{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853204","patent":{"patent_number":"US-9853204","title":"MEMS component and method for encapsulating MEMS components","assignee":null,"inventors":[],"filing_date":"2013-10-14T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":19,"abstract":"A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures."},"analysis":{"summary":"The patent titled \"Mems Component and Method for Encapsulating Mems Components\" (US-9853204) introduces a novel and highly effective method for packaging micro-electromechanical systems (MEMS) components, addressing critical challenges in reliability and manufacturing efficiency. The core innovation lies in its integrated encapsulation approach.\n\nThe primary problem this invention solves is the vulnerability of delicate MEMS structures to environmental factors like dust and moisture, and the complexity and cost associated with conventional packaging methods. Existing solutions often involve multi-step processes that can lead to lower yields and compromised device performance.\n\nThis technology's key technical approach involves fabricating MEMS component structures on a substrate, alongside metallic column and frame structures. A precisely cured resist layer is then applied to sit on these metallic structures, creating a sealed cavity that completely encloses and protects the component structures. Crucially, a structured metallization layer is provided directly on this resist layer (or an intermediate carrier), forming the external electrical contacts and ensuring robust electrical conductivity to the internal MEMS structures and their contact areas. This integrated design streamlines both the mechanical protection and electrical interconnection.\n\nFrom a business perspective, this patent offers significant value. It promises enhanced reliability and extended lifespan for MEMS devices, which translates into reduced warranty claims and increased customer satisfaction across various applications. The simplified manufacturing process, with fewer steps and higher yields, leads to substantial cost reductions and improved scalability for high-volume production. This approach enables the development of more robust and compact devices, opening new market opportunities.\n\nThe market opportunity for this innovation is vast, spanning industries like consumer electronics, automotive, medical, and industrial IoT, all of which rely heavily on reliable and miniaturized MEMS sensors and actuators. By offering a superior, cost-effective encapsulation solution, this patent positions itself as a foundational technology for the next generation of micro-devices, driving innovation and competitive advantage for manufacturers and product developers.","layman_explanation":"### What Problem Does This Solve?\nImagine you're building a tiny, intricate clockwork mechanism – something incredibly delicate that needs to operate perfectly for years. Now imagine that mechanism needs to survive being exposed to dust, humidity, or even slight bumps. This is the challenge faced by manufacturers of Micro-Electromechanical Systems (MEMS). These tiny devices, found in everything from your smartphone's accelerometer to medical implants and car sensors, are highly susceptible to environmental damage. Traditional methods of 'packaging' or protecting these devices often involve complex, expensive, and multi-step processes. These methods can be unreliable, leading to devices that fail too soon, cost too much to make, or can't be produced in large quantities efficiently. The core business problem is a lack of a reliable, cost-effective, and scalable way to protect these critical micro-components.\n\n### How Does It Work?\nThe **Mems Component and Method for Encapsulating Mems Components** patent introduces a clever and more efficient way to 'seal' these tiny devices. Think of it like this: instead of putting your delicate clockwork into a big, bulky, pre-made box, this invention builds a custom-fit, transparent 'mini-room' directly around it. First, the tiny mechanism (the MEMS component) is placed on a base. Then, tiny metallic 'walls' and 'pillars' are built around it. The really smart part is a special liquid material, called a 'resist layer,' which is precisely applied and hardened over these metallic structures. This hardened layer forms a perfect, sealed roof, creating a protective cavity – a miniature clean room – around the delicate components. What's more, this 'roof' also has integrated pathways that allow the device to connect electrically to the outside world, without needing separate, complicated wiring. It's an all-in-one solution for protection and connectivity.\n\n### Why Does This Matter?\nThis innovation matters immensely for several reasons. Firstly, it dramatically improves the reliability of MEMS devices. Products using this approach will last longer, perform more consistently, and be less prone to failure, which is a huge benefit for industries where reliability is paramount, like automotive safety systems or medical devices. Secondly, it offers significant cost savings and improved manufacturing efficiency. By simplifying the packaging process, manufacturers can reduce material waste, labor costs, and achieve higher production yields. This means more affordable MEMS components, which can drive down the cost of end products. From a market perspective, this patent enables the creation of more robust and compact devices, opening up new opportunities in demanding environments or for highly miniaturized applications. It provides a competitive edge to companies that adopt it, allowing them to deliver superior products at a better price point.\n\n### What's Next?\nThis technology is set to become a foundational element for the next generation of micro-devices. We can expect to see its principles applied in increasingly sophisticated sensors for autonomous vehicles, implantable medical devices with extended lifespans, and more durable, compact consumer electronics. As the demand for miniaturization and reliability continues to grow across industries, this approach to MEMS encapsulation will likely see widespread adoption. For investors, this signals a clear opportunity in companies specializing in advanced packaging solutions or those heavily reliant on high-performance, cost-effective MEMS components. It's a key piece of the puzzle for a future filled with smarter, more resilient tiny technologies.","technical_analysis":"The patent **Mems Component and Method for Encapsulating Mems Components** (US-9853204) describes a sophisticated approach to micro-electromechanical systems (MEMS) packaging that significantly enhances device reliability and manufacturability. The technical architecture is centered on a self-contained, wafer-level encapsulation method that integrates both mechanical protection and electrical interconnection.\n\n**Technical Architecture and Components:**\nThe invention begins with a substrate, which serves as the foundation for the MEMS component. On this substrate, several key structures are fabricated:\n1.  **Component Structures:** These are the active MEMS elements (e.g., accelerometers, gyroscopes, resonators) that require protection.\n2.  **Contact Areas:** Electrically conductive regions on the substrate connected to the component structures, facilitating signal input/output.\n3.  **Metallic Column Structures:** These are built on the contact areas. They serve as vertical electrical conduits and provide mechanical support for the subsequent layers.\n4.  **Metallic Frame Structures:** These surround the component structures, forming a perimeter. They contribute to the mechanical rigidity of the package and act as a sealing boundary.\n\n**Implementation Details – The Encapsulation Process:**\nThe core of this innovation lies in the precise application and structuring of a cured resist layer. This layer is seated directly on both the metallic frame structures and the metallic column structures. The critical aspect here is that this resist layer, in conjunction with the substrate and the metallic frame, defines and encloses a hermetically-like sealed cavity. This cavity is vital for isolating the delicate MEMS component structures from environmental contaminants like moisture, dust, and particulate matter, as well as providing mechanical protection.\n\n**Structured Metallization and Interconnection:**\nFollowing the formation of the resist layer and cavity, a structured metallization layer is introduced. This metallization can be applied either directly onto the cured resist layer or onto a carrier layer that is itself seated on the resist. This structured metallization serves two primary functions:\n1.  **External Contacts:** It forms the external electrical pads of the MEMS component, allowing it to be connected to other circuitries or a larger package.\n2.  **Electrical Conductivity:** It is electrically conductively connected to both the metallic column structures (which are in turn connected to the component's contact areas) and potentially to the metallic frame structures. This creates a seamless, integrated electrical path from the internal MEMS component structures to the external contacts, without compromising the integrity of the sealed cavity.\n\n**Algorithm Specifics (Process Flow):**\nThe process flow conceptually involves:\n*   MEMS fabrication on substrate.\n*   Deposition and patterning of metallic column and frame structures.\n*   Application and patterning of a photoresist (or similar polymer) layer, followed by curing. The resist patterning precisely defines the cavity and its sealing points on the metallic structures.\n*   Deposition and patterning of the structured metallization layer on the cured resist, ensuring electrical contact with the underlying metallic columns/contact areas.\n\n**Integration Patterns and Performance Characteristics:**\nThis approach represents a significant step towards true wafer-level packaging (WLP) for MEMS devices. The integrated nature of the encapsulation and interconnection minimizes the need for complex, separate bonding steps, which are often sources of yield loss and reliability issues in traditional packaging. By creating a robust, self-contained unit, the device exhibits improved performance characteristics:\n*   **Enhanced Hermeticity:** The resist layer, when properly cured and adhered, can provide a high level of environmental protection, crucial for long-term device stability.\n*   **Reduced Package Footprint:** Integrating the sealing and electrical layers into a single process reduces the overall size and thickness of the encapsulated MEMS component.\n*   **Improved Electrical Performance:** Shorter, more direct electrical paths from the component to external contacts can reduce parasitic capacitance and inductance, beneficial for high-frequency MEMS or sensitive sensor applications.\n*   **Higher Manufacturing Yields:** The streamlined process, with fewer critical alignment and bonding steps, generally leads to a higher percentage of functional devices per wafer.\n\n**Code-Level Implications (Manufacturing Automation):**\nWhile not directly involving 'code' in the software sense, the implications for manufacturing automation are profound. This approach lends itself well to highly automated, precise photolithographic and deposition techniques common in semiconductor fabrication. The reproducibility of the resist patterning and metallization steps can be tightly controlled, making it ideal for large-scale, high-volume production lines. This allows for greater predictability and efficiency in MEMS device manufacturing, reducing human intervention and potential for error.","business_analysis":"The patent **Mems Component and Method for Encapsulating Mems Components** (US-9853204) represents a significant advancement in micro-electromechanical systems (MEMS) packaging, carrying substantial implications for various industries and offering compelling business opportunities.\n\n**Market Opportunity Size:**\nThe global MEMS market is projected to reach tens of billions of dollars within the next few years, driven by the proliferation of IoT devices, automotive electronics, healthcare wearables, and advanced consumer electronics. A critical bottleneck in this growth has been the reliable and cost-effective packaging of delicate MEMS components. This patent directly addresses this bottleneck, opening up a massive market opportunity for manufacturers who can leverage this technology. By enabling more durable and affordable MEMS, it expands the addressable market for a wide range of applications, especially in harsh environments or long-lifecycle products.\n\n**Competitive Advantages:**\nThis innovative encapsulation method offers several distinct competitive advantages:\n1.  **Superior Reliability:** The sealed cavity formed by the cured resist layer provides enhanced protection against environmental factors (moisture, dust, mechanical stress), leading to longer device lifetimes and reduced failure rates. This is a crucial differentiator in markets demanding high reliability, such as automotive and medical.\n2.  **Cost Efficiency:** By streamlining the packaging process, reducing the number of manufacturing steps, and improving yields, the invention significantly lowers the per-unit cost of MEMS devices. This cost advantage can be passed on to consumers or reinvested, enabling more aggressive pricing strategies or higher profit margins.\n3.  **Miniaturization:** The integrated nature of the packaging and electrical contacts allows for smaller, more compact MEMS devices, meeting the ever-increasing demand for miniaturization in consumer electronics and wearables.\n4.  **Faster Time-to-Market:** Simplified manufacturing processes can accelerate product development cycles, allowing companies to bring new MEMS-enabled products to market more quickly.\n\n**Revenue Potential and Business Models:**\nCompanies adopting this technology could realize revenue growth through:\n*   **Licensing:** Patent holders could license the technology to MEMS manufacturers globally, generating significant royalty income.\n*   **Improved Product Offerings:** Manufacturers could introduce new lines of 'ruggedized' or 'ultra-reliable' MEMS devices at premium price points.\n*   **Cost Leadership:** By reducing production costs, companies can gain market share by offering competitively priced MEMS components without sacrificing quality.\n*   **Foundry Services:** Specialized foundries could offer advanced MEMS packaging services based on this patent, attracting clients seeking cutting-edge solutions.\n\n**Strategic Positioning:**\nThis patent allows companies to strategically position themselves as leaders in advanced MEMS packaging. By offering a solution that addresses both reliability and cost, they can become preferred suppliers for industries with stringent quality requirements. It enables a move from simply selling MEMS components to providing integrated, high-value, encapsulated solutions. Furthermore, it strengthens intellectual property portfolios, creating barriers to entry for competitors relying on older, less efficient packaging methods.\n\n**ROI Projections:**\nInvestment in R&D and manufacturing infrastructure to implement this technology could yield substantial returns. Reduced scrap rates due to higher yields, decreased warranty costs from improved reliability, and expanded market reach due to competitive pricing and enhanced product features all contribute to a strong return on investment. For example, a 5-10% improvement in manufacturing yield coupled with a 20% reduction in field failures could lead to millions in savings and increased revenue annually for a high-volume MEMS producer. The ability to enter new, demanding markets with robust products also promises significant long-term growth and profitability.","faqs":[{"answer":"The **Mems Component and Method for Encapsulating Mems Components** is a patent (US-9853204) that describes an innovative method for packaging micro-electromechanical systems (MEMS) devices. It focuses on creating a robust, self-contained protective enclosure directly on the MEMS component itself.\n\nThis invention introduces a novel way to shield delicate micro-structures from environmental factors like dust, moisture, and mechanical stress. It achieves this by using a specialized cured resist layer to form a sealed cavity around the MEMS component, which is built on a substrate with metallic support structures.\n\nCrucially, this technology also integrates the electrical connections into the packaging design. A structured metallization layer is applied on the resist layer, providing external contacts that are electrically linked to the internal MEMS structures. This integrated approach simplifies manufacturing while significantly enhancing the reliability and performance of the encapsulated device.\n\nEssentially, this patent provides a more efficient, reliable, and scalable solution for protecting the tiny, intricate components that power much of our modern technology, from smartphones to medical devices.","question":"What is Mems Component and Method for Encapsulating Mems Components?"},{"answer":"The **Mems Component and Method for Encapsulating Mems Components** works by building a custom-fit, protective environment directly around the delicate MEMS structures. First, the MEMS component structures are fabricated on a base, known as a substrate. Alongside these, metallic column structures are built on electrical contact areas, and metallic frame structures are created to surround the component.\n\nNext, a key step involves applying a liquid 'resist layer' that is then hardened, or 'cured.' This cured resist layer is precisely seated on top of both the metallic frame and column structures. This strategic placement, along with the substrate and the metallic frame, creates a completely sealed cavity around the MEMS component. This cavity acts as a miniature, hermetic-like cleanroom, effectively isolating the sensitive micro-structures from external contaminants and physical damage.\n\nFinally, a 'structured metallization' layer is applied directly onto this cured resist layer. This metallization serves two critical purposes: it forms the external electrical contacts for the MEMS device, and it is electrically connected to the internal metallic column structures (and thus to the MEMS component's contact areas). This integrated design ensures both robust environmental protection and seamless electrical connectivity within a compact package.","question":"How does Mems Component and Method for Encapsulating Mems Components work?"},{"answer":"The **Mems Component and Method for Encapsulating Mems Components** addresses a critical and long-standing problem in the micro-electromechanical systems (MEMS) industry: the reliable and cost-effective encapsulation of delicate micro-devices.\n\nTraditional MEMS packaging methods often face several challenges: they can be complex, involving multiple bonding steps and materials, leading to high manufacturing costs and lower production yields. Furthermore, these methods sometimes provide insufficient protection against environmental factors like moisture, dust, and mechanical stress, which can lead to premature device failure or performance degradation.\n\nThis patent solves these issues by offering a simplified, integrated, and highly effective encapsulation solution. It provides a robust sealed cavity that protects MEMS components while also streamlining the electrical interconnection process. This leads to devices with enhanced reliability, longer lifespans, and reduced manufacturing costs, ultimately enabling wider adoption and new applications for MEMS technology in various industries.","question":"What problem does Mems Component and Method for Encapsulating Mems Components solve?"},{"answer":"The patent **Mems Component and Method for Encapsulating Mems Components** (US-9853204) lists its inventors as those who developed this innovative encapsulation technology. While specific inventor names are not provided in the prompt, the invention stems from dedicated research and development efforts within the field of micro-electromechanical systems (MEMS) and semiconductor packaging.\n\nTypically, such groundbreaking patents are the result of collaboration among experts in materials science, micro-fabrication, electrical engineering, and mechanical engineering. These individuals work to overcome significant technical challenges in creating highly reliable and efficient micro-devices.\n\nThe development of this technology reflects a deep understanding of MEMS physics and advanced manufacturing processes, aimed at pushing the boundaries of miniaturization and device robustness. The impact of such an invention is often felt across the entire industry, improving product quality and enabling new applications.","question":"Who invented Mems Component and Method for Encapsulating Mems Components?"},{"answer":"The **Mems Component and Method for Encapsulating Mems Components** offers several significant benefits that are transforming the MEMS industry.\n\nFirstly, it provides **enhanced reliability and durability**. The sealed cavity created by the cured resist layer offers superior protection against environmental factors such as moisture, dust, and mechanical shock. This leads to longer device lifespans, reduced field failures, and increased overall product robustness, which is crucial for critical applications in automotive, medical, and industrial sectors.\n\nSecondly, the technology leads to **simplified manufacturing and cost efficiency**. By integrating the encapsulation and electrical interconnection into fewer process steps, it reduces manufacturing complexity, lowers material waste, and improves production yields. This translates into substantial cost savings per unit, making advanced MEMS components more affordable and accessible for high-volume production.\n\nFinally, this innovation enables **greater miniaturization and improved performance**. The integrated design results in a smaller package footprint, allowing for more compact devices. The direct and robust electrical connections also minimize parasitic effects, which can enhance the electrical performance of sensitive MEMS components, opening doors for new, high-performance applications in consumer electronics and beyond. These benefits collectively provide a strong competitive advantage for manufacturers utilizing this patent.","question":"What are the key benefits of Mems Component and Method for Encapsulating Mems Components?"},{"answer":"The **Mems Component and Method for Encapsulating Mems Components** distinguishes itself from prior art through several key innovations in MEMS packaging. Traditional methods often rely on complex, multi-step processes like anodic bonding, glass frit bonding, or the use of ceramic/metal packages, each with its own limitations regarding cost, size, thermal budget, and hermeticity.\n\nOne major difference is the **integrated cavity formation using a single resist layer**. Unlike prior art that might use separate cap wafers or multiple bonding materials, this invention uses a precisely patterned and cured resist layer seated on metallic structures to directly form the sealed protective cavity. This dramatically simplifies the process flow and reduces the number of interfaces where defects could occur.\n\nAnother distinction lies in the **multi-functional metallic structures and direct electrical interconnection**. The metallic columns and frames not only provide structural support for the resist layer but also serve as integral electrical pathways. The structured metallization on the resist layer directly connects to these internal structures, eliminating the need for complex through-silicon vias or separate wire bonding steps often found in other wafer-level packaging techniques. This integration reduces package footprint, improves electrical performance by minimizing parasitic effects, and enhances overall reliability by reducing potential failure points. This holistic approach offers a more efficient, reliable, and scalable solution compared to the fragmented processes of prior art.","question":"How is Mems Component and Method for Encapsulating Mems Components different from prior art?"},{"answer":"The **Mems Component and Method for Encapsulating Mems Components** patent is poised to significantly impact a wide array of industries that rely heavily on reliable, miniaturized micro-electromechanical systems (MEMS).\n\n**Consumer Electronics:** This includes smartphones, wearables, tablets, and smart home devices. Improved MEMS encapsulation means more durable accelerometers, gyroscopes, microphones, and pressure sensors, leading to more robust products that can withstand everyday wear and tear, and potentially enabling new functionalities in smaller form factors.\n\n**Automotive:** Critical for advanced driver-assistance systems (ADAS), airbag deployment, engine management, and vehicle stability control, automotive MEMS sensors demand extreme reliability in harsh environments. This technology will lead to more dependable sensors that can endure high temperatures, vibrations, and moisture, enhancing vehicle safety and performance.\n\n**Medical Devices:** For implantable sensors, diagnostic tools, and drug delivery systems, long-term reliability and biocompatibility are paramount. This patent enables the creation of more robust and long-lasting medical MEMS, improving patient care and expanding the possibilities for advanced medical interventions.\n\n**Industrial IoT and Aerospace/Defense:** In challenging environments like factories, remote infrastructure, or extreme aerospace conditions, sensors need to be exceptionally durable. This innovation will facilitate the deployment of highly reliable MEMS for monitoring, control, and navigation systems, reducing maintenance costs and improving operational efficiency. The widespread applicability of this technology makes it a foundational patent for future advancements across these diverse sectors.","question":"What industries will Mems Component and Method for Encapsulating Mems Components impact?"},{"answer":"The patent for **Mems Component and Method for Encapsulating Mems Components** has a documented timeline for its filing and publication.\n\nThe patent application for this innovation was **filed on October 14, 2013**. This marks the initial date when the inventors submitted their detailed description of the invention to the patent office, establishing their claim to the technology.\n\nFollowing the examination process, the patent was subsequently **published and granted on December 26, 2017**. The publication date signifies when the patent became publicly accessible, detailing its claims and specifications. The granting date confirms the legal protection afforded to the inventors for their unique method of MEMS component encapsulation.\n\nThis timeline highlights the multi-year process involved in securing intellectual property rights for complex technological innovations like the **Mems Component and Method for Encapsulating Mems Components**, underscoring the thorough evaluation and validation it underwent by the patent authorities.","question":"When was Mems Component and Method for Encapsulating Mems Components filed/granted?"},{"answer":"The commercial applications of **Mems Component and Method for Encapsulating Mems Components** are extensive, touching nearly every sector that utilizes micro-electromechanical systems (MEMS).\n\nIn **consumer electronics**, this technology can lead to more durable and water-resistant smartphones, tablets, and wearables, as accelerometers, gyroscopes, and microphones become better protected. This enhances product longevity and user experience, reducing warranty claims.\n\nFor the **automotive industry**, it enables the development of highly reliable sensors crucial for advanced safety systems (e.g., airbag deployment, electronic stability control), engine management, and emerging autonomous driving technologies. These sensors must perform flawlessly under extreme temperature, vibration, and moisture conditions, making this encapsulation method invaluable.\n\nIn **medical devices**, the patent supports the creation of long-lasting and robust implantable sensors (e.g., for continuous glucose monitoring, pressure sensing) and diagnostic tools. Enhanced reliability is critical for patient safety and device efficacy in biological environments.\n\n**Industrial IoT (IIoT)** benefits from more rugged sensors for condition monitoring in factories, smart infrastructure, and environmental sensing. Devices protected by this technology can withstand harsh industrial settings, reducing downtime and maintenance costs. Furthermore, it facilitates **aerospace and defense** applications where components must survive extreme operating conditions.\n\nUltimately, this patent empowers manufacturers to produce higher-quality, more reliable, and cost-effective MEMS devices, opening new market segments and driving innovation across diverse commercial landscapes.","question":"What are the commercial applications of Mems Component and Method for Encapsulating Mems Components?"},{"answer":"The **Mems Component and Method for Encapsulating Mems Components** patent provides a robust foundation for future advancements in micro-device packaging and performance. Several key developments are anticipated as this technology evolves.\n\nFirstly, there will likely be continued research into **novel resist materials**. This could involve developing resist layers with even superior barrier properties against a wider range of chemicals and gases, or materials that offer enhanced mechanical flexibility without compromising hermeticity. Integration of self-healing properties into the resist layer could also emerge, further extending device lifespan.\n\nSecondly, **advanced metallization schemes** are expected. Future developments might focus on optimizing the structured metallization for higher frequency applications (e.g., RF-MEMS) or for integrating more complex electrical functions directly within the encapsulation layer. This could include embedded passive components or even active circuitry, leading to 'smart' encapsulated modules.\n\nFinally, the principles of this invention could be extended to **heterogeneous integration**. This means packaging different types of micro-devices (e.g., MEMS with integrated circuits or photonics) within the same robust, resist-based cavity. This would enable highly compact and multi-functional systems, pushing the boundaries of miniaturization and system-on-chip capabilities. The **Mems Component and Method for Encapsulating Mems Components** is not just a solution for today but a springboard for the next generation of resilient and intelligent micro-systems.","question":"What are the future developments expected for Mems Component and Method for Encapsulating Mems Components?"}],"topics":["MEMS encapsulation","micro-electromechanical systems","resist layer packaging","structured metallization","semiconductor packaging","technical","background","micro"],"tech_cluster":null},"seo":{"title":"MEMS Component Encapsulation - Patent US-9853204","description":"Discover the Mems Component and Method for Encapsulating Mems Components patent (US-9853204) for robust, cost-effective MEMS packaging. Enhanced reliability & manufacturing efficiency.","keywords":["MEMS encapsulation","micro-electromechanical systems","resist layer packaging","structured metallization","semiconductor packaging","MEMS reliability","patent US-9853204","wafer-level packaging","micro-device protection","H01L"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853204","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853204","citation_suggestion":"Patentable. \"MEMS component and method for encapsulating MEMS components\" (US-9853204). https://patentable.app/patents/US-9853204","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853204","json":"https://patentable.app/api/llm-context/US-9853204","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:31:00.686Z"}