{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853191","patent":{"patent_number":"US-9853191","title":"Light emitting device manufacturing method","assignee":null,"inventors":[],"filing_date":"2016-12-09T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":16,"abstract":"A light emitting device manufacturing method includes bonding an electrode of a light emitting element to a conductive member of a base. First wavelength conversion particles, second wavelength conversion particles and filling particles are electrodeposited on a surface of the light emitting element to form a wavelength conversion layer in which the filling particles are disposed among the first wavelength conversion particles and the second wavelength conversion particles. The first wavelength conversion particles contain aluminum. The second wavelength conversion particles have surfaces covered with covering material which contains aluminum. The filling particles contain aluminum. The filling particles have particle size smaller than particle sizes of both the first wavelength conversion particles and the second wavelength conversion particles. The filling particles have aspect ratio smaller than aspect ratios of both the first wavelength conversion particles and the second wavelength conversion particles."},"analysis":{"summary":"The **Light Emitting Device Manufacturing Method** patent (US-9853191) introduces a groundbreaking approach to fabricating light-emitting diodes (LEDs) with superior performance characteristics. At its core, this innovation addresses the critical challenge of creating a highly uniform and efficient wavelength conversion layer, which is essential for transforming the primary light output of an LED into desired colors, such as white light from a blue chip.\n\nThe central problem this patent solves is the inconsistency and inefficiency inherent in traditional wavelength conversion layer formation. Previous methods often result in uneven phosphor distribution, leading to diminished light extraction, color non-uniformity, and reduced overall device lifespan. This patent overcomes these limitations by employing a sophisticated electrodeposition technique.\n\nThe key technical approach involves bonding a light-emitting element's electrode to a conductive base, then precisely electrodepositing a unique composite layer. This layer comprises three distinct types of particles: first wavelength conversion particles, second wavelength conversion particles, and specialized 'filling particles.' A critical aspect is that all these particles either contain aluminum or are covered with aluminum-containing material. Crucially, the filling particles are designed to be significantly smaller in both particle size and aspect ratio than the other two particle types. This allows them to precisely fill the interstitial spaces among the larger particles, creating an exceptionally dense, uniform, and void-free wavelength conversion layer. This meticulous arrangement optimizes light scattering, re-emission, and thermal management.\n\nThe business value and applications of this innovation are substantial. Manufacturers can achieve higher luminous efficacy, improved color rendering index (CRI), and extended operational lifespan for their LED products. This translates directly into reduced manufacturing costs through higher yields and less material waste, while simultaneously enhancing product quality and market competitiveness. The precision of this method also opens doors for highly customized light spectrums and advanced applications requiring stringent optical performance.\n\nThis patent presents a significant market opportunity within the rapidly expanding solid-state lighting industry. As demand for energy-efficient, high-quality illumination continues to grow across consumer electronics, automotive, architectural, and general lighting sectors, technologies like this patent offer a distinct competitive advantage. It positions adopters to lead in developing next-generation LED products that are more efficient, reliable, and visually appealing, promising substantial returns on investment.","layman_explanation":"### What Problem Does the Light Emitting Device Manufacturing Method Solve?\n\nImagine you're trying to create a perfect white light from a small, blue light bulb. To do this, you need to coat the blue bulb with a special material that changes the blue light into other colors, which then mix to appear white. This coating is called a 'wavelength conversion layer.' The big challenge in the LED industry has always been applying this coating perfectly. If the coating is uneven, too thick in some places and too thin in others, the white light won't be consistent – it might look yellowish in one spot and bluish in another. This inconsistency leads to lower quality products, wasted energy because light isn't converted efficiently, and shorter lifespans for the LEDs. Businesses face higher manufacturing costs due to lower yields and a struggle to produce premium, reliable lighting solutions consistently.\n\n### How Does the Light Emitting Device Manufacturing Method Work?\n\nThe **Light Emitting Device Manufacturing Method** patent introduces a clever new way to apply this 'color-changing' coating, much like a highly precise robotic painter. Instead of just spraying or dripping the material, which can be messy, this technology uses an 'electrodeposition' process. Think of it like using magnets to perfectly arrange tiny, specialized 'sparkly dust' particles onto the LED chip. First, the core light-emitting part is attached to its base. Then, this patent describes submerging it in a liquid filled with three types of these 'sparkly dust' particles: two main types that do the color changing, and a third, super-tiny type called 'filling particles.' All these particles contain a common element, aluminum, which helps them work together. The key genius here is that the 'filling particles' are much smaller than the others. As the larger particles settle, these tiny filling particles snugly fit into every microscopic gap, like putting fine sand between larger pebbles to make a perfectly solid, smooth surface. This meticulous layering creates an incredibly dense and uniform coating, almost like a perfectly tiled floor, ensuring no light is wasted and the color is consistent.\n\n### Why Does the Light Emitting Device Manufacturing Method Matter?\n\nThis innovation matters significantly for several business reasons. Firstly, it leads to **superior product quality**. LEDs produced with this method will offer brighter, more uniform, and more accurate colors, making them ideal for high-end applications like premium televisions, advanced automotive lighting, and specialized medical equipment. Secondly, it promises **increased manufacturing efficiency and cost savings**. The precision of electrodeposition means less material waste and higher production yields, reducing the cost per unit. This allows companies to either offer more competitive pricing or enjoy higher profit margins. Thirdly, it provides a **strong competitive advantage**. Companies adopting this technology can differentiate their products in a crowded market, attracting customers who prioritize quality and reliability. Lastly, it **extends product lifespans**, reducing warranty claims and enhancing brand reputation. For investors, this translates into a more stable and profitable business model with a clear path to market leadership in advanced lighting solutions.\n\n### What's Next for the Light Emitting Device Manufacturing Method?\n\nThe future applications of this technology are vast and exciting. We can expect to see LEDs with even higher energy efficiency, leading to lower electricity consumption for everything from streetlights to smartphones. The precision it offers could enable new types of customizable lighting, allowing consumers and businesses to fine-tune light spectrums for specific moods, tasks, or even health benefits. In terms of market adoption, initial integration will likely occur in high-value, high-performance sectors, gradually expanding as the technology matures and becomes more cost-effective for mass-market applications. This patent positions its adopters to be at the forefront of the next wave of lighting innovation, making it a compelling area for strategic investment and partnership in the coming years.","technical_analysis":"The **Light Emitting Device Manufacturing Method** patent (US-9853191) outlines a highly innovative process for fabricating light-emitting diodes (LEDs) with enhanced wavelength conversion layers. This technical deep dive focuses on the architectural and material science aspects that contribute to its superior performance.\n\n**Technical Architecture and Process Flow:**\n1.  **Base Preparation and Bonding:** The method initiates with the fundamental step of bonding an electrode of a light-emitting element (e.g., an LED chip) to a conductive member of a base. This establishes the electrical connectivity and mechanical support for the LED package. The bonding process itself must ensure robust electrical contact and thermal dissipation pathways.\n2.  **Electrodeposition Bath Formulation:** A critical component is the preparation of an electrolyte solution containing the three distinct types of particles: first wavelength conversion particles, second wavelength conversion particles, and filling particles. The stability of the suspension, the charge characteristics of the particles, and the overall electrochemical environment are paramount for uniform deposition.\n3.  **Controlled Electrodeposition:** The core innovation lies in the electrodeposition process. When an electric field is applied, the suspended particles are driven to deposit onto the surface of the light-emitting element, which acts as a working electrode. Unlike conventional dispensing or spraying, electrodeposition allows for precise control over the thickness, uniformity, and density of the deposited layer. This method is inherently self-limiting under certain conditions, allowing for highly reproducible layer formation.\n\n**Material Science and Particle Specifics:**\n*   **First Wavelength Conversion Particles:** These particles are designed to contain aluminum. Aluminum-containing compounds (e.g., aluminates) are common hosts for phosphors due to their thermal stability, chemical inertness, and favorable optical properties. The specific composition would dictate the primary wavelength conversion characteristics (e.g., YAG:Ce for yellow emission).\n*   **Second Wavelength Conversion Particles:** These particles feature surfaces covered with a covering material that also contains aluminum. This surface modification is a sophisticated engineering detail. The covering material could serve multiple purposes: a) enhance dispersibility in the electrodeposition bath, preventing agglomeration; b) modify surface charge for controlled deposition kinetics; c) provide a protective barrier against moisture or other environmental factors; d) act as a secondary wavelength converter or a reflector to optimize light path within the layer. The aluminum content suggests compatibility and potentially enhanced adhesion with the other particle types.\n*   **Filling Particles:** These are crucial for the patent's efficacy. They also contain aluminum, ensuring chemical compatibility. Their defining characteristics are significantly smaller particle size and aspect ratio compared to both the first and second wavelength conversion particles. This size differential is key to their function: they are designed to precisely occupy the interstitial voids created between the larger, primary wavelength conversion particles during deposition. This 'filler' role transforms a potentially porous or irregular layer into a dense, homogeneous one.\n\n**Implementation Details and Performance Characteristics:**\n*   **Optimized Packing Density:** The strategic inclusion of smaller filling particles ensures maximum packing density of the wavelength conversion layer. This minimizes voids, which can act as light scattering centers or points of failure, leading to improved light extraction efficiency.\n*   **Enhanced Optical Uniformity:** By filling the gaps, the filling particles create a more optically homogeneous layer. This reduces color shifts across the emission area and improves the color rendering index (CRI) and correlated color temperature (CCT) consistency.\n*   **Improved Thermal Dissipation:** A denser layer often exhibits better thermal conductivity. This is critical for LEDs, as excessive heat can degrade phosphor performance and shorten the lifespan of the entire device. The compact structure facilitates more efficient heat transfer away from the active phosphor material.\n*   **Process Scalability:** Electrodeposition is a highly scalable manufacturing technique, adaptable to both small-batch and high-volume production, making this method commercially viable for various LED applications.\n\n**Integration Patterns and Code-Level Implications (Conceptual):**\nWhile this patent is hardware-focused, its principles could influence software and control systems for automated manufacturing. Integration would involve precise control of electrodeposition parameters (voltage, current, time, bath composition, temperature) via programmable logic controllers (PLCs) or advanced manufacturing execution systems (MES). Data analytics could be employed to monitor particle suspension stability, deposition rates, and layer uniformity in real-time, feeding back into process optimization algorithms. Predictive maintenance based on electrode wear or bath degradation would also be critical for sustaining high-volume production quality. The precise control over material placement also opens doors for advanced optical modeling and simulation software to predict light output characteristics based on layer composition and geometry.","business_analysis":"The **Light Emitting Device Manufacturing Method** patent (US-9853191) represents a significant strategic asset within the rapidly evolving solid-state lighting and display industries. Its core innovation, a precise electrodeposition method for forming highly uniform and efficient wavelength conversion layers, addresses critical pain points that have long challenged LED manufacturers, thus creating substantial market opportunities and competitive advantages.\n\n**Market Opportunity Size:**\nThe global LED market, including general lighting, automotive, display, and specialized applications, is projected to reach hundreds of billions of dollars in the coming years. Within this vast market, the demand for higher performance, greater energy efficiency, and extended reliability is constant. This innovation directly targets the premium and high-performance segments where improved light quality (CRI, CCT uniformity) and longevity command higher prices. Applications like high-resolution displays (e.g., micro-LEDs, mini-LEDs), automotive headlamps, medical lighting, and architectural accent lighting are particularly ripe for disruption by technologies that offer superior optical characteristics and durability. The ability to precisely control the wavelength conversion layer opens up entirely new possibilities for customized spectral output, tapping into niche markets.\n\n**Competitive Advantages:**\n1.  **Superior Product Performance:** LEDs manufactured using this method will likely exhibit higher luminous efficacy, better color uniformity, and a longer operational lifespan than those produced via conventional techniques. This provides a clear differentiation in a crowded market.\n2.  **Manufacturing Efficiency and Cost Reduction:** Electrodeposition offers greater control over material usage, potentially reducing phosphor waste. The repeatability and precision of the process can lead to higher manufacturing yields and reduced defect rates, thereby lowering per-unit production costs, especially for high-volume, high-specification components.\n3.  **Technological Barrier to Entry:** The specific combination of electrodeposition, multi-particle composition (including specialized filling particles), and aluminum-containing materials creates a complex and robust intellectual property barrier. Competitors would face significant R&D challenges and potential infringement risks to replicate this performance.\n4.  **Strategic Positioning:** Companies adopting this technology can position themselves as leaders in advanced LED component manufacturing, attracting partnerships, licensing opportunities, and high-value customers seeking next-generation solutions.\n\n**Revenue Potential and Business Models:**\nRevenue generation could stem from several avenues:\n*   **Direct Manufacturing:** Companies could integrate this method into their own LED production lines to create premium-tier products.\n*   **Licensing:** The patent could be licensed to other LED manufacturers globally, generating substantial royalty income.\n*   **Component Sales:** Producing and selling specialized wavelength conversion layers or pre-coated LED chips to downstream assemblers.\n*   **Joint Ventures/Partnerships:** Collaborating with established players in specific application areas (e.g., automotive, display) to co-develop and market new products.\n\n**Strategic Positioning:**\nThis patent allows for a strategic pivot towards high-value, high-margin LED segments. Instead of competing solely on price, companies can leverage the superior performance and reliability offered by this method. It enables a focus on applications where consistent color, high brightness, and long-term stability are non-negotiable, such as professional lighting, medical devices, and advanced consumer electronics. Furthermore, the precision of the method allows for the creation of new form factors or integration possibilities not feasible with less controlled processes.\n\n**ROI Projections:**\nThe return on investment for companies adopting or licensing this patent is likely to be substantial. Increased yields, reduced rework, and lower material costs directly impact the bottom line. More importantly, the ability to command premium pricing for superior products, expand into new high-growth markets, and establish a strong intellectual property position will drive significant long-term value. Early adopters could capture significant market share and establish a dominant position in advanced LED component supply, securing long-term revenue streams and shareholder value.","faqs":[{"answer":"The **Light Emitting Device Manufacturing Method** patent (US-9853191) describes a novel and highly precise technique for fabricating light-emitting diodes (LEDs). Specifically, it focuses on an advanced method for forming the wavelength conversion layer, which is crucial for converting the primary light (e.g., blue light) emitted by an LED chip into the desired output light, such as white light. This innovation addresses the inconsistencies and inefficiencies often found in traditional LED manufacturing processes, promising superior performance and durability.\n\nAt its core, this patent introduces an electrodeposition process that carefully layers specific types of particles onto the LED element. This method ensures a highly uniform and dense distribution of these light-converting materials, a significant improvement over older techniques like spraying or dispensing. The meticulous control over particle placement is what sets this invention apart, leading to a more consistent and efficient light output.\n\nThis patented method is poised to impact various sectors of the lighting and display industries by enabling the production of LEDs with enhanced optical quality and extended operational lifespan. It represents a significant step forward in material science and manufacturing precision for solid-state lighting applications. The patent was filed on December 9, 2016, and published on December 26, 2017.","question":"What is the Light Emitting Device Manufacturing Method patent?"},{"answer":"The **Light Emitting Device Manufacturing Method** operates through a sophisticated electrodeposition process. First, an electrode of a light-emitting element (the LED chip) is bonded to a conductive member of a base, establishing the necessary electrical connection.\n\nNext, a specialized liquid solution, known as an electrolyte, is prepared. This electrolyte contains three distinct types of microscopic particles: first wavelength conversion particles, second wavelength conversion particles, and unique 'filling particles.' A key aspect is that all these particles either contain aluminum or are covered with an aluminum-containing material, ensuring chemical compatibility and optimized performance within the system.\n\nWhen an electric field is applied, these charged particles are precisely drawn out of the electrolyte and deposited onto the surface of the light-emitting element. The crucial innovation lies in the 'filling particles,' which are engineered to be significantly smaller in both particle size and aspect ratio than the other two types. As the larger wavelength conversion particles deposit, these smaller filling particles strategically occupy the interstitial spaces between them. This meticulous packing creates an exceptionally dense, uniform, and void-free wavelength conversion layer, which is critical for efficient light conversion and emission.","question":"How does the Light Emitting Device Manufacturing Method work?"},{"answer":"The **Light Emitting Device Manufacturing Method** patent primarily solves the long-standing problem of inconsistency and inefficiency in forming the wavelength conversion layer of light-emitting diodes (LEDs). In traditional manufacturing methods, such as dispensing or spraying phosphor materials, it's challenging to achieve a perfectly uniform and dense layer.\n\nThis often leads to several critical issues: first, **uneven light output and inconsistent color temperature**, meaning the light produced might not be a pure white or could vary across the LED's surface. Second, **reduced light extraction efficiency**, as light can be trapped or scattered inefficiently within a porous or irregular layer, wasting energy. Third, **accelerated degradation and shorter LED lifespans**, because voids or inconsistencies in the layer can create thermal hotspots or expose the sensitive phosphor materials to environmental stressors like moisture and oxygen.\n\nBy introducing a precision electrodeposition technique with multi-sized, aluminum-containing particles, this innovation overcomes these limitations. It ensures a highly uniform, dense, and robust wavelength conversion layer, leading to superior optical performance, greater efficiency, and enhanced durability for the final LED product. This directly translates to higher quality, more reliable, and longer-lasting light sources across various applications.","question":"What problem does the Light Emitting Device Manufacturing Method solve?"},{"answer":"The patent data provided for the **Light Emitting Device Manufacturing Method** (US-9853191) does not specify the names of the inventors or the assignee. In many patent filings, the inventor information is publicly available, but sometimes it is withheld or not immediately apparent in summary data.\n\nTypically, patents are filed by individual inventors or, more commonly, assigned to corporations or research institutions where the inventors are employed. These organizations then hold the rights to the invention. The absence of specific names in this context means the direct inventors are not disclosed in the provided abstract data. However, the innovation itself stems from expert research and development in the field of optoelectronics and material science.\n\nFor full details regarding the inventors and assignee, one would typically refer to the complete patent document available through official patent databases like the USPTO (United States Patent and Trademark Office) or Google Patents, where such information is fully itemized.","question":"Who invented the Light Emitting Device Manufacturing Method?"},{"answer":"The **Light Emitting Device Manufacturing Method** offers a suite of significant benefits that enhance the performance, efficiency, and reliability of light-emitting devices:\n\n1.  **Superior Light Quality and Uniformity:** By creating an exceptionally dense and uniform wavelength conversion layer, the method ensures highly consistent color temperature and improved color rendering index (CRI). This eliminates patchy light or color shifts, delivering a purer and more aesthetically pleasing light output, crucial for high-end displays and quality illumination.\n2.  **Enhanced Luminous Efficacy (Energy Efficiency):** The precise packing of particles and the absence of voids within the layer minimize internal light scattering and absorption. This allows more converted light to escape the LED package, resulting in higher lumens per watt and significantly greater energy efficiency compared to traditional methods.\n3.  **Extended Lifespan and Increased Durability:** A robust, void-free wavelength conversion layer provides better protection for the sensitive phosphor materials against thermal degradation, moisture ingress, and mechanical stress. This directly translates to a longer operational lifespan for the LED, reducing maintenance and replacement costs.\n4.  **Improved Thermal Management:** A denser and more uniform layer can offer superior thermal conductivity pathways, facilitating more efficient heat dissipation from the active phosphor components. Effective thermal management is critical for preventing performance degradation and ensuring the longevity of high-power LEDs.","question":"What are the key benefits of the Light Emitting Device Manufacturing Method?"},{"answer":"The **Light Emitting Device Manufacturing Method** distinguishes itself significantly from prior art in LED manufacturing, primarily through its innovative use of electrodeposition and a sophisticated multi-particle system. Traditional methods, such as dispensing phosphor-resin mixtures or spraying phosphor slurries, often suffer from several limitations. These include non-uniform particle distribution, the presence of voids or air bubbles within the layer, imprecise thickness control, and material waste.\n\nThis patent overcomes these issues by employing **electrodeposition**, an electrochemical process that precisely controls the migration and deposition of particles onto the LED surface. This offers a level of uniformity and density that is difficult to achieve with mechanical application methods. Furthermore, a key differentiating factor is the use of **three distinct types of particles**: first and second wavelength conversion particles, and crucially, specialized 'filling particles.' These filling particles are engineered to be significantly smaller in size and aspect ratio, allowing them to precisely interlock and fill the microscopic gaps between the larger particles. This creates an exceptionally dense, homogeneous, and robust wavelength conversion layer, a microstructural achievement largely unattainable with prior art. The consistent use of aluminum or aluminum-containing materials across all particle types also suggests a deliberate strategy for chemical compatibility and enhanced performance that sets this method apart.","question":"How is the Light Emitting Device Manufacturing Method different from prior art?"},{"answer":"The **Light Emitting Device Manufacturing Method** is poised to significantly impact a wide array of industries that rely on high-performance light-emitting devices:\n\n1.  **Consumer Electronics:** This includes manufacturers of smartphones, tablets, televisions, and other displays. The method's ability to create highly uniform and efficient wavelength conversion layers will lead to screens with more vivid colors, higher brightness, better contrast, and potentially extended battery life due to improved LED efficiency.\n2.  **Automotive Lighting:** The demand for reliable, high-performance, and long-lasting headlights, taillights, and interior lighting is critical in the automotive sector. This innovation offers superior durability and consistent light output, which are essential for safety and aesthetic design.\n3.  **General Illumination:** From residential to commercial and industrial lighting, the enhanced energy efficiency, superior light quality, and extended lifespan of LEDs produced by this method will lead to lower operational costs, reduced maintenance, and more visually appealing environments.\n4.  **Specialized Lighting:** Industries requiring precise light control, such as medical lighting (for diagnostics or surgery), horticulture (grow lights for agriculture), and industrial inspection systems, will benefit from the ability to produce highly stable and accurate light spectra.\n5.  **Augmented/Virtual Reality (AR/VR):** The need for ultra-high-resolution, bright, and compact displays in AR/VR headsets makes this precision manufacturing method highly relevant for future advancements in these immersive technologies. The Light Emitting Device Manufacturing Method facilitates the creation of robust and efficient components essential for the next generation of visual experiences across these diverse sectors.","question":"What industries will the Light Emitting Device Manufacturing Method impact?"},{"answer":"The **Light Emitting Device Manufacturing Method** patent, identified by the number US-9853191, has specific dates associated with its filing and publication.\n\nThis patent was **filed** on **December 9, 2016**. The filing date marks the official submission of the patent application to the patent office, establishing the priority date for the invention. It signifies when the inventors formally claimed their new method.\n\nSubsequently, the patent was **published** on **December 26, 2017**. The publication date is when the patent application becomes publicly accessible, allowing others to review the details of the invention. While the publication date is often close to the filing date, the granting date (when the patent is officially issued) can occur later after examination. For this particular patent, the publication date is the key milestone indicating its public disclosure and availability for review by the wider industry and scientific community. This timeline positions the innovation as a relatively recent development in LED manufacturing technology.","question":"When was the Light Emitting Device Manufacturing Method filed/granted?"},{"answer":"The commercial applications of the **Light Emitting Device Manufacturing Method** are extensive, spanning various high-value segments within the lighting and display industries. Its ability to produce LEDs with superior optical performance, efficiency, and durability makes it highly attractive for several market sectors.\n\nOne primary application is in **high-resolution displays**, including next-generation televisions, computer monitors, and particularly mini-LED and micro-LED technologies. The method's precision ensures pixel-level uniformity and brightness, which are critical for vivid, high-contrast visual experiences. In **automotive lighting**, the enhanced reliability and consistent light output are invaluable for headlights, taillights, and interior lighting systems, contributing to both safety and premium vehicle aesthetics. For **general and architectural illumination**, the increased energy efficiency and superior color rendering index (CRI) translate to higher quality, more sustainable lighting solutions for homes, offices, and public spaces, reducing operational costs and improving ambiance. Furthermore, in **specialized lighting markets**, such as medical devices, horticulture (grow lights), and industrial inspection equipment, the precise control over light spectrum and long-term stability offered by this method enables tailored solutions for specific functional requirements. The Light Emitting Device Manufacturing Method therefore provides a competitive edge for manufacturers aiming to lead in these advanced and demanding commercial segments, offering products with unparalleled performance and longevity.","question":"What are the commercial applications of the Light Emitting Device Manufacturing Method?"},{"answer":"The **Light Emitting Device Manufacturing Method** lays a robust foundation for numerous future developments in solid-state lighting. As this technology matures and gains wider adoption, several key advancements are expected:\n\n1.  **Further Efficiency Gains:** Ongoing research will likely focus on optimizing the electrodeposition process and particle formulations to push LED luminous efficacy even closer to theoretical limits, leading to even greater energy savings across all applications.\n2.  **Advanced Color Tuning and Customization:** The precise control over the wavelength conversion layer could enable dynamic, tunable white light systems with unprecedented accuracy, allowing for real-time adjustment of color temperature and spectrum for human-centric lighting applications or specialized industrial processes. This could extend to highly saturated colors for advanced displays.\n3.  **Integration with Smart Technologies:** The robust and uniform nature of the electrodeposited layers might facilitate more seamless integration of LEDs with sensors, communication modules (e.g., Li-Fi), and other smart functionalities, leading to truly intelligent lighting systems and interconnected devices.\n4.  **Novel Material Exploration:** The patent's emphasis on aluminum-containing particles suggests future exploration into new aluminate-based phosphor hosts or covering materials with enhanced optical, thermal, or electrochemical properties, potentially leading to even broader color gamuts and improved stability.\n5.  **Miniaturization and New Form Factors:** The ability to create extremely thin and uniform layers will be crucial for the continued miniaturization of LEDs, paving the way for more compact, flexible, and potentially transparent light sources, opening up possibilities for innovative product designs and applications beyond traditional lighting fixtures. These developments will solidify the Light Emitting Device Manufacturing Method's role as a cornerstone for future lighting innovation.","question":"What are the future developments expected for the Light Emitting Device Manufacturing Method?"}],"topics":["Light Emitting Device Manufacturing Method","LED manufacturing","wavelength conversion","electrodeposition","light emitting device","pursuit","enhanced","performance"],"tech_cluster":null},"seo":{"title":"Light Emitting Device Manufacturing Method - Patent US-9853191","description":"Discover the Light Emitting Device Manufacturing Method patent (US-9853191) for superior LED performance. Learn about precision electrodeposition, multi-particle layers, and enhanced light quality.","keywords":["Light Emitting Device Manufacturing Method","LED manufacturing","wavelength conversion","electrodeposition","light emitting device","patent US-9853191","LED efficiency","phosphor layering","solid-state lighting","aluminum particles","optical performance","manufacturing method","LED innovation","patent analysis"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853191","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853191","citation_suggestion":"Patentable. \"Light emitting device manufacturing method\" (US-9853191). https://patentable.app/patents/US-9853191","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853191","json":"https://patentable.app/api/llm-context/US-9853191","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:50:29.917Z"}