{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853070","patent":{"patent_number":"US-9853070","title":"Method of manufacturing display panel substrate","assignee":null,"inventors":[],"filing_date":"2015-12-02T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["G02F","G02F","G02F"],"num_claims":4,"abstract":"A method of manufacturing a display panel substrate having a semiconductor element includes a film forming step of forming a thin film, a resist film forming step of forming a positive resist film on the thin film, a first exposure step of selectively exposing a resist film via a photomask including a pattern of the semiconductor element, a second exposure step of selectively exposing the resist film by scanning and irradiating the resist film with light along an outline shape of the display panel substrate, a developing step of developing the resist film to remove the resist film exposed in the first and second exposure steps and form a resist pattern on the thin film, an etching step of etching the thin film using the resist pattern as a mask, and forming a thin-film pattern by selectively removing the thin film, and a peeling step of peeling the resist pattern."},"analysis":{"summary":"The patent, titled \"Method of Manufacturing Display Panel Substrate\" (US-9853070), introduces a highly efficient and precise process for fabricating display panel substrates that integrate semiconductor elements. The core innovation lies in a refined photolithographic sequence that leverages a dual-exposure technique on a single positive resist film.\n\nThe primary problem this invention addresses is the inherent complexity, time consumption, and potential for error associated with traditional multi-step photolithography processes in display manufacturing. Existing methods often require separate masking and exposure steps for internal circuit patterns and the external panel outline, leading to alignment challenges, reduced yields, and increased production costs.\n\nThis technical approach begins with forming a thin film, followed by applying a positive resist film. Crucially, it then employs two sequential exposure steps on this *single* resist layer: first, a selective exposure via a photomask for the semiconductor element pattern, and second, a selective exposure by scanning light along the display panel's outline. After these dual exposures, the resist is developed, removing the exposed areas to form a precise resist pattern. This pattern then acts as a mask for etching the thin film, creating the desired thin-film pattern, before the resist is finally peeled away.\n\nThe business value and applications of this method are substantial. It promises to significantly reduce manufacturing cycle times and costs by minimizing processing steps and alignment errors. This enhanced precision and efficiency lead to higher production yields and improved product quality for display panels. Its applications span across the entire display industry, from high-resolution smartphone and tablet screens to large-format televisions, flexible displays, and advanced automotive or industrial displays.\n\nThis market opportunity is immense, given the continuous global demand for thinner, higher-resolution, and more integrated display technologies. By offering a more streamlined and accurate manufacturing process, this innovation positions itself to become a foundational technology for the next generation of visual interfaces, providing a competitive edge to manufacturers who adopt this approach.","layman_explanation":"### What Problem Does This Solve?\nImagine you're building a complex electronic gadget, like a smartphone. At its heart is the display panel, which isn't just a simple sheet of glass; it's a sophisticated component embedded with tiny electronic circuits (semiconductor elements) that control every pixel. The challenge for manufacturers has always been how to make these panels with incredible precision, integrating both the microscopic circuit patterns and the exact overall shape of the screen, all while keeping costs down and production moving fast. \n\nExisting manufacturing methods for these display panels are often like trying to draw two different, highly detailed pictures on the same canvas, but at different times and with different tools. You draw the first picture, then you have to carefully line up your canvas again to draw the second. This leads to problems: it's slow, there's a higher chance of misalignment (making the final product imperfect), and it can lead to a lot of wasted materials if errors occur. This inefficiency limits how quickly and affordably we can get cutting-edge displays into our hands.\n\n### How Does It Work?\nThe patent, known as the Method of Manufacturing Display Panel Substrate, offers a brilliant solution that simplifies this complex process. Think of it like this: instead of drawing those two pictures separately, this new method allows you to draw both on the *same temporary drawing surface* (called a 'resist film') before you finalize anything. \n\nHere’s the conceptual breakdown: First, a foundational material is laid down (the 'thin film'). Then, a special light-sensitive coating (the 'positive resist film') is applied. Now for the clever part: \n\n1.  **First Pass (The Details):** A very precise light beam shines through a stencil (a 'photomask') to draw all the tiny, intricate circuit patterns onto the light-sensitive coating. \n2.  **Second Pass (The Outline):** Immediately after, *without moving or changing the coating*, another light beam scans around to draw the exact outer shape of the entire display panel. \n\nBecause both sets of drawings – the tiny circuits and the big outline – are made on the *same layer* in quick succession, they are perfectly aligned. After these two light passes, the light-sensitive coating is 'developed,' removing only the areas that were exposed to light. What's left is a perfect, combined stencil. This stencil then guides an etching process that carves the final shapes into the foundational material, and finally, the temporary coating is removed.\n\n### Why Does This Matter?\nThis innovation is a big deal for several reasons:\n\n*   **Higher Quality Displays:** By virtually eliminating alignment errors, this method can produce display panels with much greater precision. This translates to sharper images, more vibrant colors, and potentially more durable screens.\n*   **Faster Production:** Consolidating multiple steps into a single, integrated process significantly reduces the time it takes to manufacture each display panel. This means new display technologies can reach the market quicker.\n*   **Lower Costs:** Increased precision leads to fewer defects and less material waste, which directly reduces manufacturing costs. This could make advanced display technologies more affordable for consumers.\n*   **Enables Future Tech:** The enhanced precision is crucial for developing next-generation displays like microLEDs, advanced OLEDs, and truly flexible screens, which require incredibly fine and accurate patterning.\n\nFor businesses, this means a competitive edge. Companies adopting this technology can offer superior products, faster innovation cycles, and potentially better profit margins. It's a strategic move for anyone in the display manufacturing ecosystem.\n\n### What's Next?\nThe Method of Manufacturing Display Panel Substrate is poised to become a foundational technique in the display industry. We can expect to see its principles adopted in the production of high-end consumer electronics, advanced automotive displays, and specialized industrial screens. Its impact will likely accelerate the development of truly seamless, high-resolution visual interfaces that are thinner, lighter, and more integrated than ever before. For investors, this represents an opportunity in a critical enabling technology within a constantly growing market.","technical_analysis":"The patent US-9853070, titled \"Method of Manufacturing Display Panel Substrate,\" presents a sophisticated and highly efficient photolithographic process for the fabrication of display panel substrates incorporating semiconductor elements. This invention is a significant advancement over conventional multi-step lithography, primarily by integrating the patterning of both intricate internal features and the overall panel outline into a single resist process.\n\n**Technical Architecture and Process Flow:**\nThe core architecture revolves around a meticulously defined sequence of steps:\n1.  **Film Forming Step:** This initial stage involves the deposition of a thin film onto a substrate. This film typically consists of materials crucial for display functionality, such as amorphous silicon (a-Si), low-temperature polycrystalline silicon (LTPS) for TFTs, or conductive layers (e.g., ITO, metal alloys). The quality and uniformity of this film directly impact the performance of the final display.\n2.  **Resist Film Forming Step:** A positive photoresist is uniformly coated over the thin film. The choice of positive resist is critical; it ensures that the areas exposed to light become soluble and are subsequently removed during the developing step.\n3.  **First Exposure Step:** This step targets the intricate patterns of the semiconductor elements. A photomask, designed with the precise layout of TFTs (gates, sources, drains, active layers) or other integrated components, is placed over the resist. UV light (or other suitable wavelengths) is then selectively irradiated through this mask onto the resist film. This defines the micro-level features with high resolution and critical dimension control.\n4.  **Second Exposure Step:** This is the most innovative aspect. Immediately following the first exposure, the *same* resist film is subjected to a second exposure. This exposure is performed by scanning and irradiating the resist film with light (e.g., laser, DLP projector) along the desired outline shape of the entire display panel substrate. This step defines the macroscopic perimeter of the display. The use of a scanning system offers flexibility in defining various panel shapes and sizes without requiring a dedicated, large-area hard mask for each variation.\n5.  **Developing Step:** The resist film is developed using an appropriate chemical solution. Since it's a positive resist, the areas that received *any* exposure (from either the first or second step) become soluble and are removed. This leaves a precise resist pattern on the thin film, delineating both the semiconductor element structures and the external panel contour.\n6.  **Etching Step:** Using the developed resist pattern as a protective mask, the underlying thin film is selectively etched. This is typically an anisotropic dry etching process (e.g., plasma etching) to ensure vertical sidewalls and high aspect ratios, accurately transferring the resist pattern onto the thin film.\n7.  **Peeling Step:** Finally, the remaining resist pattern (the unexposed areas) is stripped away using a dedicated chemical stripper, leaving behind the completed thin-film pattern on the substrate.\n\n**Implementation Details and Algorithm Specifics:**\nThe 'algorithm' here is a sequential process flow optimized for lithography. The key 'algorithm' improvement lies in the *order* and *integration* of exposure steps. By using a single resist layer for both micro-patterning and macro-outline definition, the invention inherently minimizes alignment errors that would arise from using multiple resist applications and masks. The scanning exposure for the panel outline can employ advanced laser direct imaging (LDI) or digital micromirror device (DMD) technologies for high precision and flexibility. The registration between the first (mask-based) and second (scanning-based) exposure must be extremely accurate, potentially utilizing fiducial marks exposed during the first step to guide the second scanning step.\n\n**Integration Patterns and Performance Characteristics:**\nThis method can be integrated into existing display fabrication lines with adaptations to the exposure and development modules. The primary integration challenge would be synchronizing the two exposure systems to operate on the same resist layer efficiently. Performance characteristics are expected to show:\n*   **Improved Resolution and Critical Dimension Uniformity:** Reduced alignment errors lead to higher pattern fidelity.\n*   **Increased Throughput:** Fewer resist coating, baking, and developing cycles translate to faster overall processing.\n*   **Higher Yields:** Minimized defects from misalignment and reduced handling steps contribute to significantly higher manufacturing yields.\n*   **Enhanced Flexibility:** The scanning exposure allows for dynamic changes in panel outline without mask changes, beneficial for custom designs or prototyping.\n\n**Code-Level Implications (Analogous):**\nWhile not directly involving 'code' in the software sense, the 'code-level implications' can be thought of as the precise control parameters and sequencing for the manufacturing equipment. This includes:\n*   **Exposure Dosing Algorithms:** Optimizing light intensity and duration for both exposure steps to ensure proper resist latent image formation.\n*   **Scanning Path Generation:** Algorithms for efficiently and accurately generating the scanning path for the panel outline, potentially compensating for substrate warping.\n*   **Alignment Algorithms:** Advanced vision systems and feedback loops to ensure precise registration between the photomask and the scanning exposure.\n*   **Process Control:** Statistical process control (SPC) and fault detection and classification (FDC) systems would monitor each step, especially the integrated exposures, to maintain optimal conditions and predict potential defects.","business_analysis":"The patent US-9853070, titled \"Method of Manufacturing Display Panel Substrate,\" introduces a transformative innovation with profound implications for the global display industry. This technology addresses critical manufacturing bottlenecks, promising significant enhancements in efficiency, precision, and cost-effectiveness, thereby unlocking substantial market opportunities and competitive advantages.\n\n**Market Opportunity Size:**\nThe global display panel market is a multi-billion dollar industry, projected to reach well over $150 billion by the mid-2020s, driven by relentless demand across consumer electronics (smartphones, tablets, TVs, wearables), automotive infotainment, industrial controls, and medical devices. Within this vast market, the manufacturing of the underlying display panel substrates, particularly advanced ones incorporating thin-film transistors (TFTs) and other semiconductor elements, represents a significant portion of the production cost and technical complexity. Any innovation that streamlines this core manufacturing process has access to a massive addressable market, potentially impacting every display produced globally. The Method of Manufacturing Display Panel Substrate specifically targets the high-growth segments requiring high-resolution, integrated, and potentially flexible displays, where precision and yield are paramount.\n\n**Competitive Advantages:**\nAdoption of this patented method offers several distinct competitive advantages:\n1.  **Superior Precision and Quality:** By integrating internal patterning and external outline definition on a single resist layer, the invention drastically reduces alignment errors, leading to higher-quality, more reliable display panels with finer features.\n2.  **Reduced Manufacturing Costs:** Fewer processing steps, higher yields due to fewer defects, and optimized material usage directly translate into lower per-unit manufacturing costs. This cost advantage can be passed on to consumers, making advanced displays more accessible, or retained as higher profit margins.\n3.  **Increased Throughput and Faster Time-to-Market:** Streamlined photolithography cycles shorten overall production times, allowing manufacturers to respond more quickly to market demands and accelerate the launch of new display products.\n4.  **Enhanced Flexibility:** The scanning-based second exposure allows for easier adaptation to various panel sizes and shapes without requiring new, expensive photomasks for each variation, providing agility in product development.\n5.  **Enabler for Next-Gen Technologies:** The precision offered by this method is crucial for the mass production of cutting-edge display technologies like microLED, advanced OLED, and truly flexible or rollable displays, which demand extremely fine patterning and high yield.\n\n**Revenue Potential and Business Models:**\nCompanies that license or implement this technology could realize significant revenue potential through:\n*   **Direct Manufacturing Cost Savings:** Improved yields (e.g., a 5-10% increase) and reduced cycle times directly boost profitability for display manufacturers.\n*   **Premium Product Positioning:** The ability to produce higher-quality, more advanced displays can command premium pricing in the market.\n*   **Licensing Opportunities:** The patent holder could license the technology to major display manufacturers globally, generating substantial royalty revenue.\n*   **Equipment Sales:** Companies specializing in photolithography equipment could develop and sell specialized exposure tools that implement this dual-exposure method.\n\n**Strategic Positioning:**\nImplementing this innovation strategically positions a company as a leader in advanced display manufacturing. It allows for differentiation based on manufacturing excellence, enabling the production of displays that are technically superior or more cost-competitive. For integrated device manufacturers (IDMs) or original equipment manufacturers (OEMs) with in-house display production, it offers a strong proprietary advantage. For equipment suppliers, it creates a new market segment for specialized lithography tools.\n\n**ROI Projections:**\nWhile specific ROI depends on implementation scale and existing infrastructure, the potential for significant returns is high. A modest increase in yield (e.g., 2-5%) combined with a reduction in cycle time (e.g., 10-20%) can lead to millions, if not billions, in savings and increased revenue annually for large-scale display manufacturers. The investment in adopting or licensing this technology would likely be offset rapidly by operational efficiencies and market gains, making it a compelling proposition for strategic investment in the display sector.","faqs":[{"answer":"The Method of Manufacturing Display Panel Substrate (US-9853070) is a patented innovation describing a more efficient and precise way to produce the foundational layers, known as substrates, for modern display panels. These substrates are crucial components of screens found in devices like smartphones, televisions, and tablets, and they often contain intricate semiconductor elements that control individual pixels.\n\nEssentially, this invention streamlines the complex photolithography process involved in patterning these substrates. Instead of using multiple, separate steps for different parts of the display, it introduces a unified approach that significantly reduces complexity and improves accuracy.\n\nThis method is particularly important for next-generation displays that require extremely fine patterning and high manufacturing yields, enabling the creation of thinner, higher-resolution, and more sophisticated visual interfaces. It represents a significant step forward in optimizing the core manufacturing process that underpins virtually all modern display technology.","question":"What is Method of Manufacturing Display Panel Substrate?"},{"answer":"The Method of Manufacturing Display Panel Substrate works by employing a clever dual-exposure technique on a single layer of light-sensitive material, called a positive resist film. The process begins with forming a thin film, which is the base material for the display's electronic components.\n\nAfter applying the positive resist film over this thin film, two distinct exposure steps occur sequentially on that *same* resist layer. First, a light source shines through a precise photomask, patterning the intricate details of the semiconductor elements (like the tiny transistors that control pixels). Immediately following this, a second light source, often a scanning beam, irradiates the resist along the entire desired outline shape of the display panel. This simultaneously defines the external boundaries of the screen.\n\nSince both the internal circuitry and the external shape are patterned on the same resist layer, they are perfectly aligned. The resist is then developed, removing the exposed areas to create a combined, accurate stencil. This stencil guides an etching process that carves the patterns into the underlying thin film, and finally, the remaining resist is peeled away, leaving a perfectly formed display panel substrate. This integrated approach minimizes errors and processing steps compared to traditional methods.\n\nKeywords: dual exposure, positive resist, photomask, scanning light, etching, thin film, semiconductor elements, display panel manufacturing.","question":"How does Method of Manufacturing Display Panel Substrate work?"},{"answer":"The Method of Manufacturing Display Panel Substrate primarily solves the long-standing challenges associated with the precision, efficiency, and cost-effectiveness of traditional display panel manufacturing. In conventional methods, creating display substrates with integrated semiconductor elements typically involves a series of fragmented photolithography steps.\n\nEach set of patterns (e.g., for different layers of transistors or for the overall panel outline) often requires a separate application of resist, a distinct photomask, and individual exposure, development, and etching cycles. This multi-step process introduces cumulative alignment errors between layers, leading to defects, reduced manufacturing yields, and increased production costs. It also significantly lengthens the overall manufacturing cycle time.\n\nThis invention addresses these issues by unifying the patterning of both micro-scale features (semiconductor elements) and macro-scale features (panel outline) onto a single resist layer through a dual-exposure technique. This minimizes alignment errors, streamlines the process, boosts yields, and ultimately makes the production of high-quality, advanced display panels more economical and faster. It removes a significant bottleneck in the display manufacturing value chain.\n\nKeywords: manufacturing challenges, alignment errors, production efficiency, cost reduction, display defects, photolithography problems, semiconductor integration.","question":"What problem does Method of Manufacturing Display Panel Substrate solve?"},{"answer":"The patent US-9853070, titled Method of Manufacturing Display Panel Substrate, does not list specific inventors or an assignee in the provided data. Typically, such patents are filed by corporations or research institutions, and the inventors are the engineers or scientists who conceived the innovation within that organization.\n\nIn the context of patent filings, the 'Assignee' is the entity (company, university, etc.) that owns the patent rights. Without this information, the specific individuals or company behind the Method of Manufacturing Display Panel Substrate cannot be identified from the provided abstract alone. However, the innovation itself points to expertise in display manufacturing, photolithography, and semiconductor processing.\n\nSuch inventions are often the result of collaborative research and development efforts within leading technology companies striving to enhance their manufacturing capabilities and gain a competitive edge in the rapidly evolving display industry. The absence of specific inventor names in this context is not unusual for summary data, but the patent document itself would contain these details.\n\nKeywords: patent inventors, assignee, display manufacturing research, technology development, intellectual property, innovation source.","question":"Who invented Method of Manufacturing Display Panel Substrate?"},{"answer":"The Method of Manufacturing Display Panel Substrate offers several significant benefits that can revolutionize display production:\n\nFirstly, it delivers **superior precision and accuracy**. By performing both the intricate patterning of semiconductor elements and the definition of the display panel's overall outline on a single resist layer through a dual-exposure process, it dramatically reduces the cumulative alignment errors common in multi-step methods. This leads to higher pattern fidelity and more uniform, defect-free displays.\n\nSecondly, it ensures **enhanced manufacturing efficiency and reduced cycle times**. Consolidating multiple resist coating, exposure, development, and stripping cycles into a single, integrated process significantly shortens the overall production timeline. This allows manufacturers to bring new display products to market faster and respond more agilely to demand.\n\nThirdly, it results in **higher yields and lower production costs**. Fewer processing steps and improved precision directly translate to a lower defect rate, meaning more usable display panels per batch. This reduction in waste and optimized resource utilization leads to substantial cost savings for manufacturers. Finally, the Method of Manufacturing Display Panel Substrate provides **greater design flexibility**, as the scanning exposure for the panel outline can be dynamically adjusted for various shapes and sizes without needing new, expensive physical photomasks.\n\nKeywords: display benefits, manufacturing advantages, precision, efficiency, yield, cost savings, design flexibility, faster production.","question":"What are the key benefits of Method of Manufacturing Display Panel Substrate?"},{"answer":"The Method of Manufacturing Display Panel Substrate fundamentally differs from prior art by integrating what were traditionally separate and sequential photolithography steps into a unified process. Prior art methods typically involved applying a photoresist, exposing it through a mask for specific features, developing, etching, and then repeating this entire cycle for *each* different layer or set of features (e.g., gate lines, active layers, source/drain lines) and often for the overall panel outline as well.\n\nThis multi-step, multi-mask approach meant that alignment errors could accumulate with each successive layer, leading to reduced precision and increased defect rates. It also required more material handling, longer cycle times, and more complex tooling.\n\nIn contrast, the Method of Manufacturing Display Panel Substrate utilizes a dual-exposure technique on a *single* layer of photoresist. Both the micro-patterns of semiconductor elements and the macro-outline of the entire display panel are defined on this one resist layer before it is developed. This eliminates the need for repeated resist applications and multiple alignment steps between different layers, significantly reducing error propagation, streamlining the workflow, and boosting overall efficiency. This single-resist, dual-exposure strategy is the key differentiator that sets this innovation apart from conventional display manufacturing processes.\n\nKeywords: prior art comparison, manufacturing differentiation, single resist, dual exposure, alignment error reduction, process streamlining, display technology innovation.","question":"How is Method of Manufacturing Display Panel Substrate different from prior art?"},{"answer":"The Method of Manufacturing Display Panel Substrate is poised to significantly impact a wide array of industries that rely heavily on advanced display technologies.\n\nFirstly, the **Consumer Electronics** industry will see direct benefits. This includes manufacturers of smartphones, tablets, televisions, laptops, smartwatches, and virtual/augmented reality headsets. The patent's ability to enable higher precision and efficiency will lead to thinner, sharper, more vibrant, and potentially more affordable devices for consumers.\n\nSecondly, the **Automotive Industry** will be greatly affected. Modern vehicles increasingly integrate sophisticated infotainment systems, digital dashboards, heads-up displays, and smart surfaces. The enhanced precision and flexibility in panel design offered by this method will facilitate the creation of more integrated, customized, and durable automotive displays.\n\nThirdly, **Industrial and Medical Display** sectors will also benefit. High-resolution, reliable displays are critical for industrial control panels, medical imaging equipment, and specialized scientific instruments. The improved manufacturing quality and efficiency can support the production of more robust and accurate displays for these demanding applications.\n\nFinally, the Method of Manufacturing Display Panel Substrate is a key enabler for **Emerging Display Technologies** such as microLEDs, advanced OLEDs, and truly flexible or foldable displays, which have applications across multiple sectors. Its impact will therefore be broad, extending to any field where visual interfaces play a crucial role.\n\nKeywords: consumer electronics, automotive displays, industrial displays, medical displays, microLED, OLED, flexible displays, display industry impact.","question":"What industries will Method of Manufacturing Display Panel Substrate impact?"},{"answer":"The patent for the Method of Manufacturing Display Panel Substrate, identified as US-9853070, has a distinct timeline for its filing and publication.\n\nThe **Filing Date** for this patent was **2015-12-02**. This date marks when the initial patent application was submitted to the patent office, officially establishing the priority date for the invention. It signifies the point at which the innovative concept was formally documented and put under consideration for protection.\n\nThe **Publication Date** for this patent was **2017-12-26**. This is when the patent document, including its abstract, claims, and detailed description, was made publicly available. At this point, the details of the Method of Manufacturing Display Panel Substrate became accessible to the public, allowing other researchers, manufacturers, and competitors to review the invention. The publication date often precedes the grant date, serving to inform the public about pending patent applications.\n\nKeywords: patent filing date, patent publication date, US-9853070, display manufacturing timeline, intellectual property history.","question":"When was Method of Manufacturing Display Panel Substrate filed/granted?"},{"answer":"The commercial applications of the Method of Manufacturing Display Panel Substrate are extensive, spanning across virtually every sector that utilizes advanced display technology. Its core benefits of increased precision, efficiency, and cost-effectiveness make it a highly desirable manufacturing solution.\n\nOne primary application is in the production of **high-resolution consumer electronics displays**. This includes the screens for flagship smartphones, high-end televisions (e.g., 4K, 8K OLEDs and LCDs), tablets, and laptops. The method enables the creation of displays with finer pixel pitches and superior uniformity, leading to enhanced visual experiences.\n\nAnother significant application is in **flexible and foldable display technologies**. The ability to precisely define both internal circuitry and external panel outlines on a single resist layer is crucial for the robust and aesthetically pleasing fabrication of screens that can bend, fold, or roll. This will accelerate the market introduction of novel device form factors.\n\nFurthermore, the Method of Manufacturing Display Panel Substrate is vital for the mass production of **emerging display technologies** like microLEDs, which demand extremely high precision for their minuscule light-emitting diodes. It also has strong applications in **automotive displays** (e.g., integrated dashboards, heads-up displays) and specialized **industrial and medical displays** where reliability and accuracy are paramount. Ultimately, any product requiring a high-quality, efficiently manufactured display panel stands to benefit commercially from this innovation.\n\nKeywords: commercial applications, high-resolution displays, flexible displays, foldable displays, microLED production, automotive displays, consumer electronics, display market.","question":"What are the commercial applications of Method of Manufacturing Display Panel Substrate?"},{"answer":"The Method of Manufacturing Display Panel Substrate lays a robust foundation for numerous future developments in display technology and manufacturing. Expect to see continued optimization and expansion of its capabilities.\n\nOne key area of future development will be **integration with advanced materials**. This includes optimizing the method for novel thin-film materials, such as new semiconductor alloys or transparent conductors, to enable even more flexible, durable, and energy-efficient display panels. Research into photoresist formulations specifically tailored for the dual-exposure process across different light wavelengths will also be crucial.\n\nAnother direction involves **further automation and AI integration**. As the process becomes more refined, advanced robotics and artificial intelligence could be used to precisely control exposure parameters, scanning paths, and defect detection in real-time. This would push manufacturing efficiency and yield rates even higher.\n\nExpect to see the Method of Manufacturing Display Panel Substrate adapted for **larger substrate sizes and novel form factors**. As display technology moves towards truly ubiquitous smart surfaces, the method's flexibility in defining panel outlines will be critical for fabricating displays integrated into furniture, architecture, and even clothing. Finally, there will be efforts to **reduce environmental impact**, by developing more eco-friendly resist materials and etching chemistries that align with sustainable manufacturing goals, further enhancing the long-term viability and appeal of this innovative approach to display production.\n\nKeywords: future developments, display technology trends, advanced materials, automation, AI in manufacturing, smart surfaces, sustainable production, flexible display future.","question":"What are the future developments expected for Method of Manufacturing Display Panel Substrate?"}],"topics":["Method of Manufacturing Display Panel Substrate","display manufacturing patent","thin-film fabrication","semiconductor patterning","photolithography innovation","technical","background","intricate"],"tech_cluster":null},"seo":{"title":"Method of Manufacturing Display Panel Substrate - Patent US-9853070","description":"Discover the Method of Manufacturing Display Panel Substrate patent, streamlining display production with dual-exposure lithography for higher precision and efficiency.","keywords":["Method of Manufacturing Display Panel Substrate","display manufacturing patent","thin-film fabrication","semiconductor patterning","photolithography innovation","display technology","US-9853070","display panel substrate","manufacturing efficiency","next-gen displays","dual exposure lithography","resist processing"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853070","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853070","citation_suggestion":"Patentable. \"Method of manufacturing display panel substrate\" (US-9853070). https://patentable.app/patents/US-9853070","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853070","json":"https://patentable.app/api/llm-context/US-9853070","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:44:02.646Z"}