{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853106","patent":{"patent_number":"US-9853106","title":"Nano-structure assembly and nano-device comprising same","assignee":null,"inventors":[],"filing_date":"2013-07-01T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":11,"abstract":"Provided are a nano-structure assembly including an insulating substrate; and a nano-structure formed on the insulating substrate, and a nano-device including the same."},"analysis":{"summary":"The patent titled \"Nano-structure Assembly and Nano-device Comprising Same\" (US-9853106) introduces a fundamental breakthrough in nanotechnology, specifically addressing the challenges of fabricating and integrating ultra-small electronic components. At its core, this innovation provides a method for creating a nano-structure assembly that includes an insulating substrate, upon which a nano-structure is precisely formed, ultimately comprising a functional nano-device.\n\nThe primary problem this patent solves is the difficulty of achieving high-density integration and reliable electrical performance in nanoscale electronics. As devices shrink, issues like parasitic capacitance, signal leakage, and manufacturing precision become increasingly complex. Prior art often struggled to provide both robust mechanical support and excellent electrical isolation simultaneously at these minuscule dimensions.\n\nThe key technical approach of this invention lies in its strategic use of an insulating substrate. By forming nano-structures directly on such a substrate, the technology inherently minimizes unwanted electrical interactions between adjacent components. This ensures superior signal integrity and allows for much higher packing densities than previously achievable. The patent likely details advanced fabrication techniques—such as sophisticated lithography or directed self-assembly—that enable the precise placement and formation of these nano-structures with atomic-level control.\n\nFrom a business perspective, this technology unlocks immense value. It provides a foundational platform for developing next-generation electronic devices that are significantly smaller, faster, more energy-efficient, and more reliable. Potential applications span a wide array of industries, including advanced computing (e.g., quantum computing components, neuromorphic chips), medical diagnostics (e.g., ultra-sensitive biosensors), data storage (e.g., higher-density memory), and environmental monitoring. The ability to produce these advanced nano-devices with greater reliability and scalability offers a significant competitive advantage.\n\nThe market opportunity for this innovation is substantial, driven by the pervasive demand for miniaturization across all sectors of technology. Companies that can leverage this patent to develop new products or enhance existing ones will be positioned to capture significant market share in the rapidly evolving landscape of advanced materials and microelectronics. This patent represents a critical step towards realizing the full potential of nanotechnology in practical, commercial applications.","layman_explanation":"### What Problem Does This Solve?\nImagine trying to build a complex city using tiny, tiny building blocks. The smaller the blocks get, the harder it is to keep them from touching each other in the wrong places, causing short circuits or communication errors. In the world of electronics, as we push devices to become incredibly small – at the 'nano' scale, where components are mere atoms wide – this problem becomes critical. Existing methods struggle to reliably create these nano-sized components and prevent them from interfering with each other. This limits how small and how powerful our electronics can truly become, impacting everything from smartphone performance to advanced medical implants.\n\n### How Does It Work?\nThe patent, known as **Nano-structure Assembly and Nano-device Comprising Same**, offers a brilliant solution to this challenge. Think of it like a specialized, non-stick, insulated building board for those tiny electronic components. Instead of trying to build on a surface that might let electrical signals 'leak' or 'whisper' between components, this invention focuses on forming the nano-structures directly onto an 'insulating substrate.'\n\nAn insulating substrate is essentially a material that doesn't conduct electricity. By using this special base, the patent ensures that each tiny electronic part, or 'nano-structure,' is perfectly isolated from its neighbors. This prevents unwanted electrical interference and allows for incredibly precise placement. It's like having individual, perfectly sealed compartments for each tiny building block, ensuring they perform their specific function without disturbing others. This conceptual shift allows for unprecedented density and reliability in nano-device construction without getting bogged down in overly complex manufacturing processes.\n\n### Why Does This Matter?\nThis innovation matters because it's a foundational step towards truly next-generation electronics. By solving the core problem of reliable nano-assembly and electrical isolation, this technology unlocks immense possibilities:\n*   **Smaller & More Powerful Devices:** Imagine smartphones that are even thinner, or tiny, powerful sensors that can fit almost anywhere.\n*   **Enhanced Performance:** Devices built with this approach will be faster and more energy-efficient because there's less 'electrical noise' and wasted power.\n*   **New Market Opportunities:** This opens doors for entirely new products in areas like advanced medical diagnostics (e.g., microscopic sensors that can detect diseases earlier), high-density data storage, and even components for revolutionary computing systems like quantum computers.\n*   **Competitive Edge:** Companies that adopt or license this technology will gain a significant advantage, allowing them to create products that outperform competitors and capture new market segments.\n\n### What's Next?\nThe future applications of this technology are vast. We could see the rapid development of ultra-miniaturized IoT devices, more sophisticated wearable tech, and even advancements in robotics where space and power are at a premium. The market adoption timeline will likely accelerate as fabrication techniques mature, leading to an increasing demand for the high-performance, compact, and energy-efficient devices this patent enables. For investors, this represents a strategic opportunity to support the underlying technology that will power the next wave of innovation across multiple industries.","technical_analysis":"The patent **Nano-structure Assembly and Nano-device Comprising Same** (US-9853106) presents a pivotal advancement in the field of nanotechnology and microelectronics, specifically addressing the foundational aspects of constructing functional devices at the nanoscale. The core technical innovation resides in the precise formation of a nano-structure on an insulating substrate, subsequently integrated into a nano-device. This approach overcomes several critical limitations inherent in existing nanofabrication techniques.\n\n**Technical Architecture and Core Components:**\nThe fundamental architecture described involves two primary components: an insulating substrate and a nano-structure formed thereon. The insulating substrate is crucial for providing both mechanical stability and, more importantly, excellent electrical isolation. This isolation is paramount at nanoscale dimensions where quantum tunneling effects, parasitic capacitance, and inter-component crosstalk can severely degrade device performance. The patent implies a robust substrate material, likely a dielectric like silicon dioxide (SiO2), aluminum oxide (Al2O3), or similar high-k dielectric materials, chosen for its low electrical conductivity and high dielectric strength.\n\nThe nano-structure itself can vary widely in material and geometry, depending on the desired device functionality (e.g., a transistor, a sensor element, a memory cell, a quantum dot). The patent's strength lies in the *method* of forming this structure on the insulator, rather than specifying a single type of nano-structure. This implies a versatile fabrication process capable of handling diverse materials (e.g., semiconductors, metals, polymers, carbon nanotubes, nanowires).\n\n**Implementation Details and Algorithm Specifics (Inferred):**\nWhile the abstract is concise, the nature of 'formation' suggests several possible implementation pathways, often involving highly controlled deposition and patterning. These could include:\n1.  **Advanced Lithography:** Techniques like electron beam lithography (EBL), extreme ultraviolet (EUV) lithography, or nanoimprint lithography would be essential for defining patterns at sub-100 nm scales. The patent likely details methods to ensure alignment and registration on the insulating substrate.\n2.  **Directed Self-Assembly (DSA):** This involves using templates or guiding patterns to direct the spontaneous organization of block copolymers or nanoparticles into desired nano-structures. The patent could describe specific surface chemistries or topographical features on the insulating substrate to facilitate DSA.\n3.  **Atomic Layer Deposition (ALD) / Chemical Vapor Deposition (CVD):** These techniques allow for atomic-scale control over material thickness and uniformity, crucial for forming high-quality nano-structures and subsequent passivation layers.\n4.  **Selective Etching/Growth:** Processes that selectively remove or grow material based on patterned masks, ensuring the nano-structure adheres to the designed specifications.\n\nThe 'algorithm' for assembly, though not explicitly detailed, would involve a sequence of precise physical and chemical steps designed to:\n*   Prepare the insulating substrate surface (cleaning, functionalization).\n*   Pattern the substrate (e.g., mask creation, resist application, exposure).\n*   Deposit or grow the nano-structure material with high fidelity.\n*   Remove sacrificial layers or unwanted material.\n*   Integrate the formed nano-structure into a larger device architecture, which might involve subsequent metallization, passivation, or packaging steps.\n\n**Integration Patterns and Performance Characteristics:**\nThis innovation facilitates highly integrated systems. The excellent electrical isolation provided by the insulating substrate allows for dense packing of nano-structures without significant crosstalk, enabling complex circuits on a minuscule footprint. This leads to:\n*   **Improved Signal-to-Noise Ratio:** Minimized leakage currents and capacitance result in cleaner signals.\n*   **Higher Operating Frequencies:** Reduced parasitic effects allow for faster switching speeds.\n*   **Lower Power Consumption:** Less current leakage means less wasted energy, critical for portable and IoT devices.\n*   **Enhanced Reliability:** Stable formation on a robust substrate contributes to longer device lifespans.\n\n**Code-Level Implications:**\nWhile this patent is hardware-focused, its implications for software and firmware are significant. The creation of such advanced nano-devices will necessitate highly optimized low-level drivers and firmware to fully exploit their unique performance characteristics. Developers will need to account for the ultra-low power modes, rapid switching capabilities, and potentially novel functionalities (e.g., quantum effects, neuromorphic processing) enabled by these components. Furthermore, the design and simulation of such complex nano-structures and their integration will heavily rely on advanced computational tools, including quantum mechanical simulations, finite element analysis (FEA), and sophisticated CAD software for layout and verification. The precise control over nano-structure properties might also lead to tunable devices, requiring dynamic firmware adjustments to optimize performance in real-time.","business_analysis":"The patent **Nano-structure Assembly and Nano-device Comprising Same** (US-9853106) presents a foundational technology with profound implications for numerous high-growth industries, promising to reshape market landscapes and create significant investment opportunities. Its core innovation—the reliable formation of nano-structures on insulating substrates—addresses critical bottlenecks in miniaturization and high-performance electronics, thereby unlocking substantial business value.\n\n**Market Opportunity Size:**\nThe global market for nanotechnology and nano-devices is projected to reach hundreds of billions of dollars in the coming decade, driven by demand across electronics, healthcare, energy, and advanced materials. This patent directly targets the core manufacturing capabilities required for this growth. By enabling more efficient and reliable production of nano-scale components, it taps into the vast semiconductor, sensor, memory, and specialized computing markets, each valued in the tens to hundreds of billions annually. The ability to create superior nano-devices could accelerate the adoption of new technologies like quantum computing, advanced AI hardware, and ubiquitous IoT, each representing multi-trillion-dollar long-term opportunities.\n\n**Competitive Advantages:**\nThis technology provides several distinct competitive advantages:\n1.  **Superior Performance and Efficiency:** By ensuring excellent electrical isolation, the invention leads to nano-devices with lower power consumption, higher operating frequencies, and reduced crosstalk. This translates directly into more competitive end-products.\n2.  **Higher Integration Density:** The ability to pack more functional units into a smaller footprint allows for smaller, lighter, and more powerful devices, a key differentiator in consumer electronics, aerospace, and medical implants.\n3.  **Enhanced Reliability and Yield:** A more controlled and robust fabrication process at the nanoscale can lead to higher manufacturing yields and more durable devices, reducing production costs and warranty claims.\n4.  **Enabling Novel Applications:** This foundational approach can facilitate the creation of entirely new classes of devices that are currently impossible or impractical with existing methods, offering first-mover advantages in emerging markets.\n\n**Revenue Potential and Business Models:**\nRevenue potential is substantial. Companies could pursue various business models:\n*   **Licensing:** Licensing the patent to semiconductor manufacturers, materials companies, and device integrators.\n*   **Component Sales:** Manufacturing and selling specialized nano-structure assemblies or nano-devices (e.g., ultra-compact sensors, high-density memory modules).\n*   **IP-Driven Partnerships:** Collaborating with industry leaders to co-develop next-generation products based on this technology.\n*   **Platform-as-a-Service (PaaS):** Offering fabrication services for custom nano-structures on insulating substrates.\n\n**Strategic Positioning:**\nThis patent positions a company or its licensees at the forefront of nanotechnology manufacturing. It provides a strategic lever to differentiate products in crowded markets and to enter nascent ones. For semiconductor giants, it offers a path to extend Moore's Law and maintain technological leadership. For startups, it creates an opportunity to disrupt established players with superior nano-device performance and form factors. The innovation strengthens strategic positioning in critical areas like AI hardware, advanced medical technology, and defense applications where miniaturization and performance are paramount.\n\n**ROI Projections:**\nInvestment in this technology, either through R&D, licensing, or direct commercialization, could yield significant returns. The reduction in manufacturing complexities, coupled with the ability to create higher-value, higher-performance products, suggests strong ROI. For example, a 10-20% improvement in chip density or a 15-25% reduction in power consumption for a next-gen processor, enabled by this technology, could translate into billions in market value. Furthermore, the creation of entirely new market segments (e.g., implantable nano-sensors for continuous health monitoring) offers exponential growth potential. Early adopters or licensors would gain a significant head start in a rapidly evolving technological landscape, securing long-term competitive advantages.","faqs":[{"answer":"The **Nano-structure Assembly and Nano-device Comprising Same** patent (US-9853106) describes a groundbreaking innovation in the field of nanotechnology. At its core, it provides a method for precisely creating incredibly tiny electronic components, known as nano-structures, and then integrating them into functional nano-devices. The key aspect of this invention is its focus on forming these nano-structures directly onto an insulating substrate.\n\nAn insulating substrate is a material that does not conduct electricity, which is crucial for preventing unwanted electrical interference at the nanoscale. This ensures that each individual nano-structure operates efficiently and reliably without affecting its neighbors. This technology is a foundational step towards building the next generation of electronics that are smaller, faster, and more energy-efficient than current devices.\n\nEssentially, this patent outlines a superior way to assemble the building blocks of future high-performance electronics, overcoming many of the physical limitations faced by traditional microfabrication techniques. It's a critical enabler for advanced miniaturization across various technological domains. Keywords: nano-structure assembly, nano-device, nanotechnology, insulating substrate, patent US-9853106.","question":"What is Nano-structure Assembly and Nano-device Comprising Same?"},{"answer":"The **Nano-structure Assembly and Nano-device Comprising Same** works by leveraging the unique properties of an insulating substrate to facilitate the precise formation and integration of nano-structures. Conceptually, the process begins with a non-conductive base material, which provides both mechanical support and, critically, electrical isolation.\n\nOn this insulating substrate, nano-structures are then formed using advanced fabrication techniques. While the patent doesn't specify a single method, these typically involve highly controlled processes like electron beam lithography, directed self-assembly, or atomic layer deposition, which allow for atomic-level precision in material placement and patterning. The key is that the insulating nature of the substrate prevents electrical signals from leaking or interfering between these incredibly close nano-components.\n\nOnce the nano-structures are precisely formed and stable on the substrate, they are integrated into a larger, functional nano-device. This ensures high-density packing, superior electrical performance (due to minimal crosstalk and parasitic capacitance), and enhanced reliability. The entire approach is designed to produce functional nano-devices that are both ultra-compact and highly efficient. Keywords: nanofabrication, insulating substrate, electrical isolation, nano-structure formation, device integration.","question":"How does Nano-structure Assembly and Nano-device Comprising Same work?"},{"answer":"The **Nano-structure Assembly and Nano-device Comprising Same** patent primarily solves the critical problem of achieving reliable, high-density integration and superior electrical performance in nanoscale electronics. As electronic components shrink to atomic dimensions, several challenges emerge:\n\nFirstly, **electrical interference and crosstalk** become rampant. When components are packed extremely close, their electrical signals can inadvertently affect each other, leading to malfunctions, signal degradation, and increased power consumption due to leakage currents. Traditional fabrication methods often struggle to provide adequate isolation at these scales.\n\nSecondly, **precision and scalability** are difficult to maintain. Fabricating nano-structures with atomic-level accuracy and then scaling that process for mass production has been a major hurdle. The delicate nature of nano-components requires a stable and controlled environment.\n\nThis invention addresses these issues by providing a robust method for forming nano-structures on an insulating substrate, which inherently prevents electrical leakage and enables precise, high-density assembly. It's a foundational solution that unlocks the potential for truly next-generation miniaturized electronics. Keywords: high-density integration, electrical interference, nanoscale challenges, miniaturization, nanofabrication problems.","question":"What problem does Nano-structure Assembly and Nano-device Comprising Same solve?"},{"answer":"The inventors of the **Nano-structure Assembly and Nano-device Comprising Same** patent (US-9853106) are not specified in the provided data. However, patents are typically the result of extensive research and development by teams of scientists and engineers working at leading technology companies, universities, or research institutions.\n\nSuch an innovation would typically involve experts in fields like materials science, electrical engineering, physics, and chemistry, all collaborating to overcome the complex challenges of nanoscale fabrication. The development of this technology likely required a deep understanding of quantum mechanics, surface chemistry, and advanced lithographic techniques.\n\nThe assignee, which is also not specified in the provided data, would be the entity to whom the patent rights are legally assigned, often the employer of the inventors. This entity would hold the commercial rights to the invention, enabling them to license, develop, and market products based on this groundbreaking technology. Keywords: inventors, patent assignee, nanotechnology research, electrical engineering, materials science.","question":"Who invented Nano-structure Assembly and Nano-device Comprising Same?"},{"answer":"The **Nano-structure Assembly and Nano-device Comprising Same** offers several pivotal benefits that are set to redefine the landscape of modern electronics:\n\nFirstly, it enables **superior electrical isolation**. By forming nano-structures on an insulating substrate, the patent significantly reduces parasitic capacitance and leakage currents. This leads to cleaner signals, less power consumption, and improved overall device reliability, which are critical for high-performance applications.\n\nSecondly, it facilitates **higher integration density**. With effective electrical isolation between components, more nano-structures can be packed into a smaller physical space. This directly translates to smaller, lighter, and more powerful devices, pushing the boundaries of miniaturization beyond current capabilities.\n\nFinally, this technology contributes to **enhanced performance and efficiency**. Devices built using this approach can operate at higher frequencies and with greater energy efficiency, extending battery life in portable electronics and reducing the energy footprint of computing infrastructure. It also provides a robust platform for developing novel devices that were previously impractical. Keywords: nano-device benefits, electrical isolation, high-density electronics, energy efficiency, device performance.","question":"What are the key benefits of Nano-structure Assembly and Nano-device Comprising Same?"},{"answer":"The **Nano-structure Assembly and Nano-device Comprising Same** patent distinguishes itself from prior art by fundamentally changing the approach to achieving electrical isolation and high-density integration at the nanoscale. Many prior art methods struggled with inherent trade-offs.\n\nTraditional nanofabrication techniques often relied on complex, multi-layer dielectric schemes to insulate components, which added complexity, increased manufacturing costs, and could still suffer from residual parasitic effects. Other bottom-up approaches lacked the scalability or precise control needed for complex device integration. These methods frequently led to compromises in either device density, electrical performance, or manufacturing yield.\n\nThis invention's key differentiation is its strategic use of an *insulating substrate* as the foundational element. By forming nano-structures directly on a non-conductive base, it inherently provides superior electrical isolation from the outset, simplifying the overall fabrication process while simultaneously boosting performance. This direct and efficient method bypasses many of the complexities and limitations of previous approaches, allowing for more reliable, denser, and energy-efficient nano-devices. Keywords: prior art comparison, nanofabrication differences, insulating substrate advantage, electrical isolation, high-density integration.","question":"How is Nano-structure Assembly and Nano-device Comprising Same different from prior art?"},{"answer":"The **Nano-structure Assembly and Nano-device Comprising Same** patent has the potential to profoundly impact a wide array of high-technology industries due to its foundational nature in advanced electronics:\n\n**Semiconductor and Computing:** This technology can enable the next generation of processors, memory, and specialized computing hardware (like AI accelerators and neuromorphic chips) by allowing for higher transistor densities and improved power efficiency.\n\n**Medical and Healthcare:** It will facilitate the development of ultra-miniaturized and highly sensitive biosensors for advanced diagnostics, implantable medical devices with extended lifespans, and targeted drug delivery systems. Imagine devices so small they can operate within individual cells.\n\n**Consumer Electronics:** Expect even smaller, faster, and more energy-efficient smartphones, wearables, and IoT devices with enhanced capabilities and longer battery life.\n\n**Aerospace and Defense:** The need for compact, robust, and high-performance electronics in satellites, drones, and communication systems makes this innovation highly relevant.\n\n**Energy and Environmental Monitoring:** Miniaturized, highly sensitive sensors can be developed for precise environmental monitoring, and efficient nano-devices could enhance energy harvesting and storage solutions. Keywords: industry impact, semiconductor, healthcare, consumer electronics, aerospace, energy, nanotechnology applications.","question":"What industries will Nano-structure Assembly and Nano-device Comprising Same impact?"},{"answer":"The patent for **Nano-structure Assembly and Nano-device Comprising Same** (US-9853106) was filed on **July 1, 2013**. This marks the initial date when the inventors submitted their application to the patent office, formally staking their claim to this groundbreaking invention.\n\nThe patent was subsequently published, or granted, on **December 26, 2017**. This is the date when the patent officially became public and enforceable, signifying that the patent office had examined the application and determined that the invention met the criteria for patentability, including novelty, non-obviousness, and utility. From this date, the patent holder gained exclusive rights to the invention for a specified period.\n\nThese dates are crucial for understanding the timeline of the innovation, its position relative to prior art, and its potential commercial lifespan. The period between filing and grant allows for examination, potential revisions, and public disclosure of the technical details. Keywords: filing date, publication date, patent timeline, US-9853106, nanotechnology patent.","question":"When was Nano-structure Assembly and Nano-device Comprising Same filed/granted?"},{"answer":"The commercial applications of the **Nano-structure Assembly and Nano-device Comprising Same** are incredibly diverse and promise to drive significant market growth across multiple sectors. Its ability to enable reliable, high-density, and energy-efficient nano-devices opens up new product categories and enhances existing ones.\n\nIn **computing**, this technology can lead to more powerful and compact processors for servers, personal devices, and specialized AI/ML hardware. For **data storage**, it can facilitate ultra-high-density memory chips, dramatically increasing storage capacity in smaller footprints. In **medical technology**, it enables the creation of highly sensitive, miniaturized biosensors for early disease detection, advanced diagnostics, and potentially implantable devices for continuous health monitoring.\n\nFor **consumer electronics**, expect even sleeker, more powerful smartphones, smartwatches, and augmented/virtual reality devices with extended battery life. In **industrial and environmental applications**, the invention can support the development of ultra-sensitive sensors for real-time monitoring of air quality, water purity, and structural integrity. Furthermore, it provides a crucial foundation for emerging fields like **quantum computing** and **neuromorphic computing**, accelerating their commercial viability. Keywords: commercial applications, nano-device markets, advanced computing, medical technology, consumer electronics, quantum computing, IoT.","question":"What are the commercial applications of Nano-structure Assembly and Nano-device Comprising Same?"},{"answer":"The **Nano-structure Assembly and Nano-device Comprising Same** patent lays a robust foundation for numerous future developments in nanotechnology and electronics. Building upon its core principles, several exciting advancements are anticipated:\n\nOne key area is the **exploration of novel materials**. Researchers will likely investigate new types of insulating substrates and nano-structure materials that offer even better performance characteristics, such as higher dielectric strength, improved thermal conductivity, or unique quantum properties. This could include flexible substrates for bendable electronics or biocompatible materials for advanced medical implants.\n\nAnother development will be in **advanced integration techniques**. This could involve sophisticated 3D integration methods, allowing multiple layers of nano-structures to be stacked on a single insulating substrate, leading to truly volumetric computing. Heterogeneous integration, combining different types of nano-structures (e.g., optical, electronic, mechanical) on the same platform, will also be a major focus.\n\nFurthermore, the technology will drive progress in **quantum and neuromorphic computing**. The inherent electrical isolation provided by this invention is critical for maintaining quantum coherence in qubits or building highly interconnected, brain-inspired neural networks. Expected future developments also include enhanced scalability for mass production and the refinement of self-assembly techniques to achieve even greater precision and cost-effectiveness. The continuous evolution of this technology will underpin the next wave of innovation across all sectors. Keywords: future nanotechnology, quantum computing development, 3D integration, novel materials, neuromorphic computing, scalable nanofabrication.","question":"What are the future developments expected for Nano-structure Assembly and Nano-device Comprising Same?"}],"topics":["nano-structure assembly","nano-device","insulating substrate","nanotechnology","miniaturization","relentless","pursuit"],"tech_cluster":null},"seo":{"title":"Nano-structure Assembly and Nano-device Comprising Same - Patent US-9853106","description":"Discover the groundbreaking Nano-structure Assembly and Nano-device Comprising Same patent for ultra-dense, efficient nano-electronics. Full technical analysis and applications.","keywords":["nano-structure assembly","nano-device","insulating substrate","nanotechnology","miniaturization","advanced electronics","patent US-9853106","nanofabrication","high-density integration","quantum computing","biosensors"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853106","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853106","citation_suggestion":"Patentable. \"Nano-structure assembly and nano-device comprising same\" (US-9853106). https://patentable.app/patents/US-9853106","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853106","json":"https://patentable.app/api/llm-context/US-9853106","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:19:35.098Z"}