhances signal integrity and data throughput in stacked memory. This can lead to superior performance metrics (e.g., lower latency, higher bandwidth) compared to competing memory packages.\n2.  **Miniaturization:** The low-profile design allows device manufacturers to create thinner, lighter, and more compact products without compromising on memory performance. This is a critical differentiator in markets where form factor is a key selling point (e.g., smartphones, wearables).\n3.  **Cost Efficiency (Indirect):** While advanced packaging can be initially costly, the improved signal integrity can reduce the need for complex error correction hardware, potentially leading to lower overall system costs and higher manufacturing yields for advanced memory modules.\n4.  **IP Protection:** Owning the intellectual property for such a foundational technology provides a strong barrier to entry for competitors and a valuable asset for licensing or strategic partnerships.\n\nCompanies leveraging this patent can strategically position themselves as leaders in high-performance, compact memory solutions, attracting top-tier clients in high-growth segments like AI hardware and premium mobile devices.\n\n**Revenue Potential and Business Models**\nRevenue generation from this patent could stem from multiple avenues:\n\n*   **Direct Manufacturing and Sales:** Companies that own and implement this technology in their own memory products (e.g., DRAM, HBM) can command higher prices due to superior performance and form factor.\n*   **Licensing:** Licensing the technology to other semiconductor manufacturers or device makers for integration into their products. This model offers high-margin royalty streams.\n*   **Joint Ventures/Partnerships:** Collaborating with leading OEMs or fabless semiconductor companies to co-develop products that embed this innovative memory packaging.\n\nGiven the widespread demand for high-performance, compact memory, the revenue potential is substantial, especially in a market where differentiation often comes from incremental performance gains. This patent offers a non-incremental leap.\n\n**ROI Projections**\nInvesting in the development and commercialization of this technology carries a strong ROI potential. The ability to address critical bottlenecks in memory performance and packaging translates directly into market leadership and premium pricing. Reduced design complexity due to improved signal integrity and potentially higher manufacturing yields further bolster profitability. Early adoption by key industry players could rapidly establish this approach as a de facto standard, generating long-term returns through market dominance and continued licensing opportunities. The strategic value of enabling future generations of high-performance, compact devices cannot be overstated, making this patent a highly attractive asset for investment and strategic development.","faqs":[{"answer":"The Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs is a patent that describes a novel approach to designing stacked semiconductor memory packages. At its core, this innovation provides an integrated circuit (IC) package substrate specifically engineered to facilitate high-speed data transmission to multiple memory dies that are stacked vertically within the package.\n\nIts key differentiating feature is the use of two distinct data channels. Each of these channels is strategically located on one side of the IC package substrate. This allows signals to be routed to the memory dies from their respective sides, which significantly enhances signal integrity and overall data throughput.\n\nEssentially, this patent outlines how to build memory modules that are not only incredibly fast but also remarkably thin and compact, addressing critical needs in modern electronics where both performance and physical size are paramount. It represents a significant advancement in semiconductor packaging technology, aimed at overcoming the limitations of traditional memory designs.","question":"What is Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs?"},{"answer":"The Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent works by intelligently optimizing the data pathways within a stacked memory package. Instead of relying on a single, potentially congested route for all data, the invention utilizes an advanced Integrated Circuit (IC) package substrate.\n\nThis substrate is designed with two distinct data channels, each positioned on a separate side of the substrate. When data needs to be sent to or received from the memory dies stacked above, signals are routed through these dedicated side channels. For example, one set of signals might use the left channel, while another uses the right.\n\nThis architectural separation minimizes interference (crosstalk) between signals, ensuring cleaner and more reliable data transmission. It also allows for more efficient and shorter signal paths, which directly translates to higher data transfer speeds and a lower overall physical profile for the memory package. It’s like having two well-organized express lanes for data, rather than one crowded main road.","question":"How does Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs work?"},{"answer":"The Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent primarily solves the dual problem of achieving high-speed data transfer and a compact, low-profile design in stacked semiconductor memory packages.\n\nTraditional stacked memory architectures, while offering high density, often face significant challenges: signal integrity degradation (crosstalk, noise) at high data rates, which leads to performance bottlenecks and errors; and physical bulkiness, as complex routing for many signals can necessitate thicker substrates. These issues limit the overall performance and miniaturization capabilities of electronic devices.\n\nThis innovation mitigates these problems by providing a more efficient, dual-channel routing system that enhances signal clarity and allows for a thinner package. It enables the development of devices that are both incredibly fast and remarkably slim, removing a critical bottleneck for next-generation computing, AI, and mobile technologies. This patent addresses the fundamental trade-off between speed, density, and form factor.","question":"What problem does Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs solve?"},{"answer":"The patent data provided does not specify the names of the inventors. However, patents like Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs are typically the result of extensive research and development by teams of engineers and scientists within leading semiconductor companies or research institutions. These teams often consist of experts in areas such as integrated circuit design, semiconductor packaging, materials science, and signal integrity engineering.\n\nWhile the specific individuals are not listed here, the innovation represents a collective effort to push the boundaries of memory technology. The assignee, if known, would indicate the company or organization that owns the rights to this intellectual property. Such patents are crucial assets for companies in the highly competitive semiconductor industry, protecting their technological advancements and providing a foundation for future product development.","question":"Who invented Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs?"},{"answer":"The Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent offers several critical benefits for modern electronics:\n\n1.  **Enhanced High-Speed Data Transfer:** By utilizing two distinct, side-routed channels, the invention significantly improves signal integrity and reduces interference, enabling much faster and more reliable data transmission to and from stacked memory dies. This boosts overall system performance.\n2.  **Achieves a Low-Profile Design:** The efficient pinout and routing strategy allows for a more compact vertical stacking of memory dies, resulting in a thinner and smaller memory package. This is vital for miniaturized devices like smartphones, wearables, and ultra-thin laptops.\n3.  **Improved Signal Integrity:** The physical separation of data channels minimizes crosstalk and noise, leading to cleaner signals and a lower bit error rate. This enhances the reliability and stability of the memory system.\n4.  **Enables Next-Generation Devices:** This technology removes a critical bottleneck in memory design, paving the way for more powerful AI accelerators, high-performance computing systems, and advanced mobile devices that require both speed and a compact form factor. These benefits collectively make this patent a valuable asset for advancing semiconductor technology.","question":"What are the key benefits of Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs?"},{"answer":"The Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent differentiates itself from prior art by its innovative dual-channel, side-routed data transmission architecture within an integrated circuit (IC) package substrate. Prior art in stacked memory typically faced significant challenges in scaling both bandwidth and maintaining signal integrity without increasing package bulk.\n\nMany existing stacked memory solutions often routed signals through more centralized or less optimized pathways, leading to higher crosstalk, increased signal degradation, and limitations on maximum operating frequencies. They often relied on compensatory measures like complex error correction, which could add latency and power consumption.\n\nThis patent, however, fundamentally redesigns the data pathways by dedicating two channels to opposing sides of the substrate, routing signals from their respective sides. This direct architectural solution intrinsically enhances signal integrity, boosts bandwidth, and allows for a genuinely low-profile package without the compromises often seen in earlier designs. It represents a more elegant and efficient engineering solution to long-standing memory packaging problems.","question":"How is Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs different from prior art?"},{"answer":"The Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent is poised to impact a wide array of industries that rely heavily on high-performance, compact memory solutions:\n\n1.  **Consumer Electronics:** This includes smartphones, laptops, tablets, gaming consoles, and wearables, where there's a constant drive for thinner form factors and faster processing capabilities.\n2.  **High-Performance Computing (HPC) and Data Centers:** For servers, supercomputers, and cloud infrastructure, the technology can provide higher memory bandwidth and efficiency, crucial for large-scale data processing and reducing operational costs.\n3.  **Artificial Intelligence (AI) and Machine Learning (ML):** AI accelerators and inference engines require immense memory bandwidth to handle complex models and real-time data, making this patent a key enabler for advanced AI hardware.\n4.  **Automotive:** Autonomous vehicles and advanced driver-assistance systems (ADAS) demand highly reliable, high-speed memory for sensor data processing and real-time decision-making.\n5.  **Edge Computing and IoT:** Compact, powerful memory is essential for intelligent edge devices and IoT gateways that perform on-device processing without relying solely on cloud connectivity.\n\nThis patent's ability to deliver both speed and miniaturization makes it a foundational technology across these diverse and rapidly evolving sectors.","question":"What industries will Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs impact?"},{"answer":"The patent, \"Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs,\" was filed on **February 17, 2017**. This marks the initial date when the inventors or assignee formally submitted their application to the patent office, establishing their claim to the invention.\n\nThe patent was subsequently published, indicating it had moved through the examination process, on **December 26, 2017**. The publication date is when the patent document becomes publicly accessible, allowing others to review its details, claims, and technical specifications. This timeline reflects a relatively swift publication process, highlighting the potential relevance and novelty of the innovation at the time of its filing within the fast-moving semiconductor industry. The filing and publication dates are crucial for understanding the patent's lifecycle and its position within the prior art landscape.","question":"When was Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs filed/granted?"},{"answer":"The commercial applications of the Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent are extensive, primarily driven by its ability to deliver high-speed, low-profile memory solutions. This makes it ideal for products where both performance and compact form factor are critical:\n\n1.  **High-End Mobile Devices:** Next-generation smartphones and tablets can integrate more powerful processors and memory without increasing device thickness, enabling faster app performance, seamless multitasking, and advanced camera capabilities.\n2.  **Ultra-Portable Laptops and Convertibles:** This technology allows for thinner, lighter, and more energy-efficient computing devices that offer desktop-class performance, enhancing portability without compromise.\n3.  **AI Accelerators and Specialized Processors:** Dedicated hardware for Artificial Intelligence and Machine Learning can leverage the increased memory bandwidth for faster model training and real-time inference, crucial for applications in autonomous driving, natural language processing, and computer vision.\n4.  **AR/VR Headsets:** Augmented and Virtual Reality devices require immense processing power and high-speed memory in a compact, lightweight form factor to deliver immersive, low-latency experiences.\n5.  **Enterprise Servers and Data Centers:** While 'low-profile' might seem less critical here, efficiency and density still matter. Higher bandwidth per unit volume can lead to more powerful and energy-efficient server modules, reducing the physical footprint and operational costs of data centers.\n\nEssentially, any product that benefits from having powerful memory in a small space can become a commercial application for this innovative patent.","question":"What are the commercial applications of Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs?"},{"answer":"The Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent lays a robust foundation for numerous future developments in semiconductor memory. We can anticipate several key evolutionary paths for this technology:\n\n1.  **Integration into Next-Gen Memory Standards:** The principles of this patent are likely to be adopted and integrated into future iterations of high-bandwidth memory (HBM), LPDDR (Low-Power Double Data Rate), and other emerging memory standards, becoming a de facto approach for high-performance stacked memory.\n2.  **Increased Channel Density and Scalability:** While the patent describes two channels, future developments might explore scaling this concept to more than two side-routed channels, further boosting bandwidth and parallelism within even denser packages.\n3.  **Advanced Thermal Management Integration:** As memory stacks become more powerful, integrating advanced thermal solutions directly into or around the IC package substrate, leveraging the existing side-channel architecture, could be a logical next step to dissipate heat more efficiently.\n4.  **Heterogeneous Integration:** This memory packaging could become a critical component in advanced heterogeneous integration, where different types of chips (e.g., CPU, GPU, AI accelerators, specialized memory) are co-packaged or integrated onto a single substrate, forming highly optimized Systems-on-Chip (SoCs).\n5.  **Adaptation to Novel Memory Technologies:** The core concepts of efficient, low-profile, high-speed routing could be adapted for future non-volatile memory technologies or other emerging memory types, ensuring their seamless integration into high-performance systems. These developments will continue to push the boundaries of what's possible in computing, driven by the foundational innovation of this patent.","question":"What are the future developments expected for Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs?"}],"topics":["high-speed memory","low-profile memory","stacked semiconductor","memory packaging","pinout design","technical","background","modern"],"tech_cluster":null},"seo":{"title":"High-Speed, Low-Profile Memory - Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs US-9853016","description":"Discover the Systems and Methods for High-speed, Low-profile Memory Packages and Pinout Designs patent: innovative dual-channel, low-profile memory packaging for high-speed data. Enhances signal integrity for next-gen devices.","keywords":["high-speed memory","low-profile memory","stacked semiconductor","memory packaging","pinout design","data transmission","IC package substrate","semiconductor innovation","memory bandwidth","signal integrity","US-9853016 patent","memory architecture","compact memory","high-density memory"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853016","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853016","citation_suggestion":"Patentable. \"Systems and methods for high-speed, low-profile memory packages and pinout designs\" (US-9853016). https://patentable.app/patents/US-9853016","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853016","json":"https://patentable.app/api/llm-context/US-9853016","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:39:09.992Z"}