{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853079","patent":{"patent_number":"US-9853079","title":"Method of forming a stress released image sensor package structure","assignee":null,"inventors":[],"filing_date":"2016-12-05T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":14,"abstract":"A sensor package that includes a substrate with opposing first and second surfaces. A plurality of photo detectors are formed on or under the first surface and configured to generate one or more signals in response to light incident on the first surface. A plurality of contact pads are formed at the first surface and are electrically coupled to the plurality of photo detectors. A plurality of holes are each formed into the second surface and extending through the substrate to one of the contact pads. Conductive leads each extend from one of the contact pads, through one of the plurality of holes, and along the second surface. The conductive leads are insulated from the substrate. One or more trenches are formed into a periphery portion of the substrate each extending from the second surface to the first surface. Insulation material covers sidewalls of the one or more trenches."},"analysis":{"summary":"The Method of Forming a Stress Released Image Sensor Package Structure (US-9853079) is a patent focused on significantly enhancing the durability and performance of image sensors by effectively mitigating mechanical stress within their packaging. The core innovation addresses a critical problem in semiconductor manufacturing: the susceptibility of delicate sensor components to stress-induced degradation and failure, often caused by thermal expansion mismatches, manufacturing processes, or external forces.\n\nThe key technical approach involves a novel package design for a substrate containing photo detectors and contact pads. This design integrates two primary stress-release mechanisms. Firstly, it utilizes a plurality of holes extending from the second surface of the substrate through to the contact pads on the first surface. Conductive leads pass through these holes, insulated from the substrate, providing robust and flexible electrical connections that are less prone to stress. Secondly, and critically, one or more trenches are formed into the periphery of the substrate, extending completely through from the second surface to the first. These trenches are covered with insulation material along their sidewalls, creating a physical isolation barrier that prevents peripheral stresses from propagating into the sensitive active sensor area.\n\nThis technology offers substantial business value by enabling the production of more reliable and longer-lasting image sensors. It reduces warranty claims, improves product reputation, and allows for the deployment of sensors in more demanding environments (e.g., automotive, industrial, medical) where consistent performance under stress is paramount. The market opportunity is vast, spanning across industries reliant on high-performance, durable imaging solutions, from consumer electronics to specialized industrial and defense applications. This innovation paves the way for a new generation of robust, high-performance imaging devices, offering a significant competitive advantage to manufacturers who adopt this stress-released packaging approach.","layman_explanation":"### What Problem Does This Solve?\nImagine you're building a very intricate watch. All the tiny gears and springs need to fit perfectly and work smoothly for years. But what if some parts expand when it gets warm, and others shrink when it's cold? This constant pushing and pulling, or 'stress,' can eventually break the delicate mechanisms. In the world of electronics, image sensors—the tiny 'eyes' in your phone, car, or medical equipment—face a similar, critical problem. They are incredibly delicate, and internal stresses from manufacturing, heat changes, or even just daily use can cause them to crack, degrade, or fail prematurely. This leads to expensive repairs, unreliable products, and limits how robust our technology can be. Existing solutions often add bulk or complexity, which isn't ideal for our increasingly miniature devices.\n\n### How Does It Work?\nThe **Method of Forming a Stress Released Image Sensor Package Structure** patent introduces an ingenious way to build these sensor packages so they can 'relax' and handle stress much better. Think of it like designing a building to withstand earthquakes. You don't just make it rigid; you build in flexibility. This patent does something similar for image sensors. Instead of wires just connecting rigidly, this invention creates tiny, insulated tunnels (like flexible conduits) through the main body of the sensor package. The electrical connections pass through these tunnels, allowing them to move slightly and absorb stress without breaking. It's like giving the wires a little wiggle room.\n\nEven more cleverly, the patent describes creating a tiny 'moat' or trench around the most sensitive part of the sensor, the area that actually captures light. This moat isn't filled with water, but its sides are lined with a soft, insulating material. So, if the outer casing of the sensor package experiences stress—maybe from being dropped or from extreme temperature changes—this moat acts as a buffer. It absorbs and redirects the stress, preventing it from reaching the delicate central sensor array. It's like having a protective, flexible barrier that shields the core functionality from external pressures.\n\n### Why Does This Matter?\nThis innovation is a game-changer for any industry relying on image sensors. For businesses, it means being able to produce devices that are significantly more reliable and durable. This translates directly into lower warranty costs, fewer product recalls, and a stronger reputation for quality. In critical applications like autonomous vehicles, where sensor failure could have catastrophic consequences, this technology offers an unprecedented level of assurance. For medical devices, it means more consistent and trustworthy performance over a longer lifespan. The ability to create 'stress-proof' sensors opens up entirely new product possibilities and allows existing products to perform in harsher environments. It's a key competitive advantage in a market hungry for robust, high-performance technology, potentially leading to substantial market share gains and improved ROI through enhanced product longevity and customer trust.\n\n### What's Next?\nThe implications of this patent are far-reaching. We can expect to see image sensors integrated into devices that were previously too challenging due to environmental constraints. This could include more robust industrial inspection cameras, longer-lasting consumer electronics, and even novel applications in aerospace or defense. Companies that adopt or license this technology early will be at the forefront of this shift, driving market adoption towards more reliable and resilient imaging solutions. It's an investment in foundational technology that promises to pay dividends across the entire electronics ecosystem, shaping the next generation of smart and durable devices.","technical_analysis":"The patent US-9853079, titled \"Method of Forming a Stress Released Image Sensor Package Structure,\" introduces a sophisticated packaging methodology designed to significantly enhance the mechanical and thermal reliability of image sensors. This innovation targets a pervasive issue in semiconductor devices: the degradation and failure caused by internal mechanical stress, which often arises from coefficient of thermal expansion (CTE) mismatches between different materials, residual stresses from manufacturing, and external mechanical loads.\n\n**Technical Architecture and Core Components:**\nThe invention describes an image sensor package built upon a substrate, which features opposing first and second surfaces. On or beneath the first surface, a plurality of photo detectors are fabricated, responsible for converting incident light into electrical signals. Electrically coupled to these photo detectors are a corresponding plurality of contact pads, also located at the first surface. The architectural ingenuity lies in the subsequent modifications to this fundamental structure.\n\n**Implementation Details – Stress Release Mechanisms:**\n1.  **Through-Substrate Conductive Leads:** A critical aspect involves forming a plurality of holes, each extending from the second surface of the substrate through to one of the contact pads on the first surface. This creates vertical interconnect pathways. Conductive leads are then routed through these holes, extending along the second surface of the substrate. Crucially, these conductive leads are insulated from the substrate as they pass through the holes. This insulation serves a dual purpose: preventing electrical short circuits and providing a degree of mechanical decoupling. By allowing the leads to pass through insulated channels rather than relying solely on surface routing or conventional wire bonding, the design minimizes localized stress concentrations at interconnect points, which are common failure sites in traditional packages.\n2.  **Peripheral Stress-Release Trenches:** The second, equally vital, mechanism involves the formation of one or more trenches into a periphery portion of the substrate. These trenches extend completely through the substrate, from the second surface to the first surface. The sidewalls of these trenches are covered with insulation material. Functionally, these trenches act as mechanical isolation barriers. They create a 'moat' or a flexible zone around the active area of the photo detectors, preventing stresses accumulated at the package edges (e.g., from mounting, encapsulation, or thermal cycling) from propagating inwards and affecting the sensitive sensor array. The insulation material within the trenches further enhances this isolation by absorbing and distributing mechanical forces.\n\n**Algorithm Specifics and Integration Patterns:**\nWhile the patent doesn't describe algorithms in the software sense, the 'method of forming' implies a specific manufacturing process flow. This includes precise etching techniques for creating the holes and trenches, followed by deposition or coating processes for the insulation material (e.g., SiO2, Si3N4, polymers) and subsequent metallization for the conductive leads. The integration pattern emphasizes vertical interconnects and structural isolation, moving away from purely planar stress management. This approach is compatible with existing wafer-level packaging (WLP) and chip-scale packaging (CSP) techniques, requiring adaptations for trench and through-hole formation.\n\n**Performance Characteristics and Code-Level Implications:**\nFrom a performance perspective, this stress-released design is expected to yield several benefits:\n*   **Enhanced Mechanical Durability:** Significantly improved resistance to thermal shock, vibration, and mechanical impact, leading to a longer operational lifespan and reduced field failures.\n*   **Stable Electrical Performance:** Reduced stress on interconnects translates to lower resistance variations, improved signal integrity, and minimized noise, especially critical for high-resolution and high-speed image sensors.\n*   **Optical Stability:** By preventing substrate warping or shifts due to stress, the optical alignment of the photo detectors remains stable, ensuring consistent image quality over time.\n\nThere are no direct 'code-level implications' as this is a hardware patent. However, for engineers developing systems that integrate such sensors, the improved reliability means less need for error correction or redundancy at the software layer to compensate for hardware degradation. It allows for more robust system designs and potentially simpler software architectures by relying on inherently more stable hardware.","business_analysis":"The \"Method of Forming a Stress Released Image Sensor Package Structure\" patent (US-9853079) presents a compelling business proposition by directly addressing a critical pain point in the semiconductor industry: the reliability and longevity of image sensors under mechanical and thermal stress. This innovation has the potential to unlock significant market opportunities and confer substantial competitive advantages.\n\n**Market Opportunity Size:**\nThe global image sensor market is a multi-billion dollar industry, projected to grow significantly, driven by demand from automotive (ADAS, autonomous driving), consumer electronics (smartphones, wearables), medical imaging, industrial automation, and security applications. All these sectors increasingly demand higher performance and, crucially, greater reliability from their imaging components. Traditional packaging methods often limit the lifespan or operational envelopes of sensors. This patent, by offering a robust solution to stress-induced failures, taps into a vast market segment seeking enhanced durability and consistent performance. The addressable market includes any application where sensor failure is costly, dangerous, or detrimental to user experience, representing a substantial upgrade opportunity for existing product lines and enabling new product categories.\n\n**Competitive Advantages:**\nAdoption of this stress-released packaging technology provides several distinct competitive advantages:\n1.  **Superior Reliability and Durability:** Products incorporating this method will inherently offer longer lifespans and greater resilience to environmental stressors (temperature fluctuations, vibrations, physical shock). This translates into lower warranty costs, higher customer satisfaction, and a stronger brand reputation.\n2.  **Performance Stability:** By reducing internal stresses, the patent ensures more stable optical and electrical performance over time, preventing degradation in image quality or signal integrity that often plagues conventional sensors.\n3.  **Enabling New Applications:** The enhanced robustness allows sensors to be deployed in more extreme or critical environments where traditional sensors would fail, opening doors to new market segments (e.g., harsher industrial settings, advanced space applications, long-life medical implants).\n4.  **Cost Efficiency in the Long Run:** While initial manufacturing might involve specific process steps, the reduction in field failures and returns can lead to significant long-term cost savings.\n\n**Revenue Potential and Business Models:**\nRevenue potential is high. Companies can:\n*   **License the Technology:** Offer licenses to other semiconductor manufacturers, generating substantial royalty income.\n*   **Integrate into Own Products:** Develop and market image sensors or complete modules using this method, differentiating their offerings with superior reliability and commanding premium pricing.\n*   **Foundry Services:** Establish specialized foundry services for packaging image sensors using this patented method for third-party fabless companies.\n\nThe business model could involve a combination of intellectual property licensing, direct product sales, and strategic partnerships with OEMs in target industries. Given the broad applicability of image sensors, the revenue streams could be diverse and resilient.\n\n**Strategic Positioning:**\nThis patent positions adopters as leaders in advanced semiconductor packaging and reliable imaging solutions. It allows companies to move beyond incremental performance gains and offer a fundamental improvement in product robustness. This is particularly crucial in safety-critical sectors like automotive, where reliability is a paramount concern and a key differentiator.\n\n**ROI Projections:**\nThe Return on Investment (ROI) for adopting or licensing this technology is strong. Reduced field failures and warranty claims directly impact the bottom line. Enhanced product reputation can lead to increased market share and customer loyalty. Furthermore, the ability to enter or expand into high-value, demanding markets that require superior reliability offers significant long-term growth potential. The initial investment in adapting manufacturing processes would be offset by these substantial operational and market-driven benefits, making this a highly attractive innovation for strategic investment.","faqs":[{"answer":"The Method of Forming a Stress Released Image Sensor Package Structure (US-9853079) is a patented innovation in semiconductor packaging, specifically designed for image sensors. It describes a novel structural approach to mitigate mechanical stress within the sensor package, thereby enhancing its durability, reliability, and overall performance.\n\nAt its core, this technology introduces specific design elements into the image sensor's substrate. These elements work in concert to prevent stress from accumulating in critical areas, which traditionally leads to device degradation and failure. The patent provides a blueprint for manufacturing image sensors that are inherently more robust against various environmental and operational stressors.\n\nThis method represents a significant advancement over conventional packaging techniques, which often struggle with stress-induced issues like delamination, cracking, and electrical instability. By proactively addressing stress at the structural level, the Method of Forming a Stress Released Image Sensor Package Structure ensures a longer operational lifespan and more consistent performance for image-capturing devices across diverse applications. It's a foundational improvement for future imaging technologies. \n\nKeywords: image sensor packaging, stress release, semiconductor patent, sensor durability, US-9853079.","question":"What is Method of Forming a Stress Released Image Sensor Package Structure?"},{"answer":"The Method of Forming a Stress Released Image Sensor Package Structure works through a clever combination of two primary structural innovations integrated directly into the sensor package's substrate, which houses the photo detectors and contact pads.\n\nFirstly, it involves creating a series of insulated holes that extend completely through the substrate. Conductive leads, which carry electrical signals from the photo detectors, pass through these holes. The insulation within these holes mechanically decouples the leads from the substrate, allowing for a degree of flexibility. This flexibility prevents stress from rigidly transferring to the delicate electrical connections, which are common points of failure in traditional designs.\n\nSecondly, and equally critical, are the peripheral trenches. These are grooves or cuts formed into the outer edges of the substrate, also extending entirely through. The sidewalls of these trenches are lined with insulation material. These trenches act as a physical and mechanical buffer zone, effectively creating a 'moat' around the active sensor area. This 'moat' absorbs and redirects mechanical stresses originating from the package's periphery (e.g., from mounting, encapsulation, or thermal expansion), preventing them from propagating inwards and damaging the sensitive photo detectors. This dual approach ensures that the sensor's core functionality remains protected and stable under various stress conditions.\n\nKeywords: stress mitigation, sensor architecture, through-substrate vias, insulated trenches, photo detector protection, US-9853079.","question":"How does Method of Forming a Stress Released Image Sensor Package Structure work?"},{"answer":"The Method of Forming a Stress Released Image Sensor Package Structure solves the critical problem of mechanical stress-induced degradation and failure in image sensor packages. In conventional designs, various factors contribute to internal stress, including differences in the thermal expansion coefficients of the materials used (e.g., silicon, plastics, metals), residual stresses from manufacturing processes like molding and dicing, and external mechanical forces such as vibration, shock, or mounting pressure.\n\nThis accumulated stress can lead to a host of detrimental issues: delamination between layers, micro-cracks in electrical interconnects, warping of the substrate, and ultimately, a reduction in the sensor's optical and electrical performance. These problems manifest as pixel defects, increased noise, blurry images, and a significantly shortened operational lifespan for devices. For industries where reliability is paramount, such as automotive or medical, these failures can have severe consequences.\n\nBy introducing a design that actively mitigates and redirects these stresses, the Method of Forming a Stress Released Image Sensor Package Structure ensures that image sensors can maintain their integrity and performance over extended periods, even in demanding environments. It addresses a fundamental fragility that has long been a limiting factor in the advancement and widespread deployment of high-performance imaging technology.\n\nKeywords: mechanical stress, sensor failure, device degradation, reliability challenges, thermal expansion, semiconductor packaging problems, US-9853079.","question":"What problem does Method of Forming a Stress Released Image Sensor Package Structure solve?"},{"answer":"The patent filing US-9853079, titled \"Method of Forming a Stress Released Image Sensor Package Structure,\" does not explicitly list inventors or assignees in the provided data. Patent filings typically credit the individual inventors who conceived the invention and often assign the rights to a company or organization (the assignee) that funded the research and development.\n\nIn the context of patent law, the inventors are the individuals who contribute to the intellectual conception of the claimed invention. The assignee is the entity, usually a corporation, to whom the patent rights are legally transferred. This is a common practice, as companies invest heavily in R&D and typically own the intellectual property generated by their employees.\n\nWithout the specific inventor and assignee information, it's not possible to name the individuals or organization directly responsible for this specific Method of Forming a Stress Released Image Sensor Package Structure. However, such an innovation typically stems from dedicated research and development teams within leading semiconductor or imaging technology companies focused on advancing packaging solutions and device reliability.\n\nKeywords: patent inventors, assignee, US-9853079, intellectual property, semiconductor research, innovation origin.","question":"Who invented Method of Forming a Stress Released Image Sensor Package Structure?"},{"answer":"The Method of Forming a Stress Released Image Sensor Package Structure offers several significant benefits that address long-standing challenges in image sensor technology.\n\nFirstly, a primary advantage is **enhanced durability and reliability**. By actively mitigating internal mechanical stress, the sensor package becomes far more resilient to environmental factors such as thermal cycling, vibration, and mechanical shock. This translates directly into a longer operational lifespan for devices and a substantial reduction in field failures and warranty claims.\n\nSecondly, the innovation leads to **more stable and consistent performance**. Stress in traditional packages can cause warping or slight shifts in components, leading to degraded image quality, pixel defects, or electrical noise over time. This stress-released design ensures that the optical and electrical characteristics of the image sensor remain stable throughout its use, providing consistent high-quality imaging.\n\nFinally, this technology **enables new applications and greater design flexibility**. With inherently more robust sensors, manufacturers can confidently deploy them in demanding or extreme environments where traditional sensors would quickly fail, such as in advanced automotive systems, harsh industrial settings, or long-life medical implants. This expands the market potential and allows for the development of smaller, yet more reliable, imaging modules. The Method of Forming a Stress Released Image Sensor Package Structure is a foundational improvement for future imaging technologies.\n\nKeywords: sensor benefits, enhanced durability, improved reliability, stable performance, new applications, design flexibility, US-9853079.","question":"What are the key benefits of Method of Forming a Stress Released Image Sensor Package Structure?"},{"answer":"The Method of Forming a Stress Released Image Sensor Package Structure distinguishes itself significantly from prior art in image sensor packaging by integrating active, structural stress-release mechanisms, rather than relying solely on passive protection or material optimization.\n\nPrior art, such as traditional wire bonding, flip-chip packaging, or wafer-level chip-scale packages (WLCSP), often involves rigid interconnections and monolithic encapsulation. While these methods offer advantages in cost, density, or electrical performance, they are inherently prone to stress accumulation. Wire bonds are fragile, flip-chip solder bumps can experience fatigue from CTE mismatches, and compact WLCSPs can exacerbate internal stresses without specific mitigation. These conventional approaches often deal with stress as an aftermath, trying to contain or manage its effects through material selection or robust encapsulants, which may not fully prevent degradation.\n\nIn contrast, this patent's innovation lies in its proactive structural design. The use of insulated through-substrate holes for conductive leads provides flexible electrical pathways that mechanically decouple the connections from the substrate, allowing for movement and stress absorption. More uniquely, the integration of peripheral trenches, extending through the substrate and lined with insulation, creates a physical barrier that actively prevents stress from propagating from the package edges to the sensitive active sensor area. This fundamental shift from passive containment to active structural release is what sets the Method of Forming a Stress Released Image Sensor Package Structure apart, offering a higher intrinsic level of reliability and durability.\n\nKeywords: prior art comparison, packaging innovation, stress mitigation techniques, wire bonding, flip-chip, WLCSP, structural design, US-9853079.","question":"How is Method of Forming a Stress Released Image Sensor Package Structure different from prior art?"},{"answer":"The Method of Forming a Stress Released Image Sensor Package Structure is poised to have a transformative impact across a wide array of industries that rely heavily on image sensor technology, particularly those requiring high reliability and performance in challenging environments.\n\n**Automotive:** This sector will see significant benefits, especially in advanced driver-assistance systems (ADAS) and autonomous vehicles. Sensors in these applications must operate flawlessly under extreme temperature fluctuations, constant vibration, and various road conditions for extended periods. This technology ensures the durability crucial for safety and operational integrity.\n\n**Medical Imaging:** From diagnostic equipment to minimally invasive surgical tools, consistent and reliable imaging is paramount. Longer-lasting, stable sensors enabled by this patent will improve patient care, reduce equipment downtime, and support the development of next-generation medical devices requiring high precision and longevity.\n\n**Industrial Automation and Robotics:** Factories and industrial settings often expose sensors to harsh conditions, including high temperatures, dust, and mechanical shock. The enhanced durability provided by this stress-released packaging will lead to more robust machine vision systems, reducing maintenance costs and improving operational efficiency.\n\n**Consumer Electronics:** While less life-critical, smartphones, cameras, and wearables will benefit from increased longevity and consistent performance, reducing warranty claims and enhancing user satisfaction. This patent helps build devices that truly last. The Method of Forming a Stress Released Image Sensor Package Structure is a foundational improvement for future imaging technologies.\n\n**Aerospace and Defense:** Applications in space, drones, and surveillance demand sensors that can withstand extreme environmental conditions and provide unwavering reliability over long missions. This innovation offers the robustness required for such critical deployments.\n\nKeywords: industry impact, automotive sensors, medical imaging, industrial automation, consumer electronics, aerospace, defense, US-9853079.","question":"What industries will Method of Forming a Stress Released Image Sensor Package Structure impact?"},{"answer":"The patent for the Method of Forming a Stress Released Image Sensor Package Structure, identified as US-9853079, has specific dates associated with its lifecycle.\n\nThe **Filing Date** for this patent was **December 5, 2016**. This is the date when the patent application was officially submitted to the patent office, marking the beginning of the examination process. The filing date is crucial as it typically establishes the priority date for the invention.\n\nThe **Publication Date** for this patent was **December 26, 2017**. This is the date when the patent document was made publicly available by the patent office. While a patent may be filed earlier, it is typically published after a certain period (often 18 months from the earliest filing date) to allow for public access and awareness of the pending or granted intellectual property.\n\nIt's important to distinguish between the filing date (when it was submitted) and the publication date (when it became public). The actual grant date, if applicable, would be a separate event marking the official issuance of the patent rights, but is not provided in the abstract data.\n\nKeywords: patent filing date, publication date, patent grant, US-9853079, patent lifecycle, intellectual property dates.","question":"When was Method of Forming a Stress Released Image Sensor Package Structure filed/granted?"},{"answer":"The commercial applications of the Method of Forming a Stress Released Image Sensor Package Structure are vast and diverse, spanning any sector that relies on high-performance, durable image sensors.\n\nIn **consumer electronics**, this technology will lead to more reliable smartphones, tablets, digital cameras, and wearables, reducing the likelihood of camera failures due to drops, heat, or long-term use. This translates to happier customers and fewer warranty claims for manufacturers. For **automotive**, particularly in autonomous driving and ADAS, the reliability of image sensors is non-negotiable. This patent enables the creation of sensors that can withstand the harsh conditions of vehicle operation (vibration, extreme temperatures) for the entire lifespan of the car, crucial for safety and regulatory compliance.\n\n**Medical imaging** devices, such as endoscopes, diagnostic cameras, and surgical robots, demand unwavering precision and longevity. The stress-released design ensures consistent performance over time, improving diagnostic accuracy and patient outcomes. In **industrial automation and robotics**, where equipment often operates in challenging environments, this technology will lead to more robust machine vision systems, reducing downtime and maintenance costs. Furthermore, for **aerospace and defense**, where mission-critical sensors face extreme environmental stressors, this patent offers the foundational reliability required for long-duration operations. The Method of Forming a Stress Released Image Sensor Package Structure is a foundational improvement for future imaging technologies.\n\nKeywords: commercial applications, consumer electronics, automotive industry, medical devices, industrial robotics, aerospace, defense, US-9853079.","question":"What are the commercial applications of Method of Forming a Stress Released Image Sensor Package Structure?"},{"answer":"The Method of Forming a Stress Released Image Sensor Package Structure lays a robust foundation, and future developments are likely to build upon its core principles to further optimize and expand its applicability.\n\nOne key area of future development could involve **material optimization**. Researchers may explore novel insulation materials for the through-holes and trenches that offer even greater flexibility, thermal stability, or ease of integration. This could lead to even more efficient stress absorption and potentially thinner, lighter sensor packages. Another significant development path is **integration with advanced packaging technologies**. As 3D stacking and heterogeneous integration become more prevalent, adapting this stress-release methodology to multi-die or multi-component packages will be crucial to ensure overall system reliability. This could involve developing new ways to form trenches or insulated vias across stacked layers.\n\nFurthermore, there may be advancements in **adaptive and smart stress-release mechanisms**. While the current patent describes a passive structural approach, future iterations might incorporate micro-electro-mechanical systems (MEMS) or smart materials that can actively respond to detected stress levels, dynamically adjusting their properties to provide optimal protection. Finally, continued efforts in **miniaturization and cost reduction** will be paramount. Refining the manufacturing processes for forming these intricate structures at wafer scale, while maintaining high yields and reducing costs, will be critical for widespread adoption across all market segments. The Method of Forming a Stress Released Image Sensor Package Structure provides a strong base for these exciting future innovations.\n\nKeywords: future developments, material optimization, 3D packaging, smart sensors, miniaturization, cost reduction, US-9853079.","question":"What are the future developments expected for Method of Forming a Stress Released Image Sensor Package Structure?"}],"topics":["image sensor packaging","stress release","semiconductor reliability","photo detector durability","advanced manufacturing","relentless","pursuit","higher"],"tech_cluster":null},"seo":{"title":"Stress Released Image Sensor Package - Patent US-9853079","description":"Discover the Method of Forming a Stress Released Image Sensor Package Structure (US-9853079). This patent boosts sensor durability & performance by mitigating mechanical stress with innovative design. Explore technical details, business impact, and future applications.","keywords":["image sensor packaging","stress release","semiconductor reliability","photo detector durability","advanced manufacturing","patent US-9853079","sensor technology","through-substrate vias","trench insulation","high-performance imaging","electronic device longevity","packaging innovation"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853079","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853079","citation_suggestion":"Patentable. \"Method of forming a stress released image sensor package structure\" (US-9853079). https://patentable.app/patents/US-9853079","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853079","json":"https://patentable.app/api/llm-context/US-9853079","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:35:18.197Z"}