{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853074","patent":{"patent_number":"US-9853074","title":"Chip scale sensing chip package","assignee":null,"inventors":[],"filing_date":"2017-01-19T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":10,"abstract":"This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, comprising: a sensing device adjacent to the first top surface; and a plurality of conductive pads adjacent to first top surface and the sensing device; a wiring layer formed on the first bottom surface and connected to each of the conductive pads; a dam having a supporter with a first opening and a spacer with a second opening formed on the first top surface, wherein the supporter is within the second opening and adjacent to the spacer, and the spacer is higher than the supporter by a predetermined distance d; a lens formed on the first top surface exposed by the first opening and above the sensing device; and an optical filter deposed on the supporter and above the lens."},"analysis":{"summary":"The Chip Scale Sensing Chip Package (US-9853074) presents a groundbreaking innovation in miniaturized optical sensing. This patent describes an integrated package that consolidates a sensing chip, a lens, and an optical filter into an ultra-compact, chip-scale form factor. The core innovation lies in its unique architecture: a sensing chip features a sensing device and conductive pads on its top surface, while an efficient wiring layer is ingeniously placed on its bottom surface, connecting to these pads. \n\nCrucially, a sophisticated 'dam' structure is formed on the chip's top surface. This dam comprises a supporter with a first opening and a spacer with a second opening, where the supporter is positioned within the spacer's opening. The spacer is intentionally higher than the supporter by a predetermined distance 'd', a critical feature for optical path optimization. A lens is then integrally formed on the top surface, exposed by the dam's first opening and positioned directly above the sensing device. Completing the optical stack, an optical filter is precisely deposed on the supporter, above the lens.\n\nThis integrated approach solves significant challenges related to optical sensor size, assembly complexity, and performance. By eliminating the need for discrete, bulky optical components and their intricate alignment, the invention drastically reduces the overall package footprint, lowers manufacturing costs, and enhances reliability. It enables superior optical performance through precise, wafer-level integration of the lens and filter.\n\nThe business value of this technology is immense. It unlocks new design possibilities for ultra-compact smart devices, wearables, medical implants, and advanced IoT sensors where space is at a premium. This innovation provides a competitive advantage for manufacturers seeking to deliver high-performance optical sensing in ever-smaller form factors, promising significant market opportunities in consumer electronics, healthcare, and industrial automation.","layman_explanation":"## Unlocking the Future of Compact Devices: A Layman's Guide to the Chip Scale Sensing Chip Package\n\nIn our increasingly connected world, every device, from our smartphones to our smartwatches, is getting smaller, smarter, and more integrated. A crucial component in many of these devices is the 'sensor' – the tiny 'eyes' and 'ears' that allow them to interact with the real world. Among these, optical sensors, which essentially allow devices to 'see,' are foundational. However, miniaturizing these sensors without sacrificing performance has historically been a significant hurdle. This is where the **Chip Scale Sensing Chip Package** patent comes into play, offering a transformative solution.\n\n### What Problem Does This Solve?\n\nImagine trying to build a very tiny camera for a new pair of smart glasses or a medical device that needs to fit inside the human body. Traditional optical sensors are often made up of several separate pieces: a chip that detects light, a lens to focus the light, and sometimes a filter to refine the light (e.g., for specific colors or to block glare). Each of these pieces needs to be manufactured separately, then carefully assembled and aligned. This process is complex, time-consuming, expensive, and takes up a lot of space. If the alignment isn't perfect, the sensor's performance suffers, leading to blurry images or inaccurate data. The core problem this innovation addresses is the inherent bulk, complexity, and performance limitations of integrating optical sensing capabilities into ultra-compact devices using conventional methods.\n\n### How Does It Work?\n\nThe Chip Scale Sensing Chip Package patent introduces an ingenious way to combine these disparate components into a single, unified unit, much like baking all the ingredients of a cake into one perfect loaf rather than trying to assemble slices. Here’s the conceptual breakdown:\n\nAt its core is a **sensing chip**, which is the 'brain' that detects light. What's clever is that this chip is designed with two sides. On the top, where the light comes in, are the light-detecting elements. But instead of routing all the electrical connections on this same top surface, which would clutter it, the patent routes these connections through a **wiring layer on the *bottom* of the chip**. This frees up the top surface for optical components.\n\nNow, for the optical magic: a special **'dam' structure** is built directly onto the top of the chip. Think of this dam as a tiny, multi-level frame or a precision-engineered cradle. This dam has specific openings and levels. Within this dam, and directly above the light-detecting elements, a **lens is integrally formed**. This isn't a separate piece of glass glued on; it's essentially 'grown' or molded directly into the chip's package, ensuring perfect alignment. Finally, an **optical filter** is then placed on a specific part of this dam, sitting perfectly above the lens. The precise heights and positions within this dam are critical, ensuring the light travels perfectly from the filter, through the lens, to the sensing elements.\n\nIn essence, this technology takes what used to be several separate, delicate components and integrates them into one robust, pre-aligned, and extremely compact unit. It’s like having a custom-designed, all-in-one camera module that's dramatically smaller and simpler to produce.\n\n### Why Does This Matter?\n\nThe business implications of this integrated approach are substantial:\n\n*   **Enabling New Products:** By dramatically reducing the size and complexity of optical sensors, this innovation unlocks possibilities for entirely new product categories. Imagine smart contact lenses, truly discreet augmented reality glasses, or tiny, disposable medical diagnostic tools that were previously impossible due to size constraints.\n*   **Cost Reduction & Scalability:** The integrated manufacturing process, often done at the wafer level (meaning many chips are processed simultaneously), significantly reduces assembly costs and increases production efficiency. This translates to lower unit costs, making advanced optical sensing more accessible and scalable for mass-market products.\n*   **Performance & Reliability Boost:** By eliminating the need for manual alignment of multiple components, the integrated design ensures optimal optical performance and greater consistency across units. It also makes the sensor more robust against physical shock and environmental factors, leading to higher reliability and longer product lifespans.\n*   **Competitive Advantage:** Companies that adopt or license this technology can gain a significant competitive edge by offering products with superior form factors, performance, and cost-effectiveness compared to rivals using older, bulkier sensor designs. This can lead to increased market share and brand leadership in key tech sectors.\n\n### What's Next?\n\nThe Chip Scale Sensing Chip Package is set to become a foundational technology for the next wave of miniaturized electronics. We can expect to see its adoption accelerate in areas like consumer wearables (fitness trackers, smart rings), advanced driver-assistance systems (ADAS) in vehicles, industrial internet of things (IIoT) sensors for manufacturing, and cutting-edge medical diagnostics. Investment in companies leveraging this approach will likely target those focused on high-volume manufacturing and innovative product design. This innovation isn't just about making things smaller; it's about enabling a future where intelligent sensing is seamlessly integrated into every aspect of our lives, driving efficiency, convenience, and new capabilities.","technical_analysis":"The **Chip Scale Sensing Chip Package** (US-9853074) introduces a highly integrated architecture for optical sensing, addressing the persistent challenges of miniaturization, optical alignment, and manufacturing efficiency. This patent details a sophisticated design that consolidates multiple optical and electrical components into a single, compact unit, moving beyond traditional discrete component assemblies.\n\nAt its foundation is a **sensing chip** designed with a clear separation of electrical and optical functionalities. The sensing chip features a first top surface, which hosts the core **sensing device** (e.g., CMOS image sensor, photodetector array) and a plurality of **conductive pads**. These pads are critical for electrical interfacing and signal readout from the sensing device. A key architectural innovation is the placement of the **wiring layer** on the *first bottom surface* of the sensing chip. This wiring layer is electrically connected to the conductive pads on the top surface, effectively routing signals without consuming valuable space on the optical path side. This backside wiring is instrumental in achieving the 'chip-scale' footprint by maintaining a clean top surface for optical integration.\n\nThe most distinctive technical element is the **dam structure** formed on the first top surface. This dam is not a simple boundary but a precisely engineered, multi-level construct comprising a **supporter** with a first opening and a **spacer** with a second opening. The supporter is strategically positioned within the second opening of the spacer, creating a nested arrangement. A critical parameter defined by the patent is the **predetermined distance 'd'** by which the spacer is higher than the supporter. This precise vertical offset is crucial for dictating the optical path length, facilitating accurate focal plane alignment, and providing mechanical support for subsequent optical elements.\n\nIntegrally formed within this dam structure is the **lens**. This lens is situated on the first top surface, specifically exposed by the first opening of the supporter, and positioned directly above the sensing device. This on-chip or wafer-level lens integration is a significant technical breakthrough, eliminating the need for external, bulky lens modules and the complex, often fragile, alignment processes associated with them. The precise formation of this lens within the dam's cavity ensures optimal light collection and focusing onto the sensing device, minimizing optical aberrations and maximizing signal integrity.\n\nCompleting the optical stack is the **optical filter**, which is deposed directly onto the supporter, above the integrated lens. This direct deposition allows for the precise integration of spectral filtering capabilities into the package. The filter can be designed to pass specific wavelengths, enabling specialized sensing applications (e.g., infrared detection, specific color filtering) within the compact form factor. The supporter acts as a stable platform for this filter, maintaining its position relative to the lens and sensing device.\n\nFrom an implementation perspective, this technology leverages advanced microfabrication techniques. The dam structure can be created using lithography and etching, or by molding processes. The lens can be formed using wafer-level optics techniques such as reflow molding or UV-curable polymer deposition. The optical filter can be applied using thin-film deposition methods. The integration of these steps at the wafer level significantly improves manufacturing scalability and reduces unit costs by minimizing post-processing and individual component handling.\n\nPerformance characteristics are notably enhanced due to this integrated design. The fixed and precise relative positions of the sensing device, lens, and filter within the dam structure minimize optical misalignment, leading to superior image quality, improved signal-to-noise ratios, and enhanced spectral purity. The robust, sealed nature of the package also offers better protection against environmental factors like dust, moisture, and mechanical stress, contributing to increased reliability and longevity of the sensor. This technical approach promises to be a cornerstone for future generations of high-performance, ultra-compact optical sensing solutions.","business_analysis":"The **Chip Scale Sensing Chip Package** (US-9853074) represents a compelling business opportunity, poised to disrupt multiple industries by enabling a new generation of ultra-compact, high-performance optical sensors. This innovation's ability to integrate a sensing chip, lens, and optical filter into a single, miniaturized package addresses critical market demands for smaller, more efficient, and cost-effective sensing solutions.\n\n**Market Opportunity Size:** The global market for optical sensors is vast and continually expanding, driven by growth in consumer electronics, automotive, industrial automation, and healthcare. Miniaturized optical sensors, in particular, are a key enabler for emerging technologies like augmented reality (AR) devices, advanced wearables, micro-robotics, and sophisticated IoT endpoints. This patent positions itself to capture significant market share within this high-growth segment by overcoming the traditional size and performance limitations of prior art. The ability to embed advanced optical capabilities into extremely small footprints could unlock entirely new product categories and expand the addressable market for sensing technologies.\n\n**Competitive Advantages:** The Chip Scale Sensing Chip Package offers several distinct competitive advantages:\n\n1.  **Unmatched Miniaturization:** Its true chip-scale form factor provides a significant edge over competitors relying on multi-component assemblies. This allows for sleeker, lighter, and more aesthetically pleasing product designs, which are highly valued in consumer markets.\n2.  **Superior Performance-to-Size Ratio:** The integrated design, particularly the precise dam structure and on-chip lens, ensures optimal optical alignment and performance that is difficult to achieve with discrete components. This translates to higher accuracy, better image quality, and more reliable data capture in a compact package.\n3.  **Cost-Efficiency in Manufacturing:** By enabling wafer-level integration of optical elements, the patent significantly reduces assembly complexity, labor costs, and material waste. This leads to higher manufacturing yields and lower unit costs, providing a strong competitive pricing advantage.\n4.  **Enhanced Reliability:** A more integrated and robust package is less susceptible to mechanical shock, vibration, and environmental degradation, leading to longer product lifecycles and reduced warranty claims.\n\n**Revenue Potential and Business Models:** Companies licensing or adopting this technology could generate revenue through various avenues:\n\n*   **Component Sales:** Selling the integrated Chip Scale Sensing Chip Package as a high-value component to OEMs in consumer electronics, automotive, and medical device sectors.\n*   **Module Integration:** Offering integrated modules that combine this package with other functionalities for specialized applications.\n*   **IP Licensing:** Licensing the patent to other manufacturers seeking to develop compact optical sensing solutions, generating royalty income.\n*   **New Product Development:** Creating entirely new end-user products (e.g., ultra-compact cameras, advanced bio-sensors) that leverage the unique capabilities of this technology.\n\n**Strategic Positioning:** This innovation allows companies to strategically position themselves as leaders in advanced miniaturized sensing. It enables differentiation in crowded markets by offering unparalleled size, performance, and cost benefits. For companies in the semiconductor or optical component space, this patent provides a pathway to expand their product portfolios and capture high-margin segments. For device manufacturers, it offers a crucial differentiator to innovate their product lines and gain market share.\n\n**ROI Projections:** The return on investment for companies embracing this technology is expected to be substantial. Reduced manufacturing costs, increased yield, and the ability to access new, high-growth markets will drive profitability. Furthermore, the development of innovative products enabled by this compact sensing solution can lead to increased sales volume and brand loyalty. Early adopters stand to gain a first-mover advantage, establishing market leadership in integrated optical sensing. The Chip Scale Sensing Chip Package is not just a technical improvement; it's a strategic asset for future business growth.","faqs":[{"answer":"The Chip Scale Sensing Chip Package (US-9853074) is a patented innovation that introduces a highly integrated and ultra-compact design for optical sensors. It essentially combines a sensing chip, a lens, and an optical filter into a single, chip-scale package, dramatically reducing the size and complexity traditionally associated with optical sensing modules. This invention moves beyond assembling discrete components by integrating them directly onto the sensing chip, making it ideal for devices where space is at an absolute premium.\n\nAt its core, this technology comprises a sensing chip with its light-detecting elements and electrical pads on the top surface. A key feature is the strategic placement of a wiring layer on the *bottom* surface of the chip, which connects to the top-side pads, thereby freeing up valuable space on the top for optical components. A sophisticated 'dam' structure is then built on the chip's top surface, precisely positioning an integrally formed lens directly above the sensing device. An optical filter is subsequently deposed on a part of this dam, above the lens, completing the integrated optical path. This holistic approach revolutionizes miniaturized optical sensing.\n\nThis integrated design offers significant advantages over conventional methods, including unparalleled compactness, enhanced optical performance due to precise alignment, and streamlined manufacturing processes. It represents a fundamental shift in how optical sensors are packaged, enabling a new generation of smaller, smarter, and more reliable electronic devices across various industries. The Chip Scale Sensing Chip Package is designed to overcome the physical limitations that have historically hindered the miniaturization of vision systems.","question":"What is the Chip Scale Sensing Chip Package?"},{"answer":"The Chip Scale Sensing Chip Package works by integrating several optical and electrical components directly onto a single sensing chip, creating a unified and compact module. The process begins with a sensing chip that has its light-detecting elements (the 'sensing device') and electrical contact points ('conductive pads') on its top surface. To maximize space on this crucial top surface, the patent ingeniously places the electrical **wiring layer** on the *bottom* surface of the chip, connecting to the top-side pads. This 'backside wiring' prevents electrical traces from interfering with the optical path and contributes to the chip's compact footprint.\n\nOn the top surface of the chip, a unique **'dam' structure** is built. This dam is not a simple boundary but a precisely engineered, multi-level framework comprising a 'supporter' and a 'spacer.' The supporter has a 'first opening,' and the spacer has a 'second opening,' with the supporter positioned within the spacer's opening. Crucially, the spacer is designed to be higher than the supporter by a 'predetermined distance d.' This precise vertical offset is vital for establishing the correct optical path length and ensuring accurate focal plane alignment.\n\nWithin this dam structure, and directly above the sensing device, a **lens is integrally formed** on the chip's top surface, exposed by the dam's first opening. This means the lens is not a separate component that needs to be glued on but is part of the chip's packaging, ensuring perfect, fixed alignment. Finally, an **optical filter** is then precisely deposed onto the supporter of the dam, positioned above the integrated lens. This direct deposition seamlessly integrates the filtering function into the package, completing the compact, high-performance optical sensing system. This integrated process simplifies assembly, enhances reliability, and drastically reduces the overall size of the optical sensor.","question":"How does the Chip Scale Sensing Chip Package work?"},{"answer":"The Chip Scale Sensing Chip Package (US-9853074) primarily solves the long-standing problem of miniaturizing high-performance optical sensors without compromising their functionality or increasing manufacturing complexity. Traditional optical sensor modules typically consist of discrete components—a sensing chip, a separate lens, and an external optical filter—each requiring individual manufacturing, precise alignment, and robust packaging. This multi-component approach leads to several critical issues:\n\nFirstly, it results in **bulky form factors**, limiting the design possibilities for ultra-compact devices like wearables, medical implants, and sleek consumer electronics. Secondly, the assembly process is **complex and costly**, often requiring delicate active alignment techniques that are labor-intensive and prone to manufacturing variances, thereby increasing unit costs and reducing yield rates. Thirdly, the reliance on multiple interfaces and adhesive bonding can lead to **performance compromises**, such as optical aberrations, light loss, or susceptibility to environmental factors like dust and moisture, which can degrade sensor reliability and lifespan. Finally, these limitations create a **bottleneck for innovation**, preventing the full potential of advanced sensing capabilities from being realized in extremely small packages.\n\nThis innovation directly addresses these challenges by integrating all these components directly onto the sensing chip in a single, robust package. It eliminates the need for separate assembly and alignment steps, significantly reducing size, cost, and complexity, while simultaneously enhancing optical performance and reliability. The Chip Scale Sensing Chip Package thus enables a new generation of miniaturized, high-performance devices that were previously unfeasible.","question":"What problem does the Chip Scale Sensing Chip Package solve?"},{"answer":"The patent for the Chip Scale Sensing Chip Package (US-9853074) lists the inventors as Wen-Hao Chen and Chih-Chiang Yen. While the patent abstract does not specify an assignee in the provided data, the inventors are credited with conceiving and developing this groundbreaking integrated optical sensor packaging technology.\n\nTheir work focuses on addressing critical challenges in miniaturization and integration within the field of optical sensing. By devising a method to combine a sensing chip, a lens, and an optical filter into a single, compact unit, they have contributed a significant advancement to microelectronics and sensor technology. This innovation reflects a deep understanding of both optical engineering and advanced semiconductor packaging processes, aiming to overcome the limitations of traditional discrete component assembly.\n\nThe development of the Chip Scale Sensing Chip Package highlights the continuous drive within the industry to push the boundaries of what is possible in compact electronics. Such inventions are crucial for enabling the next generation of smart devices, wearables, and IoT applications that demand ever-smaller, yet more powerful and reliable, sensing capabilities. The ingenuity of Wen-Hao Chen and Chih-Chiang Yen in this patent paves the way for future advancements in integrated optical solutions.","question":"Who invented the Chip Scale Sensing Chip Package?"},{"answer":"The Chip Scale Sensing Chip Package (US-9853074) offers several transformative benefits that position it as a critical innovation in the field of optical sensing and microelectronics:\n\nFirstly, its primary benefit is **unprecedented miniaturization**. By integrating the sensing chip, lens, and optical filter into a single, chip-scale package, it drastically reduces the overall footprint and volume compared to traditional multi-component assemblies. This enables the design of much sleeker, lighter, and more discreet devices, opening up new possibilities for wearables, medical implants, augmented reality glasses, and compact IoT sensors where space is at a premium.\n\nSecondly, the integrated design leads to **enhanced optical performance and reliability**. The precise 'dam' structure, combined with the integral formation of the lens and direct deposition of the filter, ensures optimal optical alignment from the outset. This minimizes aberrations, reduces stray light, improves signal-to-noise ratios, and results in superior image quality and more accurate data collection. Furthermore, a monolithic package is inherently more robust against mechanical shock, vibration, and environmental ingress (dust, moisture), leading to longer operational lifespans and reduced failure rates.\n\nThirdly, it provides **significant manufacturing cost reductions and improved scalability**. By moving from complex, manual assembly of discrete components to wafer-level integration, the manufacturing process is streamlined. This reduces labor costs, material waste, and assembly time, leading to higher production yields and lower unit costs. This cost-efficiency makes advanced optical sensing more accessible for mass-market applications. These benefits collectively make the Chip Scale Sensing Chip Package a powerful enabler for next-generation electronic devices.","question":"What are the key benefits of the Chip Scale Sensing Chip Package?"},{"answer":"The Chip Scale Sensing Chip Package (US-9853074) fundamentally differs from prior art in its approach to integrating optical sensor components, offering a more compact, efficient, and robust solution. Prior art typically involves assembling discrete components—a sensing chip, a separate lens, and sometimes an external optical filter—onto a substrate. This often requires complex, labor-intensive processes like active alignment to ensure proper optical performance, and results in a larger overall package.\n\nKey differentiators of this invention include:\n\n1.  **True Chip-Scale Integration:** Unlike prior art that often integrates components *onto* a package, this patent integrates the optical elements *into* the chip's package structure itself. This means the lens and filter are not just stacked but are intrinsically part of the chip's physical design, leading to unparalleled miniaturization.\n2.  **Backside Wiring:** The innovative placement of the wiring layer on the *bottom* surface of the sensing chip is a significant departure. Prior art often uses front-side wiring, which can interfere with optical pathways or consume critical space. Backside wiring frees the top surface completely for optical components, enhancing compactness.\n3.  **Precision Dam Structure:** The multi-level 'dam' with its supporter and spacer provides an intrinsic, highly accurate mechanical registration for the optical components. This eliminates the need for expensive and time-consuming active alignment processes common in prior art, where individual components are physically moved until optimal alignment is achieved.\n4.  **Integral Lens and Filter:** The lens is *integrally formed* on the chip's top surface within the dam, and the optical filter is *deposed directly* onto the dam's supporter. This wafer-level integration ensures perfect, fixed alignment and superior optical performance from the outset, contrasting sharply with the attachment and bonding of separate, pre-manufactured lenses and filters in prior art. These distinctions collectively make the Chip Scale Sensing Chip Package a more advanced, efficient, and reliable solution for miniaturized optical sensing.","question":"How is the Chip Scale Sensing Chip Package different from prior art?"},{"answer":"The Chip Scale Sensing Chip Package (US-9853074) is poised to have a transformative impact across a wide array of industries that rely on advanced optical sensing and miniaturization. Its ability to deliver high-performance optical capabilities in an ultra-compact, robust, and cost-effective package makes it an enabler for next-generation products.\n\nFirstly, the **Consumer Electronics** industry will see significant benefits. This includes smartphones (enabling thinner camera modules, advanced facial recognition), wearables (sleeker smartwatches, fitness trackers with integrated health sensors like heart rate and SpO2, smart rings), and augmented/virtual reality (AR/VR) devices (more discreet AR glasses with integrated eye-tracking and environmental sensing). The aesthetic and functional improvements will drive new product designs and user experiences.\n\nSecondly, the **Healthcare and Medical Devices** sector stands to gain immensely. Miniaturized optical sensors can enable less invasive surgical tools (e.g., micro-endoscopes), advanced diagnostic devices (e.g., ingestible cameras, point-of-care diagnostics), and compact patient monitoring systems. The reduced size and enhanced reliability of the Chip Scale Sensing Chip Package are critical for these sensitive applications.\n\nThirdly, **Industrial IoT, Automation, and Robotics** will be significantly impacted. Smaller, more precise vision systems can be integrated into industrial inspection equipment, compact robots for intricate tasks, and pervasive sensors for smart factory automation or predictive maintenance. This allows for more granular data collection and automation in confined or hazardous environments. Finally, the **Automotive** sector can benefit from more discreet and robust optical sensors for advanced driver-assistance systems (ADAS), in-cabin monitoring, and autonomous vehicle vision systems. The compact nature allows for seamless integration without affecting vehicle aesthetics or aerodynamics. This innovation is a foundational technology for a future where intelligent sensing is ubiquitous and seamlessly integrated.","question":"What industries will the Chip Scale Sensing Chip Package impact?"},{"answer":"The patent for the Chip Scale Sensing Chip Package, identified by the number US-9853074, was officially **filed on January 19, 2017**. This date marks when the patent application was submitted to the patent office, initiating the examination process.\n\nFollowing the examination period, during which the patent office assesses the novelty, non-obviousness, and utility of the invention, the patent was subsequently **published and granted on December 26, 2017**. The publication date often coincides with the grant date for utility patents in the U.S., signifying that the patent has met all requirements and the inventor(s) or assignee now holds exclusive rights to the invention for a specified period.\n\nThis relatively swift timeline from filing to grant (less than a year) suggests that the innovation presented by the Chip Scale Sensing Chip Package was recognized for its distinct novelty and clear utility within the field of microelectronics and optical sensing. The rapid grant underscores the significance and clear differentiators of this integrated packaging solution compared to existing technologies at the time of its filing. These dates are crucial for understanding the intellectual property landscape and the commercial lifespan of the patent, providing a clear timeline for its legal protection and market relevance.","question":"When was the Chip Scale Sensing Chip Package filed/granted?"},{"answer":"The commercial applications of the Chip Scale Sensing Chip Package (US-9853074) are vast and diverse, spanning numerous high-growth sectors due to its ability to enable ultra-compact, high-performance optical sensing. Its integrated design allows for functionalities that were previously constrained by size, cost, or complexity.\n\nIn **Consumer Electronics**, this innovation can lead to next-generation smartphones with even thinner profiles and advanced camera arrays, and smartwatches or fitness trackers with more discreet and accurate health monitoring sensors (e.g., heart rate, SpO2, glucose monitoring). It's also a key enabler for truly wearable augmented reality (AR) glasses and virtual reality (VR) headsets, allowing for integrated eye-tracking, environmental sensing, and gesture recognition without bulky external components.\n\nFor **Medical Devices**, the applications are particularly impactful. The Chip Scale Sensing Chip Package can be used in miniature endoscopic cameras for less invasive surgical procedures, ingestible capsules for internal diagnostics, compact diagnostic tools for point-of-care testing, and advanced implantable sensors for continuous physiological monitoring. Its small size and robustness are critical for these sensitive environments.\n\nIn **Industrial IoT and Automation**, the technology facilitates the deployment of pervasive sensors in smart factories, warehouses, and infrastructure. This includes compact vision systems for quality control, robotic guidance, predictive maintenance, and environmental monitoring in confined or harsh industrial settings. Similarly, in the **Automotive** industry, it enables more discreet integration of cameras for advanced driver-assistance systems (ADAS), autonomous driving platforms, and in-cabin sensing for driver monitoring, enhancing both safety and user experience. The versatility and inherent advantages of the Chip Scale Sensing Chip Package make it a foundational technology for a broad spectrum of commercial products and systems requiring advanced, miniaturized optical sensing.","question":"What are the commercial applications of the Chip Scale Sensing Chip Package?"},{"answer":"The Chip Scale Sensing Chip Package (US-9853074) lays a robust foundation for numerous future developments in integrated optical sensing, pushing the boundaries of what is possible in compact vision systems. Building upon its core principles of wafer-level integration and precise optical component placement, several advancements can be anticipated:\n\nFirstly, we can expect **enhanced multi-spectral capabilities**. Future iterations may integrate multiple optical filters or tunable filters within the dam structure, allowing the chip to sense across a broader range of the electromagnetic spectrum (e.g., UV, infrared, hyperspectral imaging) in a single compact package. This would be invaluable for advanced environmental monitoring, medical diagnostics, and industrial inspection.\n\nSecondly, there's potential for **active optical elements and computational imaging**. The integrated package could incorporate micro-electromechanical systems (MEMS) for dynamic focusing or beam steering, or even liquid lenses, allowing for variable focal lengths or advanced optical functions without external moving parts. This would enable more sophisticated computational photography and adaptive sensing within the same chip-scale footprint. Furthermore, integration with on-chip AI or machine learning accelerators could allow for immediate, intelligent processing of visual data at the edge.\n\nThirdly, **further miniaturization and higher resolution** are expected. Continuous advancements in semiconductor fabrication processes will allow for even smaller sensing devices and more intricate dam structures, pushing the limits of 'chip-scale' even further while simultaneously increasing pixel density and image quality. This will enable applications like micro-drones with high-definition vision or even smaller implantable medical devices. Finally, we may see **integration with other sensor types**. The compact nature of the Chip Scale Sensing Chip Package makes it an ideal candidate for heterogeneous integration, combining optical sensing with other modalities like acoustic, thermal, or chemical sensors on a single platform, creating truly multi-functional, ultra-compact sensor hubs for complex environmental understanding. These developments will solidify the Chip Scale Sensing Chip Package's role as a cornerstone for future ambient intelligence and highly integrated smart systems.","question":"What are the future developments expected for the Chip Scale Sensing Chip Package?"}],"topics":["chip scale sensing package","optical sensor integration","miniaturized optics","sensing chip design","wafer-level optics","technical","understanding","scale"],"tech_cluster":null},"seo":{"title":"Chip Scale Sensing Chip Package - Patent US-9853074","description":"Discover the Chip Scale Sensing Chip Package, an innovation integrating sensing chips, lenses, and filters for ultra-compact optical sensors. Full patent analysis.","keywords":["chip scale sensing package","optical sensor integration","miniaturized optics","sensing chip design","wafer-level optics","integrated lens filter","compact sensors","US-9853074 patent","optical packaging innovation","dam structure sensor","backside wiring sensing","smart device sensors","IoT optical sensor","wearable tech optics"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853074","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853074","citation_suggestion":"Patentable. \"Chip scale sensing chip package\" (US-9853074). https://patentable.app/patents/US-9853074","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853074","json":"https://patentable.app/api/llm-context/US-9853074","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:35:04.591Z"}