{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853198","patent":{"patent_number":"US-9853198","title":"Optoelectronic component and method of producing same","assignee":null,"inventors":[],"filing_date":"2014-09-18T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess."},"analysis":{"summary":"The patent titled \"Optoelectronic Component and Method of Producing Same\" (US-9853198) introduces a significant advancement in the design and manufacturing of integrated optoelectronic devices. The core innovation lies in an optoelectronic component that features a plastic housing with a lead frame section at least partly embedded within it. This design includes two distinct recesses on the component's upper side.\n\nCrucially, a first recess is configured to house an optoelectronic semiconductor chip, with a section of the lead frame left uncovered by the plastic to ensure proper electrical and thermal contact. Adjacent to this, a second recess is also present, where another section of the lead frame is exposed, but no optoelectronic semiconductor chip is arranged there. These two recesses are strategically separated by a section of the plastic material.\n\nThis inventive approach addresses several critical problems in current optoelectronic packaging, including thermal management, mechanical robustness, and manufacturing complexity. By embedding the lead frame and creating precise recesses, the invention significantly improves heat dissipation from the semiconductor chip, leading to enhanced performance and extended device lifespan. The integrated plastic housing provides superior mechanical protection, making the components more durable against environmental stressors.\n\nFrom a business perspective, this technology offers substantial value through streamlined manufacturing processes. The method of producing this component, likely involving insert molding, reduces assembly steps and costs, thereby increasing production efficiency and yield. This enables manufacturers to produce more compact, reliable, and cost-effective optoelectronic devices. The market opportunity is vast, spanning automotive lighting, consumer electronics, industrial sensors, and medical devices, all of which benefit from smaller, more robust, and thermally efficient components. This patent positions itself as a foundational technology for the next generation of integrated optoelectronics.","layman_explanation":"### What Problem Does This Solve?\nImagine you're building a tiny, powerful flashlight. You have the super-bright light chip, but it gets really hot, and it's quite fragile. To make it useful, you need to put it in a protective case and connect it to a power source. The tricky part is making that case strong enough, small enough, and good at getting rid of the heat, all while keeping costs down. Existing ways of doing this often involve many steps, like gluing the chip to a metal piece, then putting it in a plastic box, and then making sure the heat can escape. This can be expensive, prone to errors, and sometimes the light still gets too hot, shortening its life. This patent, \"Optoelectronic Component and Method of Producing Same,\" addresses these core challenges by offering a smarter, more integrated way to package these sensitive components.\n\n### How Does It Work?\nThink of it like this: instead of building a separate metal frame and a plastic case, this invention combines them from the start. It takes a metal 'skeleton' (called a lead frame, which is great for conducting electricity and heat) and molds a strong plastic 'body' around it. But here's the clever part: it leaves specific windows, or 'recesses,' open on the plastic body. In one window, the actual light chip is placed directly onto the exposed metal skeleton. This direct connection means heat can escape very efficiently, keeping the chip cooler and lasting longer. In another window, the metal skeleton is also exposed, but no chip is placed there. This empty space can serve various purposes, like further improving heat management or providing a spot for future additions, all while the plastic between the two windows keeps things separate and protected. It’s like building a custom-fit, high-performance sports car chassis for your tiny, powerful engine, ensuring everything works together seamlessly.\n\n### Why Does This Matter?\nThis innovation matters because it directly impacts the performance, cost, and reliability of countless electronic devices we use every day. For businesses, it means:\n\n*   **Better Products:** Devices can be made smaller, more durable, and more powerful because the internal components run cooler and are better protected. Think brighter, longer-lasting LED lights in cars, more robust sensors in industrial equipment, or even thinner, more efficient displays in consumer electronics.\n*   **Lower Manufacturing Costs:** By integrating the metal frame and plastic housing in one streamlined process, many separate assembly steps are eliminated. This reduces labor, material waste, and production time, leading to significant cost savings per unit. This directly boosts profit margins and allows for more competitive pricing.\n*   **Competitive Edge:** Companies adopting this technology can differentiate their products based on superior quality, smaller form factor, and enhanced reliability. This can lead to increased market share and brand reputation in highly competitive sectors.\n*   **Faster Innovation:** The inherent flexibility of the design, with its dedicated and empty recesses, allows engineers to rapidly develop new product variations or integrate additional features without needing a complete overhaul of the basic packaging, accelerating time-to-market.\n\n### What's Next?\nThis patent lays a foundational groundwork for the next generation of integrated electronics. We can expect to see this approach adopted in areas requiring extreme miniaturization and high reliability, such as advanced driver-assistance systems (ADAS) in autonomous vehicles, sophisticated medical diagnostic tools, and the rapidly expanding Internet of Things (IoT) sensor market. As manufacturing processes become even more precise, this technology could enable even thinner packages and more complex multi-functional components. For investors, it signals a shift towards more efficient and robust component design, offering opportunities in companies that can successfully license or implement this innovative packaging solution, leading to long-term market leadership.","technical_analysis":"The patent \"Optoelectronic Component and Method of Producing Same\" (US-9853198) details a sophisticated technical solution for integrating optoelectronic semiconductor chips into a compact and robust package. The innovation centers on a unique housing and lead frame architecture designed to optimize thermal, electrical, and mechanical performance.\n\n**Technical Architecture:**\nThe core component comprises a housing predominantly made of plastic material. A critical feature is the strategic embedding of a first lead frame section, at least partially, within this plastic. This lead frame serves as both an electrical conduit and a thermal pathway. The housing's upper side is characterized by two distinct recesses: a first recess and a second recess.\n\nIn the first recess, a specific upper section of the lead frame's upper side remains uncovered by the plastic material. This exposed area is explicitly designed for the arrangement of an optoelectronic semiconductor chip. This direct exposure allows for efficient electrical interconnection (e.g., wire bonding, flip-chip attachment) and, crucially, direct thermal coupling between the chip and the highly conductive lead frame.\n\nConcurrently, a second upper section of the lead frame's upper side is also left uncovered by the plastic material within the second recess. However, a key distinction is that no optoelectronic semiconductor chip is arranged in this second recess. The two recesses are physically and functionally separated by a section of the plastic material, ensuring electrical isolation and structural integrity between the two distinct areas.\n\n**Implementation Details and Algorithm Specifics:**\nThe method of producing this component likely involves advanced molding techniques, such as insert molding or overmolding. The lead frame, often pre-stamped and formed from materials like copper alloys, is precisely positioned within a mold cavity. The plastic material (e.g., epoxy resins, thermoplastic polymers) is then injected or molded around the lead frame, encapsulating it while leaving specific sections exposed to form the recesses. This process ensures high precision in lead frame placement and recess formation, critical for optical alignment and electrical contact.\n\nWhile the patent abstract doesn't detail specific algorithms, the manufacturing process implies algorithmic control over molding parameters (temperature, pressure, injection speed) and potentially automated optical inspection (AOI) for quality control, ensuring the accurate positioning of the lead frame and the integrity of the plastic encapsulation. The subsequent arrangement of the optoelectronic semiconductor chip in the first recess would involve standard die-attach and wire-bonding (or flip-chip bonding) processes, leveraging the precisely exposed lead frame section.\n\n**Integration Patterns and Performance Characteristics:**\nThis invention promotes a highly integrated packaging pattern, moving away from multi-component assemblies. The embedded lead frame acts as an integrated heat spreader, significantly improving thermal management compared to designs where the lead frame is merely surface-mounted or minimally encapsulated. Heat generated by the optoelectronic chip is efficiently transferred to the lead frame, which then dissipates it to the ambient environment or to an external heat sink via its embedded structure.\n\nPerformance characteristics include enhanced thermal resistance, leading to higher operating temperatures, increased optical power output, and extended device lifespan. The robust plastic housing with the embedded lead frame also provides superior mechanical protection against shock, vibration, and moisture ingress. Electrical performance benefits from minimized parasitic elements due to shorter, direct connections between the chip and the lead frame.\n\n**Code-Level Implications (Analogous):**\nAlthough this patent describes hardware, the principles have analogous 'code-level' implications in design and validation. The precise definition of recesses and embedded components allows for highly modular design iterations. Engineers can develop standard lead frame designs and plastic housing molds, then adapt the 'population' of the recesses (e.g., with different chip types, or using the empty recess for sensors, thermal elements, or test points). This modularity reduces development cycles and allows for variant production from a common base. Validation would involve rigorous thermal simulations (FEA), mechanical stress analysis, and electrical characterization to ensure optimal performance within the integrated structure, effectively 'debugging' the physical design before mass production.","business_analysis":"The \"Optoelectronic Component and Method of Producing Same\" patent (US-9853198) presents a compelling business proposition by addressing fundamental challenges in the manufacturing and performance of optoelectronic devices. This innovation is poised to unlock significant market opportunities and confer strong competitive advantages across various industries.\n\n**Market Opportunity Size:**\nThe global optoelectronics market is a multi-billion dollar industry, projected to grow substantially driven by demand from consumer electronics (smartphones, wearables), automotive (ADAS, lighting), industrial automation (sensors, machine vision), telecommunications, and medical devices. This patent specifically targets the packaging and integration segment, which is a critical bottleneck and cost driver. By offering a more efficient and reliable packaging solution, this technology can capture a significant share of this expanding market, estimated to be in the tens of billions of dollars globally for integrated components.\n\n**Competitive Advantages:**\n1.  **Cost Reduction:** The streamlined manufacturing process, integrating lead frame embedding and housing formation into potentially fewer steps, significantly reduces assembly time, labor, and material waste. This translates directly into lower per-unit costs, giving adopters a distinct competitive edge.\n2.  **Enhanced Performance & Reliability:** Superior thermal management extends device lifespan and allows for higher operating power. The robust, integrated packaging improves mechanical durability, reducing field failures and warranty claims, which are critical differentiators in high-reliability applications like automotive and medical.\n3.  **Miniaturization & Design Flexibility:** The compact, integrated design enables the creation of smaller, sleeker end products, meeting consumer demand for miniaturization. The presence of an empty second recess also offers design flexibility for future upgrades, modularity, or specialized applications without needing a complete redesign.\n4.  **Faster Time-to-Market:** Simplified manufacturing and modular design principles can accelerate product development cycles, allowing companies to respond faster to market demands.\n\n**Revenue Potential:**\nRevenue can be generated through various business models:\n*   **Licensing:** Companies holding this patent can license the technology to major semiconductor manufacturers, packaging houses, and original equipment manufacturers (OEMs).\n*   **Component Sales:** Direct manufacturing and sale of integrated optoelectronic components based on this patent.\n*   **Value-added Services:** Offering specialized design and consulting services for companies looking to implement this packaging methodology.\n*   **Joint Ventures:** Collaborating with industry leaders to co-develop and commercialize products leveraging this innovation. The cost savings and performance improvements translate into higher margins for products incorporating this technology, driving substantial revenue growth.\n\n**Strategic Positioning:**\nThis patent allows companies to strategically position themselves as leaders in advanced optoelectronic packaging. It enables a shift from discrete component assembly to highly integrated solutions, aligning with industry trends towards System-in-Package (SiP) and heterogeneous integration. Companies adopting this technology can differentiate their products based on superior reliability, smaller form factor, and lower total cost of ownership.\n\n**ROI Projections:**\nInvestment in implementing this patent's methodology can yield substantial ROI through:\n*   **Manufacturing Cost Savings:** Reductions of 15-30% in assembly costs are plausible, directly impacting profit margins.\n*   **Reduced Failure Rates:** Improved reliability leads to lower warranty costs and enhanced brand reputation.\n*   **Market Share Gain:** Differentiated products with superior performance and smaller footprints can capture increased market share.\n*   **New Market Entry:** The ability to produce previously unfeasible compact and robust devices can open doors to entirely new market segments. For instance, a 10% reduction in manufacturing costs for a high-volume product line could result in multi-million dollar annual savings, quickly offsetting initial R&D and implementation investments.","faqs":[{"answer":"The Optoelectronic Component and Method of Producing Same patent (US-9853198) introduces a novel and highly integrated design for optoelectronic components, along with the method for its manufacture. At its core, this invention describes a component featuring a plastic housing that cleverly incorporates a metallic lead frame section, partially embedded within the plastic material. This integrated structure is designed to optimize the performance and reliability of devices that emit or detect light.\n\nA key aspect of this patent is the strategic creation of two distinct recesses on the component's upper surface. One recess is specifically configured to house an optoelectronic semiconductor chip, ensuring excellent thermal and electrical contact with the exposed lead frame. The other recess, while also exposing a section of the lead frame, is intentionally left unpopulated by a semiconductor chip, offering unique flexibility and thermal benefits.\n\nThis innovative approach addresses common challenges in traditional optoelectronic packaging, such as inefficient heat dissipation, mechanical fragility, and complex manufacturing processes. By integrating these elements from the outset, the Optoelectronic Component and Method of Producing Same offers a more robust, compact, and efficient solution for a wide range of electronic applications, setting a new standard for component design and production.","question":"What is Optoelectronic Component and Method of Producing Same?"},{"answer":"The Optoelectronic Component and Method of Producing Same works by leveraging an integrated design that combines the structural protection of a plastic housing with the conductive properties of a lead frame. The manufacturing process involves molding the plastic housing around a pre-formed metallic lead frame, embedding it partially within the plastic material. This creates a monolithic, highly integrated structure.\n\nWithin this structure, two specific recesses are formed on the component's upper side. In the first recess, an optoelectronic semiconductor chip is precisely placed onto an exposed section of the embedded lead frame. This direct contact is vital for two reasons: firstly, it provides a robust electrical connection for the chip to operate, and secondly, it creates an incredibly efficient thermal pathway, allowing heat generated by the chip to dissipate quickly through the highly conductive lead frame.\n\nIn the second recess, another section of the lead frame is also exposed, but this area is deliberately left empty, without a semiconductor chip. These two recesses are kept physically and electrically separate by a section of the plastic housing. This separation, combined with the embedded lead frame, enhances the component's overall thermal management, mechanical durability, and offers significant flexibility for future design iterations or specialized functionalities.","question":"How does Optoelectronic Component and Method of Producing Same work?"},{"answer":"The Optoelectronic Component and Method of Producing Same patent solves several critical problems inherent in traditional optoelectronic component packaging. Firstly, it tackles the challenge of **inefficient thermal management**. Many optoelectronic chips generate significant heat, and traditional packaging methods often have multiple interfaces that impede heat flow, leading to higher operating temperatures, reduced performance, and shortened device lifespan. This innovation provides a direct, highly efficient thermal path from the chip to the embedded lead frame, ensuring cooler operation.\n\nSecondly, the patent addresses issues of **mechanical fragility and reliability**. Discrete component assemblies are often susceptible to physical shock, vibration, and environmental factors like moisture ingress. The integrated, monolithic structure of this invention, with its embedded lead frame within a plastic housing, offers superior mechanical protection and robustness, leading to more durable and reliable devices.\n\nFinally, it resolves problems related to **manufacturing complexity and cost**. Traditional methods involve numerous separate assembly steps, which are labor-intensive, time-consuming, and prone to errors. The method of producing Optoelectronic Component and Method of Producing Same streamlines this process by integrating the lead frame embedding and housing formation, reducing manufacturing costs, increasing production efficiency, and improving overall yield. This patent fundamentally improves how optoelectronic components are built, making them better performing, more reliable, and more economical.","question":"What problem does Optoelectronic Component and Method of Producing Same solve?"},{"answer":"While the provided patent data does not list specific inventors, the \"Optoelectronic Component and Method of Producing Same\" patent (US-9853198) was filed on September 18, 2014, and published on December 26, 2017. The development of such a sophisticated integrated packaging solution typically involves a team of expert engineers and researchers specializing in materials science, semiconductor packaging, and optoelectronics.\n\nThese inventors would have possessed deep knowledge in areas such as polymer chemistry for plastic housing materials, metallurgy for lead frame design, thermal dynamics for heat dissipation optimization, and micro-assembly techniques for chip integration. Their collective expertise would have been crucial in conceiving an architecture that not only addresses the critical performance and reliability challenges of optoelectronic components but also offers a streamlined, cost-effective manufacturing method.\n\nThe innovation reflects a meticulous understanding of the intricate interactions between different materials and processes at the micro-scale, aiming to create a more robust and efficient component. The absence of specific inventor names in the abstract is common for patents assigned to large corporations, where the intellectual property is often developed collaboratively within an R&D department. The assignee, if available, would typically represent the organization that owns the rights to this significant technological advancement in optoelectronic component design.","question":"Who invented Optoelectronic Component and Method of Producing Same?"},{"answer":"The Optoelectronic Component and Method of Producing Same patent offers a multitude of key benefits that significantly improve optoelectronic devices and their manufacturing processes. Firstly, it provides **superior thermal management**. By embedding the lead frame directly into the plastic housing and ensuring direct contact with the semiconductor chip, heat is dissipated much more efficiently. This leads to cooler operating temperatures, which in turn extends the device's lifespan, enhances its performance, and allows for higher power outputs.\n\nSecondly, this innovation delivers **enhanced mechanical robustness and reliability**. The integrated design creates a monolithic structure that is highly resistant to physical shock, vibration, and environmental factors like moisture. This results in more durable components that are less prone to failure, reducing warranty costs and improving overall product quality, particularly crucial for demanding applications.\n\nThirdly, the patent enables **streamlined and cost-effective manufacturing**. The method of producing this component, typically involving advanced molding techniques, reduces the number of discrete assembly steps. This simplification leads to lower labor costs, reduced material waste, faster production cycles, and higher manufacturing yields, ultimately decreasing the per-unit cost of the components. Finally, the design offers **greater design flexibility and potential for miniaturization**. The compact, integrated structure allows for smaller end-products, while the strategic inclusion of an empty second recess provides options for future modularity, additional functionalities, or specialized thermal solutions without requiring a complete package redesign. These benefits collectively make Optoelectronic Component and Method of Producing Same a truly impactful innovation.","question":"What are the key benefits of Optoelectronic Component and Method of Producing Same?"},{"answer":"The Optoelectronic Component and Method of Producing Same distinguishes itself significantly from prior art in optoelectronic packaging through its unique integrated design and manufacturing methodology. Traditionally, components often involved a multi-step assembly where a chip was attached to a lead frame, encapsulated, and then housed. This created multiple interfaces that hindered thermal dissipation and mechanical robustness.\n\nThis patent's primary differentiator is the **integrated embedding of the lead frame within the plastic housing**. Unlike prior art where the lead frame might be a separate element or minimally encapsulated, this invention molds the plastic directly around the lead frame, creating a single, cohesive structure from the outset. This direct integration immediately improves thermal pathways and mechanical strength. Furthermore, the **dual-recess architecture** is a novel aspect. While some prior art might use recesses, the specific configuration of a chip-populated first recess and an *intentionally unpopulated* second recess, both exposing the embedded lead frame and separated by plastic, is a key inventive step. The empty second recess offers a unique level of design flexibility, thermal management options, or modularity that is not typically found in conventional packaging.\n\nIn essence, Optoelectronic Component and Method of Producing Same moves beyond incremental improvements in assembly or material, offering a fundamental redesign of the component's core structure. This results in superior thermal performance, greater mechanical durability, and a more efficient manufacturing process compared to the often fragmented and less integrated approaches of prior art.","question":"How is Optoelectronic Component and Method of Producing Same different from prior art?"},{"answer":"The Optoelectronic Component and Method of Producing Same patent has the potential to significantly impact a wide array of industries that rely on high-performance, compact, and reliable optoelectronic components. The **automotive industry** stands to benefit immensely, particularly in areas like advanced driver-assistance systems (ADAS), LiDAR for autonomous vehicles, and sophisticated LED lighting systems (headlights, taillights, interior lighting) where durability, thermal stability, and miniaturization are paramount. This innovation can lead to brighter, more reliable, and aesthetically integrated automotive lighting solutions.\n\nIn **consumer electronics**, this technology will be crucial for the continued trend of miniaturization and enhanced performance. Devices such as smartphones, wearables, tablets, and AR/VR headsets can become thinner, lighter, and more powerful, with improved battery life due to efficient thermal management. The robustness also means more durable gadgets for everyday use.\n\nThe **industrial sector**, including industrial automation, robotics, and sensors for the Internet of Things (IoT), will find value in the enhanced reliability and compact form factor. Sensors operating in harsh environments will benefit from the improved mechanical protection. Furthermore, **medical devices** requiring precision optical components, such as endoscopes, diagnostic tools, and therapeutic equipment, can leverage this patent for smaller, more robust, and highly accurate instruments. The telecommunications sector, particularly in fiber optics and data centers, could also see applications for more compact and thermally stable optical transceivers. This patent is a foundational technology that can elevate product design and performance across these diverse and demanding markets.","question":"What industries will Optoelectronic Component and Method of Producing Same impact?"},{"answer":"The patent titled \"Optoelectronic Component and Method of Producing Same\" was officially filed on **September 18, 2014**. This date marks when the application was submitted to the patent office, initiating the examination process to determine its novelty, non-obviousness, and utility.\n\nFollowing the examination period, which can involve several rounds of communication between the applicant and the patent examiner, the patent was subsequently granted and published. The publication date for Optoelectronic Component and Method of Producing Same is **December 26, 2017**. On this date, the patent officially became public record, detailing its claims, drawings, and specifications, and granting the patent holder exclusive rights to the invention for a specified period, typically 20 years from the filing date.\n\nThe period between filing and publication demonstrates the thorough process involved in securing intellectual property rights for complex technological innovations. The granted patent signifies that the claims within Optoelectronic Component and Method of Producing Same were deemed novel and inventive by the patent authorities, recognizing its significant contribution to the field of optoelectronic component design and manufacturing.","question":"When was Optoelectronic Component and Method of Producing Same filed/granted?"},{"answer":"The commercial applications of the Optoelectronic Component and Method of Producing Same patent are extensive and diverse, spanning multiple high-growth industries. Its core benefits—superior thermal management, enhanced durability, miniaturization, and cost-effective manufacturing—make it highly desirable for a wide range of products.\n\nIn the **automotive industry**, this technology can be applied to high-brightness LED headlights and taillights, interior ambient lighting, and critical optical sensors for advanced driver-assistance systems (ADAS) and autonomous driving. The robustness ensures reliable operation in harsh automotive environments. For **consumer electronics**, it enables the development of thinner, lighter, and more powerful devices such as smartphones, tablets, smartwatches, and virtual/augmented reality (VR/AR) headsets, where compact and thermally efficient optoelectronic components are essential for performance and user experience.\n\n**Industrial applications** include high-precision optical sensors for automation, machine vision systems, and robust lighting for industrial environments. The enhanced reliability makes these components suitable for demanding operational conditions. In the **medical sector**, the patent's principles can be used for miniaturized endoscopes, diagnostic imaging equipment, and wearable health monitoring devices that require compact, durable, and high-performance optical elements. Furthermore, in **telecommunications**, more efficient and compact optical transceivers could benefit from this packaging approach, contributing to faster and more energy-efficient data networks. The versatility of Optoelectronic Component and Method of Producing Same allows it to be a foundational technology across these lucrative markets.","question":"What are the commercial applications of Optoelectronic Component and Method of Producing Same?"},{"answer":"The Optoelectronic Component and Method of Producing Same patent lays a robust foundation for numerous future developments in integrated electronics. One significant area of expected progress is **enhanced modularity and multi-functionality**. The intentionally unpopulated second recess could evolve into a standardized interface for integrating additional sensors (e.g., temperature, proximity), passive components, or even micro-controllers directly within the same compact package, leading to more intelligent and self-contained 'smart' optoelectronic modules.\n\nAnother key development will be in **advanced thermal management solutions**. While the current design already offers superior thermal performance, future iterations might incorporate micro-fluidic cooling channels or phase-change materials directly within the recesses to handle even higher power densities, pushing the boundaries of what's possible with compact designs. We can also anticipate **further miniaturization and higher integration density**, allowing for the creation of ultra-thin packages and System-in-Package (SiP) solutions where multiple heterogeneous components (e.g., light source, detector, driver IC, processor) are seamlessly integrated into a single, high-performance module.\n\nFurthermore, there will likely be advancements in **material science**, exploring new plastic compounds with even better thermal conductivity, optical properties, or mechanical strength, as well as lead frame alloys optimized for specific applications. The method of producing Optoelectronic Component and Method of Producing Same will continue to drive innovation in efficient and sustainable manufacturing processes, ultimately enabling the next generation of highly compact, reliable, and intelligent electronic devices across all sectors.","question":"What are the future developments expected for Optoelectronic Component and Method of Producing Same?"}],"topics":["optoelectronic component","semiconductor packaging","lead frame","plastic housing","thermal management","quest","enhanced","performance"],"tech_cluster":null},"seo":{"title":"Optoelectronic Component and Method of Producing Same - Patent US-9853198","description":"Discover the Optoelectronic Component and Method of Producing Same patent. Innovative design for integrated optoelectronic devices, enhancing thermal management & manufacturing.","keywords":["optoelectronic component","semiconductor packaging","lead frame","plastic housing","thermal management","manufacturing method","integrated devices","patent US-9853198","electronics innovation","compact design","optoelectronics","device reliability"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853198","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853198","citation_suggestion":"Patentable. \"Optoelectronic component and method of producing same\" (US-9853198). https://patentable.app/patents/US-9853198","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853198","json":"https://patentable.app/api/llm-context/US-9853198","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T18:30:17.757Z"}