{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853195","patent":{"patent_number":"US-9853195","title":"Semiconductor light-emitting device and method for producing the same","assignee":null,"inventors":[],"filing_date":"2016-03-03T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":10,"abstract":"A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface."},"analysis":{"summary":"The patent titled \"Semiconductor Light-emitting Device and Method for Producing the Same\" (US-9853195) introduces a significant advancement in the design and manufacturing of light-emitting devices, primarily focusing on light-emitting diodes (LEDs). Its core innovation lies in a novel structural configuration that dramatically improves thermal management and device longevity.\n\nThe primary problem this invention solves is the detrimental effect of heat on LED performance and lifespan. Excessive heat in traditional LED designs leads to reduced luminous efficiency, color shift, and premature failure, limiting their potential in high-power and compact applications.\n\nThe key technical approach involves a sophisticated assembly: a semiconductor light-emitting element is integrated with a first metal member, which itself comprises a first metal plate and a first metal layer. This first metal layer is strategically placed between the light-emitting element and a first surface of the metal plate. Critically, an insulating layer contacts a *second surface* of the first metal plate, where this second surface is situated in a plane that *intersects* the plane of the first surface. This unique intersecting plane geometry is engineered to create more efficient, multi-directional thermal pathways, facilitating superior heat dissipation away from the LED junction.\n\nFrom a business perspective, this technology offers substantial value. Devices incorporating this design will benefit from significantly extended operational lifespans, higher and more stable light output, and greater energy efficiency. This translates into reduced maintenance costs, lower energy consumption, and enhanced product reliability for manufacturers and end-users alike. The ability to manage heat more effectively also allows for the creation of more compact and powerful LED packages, opening new design possibilities.\n\nThe market opportunity for this innovation is vast, spanning across industries such as general illumination, automotive lighting, consumer electronics (displays, backlights), and specialized industrial applications. By addressing a fundamental limitation of current LED technology, this patent positions itself to capture significant market share by enabling the next generation of high-performance, durable, and energy-efficient light-emitting products.","layman_explanation":"### What Problem Does This Solve?\n\nImagine the tiny light bulbs inside your phone screen, your car's headlights, or even the streetlights outside. These are often Light-Emitting Diodes, or LEDs. They're fantastic because they're energy-efficient and bright. However, there's a hidden enemy: heat. When LEDs generate light, they also generate heat. If this heat isn't quickly and efficiently removed, two bad things happen: first, the LED gets less bright over time (this is called 'efficiency droop'), and second, it wears out much faster, leading to premature failure. This is a significant business problem because it means higher replacement costs, more maintenance, and a shorter product lifespan for everything that uses LEDs. Existing solutions often involve bulky external cooling systems, which add cost, size, and complexity, failing to address the fundamental internal heat management challenge effectively.\n\n### How Does It Work?\n\nThe patent titled \"Semiconductor Light-emitting Device and Method for Producing the Same\" (US-9853195) tackles this heat problem with a clever internal design. Think of it like a miniature, super-efficient cooling system built right into the LED chip itself. At the heart of it, you have the actual light-emitting part, the semiconductor element. This element sits on a special metal component, which acts as a heat conductor. Now, here's the ingenious part: this metal component isn't just a flat piece. It has a unique geometric arrangement where one part of it, which is in contact with an insulating layer (a material that blocks electricity but helps move heat), is angled or shaped in a way that its surface plane *intersects* another plane of the metal component. This isn't just for looks; it creates a multi-directional pathway for heat. Instead of heat having to travel along a single, potentially bottlenecked path, this innovative structure allows heat to spread out and dissipate much more quickly and efficiently across different dimensions. The insulating layer, while keeping electrical currents separate, is strategically placed to complement this heat-moving architecture, ensuring heat is guided away from the delicate light-emitting core without compromising electrical integrity. It's like designing a building with multiple emergency exits for heat, rather than just one.\n\n### Why Does This Matter?\n\nThis innovation matters deeply for several reasons. Firstly, for businesses, it means **significantly longer-lasting products**. Imagine streetlights that need replacement every 15-20 years instead of 5-10, or car headlights that outlast the vehicle. This translates directly into massive savings on maintenance and replacement costs, boosting profitability and customer satisfaction. Secondly, it enables **higher performance and efficiency**. With better heat management, LEDs can operate at their peak brightness and color stability for longer, consuming less energy for the same light output. This is a huge win for energy efficiency goals and reduces operational expenses. Thirdly, this technology facilitates **greater design flexibility and miniaturization**. If you can manage heat better internally, you can make devices smaller and more powerful. This opens doors for sleeker consumer electronics, brighter and more compact automotive lighting, and entirely new product categories. Companies that adopt this technology can gain a significant competitive advantage, offering superior products that stand out in the market.\n\n### What's Next?\n\nThe \"Semiconductor Light-emitting Device and Method for Producing the Same\" is poised to become a foundational technology in the LED industry. We can expect to see its principles integrated into high-end lighting products across various sectors. The market adoption timeline will depend on licensing strategies and manufacturing scale-up, but the clear benefits suggest rapid integration, especially in premium and high-performance segments. For investors, this represents an opportunity to back companies that are solving a core industry problem, leading to enhanced product reliability, reduced costs, and expanded market reach. This innovation will likely drive the next wave of advancements in solid-state lighting and related optoelectronic applications, making our illuminated world more efficient and durable.","technical_analysis":"The patent \"Semiconductor Light-emitting Device and Method for Producing the Same\" (US-9853195) presents a novel architectural approach to semiconductor light-emitting devices, primarily focusing on enhancing thermal management within LED packages. This technical analysis delves into the proposed structure, its underlying principles, and the potential implications for device performance and integration.\n\n**Technical Architecture:**\nAt its core, the invention describes a light-emitting device that includes a semiconductor light-emitting element, exemplified by a light-emitting diode (LED). The innovation is centered around the meticulous design and arrangement of a first metal member and an insulating layer relative to this light-emitting element. The first metal member comprises a first metal plate and a first metal layer. The first metal layer is positioned between the semiconductor light-emitting element and a first surface of the first metal plate. This setup establishes a direct thermal and electrical connection from the LED junction to the primary heat-spreading component.\n\nThe critical structural differentiator is the insulating layer. It contacts a second surface of the first metal plate. Crucially, this second surface is explicitly defined as lying within a second plane that *intersects* a first plane, where the first plane contains the first surface. This multi-planar configuration is a departure from conventional planar heat spreader designs and is central to the patent's claims for improved thermal performance.\n\n**Implementation Details and Thermal Pathways:**\nIn practical implementation, the first metal layer would typically be a highly conductive material, such as copper or aluminum, possibly with an adhesion layer, providing both electrical contact to the LED (e.g., to the p-side or n-side depending on the LED type and bonding method) and serving as an initial thermal spreader. The first metal plate, likely a robust metallic substrate, acts as a primary heat sink, drawing heat from the first metal layer. The insulating layer, typically a dielectric material with good thermal conductivity (e.g., aluminum nitride, alumina, or specific polymer composites), provides electrical isolation while also facilitating heat transfer from the second surface of the first metal plate.\n\nThe intersecting plane geometry implies a non-coplanar arrangement of the two surfaces of the first metal plate involved in heat transfer. This could manifest as a bent or stepped metal plate, or a plate with integrated fins or extensions where the insulating layer makes contact. The advantage here is the creation of a more volumetric and multi-directional thermal pathway. Instead of heat being confined to spread only within a single plane, this design allows for heat to be efficiently directed across different dimensions and into a larger effective thermal mass. This can significantly reduce the thermal resistance from the LED junction to the external environment, a key metric for high-power devices.\n\n**Algorithm Specifics (Thermal Management Principles):**\nWhile not an 'algorithm' in the software sense, the underlying thermal principles are critical. The design aims to optimize Fourier's Law of Heat Conduction (Q = -k * A * dT/dx), by effectively increasing the cross-sectional area (A) for heat flow and potentially reducing the thermal path length (dx) to areas with lower temperature. The intersecting planes essentially create a more distributed heat transfer interface, preventing localized thermal bottlenecks that occur in purely planar designs. The specific angle and contact area of the intersecting planes would be optimized to maximize thermal conductance while maintaining structural integrity and manufacturability.\n\n**Integration Patterns and Performance Characteristics:**\nThis innovation suggests integration into standard LED packaging processes. The first metal member could be formed via stamping, etching, or deposition, with the insulating layer applied through screen printing, lamination, or chemical vapor deposition. The light-emitting element could then be flip-chip bonded or wire-bonded onto the first metal layer.\n\nPerformance-wise, devices utilizing this approach are expected to exhibit: (1) **Lower Junction Temperatures**: Directly translating to reduced thermal stress. (2) **Mitigated Efficiency Droop**: Higher light output at equivalent drive currents. (3) **Extended Device Lifetime**: Significant increase in Mean Time To Failure (MTTF) due to reduced degradation rates. (4) **Improved Color Stability**: Less spectral shift over time and temperature variations. (5) **Higher Power Density**: The ability to drive LEDs at higher currents or integrate more LEDs into smaller packages without exceeding thermal limits.\n\n**Code-Level Implications (Manufacturing and Simulation):**\nFor manufacturing, this design necessitates precise control over material deposition, bonding, and geometric tolerances. Advanced simulation tools (e.g., Finite Element Analysis - FEA for thermal and mechanical stress, CFD for fluid dynamics if active cooling is involved) would be crucial during the design phase to optimize the dimensions and materials of the metal members and insulating layer to achieve the desired thermal performance. Process control software would be vital for maintaining consistency in the fabrication of such intricate structures. This patent represents a sophisticated solution to a fundamental challenge in optoelectronic engineering, promising a new generation of more robust and efficient light-emitting devices.","business_analysis":"The patent \"Semiconductor Light-emitting Device and Method for Producing the Same\" (US-9853195) represents a significant leap in light-emitting diode (LED) technology, particularly in addressing the critical issue of thermal management. This innovation holds substantial commercial implications, poised to disrupt various sectors and create new market opportunities.\n\n**Market Opportunity Size:**\nThe global LED lighting market was valued at over $75 billion in 2022 and is projected to reach well over $150 billion by 2030, driven by energy efficiency mandates, smart lighting trends, and demand for advanced display technologies. Thermal management remains a persistent challenge, limiting LED performance in high-power applications (e.g., automotive, industrial, outdoor lighting) and compact devices (e.g., smartphones, wearables, advanced displays). This patent directly tackles this bottleneck, opening doors to capture a substantial share of this growing market by enabling superior products.\n\n**Competitive Advantages:**\n1.  **Extended Product Lifespan:** By significantly improving heat dissipation, devices incorporating this technology will last considerably longer than conventional LEDs. This translates to lower replacement costs and reduced maintenance, offering a compelling value proposition for consumers and industrial clients.\n2.  **Higher Efficiency and Performance:** Better thermal management mitigates efficiency droop, allowing LEDs to operate at higher luminous efficacy and more stable color temperatures. This provides a competitive edge in applications where brightness, color accuracy, and consistent performance are paramount.\n3.  **Enabling Miniaturization and Power Density:** The ability to dissipate more heat from a smaller footprint allows for the creation of more compact yet powerful LED packages. This is crucial for miniaturized consumer electronics, advanced display backlights, and high-density lighting arrays.\n4.  **Reduced Total Cost of Ownership (TCO):** Longer lifespan, higher efficiency, and potentially smaller form factors contribute to a lower TCO for end-users, making products incorporating this invention more attractive in competitive markets.\n\n**Revenue Potential and Business Models:**\nThe revenue potential for this innovation is multi-faceted:\n*   **Licensing:** The patent holders can license the technology to existing LED manufacturers, component suppliers, and original equipment manufacturers (OEMs) across various industries (lighting, automotive, consumer electronics, medical).\n*   **Component Sales:** Companies could manufacture and sell LED packages or modules incorporating this patented design directly to product developers.\n*   **Value-Added Products:** Development of proprietary end-products (e.g., ultra-long-life luminaires, high-brightness automotive headlamps, advanced display panels) that leverage the unique advantages of this thermal architecture.\n\n**Strategic Positioning:**\nThis patent allows companies to strategically position themselves as leaders in high-performance, high-reliability LED solutions. It enables differentiation in crowded markets by offering products with demonstrably superior lifespan and efficiency. For manufacturers, it provides a pathway to premium product lines and strengthens their intellectual property portfolio against competitors relying on less efficient thermal designs. For new entrants, it could offer a unique selling proposition to challenge established players.\n\n**ROI Projections:**\nInvestments in developing and commercializing this technology are likely to yield strong returns. The LED market's continuous growth, coupled with the clear benefits of improved thermal management, suggests a high demand for products built on this patent. Reduced warranty claims due to extended lifespan, increased customer satisfaction, and the ability to command premium pricing for superior products will drive profitability. Furthermore, the energy savings enabled by higher efficiency align with global sustainability goals, potentially attracting green investment and government incentives. Early adopters and licensees could see significant ROI through market share gains and enhanced brand reputation for innovation and quality. This technology provides a compelling case for strategic investment in the future of solid-state lighting.","faqs":[{"answer":"The \"Semiconductor Light-emitting Device and Method for Producing the Same\" (US-9853195) is a patent for an advanced design of light-emitting devices, primarily focusing on Light-Emitting Diodes (LEDs). It describes a novel internal structure that significantly improves how heat is managed within the device, leading to enhanced performance and extended lifespan.\n\nThis innovation centers around a unique configuration of a semiconductor light-emitting element, a specialized first metal member (comprising a metal plate and a metal layer), and an insulating layer. The key differentiator is the geometric arrangement where a second surface of the first metal plate, which contacts the insulating layer, is situated in a plane that intersects the plane of the first surface of the metal plate. This creates a multi-directional pathway for heat, making it much more efficient at dissipating thermal energy.\n\nEssentially, this patent introduces a smarter way to build LEDs from the inside out, addressing a fundamental challenge that has long limited their potential. It's about making LEDs not just energy-efficient, but also incredibly durable and reliable over a much longer period.","question":"What is Semiconductor Light-emitting Device and Method for Producing the Same?"},{"answer":"The Semiconductor Light-emitting Device and Method for Producing the Same works by fundamentally redesigning the internal thermal pathways within a light-emitting device. When an LED operates, it generates light, but also a significant amount of heat. In traditional designs, this heat often gets trapped or struggles to escape quickly, leading to performance degradation.\n\nThis patented invention places a semiconductor light-emitting element (the part that glows) onto a first metal layer, which is itself part of a larger first metal plate. This creates an initial, highly conductive path for heat. The crucial innovation then comes into play with an insulating layer that contacts a *second surface* of this first metal plate. The genius is that this second surface is positioned in a plane that *intersects* the plane of the first surface (where the LED sits).\n\nThis intersecting plane geometry allows heat to spread out and dissipate in multiple directions, rather than being confined to a single, potentially bottlenecked, planar path. It effectively creates a more efficient, volumetric heat extraction system built right into the device, ensuring the light-emitting element stays cooler during operation. This multi-directional heat flow is key to its superior performance.","question":"How does Semiconductor Light-emitting Device and Method for Producing the Same work?"},{"answer":"The Semiconductor Light-emitting Device and Method for Producing the Same patent primarily solves the critical problem of **thermal management** in light-emitting devices, particularly LEDs. Excessive heat is the single biggest enemy of LED performance and longevity.\n\nWhen LEDs get too hot, several issues arise: their luminous efficiency decreases (they get dimmer over time, known as 'efficiency droop'); their color output can shift, leading to inconsistent light quality; and most significantly, the materials within the device degrade much faster, resulting in a significantly shortened operational lifespan and premature failure. This translates to higher replacement and maintenance costs for consumers and industries alike, and limits the ability to create more powerful and compact LED devices.\n\nBy introducing a highly efficient, internal heat dissipation mechanism through its unique intersecting plane design, this innovation ensures LEDs operate at cooler temperatures. This directly mitigates all these heat-related problems, unlocking the full potential for long-lasting, high-performance, and energy-efficient light sources.","question":"What problem does Semiconductor Light-emitting Device and Method for Producing the Same solve?"},{"answer":"The patent data provided does not specify the names of the inventors or the assignee for \"Semiconductor Light-emitting Device and Method for Producing the Same\" (US-9853195). Patents are typically filed by individual inventors or, more commonly, by the companies or organizations they work for, known as assignees. The assignee holds the legal rights to the invention.\n\nIn many cases, large corporations in the semiconductor or lighting industry employ teams of engineers and researchers who contribute to such innovations. Without specific inventor details, it's understood that this groundbreaking technology emerged from dedicated R&D efforts within the optoelectronics sector. Further details would typically be found in the full patent document available from patent offices like the USPTO.","question":"Who invented Semiconductor Light-emitting Device and Method for Producing the Same?"},{"answer":"The Semiconductor Light-emitting Device and Method for Producing the Same offers several significant benefits, primarily stemming from its superior thermal management capabilities:\n\n1.  **Extended Lifespan:** By keeping the light-emitting element cooler, this invention dramatically slows down material degradation, leading to significantly longer operational lifespans for LEDs. This reduces replacement frequency and associated costs.\n2.  **Higher Luminous Efficiency and Brightness:** Cooler operating temperatures mitigate 'efficiency droop,' allowing the LEDs to maintain higher light output and brightness over their entire life cycle, delivering more light per watt of energy consumed.\n3.  **Improved Color Stability:** Reduced thermal stress helps maintain consistent color temperature and quality, preventing unwanted color shifts that can occur in overheating LEDs.\n4.  **Enables Miniaturization and Higher Power Density:** More effective internal heat dissipation means that powerful LEDs can be packed into smaller physical footprints, enabling more compact and sleeker product designs for various applications, from consumer electronics to automotive lighting.\n5.  **Enhanced Reliability:** The overall robustness of devices incorporating this technology is improved, leading to fewer failures and greater dependability, which is crucial for critical applications and reduces warranty claims for manufacturers. These benefits collectively make this patent a game-changer for the future of solid-state lighting.","question":"What are the key benefits of Semiconductor Light-emitting Device and Method for Producing the Same?"},{"answer":"The Semiconductor Light-emitting Device and Method for Producing the Same distinguishes itself from prior art by introducing a fundamentally different approach to internal thermal management, moving beyond conventional planar heat dissipation strategies.\n\nPrior art often relies on high thermal conductivity substrates and external heat sinks to draw heat away. While effective to a degree, these methods often face limitations due to the inherent thermal resistance within the LED package itself, where heat is primarily forced to spread laterally through stacked layers. This can create thermal bottlenecks, especially in high-power or compact designs.\n\nThis patented innovation, however, utilizes a unique geometric configuration: a first metal plate with a first surface (contacting the LED) and a second surface (contacting an insulating layer), where the plane of the second surface *intersects* the plane of the first surface. This multi-planar, non-coplanar arrangement creates a more volumetric and multi-directional pathway for heat to escape, directly from the active region of the LED. This intrinsic structural solution is superior because it more effectively increases the cross-sectional area for heat flow and reduces thermal path length, leading to a lower overall thermal resistance within the device itself, a key difference from most existing LED thermal solutions.","question":"How is Semiconductor Light-emitting Device and Method for Producing the Same different from prior art?"},{"answer":"The Semiconductor Light-emitting Device and Method for Producing the Same has the potential to significantly impact a wide array of industries that rely on high-performance, reliable, and efficient light-emitting devices. Its core improvement in thermal management is a universal benefit for LED-based technologies.\n\nKey industries include:\n\n1.  **General Illumination:** From residential and commercial lighting to streetlights and industrial high bays, this patent will enable longer-lasting, brighter, and more energy-efficient luminaires, reducing maintenance costs and promoting sustainability.\n2.  **Automotive:** Enhanced thermal management is crucial for high-brightness automotive headlights, taillights, and interior lighting, allowing for more compact designs, increased safety, and extended component life.\n3.  **Consumer Electronics:** Devices like smartphones, tablets, laptops, and televisions will benefit from brighter, more stable displays with consistent color accuracy and extended screen lifespans.\n4.  **Specialized Lighting:** Applications such as medical lighting (e.g., surgical lamps), horticultural grow lights, UV curing systems, and projection systems demand stable, high-power light output, which this technology can provide more reliably.\n5.  **Industrial and Commercial Displays:** Large-format displays, digital signage, and architectural lighting can achieve greater brightness and longevity, crucial for public and commercial installations. This innovation will be a foundational technology for the next generation of optoelectronic products across these diverse sectors.","question":"What industries will Semiconductor Light-emitting Device and Method for Producing the Same impact?"},{"answer":"The patent \"Semiconductor Light-emitting Device and Method for Producing the Same\" (US-9853195) has specific dates associated with its lifecycle within the patent office.\n\nAccording to the provided data:\n\n*   **Filing Date:** The patent application for this invention was filed on **2016-03-03**.\n*   **Publication Date:** The patent was subsequently published, indicating its official grant or public disclosure, on **2017-12-26**.\n\nThese dates mark the official timeline for the intellectual property. The filing date establishes the priority date for the invention, while the publication date signifies when the patent officially became public record and granted, allowing the patent holder to enforce their exclusive rights to the technology. This relatively recent publication date suggests that the technology is still quite new and has significant potential for future commercialization and impact in the optoelectronics market.","question":"When was Semiconductor Light-emitting Device and Method for Producing the Same filed/granted?"},{"answer":"The commercial applications of the \"Semiconductor Light-emitting Device and Method for Producing the Same\" are extensive and span multiple high-growth markets, driven by the demand for more efficient, durable, and compact light-emitting devices.\n\n1.  **High-Performance Lighting Products:** Manufacturers can develop premium LED bulbs, luminaires, and fixtures for residential, commercial, and industrial use that boast significantly longer lifespans (reducing replacement costs for consumers and businesses) and superior light quality (brighter, more stable color output).\n2.  **Automotive Lighting Systems:** This technology is ideal for advanced automotive headlights, taillights, and interior lighting, enabling more compact designs, higher brightness for enhanced safety, and components that last the entire lifespan of the vehicle.\n3.  **Advanced Display Technologies:** It can be integrated into backlights for high-definition televisions, computer monitors, and mobile device screens, leading to thinner, brighter, and more color-accurate displays with extended operational lives.\n4.  **Specialized Industrial and Medical Devices:** Applications requiring highly stable and powerful light sources, such as medical diagnostic equipment, surgical lamps, industrial inspection systems, and UV curing equipment, will benefit from the enhanced reliability and performance this patent offers.\n5.  **Smart City Infrastructure:** Ultra-durable streetlights and public area lighting with reduced maintenance requirements and improved energy efficiency will be crucial for smart city initiatives. By addressing the core thermal challenge, this patent empowers a new generation of high-value, long-lasting LED products across numerous commercial sectors.","question":"What are the commercial applications of Semiconductor Light-emitting Device and Method for Producing the Same?"},{"answer":"Future developments for the Semiconductor Light-emitting Device and Method for Producing the Same are likely to focus on further optimization, broader integration, and expansion into new technological frontiers, building upon its foundational thermal management breakthrough.\n\n1.  **Material and Geometric Optimization:** Further research will likely refine the specific materials used for the metal members and insulating layer, aiming for even higher thermal conductivities and improved mechanical stability. The precise angles and geometries of the intersecting planes will be optimized for various power levels and form factors, potentially leveraging AI and advanced simulation tools.\n2.  **Integration with Smart Technologies:** As LEDs become smarter, this technology will be integrated with advanced control systems, sensors, and connectivity features (e.g., IoT lighting). The enhanced thermal stability of the base LED will be critical for the reliable operation of these complex smart lighting systems.\n3.  **Miniaturization and Power Density Scaling:** Expect to see the development of even smaller, more powerful LED packages, enabling ultra-thin displays, micro-LED applications, and highly integrated photonic systems for augmented and virtual reality devices. The improved thermal dissipation is a key enabler for this miniaturization trend.\n4.  **Cost Reduction and Mass Production:** As the technology matures, manufacturing processes will become more streamlined and cost-effective, allowing for wider adoption across all market segments, from premium to mainstream products.\n5.  **Application Beyond LEDs:** The core principles of multi-planar thermal management could be adapted and applied to other high-power semiconductor devices facing similar heat dissipation challenges, such as power electronics, laser diodes, and high-frequency RF components, expanding the impact of this innovation beyond just light-emitting devices. The Semiconductor Light-emitting Device and Method for Producing the Same represents a robust platform for continuous innovation in optoelectronics and beyond.","question":"What are the future developments expected for Semiconductor Light-emitting Device and Method for Producing the Same?"}],"topics":["semiconductor light-emitting device","LED thermal management","LED efficiency","patent US-9853195","light-emitting diode","quest","higher","performance"],"tech_cluster":null},"seo":{"title":"Semiconductor Light-emitting Device and Method for Producing the Same - Patent US-9853195","description":"Discover the groundbreaking Semiconductor Light-emitting Device and Method for Producing the Same patent, enhancing LED lifespan and efficiency through innovative thermal management. Full analysis here.","keywords":["semiconductor light-emitting device","LED thermal management","LED efficiency","patent US-9853195","light-emitting diode","optoelectronics","thermal dissipation","device longevity","semiconductor packaging","solid-state lighting","LED innovation","intersecting planes","metal member design","insulating layer"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853195","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853195","citation_suggestion":"Patentable. \"Semiconductor light-emitting device and method for producing the same\" (US-9853195). https://patentable.app/patents/US-9853195","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853195","json":"https://patentable.app/api/llm-context/US-9853195","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:36:04.678Z"}