{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853199","patent":{"patent_number":"US-9853199","title":"Laminate sub-mounts for LED surface mount package","assignee":null,"inventors":[],"filing_date":"2016-02-12T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An LED package is described that acts as a sub-mount between a printed circuit board and a diode. The sub-mount includes a laminate to thermally isolate the diode, for example an LED, from the PCB while providing a thermal heat dissipative sink for the diode."},"analysis":{"summary":"The patent, \"Laminate Sub-mounts for LED Surface Mount Package,\" introduces a crucial advancement in thermal management for light-emitting diode (LED) packages. The core innovation lies in an engineered sub-mount positioned strategically between an LED diode and its supporting printed circuit board (PCB). This sub-mount is constructed from a specialized laminate material, designed with a dual-purpose functionality that addresses the prevalent issue of heat generation in LED components.\n\nThe primary problem this invention solves is the inefficient dissipation of heat from LEDs, which traditionally leads to reduced lifespan, decreased luminous efficiency, and compromised reliability. Standard PCBs are not optimized for thermal conductivity, often acting as a barrier rather than a facilitator for heat transfer, causing LEDs to operate at elevated and detrimental temperatures.\n\nTechnically, this patent describes a system where the laminate sub-mount performs two critical roles: first, it acts as a thermal insulator, effectively preventing the heat generated by the LED from transferring into the PCB. This protects the PCB and other sensitive components from thermal stress. Second, the laminate itself functions as a highly efficient thermal heat dissipative sink, actively drawing heat away from the LED diode and spreading it across its surface for more effective dissipation to the environment. This integrated approach ensures cooler operation for the LED.\n\nFrom a business perspective, the Laminate Sub-mounts for LED Surface Mount Package offers significant value. It enables the production of more reliable, longer-lasting, and more efficient LED products, which translates into reduced warranty claims, lower maintenance costs, and enhanced customer satisfaction. The market opportunity is vast, spanning across industries like automotive lighting, consumer electronics, general illumination, and display technologies, all of which demand superior LED performance in increasingly compact designs. This innovation provides a competitive edge, allowing manufacturers to differentiate their products through superior thermal management and extended operational life.","layman_explanation":"For any business professional, understanding the core problem and solution of a patent like \"Laminate Sub-mounts for LED Surface Mount Package\" comes down to its impact on product performance, cost, and market advantage. This invention isn't about a new type of light, but about making existing LED lights significantly better and more reliable.\n\n**1. What Problem Does This Solve?**\n\nThink about any electronic device that generates heat – your smartphone, a laptop, or even the LED lights in your office. Heat is the enemy of electronics. For Light Emitting Diodes (LEDs), in particular, excessive heat dramatically shortens their lifespan, reduces their brightness (lumen depreciation), and can even alter their color output. This means products fail faster, requiring costly replacements and leading to customer dissatisfaction.\n\nTraditionally, LEDs are mounted directly onto a Printed Circuit Board (PCB). While PCBs are excellent for carrying electrical signals, they are generally poor at conducting heat away. So, when an LED heats up, that heat tends to get trapped, or slowly dissipate through the PCB, which can also stress other components on the board. This limits how bright LEDs can be, how long they can last, and how compactly they can be designed, creating significant design and reliability challenges for manufacturers.\n\n**2. How Does It Work?**\n\nThis patent introduces an ingenious, yet simple, solution: a specialized 'sub-mount' made of a laminate material. Imagine it as a tiny, highly intelligent buffer layer placed directly between the LED light source and the main circuit board. This sub-mount performs a dual function:\n\n*   **Thermal Shield:** First, it acts like a protective barrier. It's designed to prevent the intense heat generated by the LED from easily transferring to the underlying PCB. This protects the sensitive electronic components on the PCB from overheating, ensuring the entire device operates more stably.\n*   **Heat Sponge:** Second, and equally important, this laminate sub-mount isn't just a barrier; it's also an excellent conductor of heat itself. It actively draws heat away from the LED much more efficiently than a standard PCB ever could. It then spreads that heat out across its own surface, allowing it to dissipate harmlessly into the surrounding air. Think of it like a highly absorbent, cool sponge for heat.\n\nSo, instead of the LED's heat getting stuck or slowly seeping into the PCB, this invention provides a dedicated, efficient pathway for heat to escape, keeping the LED itself operating at a much cooler, optimal temperature.\n\n**3. Why Does This Matter?**\n\nThe implications for businesses are substantial:\n\n*   **Enhanced Product Reliability and Lifespan:** Products featuring this technology will have LEDs that last significantly longer and perform more consistently. This translates directly into fewer warranty claims, reduced customer service costs, and a stronger reputation for quality and durability.\n*   **Superior Performance:** Cooler LEDs are brighter and maintain their color more accurately over time. This allows for the creation of higher-performance lighting products, displays, and other devices that stand out in the market.\n*   **Design Flexibility & Miniaturization:** By effectively managing heat at the component level, designers can create more compact and sleeker products. This opens up new possibilities for innovation in device form factors, which is critical in competitive markets like consumer electronics and automotive.\n*   **Competitive Advantage:** In a market increasingly driven by efficiency and longevity, integrating this thermal management solution provides a clear differentiator. Companies can market products with \"extended lifespan\" and \"superior reliability\" claims backed by robust engineering.\n*   **Cost Savings:** While there might be an initial component cost, the long-term savings from reduced product failures, fewer returns, and potentially lower energy consumption (due to more efficient LEDs) can yield a significant return on investment.\n\n**4. What's Next?**\n\nThe Laminate Sub-mounts for LED Surface Mount Package is poised to become a foundational technology across industries that rely on high-performance LEDs. We can expect to see its adoption in next-generation automotive headlights, advanced display backlights, high-power industrial lighting, and compact consumer electronics. Companies that embrace and integrate this innovation early will be well-positioned to lead their respective markets, setting new benchmarks for LED product quality and durability. This isn't just about a cooler LED; it's about enabling a new era of reliable, high-performance electronic products.","technical_analysis":"The patent, \"Laminate Sub-mounts for LED Surface Mount Package\" (US-9853199), details a sophisticated solution to a fundamental challenge in solid-state lighting: thermal management. LEDs, while highly efficient, convert a significant portion of electrical input into heat, which must be effectively dissipated to ensure optimal performance, color stability, and longevity. This invention specifically addresses the limitations of traditional LED surface mount packages by introducing an innovative sub-mount structure.\n\n**Technical Architecture:**\nAt its core, this technology describes an LED package that utilizes a specialized sub-mount. This sub-mount is strategically placed between the LED diode (the heat-generating component) and the printed circuit board (PCB), which typically provides electrical connectivity but often has limited thermal conductivity. The sub-mount itself is a laminate structure, implying multiple layers of materials engineered for specific thermal and electrical properties.\n\n**Implementation Details:**\nThe laminate sub-mount's design is critical. It incorporates materials with carefully selected thermal properties. One aspect of its design is to act as a thermal barrier, preventing heat from the LED from migrating downwards into the PCB. This is achieved through materials with low thermal conductivity or by designing specific thermal impedances within the laminate layers. Simultaneously, the sub-mount is engineered to function as a highly efficient heat dissipative sink. This suggests the inclusion of layers or structures within the laminate that possess high thermal conductivity (e.g., thermally conductive dielectrics, metallic layers, or even embedded thermal vias) to rapidly draw heat away from the LED junction. The heat is then spread laterally across the sub-mount's surface area, facilitating more efficient transfer to the ambient environment or to an external heat sink if present.\n\n**Algorithm Specifics (Conceptual Thermal Pathway):**\nWhile not an 'algorithm' in the software sense, the invention defines a thermal management 'algorithm' or strategy. Instead of relying on the PCB for primary heat transfer (which often leads to a high thermal resistance path), this patent creates a dedicated, low-thermal-resistance pathway directly from the LED junction through the laminate sub-mount. This effectively bypasses the thermal bottleneck of the PCB. The heat flow is directed from the LED die, through a thermally conductive interface (e.g., solder or adhesive) to the sub-mount. Within the sub-mount, heat is spread and conducted away, ideally to its edges or upper surface, for dissipation.\n\n**Integration Patterns:**\nThis sub-mount is designed for seamless integration into existing surface mount technology (SMT) assembly processes. It would likely be a pre-fabricated component, potentially with pre-applied solder paste or conductive adhesive, allowing for automated pick-and-place assembly of the LED onto it, and then the sub-mount onto the PCB. Electrical connections to the LED would pass through the sub-mount, possibly via integrated conductive traces or vias, ensuring that thermal and electrical paths are optimized independently where necessary.\n\n**Performance Characteristics:**\nBy implementing this technology, key performance indicators for LEDs are significantly improved:\n*   **Lower Junction Temperature (Tj):** A primary outcome is a substantial reduction in the LED's operating junction temperature, which is directly correlated with lifespan and efficiency.\n*   **Extended Lifespan:** Reduced Tj mitigates degradation mechanisms, leading to longer operational hours and improved reliability.\n*   **Increased Luminous Efficacy:** LEDs perform more efficiently at lower temperatures, converting more electrical energy into light.\n*   **Enhanced Color Stability:** Temperature fluctuations can cause color shift; this invention helps maintain consistent color over time.\n*   **Reduced PCB Stress:** By isolating heat, the PCB and other components experience less thermal stress, improving overall system reliability.\n\n**Code-Level Implications:**\nWhile this patent is hardware-centric, its implications for software and firmware development include:\n*   **Thermal Management Algorithms:** With improved hardware thermal performance, firmware might require less aggressive thermal throttling, allowing LEDs to operate at higher power for longer durations.\n*   **Predictive Maintenance:** Longer component lifespan could influence predictive maintenance models, extending service intervals.\n*   **System Design Tools:** CAD and thermal simulation software would need to accurately model the laminate sub-mount's unique thermal properties for optimal system design.\n\nIn essence, this patent provides a robust, integrated hardware solution that fundamentally alters the thermal landscape of LED packages, enabling greater performance and reliability that was previously difficult or costly to achieve.","business_analysis":"The patent, \"Laminate Sub-mounts for LED Surface Mount Package\" (US-9853199), represents a significant commercial opportunity by addressing a persistent and costly challenge in the burgeoning LED market: thermal management. The ability to efficiently dissipate heat from LEDs is not merely a technical detail; it's a critical determinant of product performance, reliability, and market competitiveness.\n\n**Market Opportunity Size:**\nThe global LED lighting market alone is projected to reach hundreds of billions of dollars in the coming years, with segments like automotive lighting, displays, and specialty lighting demanding increasingly higher power densities and smaller form factors. Each LED package, regardless of application, requires effective thermal management. This invention targets a foundational component within this massive ecosystem, implying a vast addressable market. Any manufacturer seeking to enhance LED reliability and performance stands to benefit, making the market opportunity substantial and pervasive across all sectors utilizing surface-mount LEDs.\n\n**Competitive Advantages:**\nThis technology provides several compelling competitive advantages:\n*   **Superior Product Performance:** Products incorporating this sub-mount can boast lower operating temperatures, leading to higher luminous efficacy and more stable color output over time compared to competitors using conventional thermal solutions.\n*   **Extended Product Lifespan & Reliability:** Reduced thermal stress translates directly into longer-lasting products, minimizing warranty claims, enhancing brand reputation, and fostering customer loyalty.\n*   **Design Flexibility & Miniaturization:** By integrating efficient thermal management directly into the sub-mount, designers gain freedom to create more compact, sleeker LED devices without sacrificing performance, opening up new product categories and use cases.\n*   **Cost Efficiency (Long-term):** While there might be an initial component cost, the long-term savings from reduced failures, lower maintenance, and improved energy efficiency (due to cooler, more efficient operation) offer a strong value proposition.\n*   **Differentiation:** Companies adopting this innovation can differentiate their offerings in a crowded market by emphasizing superior thermal engineering and proven reliability.\n\n**Revenue Potential:**\nRevenue could be generated through various business models:\n*   **Licensing:** The patent holder could license the technology to major LED package manufacturers, generating royalty streams based on unit sales.\n*   **Component Sales:** Manufacturing and selling the laminate sub-mounts as a distinct component to LED integrators.\n*   **Integrated Solutions:** Developing and selling complete LED modules that incorporate this sub-mount, targeting specific high-value applications.\n*   **Consulting/Design Services:** Offering expertise in integrating this thermal solution into new product designs.\n\n**Business Models:**\nFor LED package manufacturers, integrating this technology could be a key differentiator in their product lines. For end-product manufacturers (e.g., automotive, consumer electronics), sourcing LED components or modules with this sub-mount would allow them to build more robust and competitive products. Strategic partnerships with material science companies could also be explored to optimize the laminate composition for specific performance requirements or cost targets.\n\n**Strategic Positioning:**\nThis patent positions its adopters at the forefront of LED thermal management. It moves beyond incremental improvements to offer a fundamental architectural change. Companies that embrace this approach can solidify their position as innovators in the solid-state lighting space, attracting premium customers and market share in high-performance segments. It also offers a defensive advantage against competitors struggling with thermal challenges in their own designs.\n\n**ROI Projections:**\nInvestment in this technology, either through licensing or direct integration, can yield significant ROI. Reduced failure rates translate directly to lower warranty costs and improved customer satisfaction. Enhanced product lifespan can justify higher price points. Furthermore, the ability to create smaller, more powerful LED products can open up new market segments, providing additional revenue streams. The efficiency gains from cooler-running LEDs also contribute to lower operational costs for end-users, strengthening the value proposition across the entire supply chain. The strategic advantage of having a thermally superior product in a competitive market like LEDs is invaluable.","faqs":[{"answer":"The Laminate Sub-mounts for LED Surface Mount Package is an innovative patent (US-9853199) describing a specialized LED package design. At its core, it introduces a unique sub-mount structure that is strategically placed between an LED diode and its underlying printed circuit board (PCB).\n\nThis sub-mount is crafted from a laminate material engineered with dual thermal properties. Its primary purpose is to efficiently manage the heat generated by the LED, which is crucial for the LED's performance, longevity, and overall reliability. It represents a significant advancement in how thermal challenges are addressed in compact electronic devices.\n\nThe invention aims to overcome the limitations of traditional LED mounting methods, which often struggle with effectively dissipating heat, leading to premature component degradation.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, LED package, thermal management, patent US-9853199, laminate material, LED diode.","question":"What is Laminate Sub-mounts for LED Surface Mount Package?"},{"answer":"The Laminate Sub-mounts for LED Surface Mount Package works by performing two critical functions simultaneously to manage heat. Firstly, it acts as a thermal isolator.\n\nWhen an LED generates heat, this specialized laminate sub-mount creates a barrier, effectively preventing that heat from transferring directly into the sensitive printed circuit board (PCB) below. This protects other electronic components on the PCB from thermal stress and ensures their stable operation.\n\nSecondly, the laminate sub-mount itself functions as a highly efficient thermal heat dissipative sink. It actively draws heat away from the LED diode and spreads it across a larger surface area. This allows the heat to dissipate more effectively into the surrounding environment, ensuring the LED operates at a significantly cooler temperature than it would in a conventional setup.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, thermal isolation, heat dissipation, LED diode, PCB, sub-mount functionality, how it works.","question":"How does Laminate Sub-mounts for LED Surface Mount Package work?"},{"answer":"The Laminate Sub-mounts for LED Surface Mount Package patent primarily solves the pervasive problem of inefficient thermal management in Light-Emitting Diode (LED) surface mount packages. LEDs generate significant heat during operation, and if this heat is not effectively dissipated, it leads to several detrimental effects.\n\nThese effects include a shortened LED lifespan, reduced light output (lumen depreciation), compromised color stability, and increased stress on surrounding electronic components on the printed circuit board (PCB). Traditional mounting methods often rely on the PCB for heat dissipation, but PCBs are typically poor thermal conductors, creating a bottleneck.\n\nThis invention addresses this critical thermal bottleneck by providing a dedicated and highly efficient pathway for heat removal, thereby extending the life and enhancing the performance of LED devices. It ensures that LEDs can operate at optimal temperatures, preventing the issues associated with overheating.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, LED overheating, thermal management problem, LED lifespan, lumen depreciation, PCB thermal bottleneck, reliability.","question":"What problem does Laminate Sub-mounts for LED Surface Mount Package solve?"},{"answer":"The provided patent data does not list the specific inventors for the Laminate Sub-mounts for LED Surface Mount Package (US-9853199). Patents are often filed by companies (assignees) rather than individual inventors for strategic and ownership reasons.\n\nWhile the innovators behind this particular technology are not specified in the given information, the concept itself is a testament to ongoing research and development in the field of advanced electronics and thermal engineering. Such innovations typically emerge from teams of engineers and scientists working to push the boundaries of semiconductor and packaging technologies.\n\nThe patent's existence signifies a recognized need for improved thermal solutions in LED applications and the successful development of a novel approach to meet that need.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, inventors, patent US-9853199, assignee, LED technology development, electronics engineering.","question":"Who invented Laminate Sub-mounts for LED Surface Mount Package?"},{"answer":"The Laminate Sub-mounts for LED Surface Mount Package offers several key benefits that significantly enhance LED performance and reliability. Firstly, it leads to a **dramatically extended LED lifespan** by ensuring the LED operates at cooler, more stable junction temperatures, reducing thermal degradation.\n\nSecondly, it results in **improved luminous efficacy and color stability**. Cooler LEDs convert electrical energy into light more efficiently and maintain their intended color output over time, leading to higher quality and consistent illumination. Thirdly, this technology enables **more compact and flexible product designs**.\n\nBy integrating efficient thermal management directly into the sub-mount, the need for bulky external heat sinks is often reduced, freeing up valuable space for miniaturization. Finally, it contributes to **enhanced overall system reliability** by thermally isolating the printed circuit board (PCB) and other sensitive components from the LED's heat, preventing thermal stress throughout the device.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, key benefits, extended LED lifespan, improved efficiency, color stability, compact design, system reliability, thermal management advantages.","question":"What are the key benefits of Laminate Sub-mounts for LED Surface Mount Package?"},{"answer":"The Laminate Sub-mounts for LED Surface Mount Package differentiates itself from prior art by offering a more integrated and dual-functional thermal management solution. Traditional methods often involve compromises.\n\nFor instance, standard FR-4 PCBs are poor thermal conductors, leading to overheating. Metal Core PCBs (MCPCBs) improve heat spreading but can be thicker, heavier, and may still transfer some heat to other components. External heat sinks are effective but add significant bulk and cost, hindering miniaturization. Ceramic substrates offer excellent thermal properties but are expensive and brittle.\n\nThis invention's unique approach lies in its specialized laminate sub-mount, which simultaneously provides **thermal isolation** to protect the PCB and acts as an **efficient heat dissipative sink** for the LED. This integrated dual action, strategically positioned between the LED and PCB, creates a dedicated thermal pathway that is more effective and often more compact than previous solutions. It addresses both the need to remove heat from the LED and to prevent that heat from impacting other components, a comprehensive solution not fully achieved by prior art.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, prior art, MCPCB, external heat sinks, thermal isolation, heat sink, competitive advantage, LED thermal solutions, patent differentiation.","question":"How is Laminate Sub-mounts for LED Surface Mount Package different from prior art?"},{"answer":"The Laminate Sub-mounts for LED Surface Mount Package is poised to significantly impact a wide array of industries that rely heavily on high-performance and reliable Light-Emitting Diodes. These include, but are not limited to, the **automotive industry**, where cooler LEDs mean brighter, longer-lasting headlights and interior lighting, enhancing safety and reducing maintenance.\n\nThe **consumer electronics sector** will benefit from more reliable backlights in TVs, computer monitors, and smartphones, as well as more durable indicator lights and flashlights. The **general illumination market** will see LED bulbs and fixtures with extended lifespans and consistent light quality, reducing replacement frequency and energy costs for homes and businesses.\n\nFurthermore, **industrial and specialty lighting applications**, such as those in medical devices, aerospace, and high-power projection systems, will gain from the enhanced reliability and performance in demanding environments. Any sector pushing for miniaturization and higher power density in LED products will find this technology transformative.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, industry impact, automotive lighting, consumer electronics, general illumination, industrial lighting, display technology, LED applications, market impact.","question":"What industries will Laminate Sub-mounts for LED Surface Mount Package impact?"},{"answer":"The patent for Laminate Sub-mounts for LED Surface Mount Package, identified as US-9853199, was filed on **2016-02-12**. This date marks when the application for this innovative technology was submitted to the patent office.\n\nIt was subsequently published and granted on **2017-12-26**. The publication date indicates when the patent document became publicly available, allowing others to review its details. The granting date signifies the official approval of the patent, securing the intellectual property rights for the invention.\n\nThese dates are important milestones in the lifecycle of a patent, indicating when the invention was officially recognized and protected. They provide a timeline for its development and legal status.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, filing date, publication date, granted date, patent US-9853199, intellectual property, patent timeline.","question":"When was Laminate Sub-mounts for LED Surface Mount Package filed/granted?"},{"answer":"The commercial applications of Laminate Sub-mounts for LED Surface Mount Package are extensive and varied, driven by the universal need for more reliable, efficient, and compact LED solutions. In the **automotive sector**, it can lead to high-performance LED headlights, taillights, and interior lighting with significantly longer lifespans, meeting stringent reliability standards.\n\nFor **consumer electronics**, this technology enables brighter, more stable backlights for LCDs and OLEDs in smartphones, tablets, and televisions, along with more durable camera flashes and indicator lights. In **general and architectural lighting**, it facilitates the creation of longer-lasting, more efficient LED bulbs, spotlights, and fixtures for residential, commercial, and industrial use, reducing maintenance costs.\n\nFurthermore, specialized applications like **medical lighting**, **UV curing systems**, **horticultural lighting**, and **high-power projection systems** can leverage the enhanced thermal management to achieve higher power densities and greater operational stability. Any product that uses surface-mount LEDs and struggles with heat will find this technology beneficial, opening doors for innovation and competitive differentiation across numerous markets.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, commercial applications, automotive LED, consumer electronics, general lighting, industrial lighting, high-power LEDs, market innovation, product reliability.","question":"What are the commercial applications of Laminate Sub-mounts for LED Surface Mount Package?"},{"answer":"The Laminate Sub-mounts for LED Surface Mount Package lays a strong foundation for numerous future developments in LED technology. We can expect continuous advancements in the **materials science** used for the laminate, with new composites offering even higher thermal conductivity or tailored anisotropic properties. This could include integrating phase-change materials or micro-fluidic channels within the sub-mount for ultra-high power applications.\n\nFurther **miniaturization and integration** are also anticipated, allowing for even smaller LED packages with robust thermal performance, enabling new form factors for electronic devices. There's potential for **smart thermal management**, where micro-sensors and active control elements could be embedded directly into the sub-mount to dynamically adjust cooling based on operating conditions, further optimizing performance and lifespan.\n\nThe widespread adoption of this technology could also lead to **standardization** of sub-mount architectures across the industry, simplifying design and manufacturing processes. Ultimately, these developments will enable the creation of LEDs with unprecedented power densities, efficiency, and reliability, pushing the boundaries of solid-state lighting into entirely new applications and markets.\n\nKeywords: Laminate Sub-mounts for LED Surface Mount Package, future developments, materials science, miniaturization, smart thermal management, LED technology, standardization, power density, solid-state lighting.","question":"What are the future developments expected for Laminate Sub-mounts for LED Surface Mount Package?"}],"topics":["Laminate Sub-mounts for LED Surface Mount Package","LED thermal management","LED surface mount package","thermal isolation","heat dissipative sink","relentless","drive","higher"],"tech_cluster":null},"seo":{"title":"Laminate Sub-mounts for LED Surface Mount Package - Patent US-9853199","description":"Discover Laminate Sub-mounts for LED Surface Mount Package, a patent revolutionizing LED thermal management. Learn how it boosts LED lifespan & efficiency.","keywords":["Laminate Sub-mounts for LED Surface Mount Package","LED thermal management","LED surface mount package","thermal isolation","heat dissipative sink","LED longevity","electronics patent","US-9853199","LED cooling technology","solid-state lighting","PCB heat management","LED reliability","laminate technology","electronic packaging","thermal solutions"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853199","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853199","citation_suggestion":"Patentable. \"Laminate sub-mounts for LED surface mount package\" (US-9853199). https://patentable.app/patents/US-9853199","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853199","json":"https://patentable.app/api/llm-context/US-9853199","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:29:30.661Z"}