{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853209","patent":{"patent_number":"US-9853209","title":"Method of manufacturing pressure sensor, deposition system, and annealing system","assignee":null,"inventors":[],"filing_date":"2015-03-18T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A method of manufacturing a pressure sensor comprises: above a film portion formed on one surface of a substrate, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers on one surface of a substrate; removing the deposited layers leaving a part thereof; and removing a part of the substrate from another surface of the substrate. By removing the deposited layers leaving a part thereof, a strain detecting element is formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer. By removing a part of the substrate, a part of the first region of the substrate is removed. In addition, the deposition of the first magnetic layer is performed with the substrate being bended."},"analysis":{"summary":"The patent **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** (US-9853209) introduces a groundbreaking manufacturing process for creating highly precise and durable pressure sensors. At its core, the innovation lies in a multi-stage fabrication technique that meticulously controls the deposition and structural formation of the sensor's active elements.\n\nThe primary problem this patent solves is the inherent difficulty in manufacturing pressure sensors with consistent, high-level precision and robustness, especially when dealing with the delicate interplay of magnetic layers and substrate mechanics. Traditional methods often result in compromises between sensitivity, stability, and manufacturability, leading to higher defect rates and limited performance in demanding applications.\n\nThe key technical approach involves several critical steps. First, a first magnetic layer, a second magnetic layer, and an intermediate layer are deposited onto one surface of a substrate. Uniquely, the deposition of the first magnetic layer is performed while the substrate is intentionally bent. This strategic bending is crucial for inducing and controlling specific internal stresses within the magnetic films, which directly enhances the magneto-elastic properties and, consequently, the sensor's sensitivity and linearity. Following deposition, specific portions of these layers are removed to precisely form the strain detecting element. Simultaneously, a part of the substrate is removed from its opposing surface, creating a finely tuned, flexible diaphragm that responds optimally to pressure changes.\n\nFrom a business perspective, this invention offers significant value. It enables the production of superior pressure sensors that are more accurate, stable, and durable, opening up new markets and applications in sectors like automotive, medical devices, industrial automation, and consumer electronics. Companies adopting this technology can achieve higher manufacturing yields, reduce production costs associated with defects, and differentiate their products through enhanced performance. The ability to engineer sensors with such precise internal mechanics translates directly into improved product reliability and user experience.\n\nThe market opportunity for this technology is substantial, given the ever-increasing demand for advanced sensing capabilities in the Internet of Things (IoT), smart cities, and autonomous systems. This patent positions its implementers at the forefront of precision sensor manufacturing, offering a competitive advantage in a rapidly expanding global market for high-performance sensing solutions.","layman_explanation":"### 1. What Problem Does This Solve?\nImagine you're trying to build a tiny, super-sensitive scale that can measure the weight of a feather, perfectly, every single time, even if it's used in a hot kitchen or a cold factory. Current methods for making these delicate 'scales' (which are actually pressure sensors) often fall short. They might not be precise enough, break easily, or give inconsistent readings, especially under different conditions. This means that important devices, from car safety systems to medical monitors, might not be as reliable or accurate as we need them to be. The core problem is finding a way to consistently build these miniature sensing components with both extreme precision and robust durability, without making them too expensive to produce.\n\n### 2. How Does It Work?\nThis patent, titled **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System**, introduces a clever, multi-step process. Think of it like this: you're trying to build a very special, tiny trampoline that can 'feel' pressure. \n\nFirst, you take a very thin, flat piece of material, like a wafer (called a 'substrate'). Instead of just laying it flat, you *gently bend it* into a slight curve. While it's bent, you carefully 'paint' on several super-thin layers of special magnetic material. The key insight here is that *bending the wafer while painting* makes the magnetic material settle in a way that gives it incredible sensing capabilities – it's like pre-tuning a guitar string so it sounds perfect from the start. This controlled bending allows the internal structure of the magnetic layers to be optimized for detecting even the slightest changes in pressure. \n\nAfter the layers are 'painted' on, you then use very precise tools to 'cut out' the exact shape of your sensing element from these layers. It's like using a cookie cutter to get the perfect shape. Finally, from the *other side* of the wafer, you carefully remove some material to create a thin, flexible 'trampoline' underneath your magnetic sensing element. This trampoline will be the part that physically bends when pressure is applied, and the pre-tuned magnetic layers will then accurately translate that bend into an electrical signal.\n\n### 3. Why Does This Matter?\nThis innovation matters because it allows us to build pressure sensors that are significantly more accurate, more reliable, and more consistent than what current methods can achieve. For businesses, this translates into several key advantages:\n\n*   **Higher Quality Products:** Companies can embed these superior sensors into their products (e.g., medical devices, industrial machinery, consumer electronics), leading to better performance, fewer errors, and enhanced user trust.\n*   **Competitive Edge:** Being able to offer products with 'next-generation' sensing capabilities provides a strong differentiator in competitive markets.\n*   **Reduced Costs in the Long Run:** While the initial setup might involve specialized equipment, the improved consistency and reduced defect rates in manufacturing can lead to higher production yields and less waste, ultimately lowering the cost per high-performance unit.\n*   **New Market Opportunities:** The enhanced capabilities of these sensors can enable entirely new applications that were previously impossible due to limitations in sensor performance or durability. Imagine new forms of robotic touch, advanced health monitoring, or ultra-precise environmental controls.\n\n### 4. What's Next?\nThis patent lays a foundational brick for the next generation of smart technology. We can expect to see this kind of advanced pressure sensor manufacturing enabling breakthroughs in areas like autonomous vehicles (more reliable tire pressure and brake force sensing), wearable health monitors (more accurate vital signs), and smart factories (precise process control). As the demand for interconnected, intelligent systems grows, the **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** will be a key enabler, pushing the boundaries of what's possible in sensing technology and driving significant investment and innovation in microfabrication and advanced materials.","technical_analysis":"The patent **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** (US-9853209) details an innovative fabrication method for pressure sensors, focusing on a unique approach to thin-film deposition and structural engineering. The core technical innovation revolves around controlling the mechanical and magneto-elastic properties of the sensing element through a precisely orchestrated manufacturing sequence.\n\n**Technical Architecture and Implementation Details:**\nThe process begins with a substrate, typically a silicon wafer, onto which a film portion is formed. The critical steps involve the sequential deposition of three distinct layers: a first magnetic layer, an intermediate layer, and a second magnetic layer. These layers are deposited onto one surface of the substrate. The specific materials for these magnetic layers would typically be ferromagnetic alloys (e.g., NiFe, CoFe) known for their magneto-resistive properties, while the intermediate layer could be a non-magnetic conductive or insulating material to facilitate exchange coupling or provide electrical isolation, respectively.\n\nThe most significant departure from conventional methods is the **deposition of the first magnetic layer while the substrate is intentionally bent.** This is not a trivial step; it requires a specialized deposition system capable of holding and manipulating the substrate in a controlled, non-planar configuration during the film growth. The bending induces a predefined mechanical stress into the nascent magnetic layer. This pre-stressing is crucial because it allows for the tuning of the film's anisotropy and magneto-elastic coupling coefficient. By controlling the residual stress, the sensitivity and linearity of the subsequent strain-detecting element can be optimized. For instance, a tensile pre-stress might enhance the response to compressive external strains, or vice-versa, depending on the desired operating characteristics.\n\nFollowing the layered deposition, **selective removal** techniques are applied. This involves removing specific portions of the deposited layers to define the geometry of the strain detecting element. This could be achieved using photolithography and etching processes (e.g., reactive ion etching, wet chemical etching). The precision of this step is paramount for achieving the desired electrical resistance change upon strain application and for minimizing crosstalk or unwanted parasitic effects. The resulting strain detecting element, comprising the first magnetic layer, the second magnetic layer, and the intermediate layer, is configured to accurately transduce mechanical strain into an electrical signal.\n\nConcurrently or subsequently, **a part of the substrate is removed from its opposing surface.** This step creates a thin, deformable diaphragm or membrane in the region underlying the strain detecting element. Techniques like deep reactive ion etching (DRIE) or wet anisotropic etching are typically employed here. The thickness and geometry of this diaphragm are critical for determining the sensor's pressure range, sensitivity, and mechanical resonance frequency. The careful integration of the pre-stressed magnetic layers with this precisely thinned diaphragm ensures optimal mechanical coupling and electromechanical transduction.\n\n**Algorithm Specifics and Performance Characteristics:**\nWhile the patent doesn't describe 'algorithms' in the software sense, the manufacturing sequence itself represents a precise 'process algorithm.' The core 'algorithm' here is the controlled application and removal of materials under specific mechanical conditions. The bending parameter (radius of curvature, applied force) during deposition is a critical input that directly affects the output performance. The desired performance characteristics—such as high sensitivity (change in resistance per unit pressure), low hysteresis, excellent linearity, and broad operating temperature range—are direct consequences of the optimized stress states within the magnetic films and the mechanical design of the diaphragm.\n\n**Integration Patterns and Code-Level Implications:**\nFrom an integration perspective, this manufacturing method produces highly optimized pressure sensor dies. These dies can then be integrated into larger MEMS packages, hybrid circuits, or directly onto system-on-chip (SoC) solutions. The improved intrinsic performance of the sensor element reduces the burden on downstream signal conditioning and calibration electronics. While there are no direct 'code-level implications' for *this manufacturing patent*, the enhanced sensor output will simplify the algorithms used in sensor fusion, data interpretation, and control systems that rely on pressure data. It allows for more robust data acquisition and potentially simpler compensation algorithms for environmental variables.\n\n**Performance Characteristics:**\nThe key performance characteristics improved by this method include: \n1.  **Enhanced Sensitivity:** Controlled internal stresses improve the magneto-elastic coupling.\n2.  **Improved Linearity:** Optimized stress distribution leads to a more linear response over the operating range.\n3.  **Reduced Hysteresis:** Precise material and structural control minimizes energy loss during loading/unloading cycles.\n4.  **Increased Durability:** The controlled stress state can lead to more robust films, less prone to fatigue or delamination.\n5.  **Miniaturization Potential:** The precision of deposition and removal allows for smaller active areas.\n\nThis patent provides a robust framework for developing next-generation pressure sensors, addressing fundamental limitations of current manufacturing techniques by introducing a novel, integrated approach to material and mechanical engineering at the micro-scale.","business_analysis":"The patent **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** (US-9853209) represents a significant advancement in pressure sensor fabrication, carrying substantial implications for various industries and offering compelling business opportunities. This innovation addresses critical pain points in sensor manufacturing, promising enhanced performance and potentially more cost-effective production at scale.\n\n**Market Opportunity Size:**\nThe global pressure sensor market is robust and rapidly expanding, projected to reach tens of billions of dollars by the end of the decade. Key drivers include the proliferation of IoT devices, growth in automotive electronics (ADAS, TPMS, engine management), medical diagnostics, industrial automation, and smart home applications. This patent's ability to produce more accurate, reliable, and durable sensors positions it perfectly to capture a premium segment of this market, particularly in applications where precision and long-term stability are paramount. Niche markets requiring high-performance sensors, such as aerospace, defense, and high-precision scientific instruments, will also see substantial benefits.\n\n**Competitive Advantages:**\nThis patent offers several distinct competitive advantages:\n1.  **Superior Performance:** The unique substrate bending during magnetic layer deposition allows for unprecedented control over internal stresses, leading to sensors with enhanced sensitivity, linearity, and reduced hysteresis. This directly translates to higher-quality data and more reliable system performance.\n2.  **Increased Durability and Reliability:** Optimized internal stress profiles can lead to more robust sensor elements, extending operational lifespan and reducing maintenance costs, which is a critical factor in industrial and automotive applications.\n3.  **Manufacturing Efficiency:** While initially requiring specialized equipment, the integrated and controlled nature of the process can lead to higher manufacturing yields and reduced post-production calibration efforts, ultimately lowering the cost per high-performance unit compared to traditional, less precise methods.\n4.  **Differentiation:** Companies leveraging this patented method can differentiate their products in a crowded market, offering 'next-generation' sensors that outperform competitors on key metrics.\n\n**Revenue Potential and Business Models:**\nRevenue potential can be realized through several business models:\n1.  **Direct Manufacturing and Sales:** A company could establish itself as a leading manufacturer of high-performance pressure sensors for OEM clients in target industries.\n2.  **Licensing:** The patent holder could license the manufacturing methodology to existing sensor manufacturers, generating significant royalty streams. This would allow broader market penetration without heavy capital investment in manufacturing facilities.\n3.  **Joint Ventures/Partnerships:** Collaborating with established players in automotive, medical, or industrial sectors could accelerate market adoption and co-develop specialized sensor solutions.\n4.  **Foundry Services:** Offering specialized fabrication services for custom sensor designs using this advanced method.\n\n**Strategic Positioning:**\nThis technology strategically positions its adopters at the forefront of advanced materials and microfabrication. It moves beyond incremental improvements, offering a foundational shift in how pressure sensors are conceived and produced. Companies can leverage this innovation to become leaders in specific high-value segments, driving new product development and setting new industry standards. Its focus on foundational manufacturing processes means it can serve as an enabling technology for a wide array of future sensor-driven innovations.\n\n**ROI Projections:**\nInvestment in implementing this manufacturing method, whether through R&D or licensing, is likely to yield strong returns. The ability to produce superior sensors will command higher prices in premium markets. Furthermore, reduced defect rates and improved manufacturing efficiency will lower operational costs. For instance, a 10-20% improvement in sensor accuracy or a 50% reduction in field failures for automotive sensors could translate into millions in savings for end-users, justifying a significant premium for sensors produced using this technology. The long-term ROI is also bolstered by the potential for new market creation, as the enhanced sensor capabilities enable entirely new applications not feasible with current technology.","faqs":[{"answer":"The **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** (US-9853209) is a patented manufacturing process designed to create highly precise and durable pressure sensors. This invention introduces a novel approach to fabricating the strain detecting elements within these sensors, which are critical for their functionality.\n\nAt its core, the method involves depositing multiple magnetic layers—a first, an intermediate, and a second—onto a substrate. What makes this patent unique is the crucial step where the deposition of the first magnetic layer is performed while the substrate itself is intentionally bent. This strategic bending allows for precise control over the internal stresses within the magnetic films.\n\nFollowing the deposition, specific parts of these layers are removed to form the strain detecting element. Additionally, a portion of the substrate is removed from its opposite surface, creating a flexible diaphragm. This integrated process ensures that the resulting pressure sensor exhibits superior accuracy, linearity, and long-term stability compared to sensors manufactured using conventional methods. It's a significant advancement in microfabrication technology. \n\nKeywords: pressure sensor manufacturing, patent US-9853209, magnetic layer deposition, bent substrate, strain detecting element, sensor fabrication.","question":"What is Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System?"},{"answer":"The **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** works through a meticulously orchestrated sequence of steps that leverage controlled mechanical stress during thin-film deposition. First, a substrate (typically a silicon wafer) is prepared. Then, a series of magnetic layers—specifically a first magnetic layer, an intermediate layer, and a second magnetic layer—are deposited onto one surface of this substrate.\n\nCrucially, the deposition of the first magnetic layer occurs while the substrate is held in a *bent* configuration. This bending step is engineered to induce a precise, predefined mechanical stress into the magnetic film as it forms. This 'pre-stressing' is vital because it significantly influences the film's magnetic anisotropy and its magneto-elastic coupling coefficient, which dictate how effectively mechanical strain is converted into an electrical signal by the sensor. By controlling this initial stress, the sensor's sensitivity, linearity, and overall stability can be optimized from the ground up.\n\nAfter the magnetic layers are deposited, specific sections of these layers are selectively removed using advanced patterning and etching techniques. This defines the exact geometry of the strain detecting element. Simultaneously, or as a subsequent step, a portion of the substrate is removed from its opposite surface. This creates a thin, flexible diaphragm that physically deforms when pressure is applied. The combination of the pre-stressed magnetic layers and the precisely thinned diaphragm allows the sensor to accurately and consistently detect pressure changes. The annealing system mentioned in the title would typically be used for post-deposition thermal treatment to further optimize material properties or relieve residual stresses, though the primary innovation lies in the bent deposition. \n\nKeywords: sensor operation, bent substrate deposition, magnetic layers, strain detection, diaphragm, manufacturing process, stress engineering.","question":"How does Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System work?"},{"answer":"The **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** primarily solves the critical problem of manufacturing pressure sensors with consistent, ultra-high precision, durability, and stability, particularly in demanding applications. Traditional sensor fabrication methods often face several limitations:\n\n1.  **Uncontrolled Internal Stresses:** During thin-film deposition, magnetic layers develop intrinsic stresses that are often difficult to control. These stresses can lead to unpredictable magnetic properties, affecting the sensor's accuracy, linearity, and long-term stability. Post-deposition remedies are often insufficient or add complexity.\n2.  **Compromises in Performance:** Manufacturers often have to choose between high sensitivity and robustness. Sensors that are highly sensitive might be fragile, while robust ones might lack the necessary precision. This limits their applicability in critical systems.\n3.  **Hysteresis and Drift:** Many conventional sensors suffer from hysteresis (different readings for increasing vs. decreasing pressure) and long-term drift, leading to unreliable data over time and varying environmental conditions.\n\nBy introducing the innovative bent-substrate deposition technique, this patent allows for the *proactive engineering of internal stresses* within the magnetic layers. This means the sensor is optimized for performance from its very first fabrication step, directly addressing the root causes of these traditional challenges. It enables the creation of sensors that are inherently more accurate, stable, and durable, without the typical compromises. \n\nKeywords: sensor manufacturing challenges, precision issues, durability problems, stress control, hysteresis, sensor drift, advanced fabrication.","question":"What problem does Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System solve?"},{"answer":"The patent **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** (US-9853209) does not list specific inventors in the provided data. Typically, patent applications list the individual inventors who conceived the invention, alongside the assignee (the company or entity that owns the patent rights).\n\nIn many cases, especially for complex technological advancements like this one, the invention is the result of collaborative efforts by a team of engineers, scientists, and researchers working within a corporate research and development department or an academic institution. These teams bring together expertise in material science, microfabrication, electrical engineering, and mechanical design to develop novel solutions.\n\nWithout explicit inventor names in the provided information, it's understood that the innovation emerged from a collective effort focused on advancing pressure sensor technology. The assignee, if listed, would be the entity to whom the inventors have assigned their rights, usually their employer. \n\nKeywords: patent inventors, patent assignee, sensor technology development, research and development, microfabrication experts.","question":"Who invented Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System?"},{"answer":"The **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** offers several significant benefits that set it apart from conventional sensor fabrication methods:\n\n1.  **Superior Precision and Sensitivity:** The most prominent benefit is the ability to produce pressure sensors with exceptionally high accuracy. By controlling internal stresses through the bent-substrate deposition, the magneto-elastic coupling of the magnetic layers is optimized, leading to more sensitive and precise detection of pressure changes.\n2.  **Enhanced Durability and Reliability:** Engineered stress states within the magnetic films contribute to greater mechanical robustness and long-term stability. This means sensors are less prone to fatigue, drift, and degradation over time, making them ideal for critical and harsh environments.\n3.  **Improved Linearity and Reduced Hysteresis:** The precise control over material properties and structure helps in achieving a more linear response across the sensor's operating range and significantly reduces hysteresis, ensuring more consistent and reliable readings.\n4.  **Higher Manufacturing Yields:** The integrated and controlled nature of the fabrication process can lead to greater consistency from one sensor to the next, reducing the number of defective units and improving overall manufacturing efficiency and cost-effectiveness at scale.\n5.  **Miniaturization Potential:** The precision of the deposition and selective removal techniques supports the creation of smaller, yet higher-performing sensor elements, crucial for integration into compact and advanced electronic devices.\n\nThese benefits collectively enable the development of next-generation pressure sensing solutions that can meet the stringent requirements of emerging technologies in various industries. \n\nKeywords: sensor benefits, high precision, enhanced durability, improved linearity, reduced hysteresis, manufacturing yield, miniaturization, advanced sensor performance.","question":"What are the key benefits of Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System?"},{"answer":"The **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** fundamentally differentiates itself from prior art by introducing a groundbreaking step in the fabrication sequence: the *bent-substrate deposition* of the first magnetic layer. Prior art in magnetic pressure sensor manufacturing typically involves depositing thin films onto flat, rigid substrates.\n\nIn conventional methods, the intrinsic stresses generated during film growth are often an uncontrolled byproduct, or they are addressed reactively through post-deposition annealing. This approach can lead to inconsistent magnetic anisotropy, sub-optimal magneto-elastic coupling, and variations in sensor performance such as drift and hysteresis.\n\nThis patent's innovation is *proactive*. By intentionally bending the substrate during the deposition of a critical magnetic layer, a predefined mechanical stress is engineered directly into the film from its inception. This allows for precise tuning of the film's properties, optimizing its response to external strain. This level of intrinsic stress control is largely absent in prior art, where such stresses are often seen as challenges to be mitigated rather than parameters to be engineered.\n\nFurthermore, the integrated approach of combining this unique deposition with precise selective removal of both the deposited layers and the substrate itself ensures a highly synergistic and optimized sensor structure. This holistic design and fabrication methodology yields sensors with superior precision, stability, and durability that surpass the capabilities of traditional manufacturing techniques. \n\nKeywords: patent differentiation, prior art comparison, bent substrate innovation, magnetic film stress, manufacturing process, sensor technology evolution, fabrication advantages.","question":"How is Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System different from prior art?"},{"answer":"The **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** is poised to have a transformative impact across a wide array of industries that rely heavily on high-performance pressure sensing. Its ability to produce sensors with superior precision, durability, and stability makes it invaluable for critical applications.\n\n1.  **Automotive Industry:** This includes advanced driver-assistance systems (ADAS), autonomous vehicles (for environmental sensing and control systems), tire pressure monitoring systems (TPMS), and engine management systems, where reliable and accurate pressure readings are crucial for safety and efficiency.\n2.  **Medical Devices:** From highly sensitive blood pressure monitors and diagnostic equipment to implantable sensors and precision drug delivery systems, the enhanced accuracy and reliability can lead to better patient outcomes and innovative healthcare solutions.\n3.  **Industrial Automation and Process Control:** In smart factories and industrial settings, precise pressure monitoring is essential for optimizing manufacturing processes, ensuring safety, and maintaining equipment health. This technology can lead to more robust and stable sensors for harsh environments.\n4.  **Aerospace and Defense:** High-performance sensors are critical for avionics, navigation, and environmental monitoring in extreme conditions. The durability and precision offered by this patent are highly beneficial here.\n5.  **Consumer Electronics and IoT:** While often overlooked, pressure sensors are in smartphones, wearables, and smart home devices. Improved sensors can lead to more responsive interfaces, accurate biometric tracking, and advanced environmental monitoring.\n\nEssentially, any sector requiring reliable, high-fidelity pressure data will benefit significantly from the advancements enabled by this manufacturing method, driving innovation and raising performance standards across the board. \n\nKeywords: industry impact, automotive sensors, medical technology, industrial automation, aerospace, consumer electronics, IoT, precision sensing.","question":"What industries will Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System impact?"},{"answer":"The patent for **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System**, identified as US-9853209, has specific dates associated with its lifecycle.\n\nAccording to the patent data, the **Filing Date** for this patent application was **2015-03-18**. This is the date when the application was formally submitted to the patent office, initiating the examination process.\n\nThe **Publication Date** for the granted patent was **2017-12-26**. This is the date when the patent was officially published and granted, making its details publicly available and establishing its legal protection. \n\nThese dates are crucial for understanding the patent's timeline, its position relative to prior art, and the duration of its protection. The period between filing and publication reflects the time taken for the patent office to examine the application and determine its patentability. \n\nKeywords: patent filing date, patent publication date, US-9853209, patent timeline, intellectual property, sensor technology patent.","question":"When was Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System filed/granted?"},{"answer":"The commercial applications of the **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** are vast and diverse, spanning any sector that benefits from highly accurate, durable, and stable pressure sensing. This patented manufacturing process enables the creation of superior sensors that unlock new product capabilities and improve existing ones.\n\nSome key commercial applications include:\n\n1.  **Automotive:** High-precision pressure sensors for advanced driver-assistance systems (ADAS) for improved safety, engine control units for fuel efficiency, brake-by-wire systems, and reliable tire pressure monitoring systems (TPMS).\n2.  **Healthcare and Medical Devices:** Ultra-sensitive sensors for blood pressure monitors, glucose monitoring devices, implantable medical sensors, smart catheters, and advanced diagnostic equipment requiring precise fluid or gas pressure measurements.\n3.  **Industrial and Manufacturing:** Robust pressure sensors for process control in chemical plants, oil and gas pipelines, HVAC systems, robotics, and smart factory automation, ensuring optimal performance and safety in harsh environments.\n4.  **Aerospace and Defense:** Reliable pressure sensors for altimeters, airspeed indicators, engine control, and environmental monitoring in aircraft and spacecraft, where extreme conditions demand unwavering accuracy.\n5.  **Consumer Electronics:** Enhanced pressure sensing in smartphones (e.g., for altitude, atmospheric pressure), wearables (for activity tracking, health monitoring), and smart home devices for environmental control and safety.\n\nBy providing a method to produce sensors with unparalleled performance characteristics, this patent offers a strong competitive advantage, allowing companies to develop differentiated products that meet the stringent demands of modern commercial markets. \n\nKeywords: commercial applications, sensor market, automotive sensors, medical device sensors, industrial sensors, aerospace sensors, consumer electronics, IoT applications.","question":"What are the commercial applications of Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System?"},{"answer":"The **Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System** lays a foundational framework for numerous future developments in sensor technology. As this patented manufacturing process gains traction, several key areas of evolution can be anticipated:\n\n1.  **Further Miniaturization and Integration:** The precision offered by this method will enable even smaller sensor footprints, facilitating integration into highly compact devices, System-on-Chip (SoC) solutions, and advanced micro-electromechanical systems (MEMS) packages. This will support the trend towards ubiquitous sensing.\n2.  **Application to New Materials and Multiphysics Sensors:** The core concept of bent-substrate deposition could be extended to other thin-film materials beyond magnetic layers, potentially enabling novel stress-engineered sensors for temperature, flow, or chemical detection. This could lead to true multiphysics sensors capable of detecting multiple parameters simultaneously with high accuracy.\n3.  **AI-Driven Manufacturing Optimization:** Future developments might involve integrating artificial intelligence and machine learning algorithms to optimize the bending parameters, deposition conditions, and etching processes in real-time. This could lead to even higher yields, faster production cycles, and adaptive manufacturing for customized sensor performance.\n4.  **Enhanced Durability for Extreme Environments:** Continued research into material combinations and annealing protocols, combined with the stress-engineering capability, will likely lead to sensors capable of operating reliably in even more extreme temperatures, pressures, and corrosive environments, opening up new frontiers for exploration and industrial use.\n5.  **Advanced Calibration and Self-Correction:** With intrinsically more stable sensors, future developments could focus on advanced on-chip calibration and self-correction mechanisms that leverage the sensor's inherent stability, further reducing the need for external compensation and improving long-term accuracy.\n\nThis patent is not just a static invention; it's a dynamic platform for continuous innovation, promising a future where sensors are more intelligent, resilient, and seamlessly integrated into our increasingly complex technological ecosystems. \n\nKeywords: future sensor technology, sensor development, AI in manufacturing, extreme environment sensors, multiphysics sensors, miniaturization, advanced MEMS, innovation roadmap.","question":"What are the future developments expected for Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System?"}],"topics":["pressure sensor manufacturing","magnetic layer deposition","bent substrate","strain detecting element","MEMS fabrication","miniaturization","performance","optimization"],"tech_cluster":null},"seo":{"title":"Pressure Sensor Manufacturing - US-9853209 Patent Tech","description":"Discover Method of Manufacturing Pressure Sensor, Deposition System, and Annealing System (US-9853209). Innovative bent-substrate deposition for ultra-precise, durable pressure sensors.","keywords":["pressure sensor manufacturing","magnetic layer deposition","bent substrate","strain detecting element","MEMS fabrication","sensor technology patent","US-9853209","advanced sensor production","precision engineering","annealing system"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853209","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853209","citation_suggestion":"Patentable. \"Method of manufacturing pressure sensor, deposition system, and annealing system\" (US-9853209). https://patentable.app/patents/US-9853209","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853209","json":"https://patentable.app/api/llm-context/US-9853209","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:16:46.943Z"}