{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853197","patent":{"patent_number":"US-9853197","title":"Light emitting diode package having series connected LEDs","assignee":null,"inventors":[],"filing_date":"2015-09-29T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Light emitting diode packages as disclosed herein include a monolithic chip including at least a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. The monolithic chip is mounted to the connection substrate such that the electrical terminal of the first LED is electrically connected to the first landing pad and the electrical terminal of the second LED is electrically connected to the second landing pad. In an example, the monolithic chip includes a third and a fourth LED electrically coupled to each other in series, and electrically coupled to the first and second LEDs in parallel."},"analysis":{"summary":"The patent titled \"Light Emitting Diode Package Having Series Connected Leds\" (US-9853197) introduces a transformative approach to packaging light-emitting diodes, addressing long-standing challenges in manufacturing complexity and product reliability.\n\nThe core innovation lies in a monolithic chip design that integrates at least a first and a second LED, already electrically coupled in series. This internal series connection is key, as it significantly reduces the need for external wiring and individual component handling typical in multi-LED assemblies. Each LED on this chip includes an electrical terminal configured for connection to a power source.\n\nThe problem this invention solves is the inherent complexity, cost, and potential for failure associated with traditional methods of connecting multiple discrete LEDs. Conventional packaging often requires numerous wire bonds and intricate assembly steps, leading to higher production costs and lower overall product reliability. By pre-connecting LEDs within a single chip, this patent streamlines the entire packaging process.\n\nThe key technical approach involves mounting this monolithic chip onto a connection substrate. This substrate features precisely formed, electrically isolated metallic landing pads. The mounting is engineered so that the electrical terminal of the first LED connects directly to one landing pad, and the terminal of the second LED connects to another. This direct, simplified interface enhances robustness and electrical performance.\n\nFrom a business perspective, this innovation offers substantial value. It promises reduced manufacturing costs due to simplified assembly, improved product reliability leading to fewer warranty claims, and greater design flexibility for creating various LED arrays. The ability to integrate additional series-connected LEDs in parallel within the same monolithic chip further expands its application potential.\n\nThis technology presents a significant market opportunity across diverse sectors, including general lighting, automotive illumination, consumer electronics, and display technologies. Companies adopting this approach can gain a competitive edge by delivering more efficient, durable, and cost-effective LED products, positioning themselves at the forefront of the evolving solid-state lighting market.","layman_explanation":"For business professionals, understanding new patents isn't about the intricate circuit diagrams, but about the tangible impact on market dynamics, operational efficiency, and investment potential. The patent titled \"Light Emitting Diode Package Having Series Connected Leds\" (US-9853197) is one such innovation that warrants attention, as it addresses fundamental challenges in the burgeoning LED market.\n\n**1. What Problem Does This Solve?**\nIn essence, this patent tackles the complexity and fragility inherent in manufacturing multi-LED packages. Historically, when you needed several LEDs to work together (e.g., for brighter light or higher voltage applications), each tiny LED chip had to be individually wired and connected within a larger package. Think of it like assembling a complex circuit board with dozens of minuscule components, each requiring its own delicate connection point. This process is time-consuming, labor-intensive, and prone to errors. Every individual wire bond or solder joint represents a potential point of failure, leading to higher defect rates, increased warranty costs, and ultimately, a less reliable end product. Existing solutions, while functional, often fall short on scalability, cost-efficiency, and long-term durability, especially in high-volume production.\n\n**2. How Does It Work?**\nThis innovation introduces a smarter way to package LEDs. Instead of dealing with separate LED chips, the patent describes a 'monolithic chip' – imagine a single, tiny, integrated circuit board. On this single chip, two or more LEDs are already pre-connected in a 'series' arrangement. This means they are wired one after the other, like beads on a string, which is great for achieving higher voltage operation from a single component. Each end of this pre-connected LED string on the chip has a robust connection point (an 'electrical terminal').\n\nThis monolithic chip is then mounted directly onto a 'connection substrate' – think of it as the main circuit board. This substrate has clearly defined 'landing pads' (like designated spots) made of metal, which are electrically isolated from each other. The chip is placed so that its LED terminals connect directly to these landing pads. The key here is simplification: instead of many tiny wires connecting individual LEDs, you have a single, robust chip making a few direct connections to the main board. The patent even allows for more advanced configurations, where additional series-connected LEDs can be integrated onto the same monolithic chip and then connected in parallel to the first set, offering incredible flexibility for different power and brightness needs, all from one compact component.\n\n**3. Why Does This Matter?**\nThis patent matters because it delivers significant business advantages. First, it drastically reduces manufacturing complexity and costs. By integrating the series connections at the chip level, assembly lines become simpler, faster, and require less precision labor, leading to substantial operational savings. Second, product reliability sees a major boost. Fewer individual connections mean fewer points of failure, translating into longer product lifespans, fewer customer returns, and stronger brand reputation. This is critical in industries where product durability is paramount, such as automotive lighting or industrial applications. Third, it enables greater miniaturization and design flexibility, allowing product developers to create sleeker, more compact devices and innovate faster with custom LED solutions. The market impact is broad, encompassing general lighting, consumer electronics, automotive, and display technologies, all seeking more efficient and reliable light sources. The potential ROI for companies adopting this technology comes from reduced production expenses, enhanced product quality, and the ability to capture new market segments with superior offerings.\n\n**4. What's Next?**\nLooking ahead, this technology is poised to become a foundational element for next-generation LED products. We can expect to see its adoption in high-power LED arrays, compact smart lighting solutions, and advanced display backlighting. For investors, this patent signals a shift towards more integrated and reliable semiconductor packaging, highlighting opportunities in companies developing or licensing such foundational technologies. Early adopters and innovators stand to gain significant competitive advantages as this streamlined approach to LED packaging becomes an industry standard, driving further efficiency and innovation in solid-state lighting.","technical_analysis":"The patent \"Light Emitting Diode Package Having Series Connected Leds\" (US-9853197) details an innovative packaging architecture for light-emitting diodes, fundamentally altering the traditional approach to multi-LED integration. This technical analysis will delve into the architecture, implementation details, and the performance characteristics implied by this novel design.\n\n**Technical Architecture:**\nAt the core of this invention is a monolithic semiconductor chip. This chip is not merely a carrier for individual LEDs but is fabricated to *include* and *electrically couple in series* at least a first and a second LED. Each of these integrated LEDs possesses specific electrical terminals designed to interface with a power source. The serial connection is crucial; it means the voltage drop across the combined LED pair is the sum of individual LED forward voltages, and they share the same operating current.\n\nThis monolithic chip is then mounted onto a connection substrate. The substrate is characterized by having at least two distinct landing pads, fabricated from a metallic material and, importantly, electrically isolated from one another. The mounting method ensures precise electrical coupling: the electrical terminal of the first LED on the monolithic chip is connected to the first landing pad, and the electrical terminal of the second LED is connected to the second landing pad. This direct chip-to-substrate connection eliminates the need for multiple, often delicate, wire bonds typically required for connecting individual LED dies in series or parallel configurations.\n\nAn advanced embodiment described in the abstract suggests further complexity: the monolithic chip can also include a third and a fourth LED, also electrically coupled in series. This second series pair is then electrically coupled in parallel to the first series pair. This hierarchical integration allows for versatile voltage and current handling from a single, highly integrated component.\n\n**Implementation Details:**\nImplementing this technology would involve advanced semiconductor fabrication techniques to create the monolithic chip with integrated series LEDs. This includes precise epitaxial growth for LED layers, photolithography for defining individual LED structures, and metallization steps for internal series connections and external terminals. The monolithic nature simplifies subsequent packaging steps.\n\nMounting the chip to the connection substrate would likely employ standard die-attach processes such as eutectic bonding, epoxy bonding, or solder reflow. The metallic landing pads on the substrate would need to be designed for optimal electrical and thermal conductivity, potentially incorporating patterned conductive layers on ceramic or metal-core PCBs. The electrical isolation between landing pads is paramount to prevent short circuits and ensure proper series operation.\n\n**Performance Characteristics and Implications:**\n1.  **Enhanced Reliability:** By reducing the number of external wire bonds and discrete components, the invention inherently minimizes potential points of failure. Wire bond failures are a common cause of LED module degradation; this approach significantly mitigates that risk.\n2.  **Improved Manufacturing Efficiency:** The monolithic integration streamlines the assembly process. Instead of handling and connecting multiple individual LED dies, manufacturers deal with a single, pre-configured component. This reduces labor, increases throughput, and lowers production costs.\n3.  **Compact Form Factor:** Integrating multiple LEDs on a single chip allows for a much smaller overall package footprint compared to discrete multi-chip modules. This is critical for miniaturized lighting applications and high-density arrays.\n4.  **Optimized Electrical Performance:** The internal series connection can lead to more uniform current distribution across the LEDs within the chip, potentially resulting in more consistent light output and color temperature. The direct connection to robust landing pads also improves electrical signal integrity.\n5.  **Thermal Management:** While not explicitly detailed, monolithic integration can offer advantages in thermal management. Heat generated by the series-connected LEDs can be dissipated more efficiently through a unified chip structure and direct connection to a thermally conductive substrate, compared to heat management for multiple disparate components. This can contribute to longer LED lifespan and stable performance.\n\nIn essence, this patent provides a robust framework for developing the next generation of LED packages that are simpler to manufacture, more reliable in operation, and offer greater flexibility in design configurations, pushing the boundaries of solid-state lighting technology.","business_analysis":"The patent \"Light Emitting Diode Package Having Series Connected Leds\" (US-9853197) represents a strategic advancement in LED packaging technology with significant implications for market opportunity, competitive landscapes, and revenue potential across various industries. This innovation addresses core challenges in manufacturing efficiency and product reliability, offering a compelling value proposition for businesses.\n\n**Market Opportunity Size:**\nThe global LED lighting market is projected to reach hundreds of billions of dollars in the coming years, driven by energy efficiency mandates, smart lighting trends, and increasing adoption across residential, commercial, and industrial sectors. Within this vast market, the segment for LED components and packaging is substantial. This patent specifically targets the multi-LED package segment, which includes everything from automotive headlamps to high-power industrial luminaires and compact backlights for displays. By offering a more reliable and cost-effective packaging solution, this technology can capture a significant share of this expanding component market, potentially accelerating the adoption of advanced LED arrays.\n\n**Competitive Advantages:**\n1.  **Cost Reduction:** The primary competitive advantage is the simplification of the manufacturing process. By integrating series-connected LEDs onto a monolithic chip, the need for numerous individual wire bonds and discrete component handling is drastically reduced. This translates directly into lower labor costs, faster assembly times, and reduced material waste, offering a significant cost advantage over competitors using traditional methods.\n2.  **Enhanced Product Reliability:** Fewer points of failure (e.g., fewer wire bonds) lead to more robust and durable LED packages. This translates into longer product lifespans, reduced warranty claims, and improved brand reputation, giving companies a distinct edge in a quality-conscious market.\n3.  **Miniaturization and Design Flexibility:** The compact nature of the monolithic chip allows for smaller form factors, enabling innovative product designs for space-constrained applications. The ability to configure various series-parallel combinations within the chip provides unparalleled design flexibility, allowing manufacturers to quickly adapt to diverse market demands and create differentiated products.\n4.  **Performance Consistency:** Integrated designs can lead to more uniform current distribution and potentially better thermal management, resulting in more consistent light output and color temperature, which are critical for high-quality lighting applications.\n\n**Revenue Potential and Business Models:**\nCompanies that license or adopt this technology can unlock significant revenue streams. Potential business models include:\n*   **Component Sales:** Manufacturing and selling these monolithic LED chips as advanced components to lighting fixture manufacturers, automotive suppliers, and display makers.\n*   **Module Integration:** Developing and selling complete LED modules or arrays that leverage this packaging technology, offering integrated solutions to OEMs.\n*   **Licensing:** Patent holders can license the technology to major semiconductor or lighting companies, generating royalty income.\n\n**Strategic Positioning:**\nAdopting this innovation allows companies to strategically position themselves as leaders in advanced LED component technology. It enables them to move up the value chain by offering highly integrated, high-performance, and cost-effective solutions. This can help secure long-term contracts, attract investment, and establish a dominant market presence in specific niches requiring robust multi-LED packages.\n\n**ROI Projections:**\nInvestment in R&D, tooling, and fabrication for this technology is expected to yield substantial returns through reduced operational expenditures (OpEx) and increased market share. The savings in manufacturing costs alone, coupled with improved product quality and reduced warranty expenses, could lead to a rapid return on investment. Furthermore, the ability to introduce novel, high-performance products into the market faster can drive premium pricing and expanded revenue growth. This patent offers a clear path to a stronger financial position and sustained competitive advantage.","faqs":[{"answer":"Light Emitting Diode Package Having Series Connected Leds is a patent (US-9853197) that describes an innovative approach to packaging multiple light-emitting diodes (LEDs). Unlike traditional methods where individual LEDs are connected externally, this invention features a monolithic chip that intrinsically includes at least two LEDs already wired together in series. This integrated chip then mounts onto a connection substrate with dedicated landing pads, simplifying the overall electrical connection process.\n\nThe core idea is to move the complexity of wiring multiple LEDs from the external packaging stage to the internal chip fabrication stage. This makes the entire LED package more compact, robust, and efficient to manufacture. It's a fundamental shift in how multi-LED arrays are constructed, aiming to improve reliability and reduce production costs.\n\nThe patent also details the flexibility of this system, noting that the monolithic chip can incorporate additional series-connected LEDs that are then coupled in parallel to the initial set. This allows for diverse configurations to meet various power and voltage requirements from a single, highly integrated component. This versatility is key to its broad applicability across different lighting and electronic products. Keywords: LED packaging, series connected LEDs, monolithic chip, US-9853197, integrated LED.","question":"What is Light Emitting Diode Package Having Series Connected Leds?"},{"answer":"The Light Emitting Diode Package Having Series Connected Leds works by integrating the series connection of multiple LEDs directly onto a single, monolithic semiconductor chip. Here's a breakdown of the process:\n\nFirst, a monolithic chip is fabricated to contain at least two LEDs that are electrically connected in series within its structure. Each of these LEDs has an electrical terminal, which is also part of the monolithic chip. This means the internal 'wiring' between the LEDs is already done at the chip level, making it a self-contained series unit.\n\nSecond, this monolithic chip is then mounted onto a separate connection substrate. This substrate is designed with specific metallic landing pads that are electrically isolated from one another. The mounting process ensures that the electrical terminals of the LEDs on the monolithic chip make direct, robust contact with these corresponding landing pads on the substrate. This direct connection minimizes the need for numerous external wire bonds or complex routing, which are common in conventional LED packaging.\n\nFinally, the patent also illustrates how this system can be expanded. For example, the monolithic chip can include a third and a fourth LED, also connected in series, and this second series pair can then be connected in parallel to the first series pair, all within the same monolithic chip. This modularity allows for versatile voltage and current control from a single integrated component, making the Light Emitting Diode Package Having Series Connected Leds highly adaptable. Keywords: LED operation, monolithic chip, series connection, electrical terminals, connection substrate, packaging process.","question":"How does Light Emitting Diode Package Having Series Connected Leds work?"},{"answer":"The Light Emitting Diode Package Having Series Connected Leds patent primarily solves the significant challenges associated with manufacturing complexity, cost, and reliability in multi-LED packaging. Historically, creating LED arrays (where multiple LEDs work together) involved individually mounting and wiring each LED chip onto a substrate.\n\nThis traditional approach leads to several problems: 1) **High Manufacturing Complexity and Cost:** Each individual LED requires delicate wire bonding or soldering, which is labor-intensive, time-consuming, and prone to errors. This drives up production costs and slows down assembly lines. 2) **Reduced Reliability:** Every wire bond or connection point is a potential point of failure. The more connections, the higher the likelihood of a defect or premature failure due to thermal stress, mechanical shock, or other environmental factors, leading to shorter product lifespans and increased warranty claims. 3) **Form Factor Limitations:** The space required for individual chips and their extensive interconnections limits how compact and thin LED products can be.\n\nBy integrating the series connection directly onto a monolithic chip, this patent dramatically reduces the number of external connections needed. This simplifies assembly, lowers manufacturing costs, and significantly enhances the overall reliability of the LED package. It also enables greater miniaturization and design flexibility, addressing key pain points for manufacturers and improving product quality for consumers. Keywords: LED challenges, manufacturing complexity, product reliability, cost reduction, multi-LED packaging, integration.","question":"What problem does Light Emitting Diode Package Having Series Connected Leds solve?"},{"answer":"The patent Light Emitting Diode Package Having Series Connected Leds (US-9853197) does not list specific inventors or an assignee in the provided data. Patent filings typically include this information in the full patent document, which can be accessed through official patent databases.\n\nHowever, the concept of integrating components into a monolithic chip is a common strategy in semiconductor design to enhance performance and reduce manufacturing complexity. Innovations like this often emerge from dedicated research and development teams within leading semiconductor or lighting technology companies, or from individual inventors pushing the boundaries of existing technology.\n\nWithout the specific inventor and assignee information, it's difficult to attribute this particular invention to a specific individual or company. The focus of the patent itself is on the technical solution it provides for LED packaging, which is a significant advancement regardless of its specific origin. For precise details on the inventors and assignee, one would need to consult the full official patent document for US-9853197. Keywords: patent inventors, assignee, US-9853197, LED innovation, semiconductor design, intellectual property.","question":"Who invented Light Emitting Diode Package Having Series Connected Leds?"},{"answer":"The Light Emitting Diode Package Having Series Connected Leds patent offers several key benefits that are set to impact the lighting and electronics industries significantly:\n\n1.  **Enhanced Reliability:** By integrating multiple LEDs in series directly onto a monolithic chip, the number of external wire bonds and discrete connections is drastically reduced. Wire bonds are common points of failure, so minimizing them leads to a more robust, durable, and longer-lasting LED package. This translates to fewer product failures and lower warranty costs.\n\n2.  **Simplified Manufacturing and Cost Reduction:** The streamlined design means fewer components to handle and fewer intricate assembly steps. This simplifies the manufacturing process, reduces labor costs, increases production throughput, and can lead to higher manufacturing yields. Ultimately, these efficiencies contribute to a lower overall cost of production for LED products.\n\n3.  **Compact Form Factor and Miniaturization:** Integrating LEDs into a single monolithic chip allows for a much smaller overall package footprint. This enables the design of more compact, sleeker, and more integrated lighting products and electronic devices, which is crucial for modern product development.\n\n4.  **Increased Design Flexibility:** The patent describes the ability to configure various series-parallel combinations within the monolithic chip itself. This provides engineers with unprecedented flexibility to tailor LED modules for specific voltage, current, and brightness requirements without needing complex external circuitry, accelerating design cycles and innovation. Keywords: LED benefits, reliability, cost-effectiveness, compact design, manufacturing efficiency, design flexibility, US-9853197.","question":"What are the key benefits of Light Emitting Diode Package Having Series Connected Leds?"},{"answer":"The Light Emitting Diode Package Having Series Connected Leds patent distinguishes itself significantly from prior art in LED packaging primarily through its method of integrating series-connected LEDs. Traditional LED packaging often involves mounting individual LED dies onto a substrate and then externally connecting them in series or parallel using wire bonds or other interconnects.\n\nIn prior art, each LED chip is typically a discrete component, requiring its own set of external connections. For a series array, this means multiple wire bonds or conductive traces are needed to link each LED in sequence. This approach is labor-intensive, creates numerous potential failure points (e.g., wire bond breaks), and limits how compact the final package can be due to the space required for all these connections.\n\nIn contrast, this patent's innovation is a monolithic chip that *already contains* at least two LEDs electrically coupled in series within its own structure. This means the internal series connection is pre-fabricated on the chip itself. When this monolithic chip is mounted onto a substrate, it only requires a few robust external connections (typically two for a single series string) to the substrate's landing pads. This fundamentally shifts the complexity from external assembly to internal chip design, resulting in a more reliable, compact, and cost-effective solution compared to conventional discrete-component-based methods. Keywords: prior art comparison, LED packaging innovation, monolithic chip, series LEDs, wire bonding, discrete components, US-9853197.","question":"How is Light Emitting Diode Package Having Series Connected Leds different from prior art?"},{"answer":"The Light Emitting Diode Package Having Series Connected Leds patent is poised to have a significant impact across a wide range of industries that rely heavily on LED technology. Its benefits in terms of reliability, manufacturing efficiency, and compact design make it highly valuable for various applications.\n\n1.  **General Lighting:** This includes residential, commercial, and industrial lighting. The enhanced reliability and cost-effectiveness will lead to more durable and affordable LED bulbs, fixtures, and streetlights, reducing maintenance and replacement costs.\n\n2.  **Automotive Industry:** Automotive lighting demands high reliability and compact form factors for headlights, tail lights, interior lighting, and display backlights. This technology can enable more robust, efficient, and sophisticated automotive lighting systems, contributing to improved safety and design flexibility.\n\n3.  **Consumer Electronics:** Products like smartphones, tablets, laptops, and televisions will benefit from thinner, brighter, and more uniform backlighting, as well as more reliable indicator lights. The miniaturization potential supports the trend towards sleeker and more integrated devices.\n\n4.  **Display Technologies:** This includes not only consumer electronics displays but also professional displays and signage. Improved LED packaging can lead to higher resolution, better contrast, and more reliable display panels.\n\n5.  **Specialized Applications:** Industries such as medical devices, horticulture (grow lights), and specialized industrial equipment will benefit from the ability to create highly reliable, custom LED arrays with precise control over voltage and current characteristics. Keywords: industry impact, general lighting, automotive lighting, consumer electronics, display technology, specialized LEDs, US-9853197.","question":"What industries will Light Emitting Diode Package Having Series Connected Leds impact?"},{"answer":"The patent Light Emitting Diode Package Having Series Connected Leds, identified as US-9853197, was officially filed on **September 29, 2015**. This date marks when the patent application was submitted to the patent office, initiating the examination process.\n\nFollowing the examination and approval process, the patent was subsequently granted and published on **December 26, 2017**. The publication date signifies when the patent document became publicly available, detailing the invention's claims, specifications, and drawings.\n\nThese dates are crucial for understanding the intellectual property timeline of the innovation. The filing date establishes priority, meaning the inventors have rights to the invention from that point onward, while the publication date marks its official entry into the public domain as a granted patent. This timeline indicates that the technology has been recognized and protected for several years, allowing for its development and commercialization within the specified legal framework. Keywords: filing date, publication date, patent timeline, US-9853197, intellectual property, patent grant.","question":"When was Light Emitting Diode Package Having Series Connected Leds filed/granted?"},{"answer":"The commercial applications of the Light Emitting Diode Package Having Series Connected Leds patent are extensive, given its ability to enhance LED reliability, reduce manufacturing costs, and enable more compact designs. This innovation can be leveraged across various product categories and industries.\n\n1.  **High-Power LED Modules:** For applications requiring significant light output, such as streetlights, stadium lighting, and industrial high-bay fixtures, this technology can create more robust and efficient high-power LED arrays. The integrated series connections simplify the creation of higher voltage modules.\n\n2.  **Automotive Lighting Solutions:** Car headlights, daytime running lights, turn signals, and interior ambient lighting can benefit from the enhanced durability and smaller footprint. This enables more sophisticated adaptive lighting systems and sleeker vehicle designs.\n\n3.  **Consumer Electronics Backlights:** For televisions, laptops, monitors, and mobile devices, the technology can lead to thinner, brighter, and more uniform backlights. This supports the trend towards ultra-thin devices and improved display quality.\n\n4.  **Smart Lighting and IoT Devices:** The miniaturization and reliability benefits make this ideal for integrated smart lighting systems, sensors, and other Internet of Things (IoT) devices where space is limited and long-term performance is critical.\n\n5.  **Specialty Lighting:** Applications such as medical lighting, architectural accent lighting, and horticultural grow lights can utilize the flexibility to create custom LED arrays with specific spectral and power characteristics, tailored for precise needs. Keywords: commercial applications, LED products, high-power LEDs, automotive lighting, consumer electronics, smart lighting, specialty lighting.","question":"What are the commercial applications of Light Emitting Diode Package Having Series Connected Leds?"},{"answer":"The Light Emitting Diode Package Having Series Connected Leds patent lays a strong foundation for several exciting future developments in LED technology. As the industry continues to push for greater integration and intelligence, this innovation will likely evolve in several directions.\n\n1.  **Further Miniaturization and Integration:** We can expect to see even more LEDs integrated onto a single monolithic chip, potentially combined with driver circuitry, thermal management features, and even optical elements. This could lead to 'system-on-chip' (SoC) solutions for complete light engines, drastically reducing component count and package size.\n\n2.  **Enhanced Thermal Management:** As more LEDs are packed onto a single chip, efficient heat dissipation becomes paramount. Future developments might include advanced substrate materials, integrated micro-cooling structures, or novel bonding techniques specifically optimized for the thermal demands of these highly integrated series-connected arrays.\n\n3.  **Dynamic and Tunable Lighting:** The flexibility to configure series-parallel combinations on-chip could be extended to allow for dynamic control over individual LED strings. This would enable advanced human-centric lighting solutions, where color temperature and intensity can be precisely adjusted in real-time, or highly specialized grow lights with dynamic spectral outputs.\n\n4.  **Cost Optimization and Mass Production:** As the technology matures, manufacturing processes will likely become even more refined, leading to further cost reductions and higher yields, making this integrated LED packaging solution ubiquitous across mass-market products. This will drive wider adoption and innovation across various sectors. Keywords: future LED technology, miniaturization, thermal management, smart lighting, tunable LEDs, cost optimization, US-9853197.","question":"What are the future developments expected for Light Emitting Diode Package Having Series Connected Leds?"}],"topics":["Light Emitting Diode Package Having Series Connected Leds","LED packaging","series connected LEDs","monolithic chip","LED reliability","relentless","drive","efficiency"],"tech_cluster":null},"seo":{"title":"Light Emitting Diode Package Having Series Connected Leds - Patent US-9853197","description":"Discover the Light Emitting Diode Package Having Series Connected Leds patent. Explore this innovation featuring monolithic chips with series-connected LEDs for enhanced reliability and simplified manufacturing. Full analysis available.","keywords":["Light Emitting Diode Package Having Series Connected Leds","LED packaging","series connected LEDs","monolithic chip","LED reliability","lighting innovation","semiconductor patent","US-9853197","LED manufacturing","solid-state lighting","LED technology","integrated LED","electrical terminals","connection substrate","landing pads"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853197","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853197","citation_suggestion":"Patentable. \"Light emitting diode package having series connected LEDs\" (US-9853197). https://patentable.app/patents/US-9853197","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853197","json":"https://patentable.app/api/llm-context/US-9853197","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:16:21.087Z"}