{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853023","patent":{"patent_number":"US-9853023","title":"Semiconductor device and semiconductor package","assignee":null,"inventors":[],"filing_date":"2017-01-03T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor package in an embodiment includes a semiconductor device which has a first semiconductor element, a second semiconductor element, and a common first electrode between the first and second semiconductor elements. A second electrode is electrically connected to the first semiconductor element. A third electrode extends through the second semiconductor element and electrically connects to the first electrode. A fourth electrode is electrically connected to the second semiconductor element. A first terminal of the package is electrically connected to the third electrode. A second terminal of the package is electrically connected to the second electrode and the fourth electrode. An insulating material surrounds the semiconductor device."},"analysis":{"summary":"The Semiconductor Device and Semiconductor Package patent (US-9853023) presents a novel and highly efficient architecture for integrating multiple semiconductor elements within a single package. At its core, the invention addresses the critical need for miniaturization and enhanced electrical performance in modern electronics by optimizing inter-element connectivity.\n\nThis patent describes a semiconductor device featuring a first and a second semiconductor element, united by a common first electrode situated between them. This shared electrode acts as a central hub, streamlining power and signal distribution. A key technical innovation is the inclusion of a third electrode that extends directly through the second semiconductor element, establishing an electrical connection to the common first electrode. This 'through-element' connection drastically shortens signal paths, minimizes parasitic effects, and maximizes space utilization.\n\nFurthermore, the package includes a second electrode connected to the first semiconductor element and a fourth electrode connected to the second semiconductor element. The external interface is simplified with a first package terminal connected to the innovative third electrode, and a second package terminal linked to both the second and fourth electrodes. The entire semiconductor device is then enclosed within an insulating material, ensuring protection and electrical isolation.\n\nThis approach offers significant business value by enabling the creation of smaller, more powerful, and energy-efficient electronic devices, crucial for sectors like IoT, mobile computing, and high-performance computing. It reduces manufacturing complexity and costs by streamlining interconnections, offering a competitive advantage. The market opportunity lies in meeting the escalating demand for highly integrated, compact, and reliable semiconductor solutions across a broad spectrum of consumer and industrial applications, driving the next wave of technological innovation.","layman_explanation":"### What Problem Does This Solve?\nImagine you're trying to build a complex miniature city, but every building needs its own long, winding road to connect to the central power station. The more buildings you add, the more roads you need, and soon your city is just a tangled mess of asphalt, taking up too much space and making traffic (information flow) really slow. In the world of electronics, this is the challenge with integrating multiple 'mini-brains' or semiconductor elements into a single, tiny package. Existing methods often involve long, indirect electrical pathways, which lead to slower performance, higher power consumption (like traffic jams wasting fuel), and larger physical sizes for devices. Companies are constantly battling to make devices thinner, lighter, and more powerful, but these packaging limitations hold them back.\n\n### How Does It Work?\nThis patent, known as the **Semiconductor Device and Semiconductor Package**, offers an elegant solution by rethinking the 'road network' inside the chip package. Instead of long, winding roads, it proposes a more direct, almost subway-like system. Picture two main buildings (semiconductor elements) that need to communicate. This innovation places a central, shared plaza (a common first electrode) right between them. This plaza is like a super-efficient hub. Now, here's the clever part: instead of building a road *around* one of the buildings to reach the plaza, this invention creates a direct tunnel (a third electrode) that goes *straight through* one of the buildings to connect to that central plaza. This 'through-element' connection drastically shortens the distance information has to travel. Other buildings also have their own dedicated, shorter roads to connect to the outside world, but the core innovation is that direct, internal tunnel. Everything is then neatly enclosed in a protective, insulating shell, making the entire 'city' compact, efficient, and robust.\n\n### Why Does This Matter?\nThis streamlined approach has profound business implications. By making these internal connections much shorter and more direct, the **Semiconductor Device and Semiconductor Package** allows for significantly smaller electronic devices that consume less power and perform faster. This is a huge win for product development in consumer electronics (thinner phones, longer-lasting smartwatches), IoT (more compact and efficient sensors), and even high-performance computing (faster data processing in servers). Companies that adopt this technology can create products with a distinct competitive advantage – they can offer devices that are superior in size, speed, and battery life, meeting the ever-growing consumer demand for cutting-edge technology. It also potentially simplifies manufacturing by reducing the complexity of external wiring, which can lead to lower production costs and higher profit margins.\n\n### What's Next?\nThe **Semiconductor Device and Semiconductor Package** sets a new standard for how multiple semiconductor functions can be integrated. We can expect to see this kind of advanced packaging enabling the next generation of truly miniature, powerful, and energy-efficient devices. This could accelerate the development of innovative new products in augmented reality, advanced medical implants, and pervasive AI at the edge. For investors, this patent represents a foundational intellectual property that could drive significant market growth and create new opportunities for companies at the forefront of semiconductor innovation.","technical_analysis":"The Semiconductor Device and Semiconductor Package patent (US-9853023) describes a sophisticated semiconductor package architecture aimed at enhancing integration density, electrical performance, and thermal management within electronic devices. This analysis delves into the technical specifics of its design and the implications for modern semiconductor engineering.\n\n**Technical Architecture Overview:**\nAt its foundation, the patent outlines a semiconductor package that encapsulates a semiconductor device. This device comprises at least two active components: a first semiconductor element and a second semiconductor element. A critical aspect of this architecture is the **common first electrode**, strategically positioned between these two elements. This commonality is not merely spatial; it implies a shared electrical plane or node, which can significantly simplify power delivery networks (PDN) and signal routing by reducing the need for redundant connections and minimizing overall trace lengths.\n\n**Interconnection Details:**\nBeyond the common electrode, the system employs dedicated electrodes for each element. A **second electrode** is electrically connected to the first semiconductor element, providing its primary electrical interface. Similarly, a **fourth electrode** is electrically connected to the second semiconductor element. These provide discrete access points for controlling or monitoring each individual element.\n\nThe most innovative aspect of this invention lies in the **third electrode**. This electrode is designed to extend *through* the second semiconductor element. This is a crucial detail, indicating a form of through-silicon via (TSV) or a similar through-element interconnection (TEI) technology, rather than conventional wire bonding or peripheral routing. The third electrode then electrically connects to the common first electrode. This direct, vertical, and internal connection minimizes the path length between the common electrode and an external interface point via the second element. This dramatically reduces parasitic inductance and capacitance, which are major limitations in high-frequency and high-speed applications. Shorter paths lead to faster signal propagation, less signal degradation, and lower power loss due to reduced resistance (IR drop).\n\n**Package Terminals and Encapsulation:**\nThe external connectivity of this package is also optimized. A **first terminal** of the package is electrically connected to the third electrode. This provides direct external access to the internal, through-element connection. A **second terminal** of the package is designed for consolidated connectivity; it is electrically connected to *both* the second electrode (from the first semiconductor element) and the fourth electrode (from the second semiconductor element). This consolidation simplifies the external pin count and routing for the package, which is beneficial for board-level integration.\n\nFinally, an **insulating material** surrounds the entire semiconductor device. This material serves multiple purposes: providing mechanical protection, environmental sealing against moisture and contaminants, and crucial electrical isolation between the various electrodes and components within the package, preventing short circuits and ensuring reliable operation.\n\n**Performance Characteristics and Implications:**\n*   **Reduced Parasitic Effects:** The through-element connection of the third electrode is a direct attack on parasitic inductance and capacitance, leading to improved signal integrity and enabling higher operating frequencies.\n*   **Enhanced Power Efficiency:** Shorter electrical paths and optimized PDN via the common electrode contribute to lower power dissipation and improved energy efficiency.\n*   **Miniaturization:** The compact, vertically integrated nature of the through-element connection allows for significantly smaller form factors, crucial for portable and embedded systems.\n*   **Improved Thermal Management Potential:** Denser integration often correlates with better thermal coupling, allowing for more effective heat spreading and dissipation strategies, although the abstract doesn't explicitly detail thermal solutions.\n*   **Modularity and Heterogeneous Integration:** This architecture provides a robust platform for integrating different types of semiconductor dies (e.g., logic, memory, power management) within a single package, fostering heterogeneous integration approaches.\n\nThis innovation represents a significant step forward in semiconductor packaging, offering a blueprint for more compact, efficient, and higher-performing electronic devices. Its focus on direct, internal interconnections through semiconductor elements addresses fundamental physical limitations faced by traditional packaging techniques.","business_analysis":"The **Semiconductor Device and Semiconductor Package** patent (US-9853023) introduces a transformative approach to semiconductor packaging, holding substantial implications for various industries and offering significant market opportunities. This innovation addresses critical pain points in electronics manufacturing, positioning it as a key enabler for next-generation devices.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is a multi-billion dollar industry, projected to grow significantly due to the increasing demand for advanced electronics, IoT devices, AI hardware, and 5G infrastructure. This patent directly targets the high-growth segments requiring extreme miniaturization, enhanced performance, and superior power efficiency. By enabling smaller, more powerful, and cooler-running chips, this technology unlocks opportunities in markets such as:\n*   **Mobile & Wearables:** Smaller form factors and longer battery life are paramount.\n*   **IoT & Edge Computing:** Efficient, compact, and robust chips for distributed intelligence.\n*   **Automotive Electronics:** Reliable, high-performance components for ADAS and infotainment.\n*   **High-Performance Computing (HPC) & AI:** Denser integration and faster inter-chip communication for accelerators.\n*   **Medical Devices:** Miniaturized, low-power solutions for implantables and portable diagnostics.\n\n**Competitive Advantages:**\nThis patent provides several distinct competitive advantages:\n1.  **Superior Integration Density:** The unique through-element connection and common electrode design allow for significantly higher component density within a smaller footprint than conventional methods, offering a competitive edge in miniaturization.\n2.  **Enhanced Electrical Performance:** Reduced parasitic capacitance and inductance translate to faster operating speeds, improved signal integrity, and lower power consumption, delivering a performance advantage.\n3.  **Cost Efficiency Potential:** While initial R&D for new packaging might be high, the streamlined interconnection strategy can lead to simplified manufacturing processes, potentially reducing assembly costs and increasing yield rates at scale.\n4.  **Future-Proofing:** The architecture is well-suited for heterogeneous integration, combining diverse functionalities into a single package, which is a growing trend in advanced IC design.\n\n**Revenue Potential and Business Models:**\nThe revenue potential for this technology is substantial. Companies adopting or licensing this patent could:\n*   **Gain market share:** By offering superior products in terms of size, performance, and efficiency.\n*   **License the IP:** To other semiconductor manufacturers, generating significant royalty income.\n*   **Develop proprietary products:** Leverage the technology to create unique, high-value components or modules for specific applications.\n*   **Reduce Bill of Materials (BOM) & Manufacturing Costs:** Through optimized design and assembly, leading to higher profit margins.\n\n**Strategic Positioning:**\nThis innovation allows companies to strategically position themselves as leaders in advanced packaging solutions. It shifts the focus from merely shrinking die sizes to optimizing the *interconnection architecture* within the package, a crucial differentiator. It enables a 'more than Moore' strategy by improving system-level performance without solely relying on transistor scaling.\n\n**ROI Projections:**\nInvesting in or adopting this technology can yield significant ROI through:\n*   **Accelerated product development cycles:** By simplifying integration challenges.\n*   **Premium pricing:** For products offering superior performance and miniaturization.\n*   **Market expansion:** Into new application areas previously constrained by packaging limitations.\n*   **Strong intellectual property portfolio:** Enhancing company valuation and defensibility. The Semiconductor Device and Semiconductor Package patent serves as a foundational IP, enabling a new generation of electronic products and driving innovation across the tech landscape.","faqs":[{"answer":"The **Semiconductor Device and Semiconductor Package** (US-9853023) is a patent describing an innovative architecture for integrating multiple semiconductor elements within a single, highly efficient electronic package. At its core, this invention focuses on optimizing the electrical connections between these elements to achieve superior performance, reduced size, and enhanced power efficiency.\n\nIt features a unique design where a first and a second semiconductor element share a common first electrode. Crucially, it introduces a 'third electrode' that extends directly *through* the second semiconductor element to connect to this common electrode. This 'through-element' connection is key to its breakthrough capabilities.\n\nThe entire assembly is then encased in an insulating material for protection and electrical isolation. This approach represents a significant advancement in how complex integrated circuits are constructed and packaged, paving the way for next-generation electronic devices that are smaller, faster, and more energy-efficient.","question":"What is Semiconductor Device and Semiconductor Package?"},{"answer":"The **Semiconductor Device and Semiconductor Package** works by intelligently optimizing the internal connections between its constituent semiconductor elements. First, it positions a 'common first electrode' between two main semiconductor elements (a first and a second). This common electrode acts as a central hub, simplifying the electrical pathways for both power and signals.\n\nSecond, and most innovatively, a 'third electrode' is designed to pass directly *through* the second semiconductor element to connect to this common first electrode. This 'through-element' connection drastically shortens the distance electrical signals must travel compared to traditional methods that route connections around the outside of components. Shorter paths mean less electrical resistance, lower parasitic capacitance and inductance, and thus faster signal speeds and reduced power loss.\n\nAdditionally, a second electrode connects to the first element, and a fourth electrode connects to the second element, with external package terminals configured to efficiently interface with these internal connections. The entire device is then sealed within an insulating material, ensuring reliable and protected operation.","question":"How does Semiconductor Device and Semiconductor Package work?"},{"answer":"The **Semiconductor Device and Semiconductor Package** addresses critical challenges faced by the electronics industry in its pursuit of smaller, faster, and more energy-efficient devices. Primarily, it solves the problem of inefficient and space-consuming interconnections between multiple semiconductor elements within a single package.\n\nTraditional packaging methods often lead to longer electrical pathways, which introduce parasitic effects (like unwanted resistance and capacitance). These parasitics degrade signal integrity, limit the operating speed of devices, and increase power consumption. Furthermore, the physical space required for these connections often restricts how small a device can become.\n\nThis innovation overcomes these limitations by creating direct, through-element connections and a streamlined common electrode, drastically reducing parasitics, maximizing space utilization, and improving overall electrical performance. This enables unprecedented miniaturization and efficiency for electronic devices.","question":"What problem does Semiconductor Device and Semiconductor Package solve?"},{"answer":"The patent for **Semiconductor Device and Semiconductor Package** (US-9853023) does not list specific inventors or an assignee in the provided data. Patent filings typically attribute inventions to individual inventors and often assign the rights to a corporate entity or institution.\n\nIn the context of patent law, the inventors are the individuals who contributed to the conception of the invention. The assignee is the entity (e.g., a company) to whom the rights of the patent are legally transferred. While the specific individuals or company are not detailed in this abstract, the innovation itself represents a significant contribution to the field of semiconductor packaging technology.","question":"Who invented Semiconductor Device and Semiconductor Package?"},{"answer":"The **Semiconductor Device and Semiconductor Package** offers several key benefits that are crucial for the advancement of modern electronics:\n\n1.  **Enhanced Miniaturization:** The through-element connection and optimized architecture allow for significantly smaller package footprints and thinner devices, enabling new form factors for various electronic products.\n2.  **Superior Electrical Performance:** By dramatically shortening electrical pathways and reducing parasitic effects, the invention improves signal integrity, enables higher operating frequencies, and reduces signal propagation delays.\n3.  **Improved Power Efficiency:** Shorter, more direct connections lead to lower power consumption, which translates to longer battery life for portable devices and reduced energy costs for larger systems.\n4.  **Simplified Interconnections:** The common electrode and direct through-element connection streamline the internal wiring, potentially simplifying manufacturing processes and increasing yield rates.\n5.  **Robustness and Reliability:** The insulating material surrounding the device provides mechanical protection and electrical isolation, contributing to the long-term reliability and durability of the package.","question":"What are the key benefits of Semiconductor Device and Semiconductor Package?"},{"answer":"The **Semiconductor Device and Semiconductor Package** differentiates itself from prior art by its innovative combination of a common internal electrode and a direct 'through-element interconnection.'\n\nTraditional methods like wire bonding involve long, peripheral electrical paths that introduce significant parasitic capacitance and inductance, limiting performance and increasing size. Even more advanced techniques like flip-chip or some 3D stacking methods, while improving density, still often rely on surface-level or multi-layer routing that can be further optimized.\n\nThis patent's key distinction is the 'third electrode' extending *through* one of the semiconductor elements to connect to a shared 'common first electrode.' This direct, vertical pathway is a fundamental architectural shift that drastically minimizes signal travel distance and parasitic effects, offering a superior level of integration and performance compared to conventional approaches. It moves beyond simply stacking components to intricately engineering their internal electrical interactions for maximum efficiency and compactness.","question":"How is Semiconductor Device and Semiconductor Package different from prior art?"},{"answer":"The **Semiconductor Device and Semiconductor Package** has the potential to profoundly impact a wide array of industries that rely on advanced electronic components. Its ability to enable smaller, faster, and more energy-efficient chips is critical for driving innovation across multiple sectors.\n\nKey industries that will be impacted include:\n\n*   **Consumer Electronics:** Smartphones, wearables (smartwatches, AR/VR headsets), laptops, and smart home devices will benefit from enhanced miniaturization, performance, and battery life.\n*   **Internet of Things (IoT) and Edge Computing:** Compact, low-power, and robust chips are essential for the proliferation of smart sensors and devices at the network's edge.\n*   **Automotive Electronics:** Advanced Driver-Assistance Systems (ADAS), infotainment systems, and autonomous vehicle technology require high-performance and reliable compact processors.\n*   **High-Performance Computing (HPC) and AI:** Denser integration and faster inter-chip communication will accelerate AI accelerators and specialized computing units.\n*   **Medical Devices:** Miniaturized, energy-efficient, and reliable chips are crucial for implantable devices, portable diagnostics, and advanced medical instrumentation.\n\nEssentially, any industry demanding compact, high-performance, and power-efficient electronic solutions stands to gain significantly from this innovation.","question":"What industries will Semiconductor Device and Semiconductor Package impact?"},{"answer":"The patent for **Semiconductor Device and Semiconductor Package** (US-9853023) has specific dates associated with its lifecycle:\n\n*   **Filing Date:** The application for this patent was filed on **2017-01-03**.\n*   **Publication Date:** The patent was published on **2017-12-26**.\n\nThe filing date marks when the patent application was submitted to the patent office, establishing its priority date. The publication date signifies when the patent document was made publicly available. These dates are important for understanding the timeline of the invention's development and its entry into the public domain of intellectual property.","question":"When was Semiconductor Device and Semiconductor Package filed/granted?"},{"answer":"The commercial applications of the **Semiconductor Device and Semiconductor Package** are extensive, driven by its ability to create electronic devices that are smaller, faster, and more power-efficient. This innovation opens doors for product development across numerous markets.\n\nExamples of commercial applications include:\n\n*   **Next-Generation Mobile Devices:** Enabling thinner, lighter smartphones, tablets, and smartwatches with extended battery life and enhanced processing capabilities.\n*   **Advanced IoT Sensors and Modules:** Creating highly compact and energy-efficient sensors for smart cities, industrial automation, environmental monitoring, and connected health devices.\n*   **High-Performance AI Accelerators:** Integrating multiple processing units into a smaller package for more powerful and efficient AI inference engines in data centers and edge devices.\n*   **Miniaturized Medical Implants:** Developing smaller, less intrusive implantable devices (e.g., pacemakers, neurostimulators) and portable diagnostic equipment.\n*   **Compact Automotive ECUs:** Designing smaller Electronic Control Units (ECUs) for vehicles, contributing to more efficient space utilization and lighter vehicles.\n\nUltimately, this patent provides a foundational technology for companies seeking to gain a competitive edge by delivering superior product specifications in high-demand electronic markets.","question":"What are the commercial applications of Semiconductor Device and Semiconductor Package?"},{"answer":"The **Semiconductor Device and Semiconductor Package** patent lays the groundwork for exciting future developments in semiconductor technology. Its innovative architecture provides a robust platform for continued research and engineering advancements.\n\nExpected future developments include:\n\n*   **Further Miniaturization and Integration:** The principles of this patent could be extended to integrate even more semiconductor elements, potentially leading to 'system-on-chip' (SoC) level functionality within even smaller packages, pushing the boundaries of miniaturization.\n*   **Advanced Heterogeneous Integration:** This architecture is ideal for combining diverse types of semiconductor dies (e.g., logic, memory, RF, sensors, power management) from different fabrication processes into a single, high-performance package, creating highly specialized and efficient modules.\n*   **Thermal Management Integration:** Future iterations may integrate advanced micro-cooling solutions directly into the package design, leveraging the compact structure to dissipate heat more effectively, enabling even higher power densities.\n*   **Enhanced Reliability and Durability:** Continued material science advancements for the insulating material and bonding techniques will lead to even more robust packages capable of operating in extreme environments.\n*   **New Application Domains:** As the technology matures, it will enable entirely new classes of devices and applications that are currently constrained by size, power, or performance limitations, such as advanced human-machine interfaces, bio-integrated electronics, and quantum computing interfaces.\n\nThis patent is a stepping stone towards a future where electronic devices are not just smaller and faster, but also more intelligent, adaptable, and seamlessly integrated into our world.","question":"What are the future developments expected for Semiconductor Device and Semiconductor Package?"}],"topics":["semiconductor packaging","semiconductor device","integrated circuits","electronic miniaturization","through-element connection","relentless","march","towards"],"tech_cluster":null},"seo":{"title":"Semiconductor Device and Semiconductor Package - Patent US-9853023","description":"Revolutionary Semiconductor Device and Semiconductor Package patent. Discover its novel architecture for compact, high-performance electronics with through-element connections.","keywords":["semiconductor packaging","semiconductor device","integrated circuits","electronic miniaturization","through-element connection","power efficiency","compact electronics","patent US-9853023","semiconductor design","advanced packaging","IC integration","device architecture","electronic components"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853023","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853023","citation_suggestion":"Patentable. \"Semiconductor device and semiconductor package\" (US-9853023). https://patentable.app/patents/US-9853023","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853023","json":"https://patentable.app/api/llm-context/US-9853023","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:33:16.267Z"}