{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853064","patent":{"patent_number":"US-9853064","title":"Manufacture method of via hole, manufacture method of display panel, and display panel","assignee":null,"inventors":[],"filing_date":"2013-11-18T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["G02F","G02F"],"num_claims":2,"abstract":"A manufacture method of a via hole for a display panel, a manufacture method of a display panel, and a display panel are provided. During forming the via hole, a top film layer in an area to be formed with a via hole over a circuit pattern is etched under a first etching condition according to a slope angle as required; and a remaining portion in the area to be formed with a via hole is etched under a second etching condition according to a selection ratio as required, so as to form the via hole finally. A problem in one-step etching process that the slope angle and the selection ratio cannot be set flexibly is avoided."},"analysis":{"summary":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent introduces a groundbreaking two-step etching process that revolutionizes the fabrication of display panels. At its core, this innovation addresses a critical manufacturing challenge: the inability of traditional one-step etching methods to flexibly optimize both the slope angle and the selection ratio required for precise via hole formation. Via holes are tiny, essential electrical connections within multi-layered display panels, and their quality directly impacts display performance and reliability.\n\nThe problem this patent solves stems from the inherent compromise in single-step etching, where process conditions had to be balanced between creating the desired via hole geometry (slope angle) and preventing damage to surrounding materials (selection ratio). This led to suboptimal results, increased defect rates, and restricted design flexibility for advanced displays.\n\nThe key technical approach of this invention involves a sequential etching strategy. First, a top film layer in the area slated for a via hole is etched under specific conditions tailored to achieve the required slope angle. This ensures the structural integrity and proper contact for subsequent metallization. Second, the remaining material in that same area is etched under a different set of conditions, optimized specifically for the selection ratio. This ensures precise removal of the target material without affecting adjacent circuit patterns.\n\nThis decoupling of etching parameters provides unprecedented control and flexibility to display manufacturers. The business value is substantial: it leads to significantly enhanced display quality, reduced manufacturing defects, higher production yields, and greater freedom for designing innovative display panels. This method is crucial for the advancement of high-resolution, flexible, and micro-LED displays.\n\nThe market opportunity is immense, as the global demand for sophisticated display technologies continues to grow across consumer electronics, automotive, and industrial sectors. By enabling more efficient and precise manufacturing, this patent positions manufacturers to gain a competitive edge by delivering superior products with improved cost-effectiveness and reliability.","layman_explanation":"### What Problem Does This Solve?\nImagine you're building a highly intricate, multi-story glass building, and you need to run tiny wires between floors. These wires need to go through perfect holes, not just straight down, but with a slight, smooth ramp so that the next layer of building material can smoothly cover them. If the hole is too steep, the wire might break. If it's too wide, it might weaken the floor. And critically, you absolutely cannot damage the precious wiring or structure on the floor below.\n\nThis is a real problem in manufacturing modern display panels, like those in your smartphone, TV, or smartwatch. These panels are essentially stacks of incredibly thin layers, and 'via holes' are the tiny, critical pathways connecting electrical circuits between these layers. Historically, the process of making these holes, called 'etching,' was a one-shot deal. Manufacturers had to compromise: either make the hole with the perfect 'ramp' (or slope angle) for good connections, or ensure they didn't accidentally 'over-etch' and damage the vital components on the layer below (this is about 'selection ratio'). They couldn't perfectly optimize both simultaneously. This meant screens might have hidden flaws, manufacturing yields were lower due to defects, and designers were limited in how complex and thin they could make displays.\n\n### How Does It Work?\nThe `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent introduces a clever, two-stage approach, much like using two specialized tools instead of one general-purpose one for our glass building. Instead of trying to do everything at once, this innovation breaks down the etching process into two distinct, optimized steps:\n\n1.  **Step One: Shaping the Entrance (Slope Angle Focus):** First, the method focuses solely on creating the perfect 'ramp' or slope angle for the top part of the via hole. Imagine a skilled craftsman carefully sculpting the entrance of the wire pathway. The etching conditions (like the chemical gases and energy used) are precisely tuned to achieve this ideal slope, ensuring that when the next layer of material is added, it forms a strong, reliable connection.\n\n2.  **Step Two: Precise Clearing (Selection Ratio Focus):** Once the ideal slope is established, the process switches to a second, entirely different set of etching conditions. This second stage is like a meticulous cleaning crew that only removes the remaining material within the hole, but with extreme care not to touch or damage any of the crucial wiring or layers directly beneath. The 'selection ratio' is maximized here, meaning the etching chemicals are highly selective, only dissolving the unwanted material and leaving everything else perfectly intact.\n\nBy separating these two critical objectives, this technology eliminates the need for compromise. Each step can be perfectly optimized for its specific goal, ensuring that the final via hole is not only perfectly shaped but also flawlessly clean and protective of the underlying circuitry.\n\n### Why Does This Matter?\nThis innovation matters immensely for the entire display industry and, ultimately, for consumers. For manufacturers, it means:\n\n*   **Superior Product Quality:** Displays produced with this method will have more reliable electrical connections, leading to clearer images, faster response times, and longer-lasting devices. Think of fewer 'dead pixels' or flickering screens.\n*   **Higher Manufacturing Efficiency:** With fewer defects caused by imprecise via holes, factories can produce more usable panels from the same amount of raw materials. This directly translates to reduced waste and lower production costs.\n*   **Unleashed Innovation:** Designers are no longer constrained by the limitations of a single-step etching process. This opens the door for even thinner, more flexible, higher-resolution, and more energy-efficient displays. Imagine truly foldable phones or incredibly sharp AR/VR headsets becoming more commonplace and affordable.\n*   **Competitive Edge:** Companies that adopt this technology will be able to produce next-generation displays more effectively and cost-efficiently, giving them a significant advantage in the marketplace.\n\n### What's Next?\nThis patent is a foundational step for the future of display technology. It will likely accelerate the development and mass production of advanced displays like Micro-LEDs, which require incredibly tiny and precise via holes, and further refine flexible OLED technologies. We can expect to see this method integrated into the manufacturing of a wide range of devices, leading to a new era of visual experiences. For investors, this represents an opportunity in companies that either hold this patent, license it, or manufacture the specialized equipment needed to implement this advanced, two-step etching process.","technical_analysis":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent (US-9853064) presents a sophisticated solution to a pervasive challenge in display panel fabrication: the precise and flexible formation of via holes. Via holes, or inter-layer contacts, are fundamental to the functionality of multi-layered thin-film transistor (TFT) display panels, enabling electrical communication between different conductive and dielectric layers. The integrity of these structures—specifically their slope angle and etching selectivity—is critical for device performance, reliability, and manufacturing yield.\n\n**Technical Architecture and Problem Statement:**\nTraditional via hole etching processes typically employ a single-step dry etching technique. This monolithic approach forces a compromise in etching parameters. The 'slope angle' of the via hole sidewall is crucial for ensuring proper step coverage by subsequent metal deposition, preventing open circuits and ensuring low contact resistance. A gentle, controlled slope is often desired. Concurrently, the 'selection ratio' (or selectivity) refers to the ratio of the etch rate of the target material to the etch rate of the underlying or masking material. High selectivity is paramount to avoid damaging underlying active layers or exposing critical circuitry, which could lead to shorts or device failure. In a single-step process, etching conditions optimized for a desired slope angle might lead to poor selectivity, and vice versa, creating a constrained process window and limiting design flexibility.\n\n**Implementation Details and Algorithm Specifics:**\nThis patent introduces a two-step etching algorithm that effectively decouples these two conflicting requirements. The process can be conceptualized as follows:\n\n1.  **First Etching Condition (Slope Angle Optimization):**\n    *   **Objective:** To form the initial, top portion of the via hole with a precisely controlled sidewall slope angle. This is critical for subsequent metal layer deposition to achieve conformal coverage without thinning or breaks.\n    *   **Methodology:** The top film layer (e.g., a dielectric layer like SiNx, SiO2, or an organic insulator) in the predefined via hole area is subjected to a 'first etching condition'. This condition is carefully chosen to induce anisotropic etching while simultaneously controlling the sidewall profile. This might involve specific gas chemistries (e.g., fluorocarbon plasmas like CF4/O2, CHF3/O2 for dielectrics) that promote both etching and sidewall passivation. Parameters such as chamber pressure, RF source power, RF bias power, gas flow rates, and substrate temperature are meticulously tuned. For instance, a higher bias power might increase anisotropy, while the addition of polymer-forming gases (like C4F8) could be used to control sidewall passivation and thus the slope angle. The duration of this step is controlled to etch a specific depth, establishing the initial taper.\n\n2.  **Second Etching Condition (Selection Ratio Optimization):**\n    *   **Objective:** To complete the via hole by etching through the remaining material, ensuring high selectivity to underlying layers and preventing damage or over-etching.\n    *   **Methodology:** After the first step, the etching process transitions to a 'second etching condition'. This condition is specifically optimized for the selection ratio. The gas chemistry is often changed to be highly selective towards the remaining target material (e.g., a different fluorocarbon blend or a shift to an oxygen-rich plasma for organic layers) while having a very low etch rate for the underlying stop layer (e.g., a metal gate, source/drain layer, or another dielectric). Plasma parameters are adjusted to minimize ion bombardment damage to exposed underlying layers and reduce sputtering. Endpoint detection (e.g., using optical emission spectroscopy to monitor specific plasma species or laser interferometry to detect layer transitions) is crucial to precisely stop the etch at the desired depth, preventing punch-through or excessive recessing of the underlying circuitry.\n\n**Integration Patterns and Performance Characteristics:**\nThis two-step approach can be integrated into existing fabrication lines using multi-chamber etching systems or advanced single-chamber systems capable of rapid gas switching and precise parameter control. The critical aspect is the sequential application of distinct plasma chemistries and physical conditions. Performance characteristics include:\n\n*   **Enhanced Process Window:** The ability to independently tune slope angle and selectivity significantly expands the operational window, making the process more robust against variations in material thickness or equipment drift.\n*   **Reduced Defect Density:** Precise control minimizes issues like poor step coverage, stringers, shorts, and open circuits, leading to higher manufacturing yields.\n*   **Improved Device Performance:** Optimized via hole geometry reduces contact resistance and capacitance, contributing to faster and more power-efficient display pixels.\n*   **Material Compatibility:** The flexibility allows for adaptation to a wider range of display panel materials and stack architectures, including advanced oxide TFTs, flexible substrates, and next-generation emissive materials.\n\n**Code-Level Implications:**\nWhile not directly involving software code in the traditional sense, the 'code-level implications' refer to the complex sequence programming and recipe management within the etching equipment's control system. Advanced process control (APC) algorithms, often implemented in programmable logic controllers (PLCs) or distributed control systems (DCS), would manage gas flow sequences, plasma power ramping, pressure control, and endpoint detection logic. Machine learning could potentially be used to optimize the transition points and parameter adjustments based on real-time sensor data, further refining the process for even greater precision and yield. This system allows for more sophisticated recipe development, moving beyond simple single-parameter adjustments to a multi-variable, sequential optimization strategy.","business_analysis":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent (US-9853064) represents a significant business opportunity within the global display manufacturing sector. This innovation addresses a fundamental and costly bottleneck in the production of high-performance display panels, offering substantial competitive advantages and opening new avenues for revenue generation and strategic positioning.\n\n**Market Opportunity Size:**\nThe global display panel market is projected to reach hundreds of billions of dollars, driven by relentless demand for smartphones, tablets, laptops, televisions, automotive displays, and emerging applications like augmented/virtual reality (AR/VR) and wearable tech. Each of these segments requires increasingly sophisticated displays with higher resolutions, greater flexibility, and improved durability. The core technology of this patent—precise via hole formation—is a foundational element across all these display types, making its addressable market vast and continually expanding.\n\n**Competitive Advantages:**\nManufacturers adopting this two-step etching method gain several critical competitive advantages:\n\n1.  **Superior Product Quality:** The ability to create perfectly formed via holes with optimal slope angles and selection ratios translates directly into higher-quality display panels. This means better electrical performance, enhanced reliability, and longer product lifespans, differentiating products in a crowded market.\n2.  **Increased Manufacturing Efficiency and Yields:** By overcoming the compromises of single-step etching, this technology significantly reduces defects associated with via hole formation. Lower defect rates directly lead to higher manufacturing yields, reducing scrap and rework costs, and improving overall operational efficiency.\n3.  **Greater Design Flexibility:** Engineers are no longer constrained by etching limitations, enabling the design and mass production of thinner, more complex, higher-resolution, and novel form-factor displays (e.g., foldable, rollable) that were previously technically or economically unfeasible. This accelerates innovation cycles.\n4.  **Cost Reduction:** Improved yields and reduced waste contribute to a lower cost per panel, enhancing profitability and allowing for more aggressive pricing strategies or higher margins.\n\n**Revenue Potential and Business Models:**\nCompanies can leverage this patent through various business models:\n\n*   **Direct Implementation:** Large display manufacturers (e.g., Samsung Display, LG Display, BOE, AUO) can integrate this method into their existing fabrication lines to produce superior panels for their own products or for sale to OEMs.\n*   **Licensing:** The patent holders could license this technology to other display manufacturers or equipment suppliers, generating significant royalty revenues. Given the fundamental nature of the innovation, it could become a standard for advanced display production.\n*   **Equipment Sales/Upgrades:** Manufacturers of etching equipment could develop and sell specialized tools or upgrade kits that enable the two-step process, creating a new revenue stream.\n*   **Consulting and Services:** Expertise in implementing and optimizing this complex etching process could be offered as a high-value consulting service to display fabs globally.\n\n**Strategic Positioning and ROI Projections:**\nAdopting the `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` positions a company at the forefront of display technology. It is a strategic move that enhances a company's ability to innovate, respond to market demands for cutting-edge displays, and maintain a leadership position. The ROI on implementing this technology is expected to be high, driven by a combination of improved yields (direct cost savings), enhanced product quality (premium pricing potential, stronger brand reputation), and accelerated time-to-market for advanced display products. For a multi-billion dollar display fab, even a few percentage points improvement in yield can translate into hundreds of millions of dollars in annual savings or increased revenue. Furthermore, the ability to produce displays for emerging technologies like Micro-LEDs, which have extremely tight tolerance requirements, provides access to high-growth, high-margin future markets.","faqs":[{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` is a patent (US-9853064) that introduces a revolutionary two-step etching process for creating via holes in display panels. Via holes are tiny, critical electrical connections that bridge different layers of circuits within a display, enabling signals to flow and the screen to function.\n\nThis invention specifically addresses a long-standing challenge in display manufacturing, where traditional one-step etching methods struggled to simultaneously optimize two crucial aspects: the precise shape (slope angle) of the via hole and the protection of underlying layers (selection ratio). By decoupling these objectives into two distinct etching steps, the patent allows for unprecedented control and flexibility.\n\nIn essence, this technology makes it possible to create highly precise and reliable via holes, which are fundamental to the quality, performance, and durability of modern display panels. It's a foundational improvement in the fabrication process that underpins the visual experience of countless electronic devices.","question":"What is Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` operates through a sophisticated two-step etching process, unlike the single-step methods previously employed. Here's how it works:\n\nFirst, a top film layer in the area designated for the via hole is etched under a 'first etching condition.' This condition is specifically tailored to achieve the required 'slope angle' for the via hole. The slope angle is crucial for ensuring that subsequent layers of material (like metal connections) can smoothly cover the via hole's sidewalls without breaking or creating weak points.\n\nSecond, after the initial slope is established, the remaining material in the via hole area is etched under a distinct 'second etching condition.' This second condition is optimized for the 'selection ratio.' The selection ratio ensures that the etching process selectively removes only the unwanted material to form the complete via hole, while meticulously protecting the delicate underlying circuit patterns from any damage or unintended etching. By separating these two objectives, the method avoids the compromises inherent in single-step etching, leading to superior via hole formation. Keywords: two-step etching, slope angle, selection ratio, display panel fabrication, plasma etching.","question":"How does Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel work?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent solves a critical problem in display panel manufacturing: the inflexibility and inherent compromise of one-step etching processes for via holes. Historically, in a single etching step, manufacturers faced a dilemma:\n\nThey had to balance conflicting requirements for the via hole's 'slope angle' (its precise, often tapered, sidewall shape crucial for reliable electrical connections) and the 'selection ratio' (the ability to etch the target material without damaging underlying circuit layers). Conditions ideal for one often compromised the other, leading to suboptimal results. This inflexibility resulted in increased defect rates, such as poor electrical contacts, shorts, or open circuits, which in turn lowered manufacturing yields and increased production costs.\n\nFurthermore, these limitations restricted the design possibilities for advanced display panels, hindering the development of thinner, higher-resolution, and more complex multi-layered displays. This invention overcomes these challenges by allowing independent optimization of both parameters, leading to more precise, reliable, and cost-effective display panel production. Keywords: etching problem, manufacturing bottleneck, display defects, slope angle, selection ratio, display design limitations.","question":"What problem does Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel solve?"},{"answer":"The inventors of the `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent (US-9853064) are not specified in the publicly available patent data provided in this context. While patent documents typically list the inventors, this information was not included in the provided abstract or patent details.\n\nHowever, it's common for such innovations to emerge from research and development teams within leading display manufacturing companies or specialized semiconductor equipment firms. These teams comprise engineers and scientists specializing in materials science, plasma physics, and process engineering, dedicated to advancing the capabilities of display technology. The assignee, which is the entity to whom the patent rights are assigned (often the company employing the inventors), is also not specified in the provided data. Keywords: patent inventors, patent assignee, display technology R&D, semiconductor innovation, US-9853064.","question":"Who invented Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent offers several significant benefits that impact both display manufacturers and end-users:\n\n1.  **Enhanced Display Quality and Reliability:** By allowing precise control over via hole geometry and material selectivity, the method leads to more robust electrical connections. This translates into displays with superior image quality, faster response times, and increased durability, reducing the likelihood of defects like dead pixels or flickering.\n2.  **Higher Manufacturing Yields and Reduced Costs:** Overcoming the compromises of one-step etching significantly reduces defects during production. This means more usable display panels are produced from the same raw materials, leading to lower scrap rates, reduced rework, and substantial cost savings for manufacturers.\n3.  **Greater Design Flexibility:** Engineers are no longer constrained by the limitations of traditional etching. This unlocks new possibilities for designing innovative display panels, including ultra-thin profiles, higher pixel densities, complex multi-layered structures, and novel form factors like flexible or foldable screens.\n4.  **Accelerated Innovation:** This foundational improvement in manufacturing enables the mass production of next-generation display technologies such as Micro-LEDs and advanced OLEDs, pushing the boundaries of what visual experiences are possible. Keywords: display benefits, manufacturing efficiency, design flexibility, display quality, cost reduction, innovation.","question":"What are the key benefits of Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent significantly differentiates itself from prior art primarily through its revolutionary two-step etching process. Prior art methods typically relied on a single etching step to form via holes in display panels.\n\nThis single-step approach inherently forced a compromise: manufacturers had to balance the conflicting requirements of achieving a precise 'slope angle' for the via hole's sidewalls (critical for subsequent metal deposition) and maintaining a high 'selection ratio' (to prevent damage to underlying sensitive circuits). Optimizing for one often meant suboptimal results for the other, leading to a restricted process window, higher defect rates, and limitations in display design.\n\nIn contrast, this patent's innovation decouples these two objectives. It dedicates a 'first etching condition' solely to optimizing the slope angle and a separate 'second etching condition' exclusively to maximizing the selection ratio. This allows for independent and precise control over each parameter, eliminating the need for compromise and enabling the creation of via holes with unparalleled accuracy and integrity. Keywords: prior art comparison, two-step etching, single-step etching, slope angle, selection ratio, display manufacturing differences.","question":"How is Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel different from prior art?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent is set to have a profound impact on several key industries, primarily those reliant on advanced display technologies:\n\n1.  **Consumer Electronics:** This includes smartphones, tablets, laptops, smartwatches, televisions, and gaming monitors. The enhanced manufacturing precision will lead to higher quality, more durable, and visually superior screens in these everyday devices.\n2.  **Automotive Industry:** With the rapid integration of sophisticated infotainment systems, digital dashboards, and heads-up displays, the automotive sector demands reliable and high-performance displays. This patent will enable the production of more robust and visually appealing automotive screens.\n3.  **Augmented Reality (AR) and Virtual Reality (VR):** Emerging AR/VR devices require incredibly high-resolution micro-displays with impeccable clarity and reliability. The precision offered by this two-step etching process is crucial for the mass production of such advanced displays, driving the evolution of immersive experiences.\n4.  **Medical and Industrial Displays:** Industries requiring highly accurate and reliable visual interfaces, such as medical imaging equipment, industrial control panels, and specialized monitors, will benefit from the improved performance and durability of display panels manufactured using this method. Keywords: display industry impact, consumer electronics, automotive displays, AR/VR technology, Micro-LEDs, flexible displays, manufacturing sectors.","question":"What industries will Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel impact?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent, identified as US-9853064, has specific dates associated with its lifecycle:\n\n*   **Filing Date:** The patent application was filed on **November 18, 2013**.\n*   **Publication Date:** The patent was officially published on **December 26, 2017**.\n\nThe filing date marks when the inventors submitted their application to the patent office, establishing their priority date for the invention. The publication date signifies when the patent office made the details of the granted patent publicly available. These dates are crucial for understanding the patent's legal timeline, its position relative to prior art, and its period of enforceability. Keywords: patent filing date, patent publication date, US-9853064 timeline, intellectual property dates.","question":"When was Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel filed/granted?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent has extensive commercial applications across the entire display industry due to its fundamental improvement in manufacturing precision. Its primary commercial applications include:\n\n1.  **High-Resolution Display Production:** Enabling the cost-effective mass production of ultra-high-definition (e.g., 4K, 8K) displays for TVs, monitors, and mobile devices, where microscopic precision is paramount for image quality.\n2.  **Flexible and Foldable Display Manufacturing:** Improving the reliability and durability of via holes in flexible OLED and foldable display panels, making these advanced form factors more robust and commercially viable for smartphones, tablets, and wearable devices.\n3.  **Micro-LED Display Fabrication:** Providing the critical etching precision required for the development and mass production of Micro-LED displays, which promise superior brightness, efficiency, and longevity for future display generations.\n4.  **Advanced AR/VR Micro-Display Production:** Facilitating the creation of the extremely high-density and precise micro-displays essential for next-generation augmented and virtual reality headsets, enabling more immersive and realistic experiences.\n5.  **Specialized Display Markets:** Enhancing the performance and reliability of displays used in demanding environments, such as automotive infotainment systems, industrial control panels, and medical diagnostic equipment. Keywords: commercial applications, display production, Micro-LEDs, flexible displays, AR/VR, high-resolution displays, manufacturing technology.","question":"What are the commercial applications of Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel?"},{"answer":"The `Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel` patent lays a robust foundation for future developments in display technology. We can anticipate several key advancements building upon this two-step etching innovation:\n\n1.  **Further Miniaturization and Integration:** The precision offered will enable even smaller via holes and more complex multi-layered display architectures, pushing the boundaries for ultra-thin, borderless, and potentially transparent displays.\n2.  **Enhanced Material Compatibility:** The flexibility of the two-step process allows for easier adaptation to novel materials, such as advanced oxide semiconductors, new organic light-emitting materials, and flexible substrates, driving innovation in material science for displays.\n3.  **AI-Driven Process Optimization:** Future developments may involve integrating artificial intelligence and machine learning algorithms into the etching equipment's control systems. This could enable real-time, adaptive optimization of the first and second etching conditions, further boosting yields and precision beyond current capabilities.\n4.  **Cost Reduction and Accessibility:** As the technology matures and becomes more widely adopted, the efficiency gains are expected to drive down manufacturing costs, making advanced display technologies more accessible and affordable for a broader range of products and consumers.\n5.  **New Form Factors and Applications:** The ability to produce highly reliable and precise connections will be crucial for developing truly revolutionary display form factors, such as rollable screens, stretchable displays, and integrated smart surfaces in various environments. Keywords: future display tech, manufacturing advancements, AI in manufacturing, Micro-LED evolution, flexible display future, material science, process optimization.","question":"What are the future developments expected for Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel?"}],"topics":["manufacture method of via hole","manufacture method of display panel","display panel manufacturing","via hole etching","two-step etching","intricate","architecture","modern"],"tech_cluster":null},"seo":{"title":"Manufacture Method of Via Hole, Display Panel - Patent US-9853064","description":"Discover the Manufacture Method of Via Hole, Manufacture Method of Display Panel, and Display Panel patent (US-9853064). A two-step etching process for superior display quality & manufacturing.","keywords":["manufacture method of via hole","manufacture method of display panel","display panel manufacturing","via hole etching","two-step etching","display technology patent","semiconductor manufacturing","display panel innovation","US-9853064 patent","etching process control","slope angle etching","selection ratio etching","advanced displays"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853064","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853064","citation_suggestion":"Patentable. \"Manufacture method of via hole, manufacture method of display panel, and display panel\" (US-9853064). https://patentable.app/patents/US-9853064","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853064","json":"https://patentable.app/api/llm-context/US-9853064","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:35:09.878Z"}