{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853359","patent":{"patent_number":"US-9853359","title":"Antenna integrated in a package substrate","assignee":null,"inventors":[],"filing_date":"2013-09-26T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":19,"abstract":"An antenna integrated in a package substrate, the antenna comprising an upper antenna element, a lower antenna element and a coupling element disposed between the upper antenna element and the lower antenna element, the coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element."},"analysis":{"summary":"The **Antenna Integrated in a Package Substrate** patent (US-9853359) introduces a revolutionary design for integrating antenna functionality directly within the multi-layer substrate of an electronic package. This core innovation enables a dramatic reduction in the physical footprint of wireless communication components, addressing a critical challenge in device miniaturization.\n\nThe primary problem this invention solves is the spatial constraint imposed by traditional, discrete antenna designs. As electronic devices become smaller and demand more wireless capabilities (e.g., multi-band, 5G, IoT), the allocation of dedicated space for antennas becomes increasingly difficult, often leading to compromises in performance or design aesthetics.\n\nThe key technical approach involves a sophisticated layered architecture comprising an upper antenna element, a lower antenna element, and a unique coupling element positioned between them. Crucially, this coupling element features an aperture, which is precisely engineered to provide efficient electromagnetic coupling between the upper and lower antenna elements. This integrated design transforms a passive structural component (the package substrate) into an active RF element, allowing for high-performance antenna characteristics within the compact confines of the package.\n\nFrom a business value perspective, this innovation offers significant advantages. It enables manufacturers to design ultra-compact, sleeker, and more aesthetically pleasing wireless devices, opening new market opportunities in wearables, medical implants, high-density IoT sensors, and advanced mobile communication modules. The integration can also lead to simplified manufacturing processes, reduced bill-of-materials, and potentially enhanced reliability by protecting the antenna within the package. This strategic positioning provides a competitive edge in markets driven by miniaturization and performance.\n\nThe market opportunity for this technology is substantial, spanning across consumer electronics, industrial IoT, automotive, and healthcare sectors. As the demand for pervasive connectivity and smaller form factors continues to grow, this patent provides a foundational technology for next-generation wireless products, offering a scalable and high-performance solution for future communication standards.","layman_explanation":"### What Problem Does This Solve?\n\nImagine trying to fit a powerful engine into a tiny sports car. Every inch matters, and if one part is too big, the whole car gets bigger or less efficient. In the world of modern electronics, especially wireless devices like smartwatches, IoT sensors, or even advanced medical implants, the 'engine' is the computer chip, and the 'big part' that often takes up too much space is the antenna. Traditional antennas need their own dedicated area, which limits how small and sleek a device can be. This creates a constant battle for designers: either make the device bigger, compromise on the antenna's performance, or spend a fortune on complex, custom solutions. This patent, the **Antenna Integrated in a Package Substrate**, directly tackles this fundamental design constraint, offering a way to make devices significantly smaller without sacrificing wireless capabilities.\n\n### How Does It Work?\n\nThink of the computer chip as the brain of a device, and its 'package' as the tiny house it lives in, connected by many layers of microscopic roads (circuitry). Traditionally, the antenna is a separate structure, like a flagpole stuck outside this house. This invention cleverly moves the 'flagpole' *inside* the house's walls. It works by having two tiny 'antenna pieces' (an upper and a lower element) built right into different layers of the chip's package. Between these two pieces, there's a special 'window' or 'doorway' (called an aperture) within another layer. This 'window' isn't just a hole; it's designed to help the upper and lower antenna pieces efficiently 'talk' to each other, allowing them to send and receive wireless signals together, even though they're tiny and integrated. It’s like creating a miniature, highly efficient communication system within the very structure that holds the main chip, eliminating the need for a bulky external component.\n\n### Why Does This Matter?\n\nThis technology matters immensely because it unlocks new possibilities across various industries. For consumer electronics, it means even sleeker smartwatches, virtually invisible earbuds, or thinner smartphones. In the booming Internet of Things (IoT) market, it enables smaller, more discreet sensors that can be deployed in more places, collecting more data without being obtrusive. For medical devices, it could lead to smaller, more comfortable, and less invasive implants. From an investment perspective, this innovation offers a significant competitive advantage. Companies adopting this approach can differentiate their products through superior form factor, potentially lower manufacturing costs (by reducing component count and assembly steps), and improved overall device reliability (as the antenna is protected within the package). This translates directly into market leadership and increased revenue potential in sectors driven by miniaturization and advanced connectivity.\n\n### What's Next?\n\nThe future applications for this technology are vast. We can expect to see its integration in next-generation 5G and even 6G modules, enabling higher frequency communication in compact form factors. It will accelerate the trend towards System-in-Package (SiP) solutions, where multiple components, including the antenna, are integrated into a single, tiny module. This could lead to a new era of 'invisible electronics' – devices that are so small and seamlessly integrated they blend into our environment. For investors, understanding this patent's potential means recognizing a foundational technology that will underpin many future product innovations and market growth in the wireless domain.","technical_analysis":"The **Antenna Integrated in a Package Substrate** patent (US-9853359) describes a highly innovative approach to embedding antenna structures directly within the multi-layer substrate of an electronic package. This technical analysis delves into the architecture, implementation considerations, and performance implications of this invention, crucial for engineers and RF designers.\n\n**Technical Architecture:**\nThe core architecture comprises three primary components integrated within a package substrate: an upper antenna element, a lower antenna element, and a coupling element situated coaxially or vertically between them. The package substrate itself is a multi-layered dielectric structure, often composed of materials like FR-4, polyimide, or ceramic, depending on the application's frequency and performance requirements.\n\n1.  **Upper Antenna Element**: Typically a conductive trace or patch patterned on an upper layer of the substrate. Its geometry, dimensions, and proximity to the dielectric-air interface are critical for determining its resonant frequency and radiation pattern. This element primarily interacts with the external environment.\n2.  **Lower Antenna Element**: Similarly, a conductive trace or patch patterned on a lower layer of the substrate, often positioned above a ground plane. Its design complements the upper element, and together they form a radiating system. It acts as a counterpoise or a secondary radiator, contributing to the overall antenna characteristics.\n3.  **Coupling Element with Aperture**: This is the most distinctive and critical component. It is a conductive layer (often a ground or power plane) positioned between the upper and lower antenna elements. An aperture, or precisely defined opening, is created within this coupling element. This aperture is not arbitrary; its size, shape (e.g., slot, rectangular cutout, circular hole), and position are engineered to facilitate efficient electromagnetic coupling between the upper and lower antenna elements. The aperture acts as a 'slot antenna' or a 'coupling window,' enabling energy transfer and excitation of the radiating elements. The impedance characteristics and bandwidth of the overall antenna system are heavily influenced by the design of this aperture.\n\n**Implementation Details:**\n*   **Fabrication**: The antenna elements and the coupling element are fabricated using standard photolithographic and etching processes typical for multi-layer PCB or semiconductor package manufacturing. This allows for high precision and repeatability.\n*   **Material Selection**: The dielectric constant (εr) and loss tangent (tanδ) of the substrate materials between the antenna elements and the coupling layer are crucial. Higher εr leads to smaller antenna dimensions for a given frequency, while lower tanδ reduces dielectric losses, improving efficiency. For high-frequency applications (e.g., mmWave), low-loss materials are imperative.\n*   **Feeding Network**: The RF signal would be fed to one of the antenna elements (e.g., the lower element) via a microstrip line or a via, which is also integrated within the package substrate. The feeding point's location and impedance matching network are vital for achieving maximum power transfer and minimizing return loss.\n*   **Ground Plane**: A robust ground plane is essential for proper antenna operation, typically located on the bottom layer of the package substrate or integrated within inner layers, providing a reference for the radiating elements.\n\n**Performance Characteristics:**\n*   **Miniaturization**: The primary benefit is the significant reduction in antenna size compared to discrete components, freeing up board space.\n*   **Bandwidth and Multi-band Capability**: By carefully designing the elements and aperture, it is possible to achieve broad bandwidths or multi-band operation, as the coupling mechanism can excite multiple resonant modes.\n*   **Radiation Pattern**: The aperture design and the relative positioning of the upper and lower elements influence the radiation pattern. This integrated approach can be designed for omnidirectional or directional patterns depending on the application.\n*   **Efficiency**: While integration introduces potential for substrate losses, optimized designs with low-loss materials and precise coupling can achieve good radiation efficiency, especially when minimizing parasitic elements and transmission line losses.\n*   **EMI/EMC**: Integrating the antenna within the package can offer better control over electromagnetic interference (EMI) and electromagnetic compatibility (EMC) by providing inherent shielding and reducing stray radiation from interconnects.\n\n**Integration Patterns and Code-Level Implications (Design Tools):**\nThis technology is highly relevant for System-in-Package (SiP) and module-level integration. Design engineers would use advanced electromagnetic (EM) simulation software (e.g., HFSS, CST Studio Suite) to model the complex interactions between the antenna elements, coupling aperture, substrate materials, and surrounding components. Iterative design and optimization are critical to achieve desired RF performance. The 'code-level implications' here refer to the design rules, simulation scripts, and layout automation tools used to realize such complex integrated structures, where the antenna design becomes an integral part of the overall package layout and electrical co-simulation. This invention pushes the need for tighter integration between RF design tools and IC/package co-design platforms.\n\nIn essence, this patent provides a blueprint for a new generation of compact, high-performance antennas, crucial for the ongoing evolution of wireless communication systems and the ever-increasing demand for smaller, more capable electronic devices.","business_analysis":"The **Antenna Integrated in a Package Substrate** patent (US-9853359) presents a compelling business proposition by addressing a fundamental challenge in the wireless electronics industry: achieving high-performance communication in increasingly miniaturized devices. This innovation has the potential to unlock significant market opportunities, reshape competitive landscapes, and drive new revenue streams.\n\n**Market Opportunity Size:**\nThe global market for wireless modules and integrated circuits, particularly those featuring embedded antennas, is experiencing exponential growth, driven by the proliferation of IoT devices, 5G/6G communication, wearables, and advanced automotive systems. The ability to integrate antennas directly into package substrates taps into a multi-billion dollar market segment. This patent positions itself as a key enabler for industries where space is at a premium, such as smart medical devices, compact consumer electronics (e.g., AR/VR headsets, smartwatches), industrial sensors, and drones. The addressable market is vast and continuously expanding with new applications demanding smaller, more efficient wireless connectivity.\n\n**Competitive Advantages:**\n1.  **Miniaturization Leader**: The most immediate competitive advantage is the ability to create significantly smaller wireless modules and end-products. This allows companies to differentiate on form factor, offering sleeker designs or integrating more features into existing sizes.\n2.  **Performance and Reliability**: By integrating the antenna into a controlled package environment, this technology can offer more consistent and predictable RF performance, potentially with higher efficiency and reduced susceptibility to external interference. This translates to more reliable products and enhanced user experience.\n3.  **Cost Efficiency in Manufacturing**: Consolidating the antenna into the package substrate can reduce the number of discrete components, simplify the bill of materials (BOM), and streamline the manufacturing assembly process. This leads to lower production costs and potentially faster time-to-market.\n4.  **Strategic IP Protection**: Owning the intellectual property for such a foundational integration technology provides a strong barrier to entry for competitors and opportunities for licensing agreements.\n5.  **Future-Proofing**: The integrated approach is highly scalable for higher frequencies (e.g., mmWave for 5G/6G) and multi-band operation, making it a robust solution for future wireless standards and evolving market demands.\n\n**Revenue Potential and Business Models:**\nRevenue generation could stem from several avenues:\n*   **Direct Product Sales**: Companies manufacturing wireless modules or System-in-Package (SiP) solutions can integrate this technology into their offerings, selling advanced, compact modules to OEMs.\n*   **Licensing**: The patent holder can license the technology to semiconductor manufacturers, package foundries, and device OEMs, generating significant royalties.\n*   **Consulting and Design Services**: Offering expert design and integration services for companies seeking to implement this technology in their custom products.\n*   **Value-Added Services**: Leveraging the compact nature to enable new service models, such as more discreet monitoring devices or advanced embedded analytics.\n\n**Strategic Positioning:**\nThis innovation allows companies to strategically position themselves as leaders in high-density integration and advanced wireless solutions. It enables a 'chip-first' design philosophy for RF, pushing antenna design closer to the IC. This can attract partnerships with leading semiconductor companies, module makers, and Tier-1 OEMs seeking cutting-edge solutions for their next-generation products. It moves the antenna from a peripheral component to a core, integrated element of the system.\n\n**ROI Projections:**\nInvestment in developing and commercializing this technology can yield substantial ROI. Reduced manufacturing costs, faster product development cycles, and the ability to capture new market segments (e.g., ultra-miniature devices) can significantly boost profit margins. For licensees, the ROI comes from enhanced product competitiveness, reduced R&D cycles for antenna design, and improved device performance, leading to higher sales and market share. The long-term value lies in establishing a dominant position in the rapidly growing integrated wireless component market.","faqs":[{"answer":"The **Antenna Integrated in a Package Substrate** (US-9853359) is a patented innovation in wireless technology that describes a method for embedding an antenna directly within the multi-layer substrate of an electronic package. Instead of being a separate component mounted on a circuit board or within a device's casing, this invention integrates the antenna elements as intrinsic parts of the package structure itself. This allows for an extremely compact and efficient antenna solution. The core concept involves an upper antenna element, a lower antenna element, and a specialized coupling element with an aperture positioned between them, designed to facilitate efficient electromagnetic communication. This approach fundamentally redefines how antennas are incorporated into modern electronic devices, addressing critical challenges in miniaturization and performance.\n\nThis technology is crucial for the continued evolution of compact wireless devices, enabling smaller form factors without compromising signal quality. It represents a significant departure from traditional antenna design, where space constraints often led to trade-offs between size, cost, and performance. By moving the antenna into the package, this patent unlocks new possibilities for product design and functionality across various industries. It leverages advanced packaging techniques to create a seamless integration that enhances overall system performance and reliability. The invention focuses on making the antenna a core, rather than peripheral, component of the integrated circuit package.\n\nThe patent's details highlight the importance of the coupling element and its aperture, which is not just a simple opening but a carefully engineered feature. This aperture plays a critical role in establishing the electromagnetic link between the upper and lower radiating structures, influencing the antenna's bandwidth, resonant frequency, and radiation pattern. The entire system is designed to be co-fabricated with other package components, streamlining manufacturing and reducing the overall footprint of the wireless module. This makes the **Antenna Integrated in a Package Substrate** a foundational technology for next-generation wireless communication systems, including 5G and beyond.","question":"What is Antenna Integrated in a Package Substrate?"},{"answer":"The **Antenna Integrated in a Package Substrate** works by integrating its key components—an upper antenna element, a lower antenna element, and a coupling element with an aperture—directly into the multi-layer dielectric structure of an electronic package. Imagine the package substrate as a tiny, multi-story building where each floor serves a specific purpose. The upper antenna element is patterned on an upper 'floor' (layer), while the lower antenna element is on a lower 'floor.' Between these two, a specialized 'coupling element' layer is introduced.\n\nCrucially, this coupling element contains an 'aperture,' which is a precisely designed opening or cut-out. This aperture is not merely a void; it acts as an electromagnetic 'window' or 'channel' that facilitates efficient energy transfer and interaction between the upper and lower antenna elements. When an RF signal is fed to one of the antenna elements, the electromagnetic fields are guided and coupled through this aperture, exciting both the upper and lower elements to radiate effectively. This layered and coupled design allows the antenna to operate efficiently within a very compact space, leveraging the vertical dimension of the package substrate.\n\nThe design of the aperture is critical for the antenna's performance. Its size, shape, and location are carefully engineered to tune the antenna's resonant frequency, bandwidth, and radiation characteristics. For example, by altering the aperture's dimensions, engineers can adjust the operating frequency or expand the bandwidth to cover multiple communication bands. This integrated approach ensures that the antenna functions as a cohesive system, with the coupling element playing a central role in connecting and optimizing the performance of the radiating structures. The entire assembly is fabricated using standard semiconductor packaging techniques, ensuring high precision and repeatability in mass production.","question":"How does Antenna Integrated in a Package Substrate work?"},{"answer":"The **Antenna Integrated in a Package Substrate** (US-9853359) primarily solves the long-standing problem of **miniaturization versus performance** in wireless electronic devices. As consumer demand and technological advancements push for smaller, thinner, and more feature-rich gadgets (like smartwatches, IoT sensors, and medical implants), the physical space required by traditional antenna designs becomes a significant bottleneck. Conventional antennas, whether discrete components or PCB-integrated, often demand dedicated board area and specific clearances, limiting how compact a device can truly be.\n\nThis invention addresses several key challenges:\n\n1.  **Space Constraints**: It eliminates the need for a separate, bulky antenna component, freeing up valuable board space and reducing the overall device footprint. This is crucial for enabling sleeker designs and integrating more functionality into a given volume.\n2.  **Design Complexity**: By integrating the antenna directly into the package substrate, it simplifies the overall system design. Engineers no longer have to grapple with complex interactions between a standalone antenna and other components on a crowded PCB, or worry about external antenna placement issues.\n3.  **Performance Compromises**: In an attempt to shrink antennas, prior art often led to compromises in RF performance, such as reduced efficiency, narrower bandwidth, or undesirable radiation patterns. This patent's architecture, with its aperture-coupled elements, is designed to maintain or even enhance performance within its compact form factor.\n4.  **Manufacturing Costs and Assembly**: Integrating the antenna into the package streamlines the manufacturing process. It reduces the number of discrete components, simplifies assembly steps, and can lead to lower bill-of-materials costs and faster time-to-market. Ultimately, this technology allows for the creation of next-generation wireless products that are not only smaller and more powerful but also more cost-effective and reliable, overcoming the traditional trade-offs in wireless device design.","question":"What problem does Antenna Integrated in a Package Substrate solve?"},{"answer":"The patent for **Antenna Integrated in a Package Substrate** (US-9853359) lists no specific inventors or assignee in the provided data. In typical patent filings, the 'Inventors' section would name the individuals who conceived the invention, and the 'Assignee' section would indicate the company or entity to whom the patent rights have been assigned. Without this information in the provided data, it's not possible to identify the specific individuals or company responsible for this particular innovation.\n\nHowever, the concept of integrating antennas into package substrates or other electronic components is a field of active research and development across numerous companies and academic institutions. Innovations like this often emerge from teams of highly specialized RF engineers, materials scientists, and packaging experts working within semiconductor companies, telecommunications firms, or R&D labs. The absence of specific inventor/assignee data in the prompt means we cannot attribute the invention to a named party here.\n\nIt is common for significant technological advancements, such as the **Antenna Integrated in a Package Substrate**, to be the result of collaborative efforts aimed at solving persistent industry challenges. These innovations contribute to the collective knowledge base, even if the specific creators are not always publicly highlighted in simplified patent summaries. The focus remains on the technical contribution and its potential impact on the industry, which in this case is substantial for wireless device miniaturization and performance.","question":"Who invented Antenna Integrated in a Package Substrate?"},{"answer":"The **Antenna Integrated in a Package Substrate** (US-9853359) offers several compelling benefits that are set to revolutionize wireless device design and manufacturing:\n\n1.  **Unprecedented Miniaturization**: By embedding the antenna directly into the chip's package substrate, this technology dramatically reduces the physical space required for wireless communication. This enables the creation of significantly smaller, thinner, and lighter electronic devices, freeing up valuable board real estate for other components or allowing for more compact end-products. This benefit is crucial for wearables, IoT sensors, medical implants, and sleek consumer electronics.\n\n2.  **Enhanced RF Performance and Reliability**: Integrating the antenna within a controlled package environment provides a more stable electromagnetic field, leading to more predictable and often superior RF performance. It can result in better signal integrity, higher radiation efficiency, wider bandwidths, and reduced susceptibility to external electromagnetic interference (EMI) compared to discrete or PCB-mounted antennas. The protected nature of the embedded antenna also enhances its durability and long-term reliability against environmental factors.\n\n3.  **Simplified Manufacturing and Cost Reduction**: This integrated approach streamlines the manufacturing process by reducing the number of discrete components that need to be sourced, placed, and assembled. This can lead to a simplified bill of materials (BOM), lower assembly costs, reduced manufacturing complexity, and potentially higher production yields. Faster time-to-market for new products is another significant advantage, as antenna design and integration become more predictable and efficient.\n\n4.  **Enabling New Product Categories and Designs**: By removing the traditional antenna size constraint, this technology empowers designers to innovate new product form factors and categories that were previously impossible. It opens doors for ultra-discreet devices, highly integrated modules (System-in-Package - SiP), and more aesthetically pleasing designs that blend seamlessly into everyday objects. The **Antenna Integrated in a Package Substrate** is a foundational technology for the next generation of compact, high-performance wireless products, including those leveraging 5G and future 6G communication standards.","question":"What are the key benefits of Antenna Integrated in a Package Substrate?"},{"answer":"The **Antenna Integrated in a Package Substrate** (US-9853359) distinguishes itself from prior art by offering a unique and highly integrated approach to antenna design, primarily through its specific architecture and embedding method. Prior art often involved discrete antennas (separate components mounted on a PCB), PCB-integrated antennas (traces on the main board), or more rudimentary Antenna-in-Package (AiP) solutions.\n\nHere’s how this invention is different:\n\n1.  **Level of Integration**: Unlike discrete or PCB-integrated antennas that occupy significant board space, this patent integrates the antenna elements directly *into the multi-layer package substrate* itself. This is a much tighter and more fundamental integration than merely assembling a separate antenna component into a package (a common AiP approach). It transforms the package substrate from a passive interconnecting medium into an active RF component, leveraging advanced semiconductor packaging techniques for co-fabrication. This allows for significantly greater miniaturization than previous methods, without the high losses often associated with Antenna-on-Chip (AoC) solutions.\n\n2.  **Aperture-Coupled Stacked Design**: The core novelty lies in its specific architecture: an upper antenna element, a lower antenna element, and a unique coupling element with a precisely designed aperture situated between them. This aperture-coupling mechanism is a sophisticated method for electromagnetic energy transfer. Many prior AiP solutions might use simpler direct feeding or proximity coupling. The aperture allows for superior control over impedance matching, bandwidth, and radiation pattern within the extremely confined space, optimizing performance in a way that simpler integrated designs often cannot.\n\n3.  **Controlled Electromagnetic Environment**: By embedding the antenna within the package substrate, the design creates a highly controlled and stable electromagnetic environment. This inherently reduces susceptibility to external electromagnetic interference (EMI) and minimizes parasitic effects from surrounding components. In contrast, PCB-integrated antennas are often more sensitive to variations in board layout and nearby circuitry, leading to less predictable performance. The protected nature of the antenna within the package also enhances its robustness and reliability compared to exposed designs.\n\nIn essence, the **Antenna Integrated in a Package Substrate** moves beyond incremental improvements, offering a foundational shift in how antennas are conceived and implemented in compact wireless systems, providing a unique blend of miniaturization, performance, and manufacturing efficiency.","question":"How is Antenna Integrated in a Package Substrate different from prior art?"},{"answer":"The **Antenna Integrated in a Package Substrate** (US-9853359) has the potential to significantly impact a wide array of industries that rely on compact, high-performance wireless communication. Its ability to enable unprecedented miniaturization while maintaining or improving RF performance makes it a foundational technology for numerous sectors:\n\n1.  **Consumer Electronics**: This is arguably the most immediate and visible impact. Smartphones, smartwatches, true wireless earbuds, AR/VR headsets, and other portable gadgets can become even smaller, sleeker, and more powerful. The patent enables designs that were previously impossible due to antenna size constraints, leading to new product categories and enhanced user experiences.\n2.  **Internet of Things (IoT)**: From smart home devices and industrial sensors to smart city infrastructure, IoT devices often require discreet, low-power, and highly integrated wireless capabilities. This technology allows for the embedding of antennas into tiny, unobtrusive sensors that can be deployed almost anywhere, expanding the reach and utility of IoT networks.\n3.  **Medical Devices**: Miniaturization is critical for medical applications. This includes implantable devices (e.g., pacemakers, continuous glucose monitors), ingestible capsules, and wearable health trackers. The **Antenna Integrated in a Package Substrate** can lead to smaller, more comfortable, and less invasive medical solutions with improved reliability.\n4.  **Automotive**: Advanced driver-assistance systems (ADAS), in-car infotainment, and vehicle-to-everything (V2X) communication require numerous highly integrated antennas. This technology supports the development of compact modules for radar, GPS, Wi-Fi, and cellular connectivity within modern vehicles.\n5.  **Aerospace and Defense**: For drones, satellite communication, and specialized defense systems, size, weight, and power (SWaP) are paramount. This patent enables the creation of ultra-compact and robust communication modules for critical applications.\n6.  **Telecommunications Infrastructure**: Particularly for 5G and future 6G networks, which utilize higher frequencies and require dense arrays of antennas (e.g., for massive MIMO and beamforming), this technology can enable smaller, more efficient base station components and user equipment modules. The **Antenna Integrated in a Package Substrate** will be a key enabler for the ongoing wireless revolution across all these diverse industries, driving innovation and opening new market opportunities.","question":"What industries will Antenna Integrated in a Package Substrate impact?"},{"answer":"The **Antenna Integrated in a Package Substrate** patent, identified by the number US-9853359, has a clear timeline regarding its official filing and publication dates.\n\n*   **Filing Date**: The patent application for **Antenna Integrated in a Package Substrate** was officially filed on **September 26, 2013**. This date marks when the inventors submitted their detailed description of the invention, claims, and drawings to the patent office to begin the examination process. The filing date is significant as it typically establishes the priority date for the invention, meaning that the invention's novelty and non-obviousness are assessed against prior art existing before this date.\n\n*   **Publication Date**: The patent was subsequently published, indicating it was granted, on **December 26, 2017**. The publication date is when the patent office officially issues the patent document, making the invention's details publicly accessible and establishing the patent's enforceable rights. This date signifies that the patent application successfully navigated the examination process, met the legal requirements for patentability, and was formally approved. From this date, the patent holder gains the exclusive rights to make, use, sell, and import the invention for a specified period.\n\nUnderstanding these dates is crucial for anyone conducting prior art searches, assessing the patent's enforceability, or evaluating its market relevance. The period between filing and publication often reflects the complexity of the invention and the thoroughness of the examination process. For **Antenna Integrated in a Package Substrate**, the approximately four-year period indicates a substantial review before its final grant and publication, underscoring the innovative nature of the technology.","question":"When was Antenna Integrated in a Package Substrate filed/granted?"},{"answer":"The **Antenna Integrated in a Package Substrate** (US-9853359) has a wide range of commercial applications, primarily driven by its ability to enable highly compact, efficient, and reliable wireless communication. Its impact will be felt across various product categories and market segments:\n\n1.  **Consumer Wearables**: This includes smartwatches, fitness trackers, smart rings, true wireless earbuds, and augmented/virtual reality (AR/VR) headsets. The patent's ability to miniaturize antennas allows for sleeker designs, longer battery life (due to reduced power consumption from optimized RF), and the integration of more features into smaller, more comfortable form factors.\n2.  **Internet of Things (IoT) Devices**: For the vast and growing IoT market, this technology is a game-changer. It enables the creation of ultra-small, unobtrusive sensors for smart homes (e.g., smart thermostats, security cameras, environmental sensors), industrial IoT (e.g., asset tracking, predictive maintenance sensors), and smart city infrastructure. These devices can be embedded almost invisibly into objects, furniture, or machinery, facilitating pervasive connectivity.\n3.  **Medical and Healthcare Devices**: Miniaturization is critical for patient comfort and efficacy in medical applications. This includes implantable devices (e.g., continuous glucose monitors, neural implants, pacemakers), ingestible capsules for diagnostics, and compact wearable health monitors. The **Antenna Integrated in a Package Substrate** helps create smaller, less invasive, and more reliable medical solutions.\n4.  **Mobile Communications (Smartphones, Tablets)**: While already highly integrated, this technology can push the boundaries further, enabling thinner devices, more efficient multi-band 5G/6G modules, and potentially freeing up internal space for larger batteries or additional components.\n5.  **Automotive Electronics**: Modern vehicles are packed with wireless communication systems for safety (ADAS, V2X), navigation, and infotainment. This patent facilitates the integration of compact antenna modules for radar, GPS, Wi-Fi, Bluetooth, and cellular connectivity within constrained vehicle spaces.\n6.  **Aerospace and Defense**: For drones, miniaturized satellite communication terminals, and specialized military equipment, the reduction in size, weight, and power (SWaP) offered by this integrated antenna technology is highly valuable.\n\nEssentially, any commercial product requiring wireless connectivity where size, performance, and reliability are critical factors stands to benefit significantly from the widespread adoption of the **Antenna Integrated in a Package Substrate**.","question":"What are the commercial applications of Antenna Integrated in a Package Substrate?"},{"answer":"The **Antenna Integrated in a Package Substrate** (US-9853359) lays a strong foundation for numerous future developments in wireless technology, extending its impact well beyond current applications. Several key trends and advancements are expected:\n\n1.  **Enhanced Multi-band and Wideband Capabilities**: Future iterations will likely focus on optimizing the aperture-coupled design to support an even broader range of frequency bands (e.g., from sub-GHz IoT to millimeter-wave 5G/6G) or achieve ultra-wideband (UWB) capabilities within the same compact footprint. This will be crucial for devices requiring diverse communication standards.\n2.  **Reconfigurable and Tunable Antennas**: Expect advancements in integrating tunable elements (e.g., MEMS switches, varactors, or ferroelectric materials) within the package substrate alongside the antenna. This would allow the **Antenna Integrated in a Package Substrate** to dynamically change its operating frequency, bandwidth, or even radiation pattern to adapt to changing environmental conditions or communication needs, paving the way for cognitive radio systems.\n3.  **Integration with AI and Machine Learning**: Future developments will likely leverage AI and ML for advanced design optimization, real-time performance monitoring, and predictive maintenance of these complex integrated antenna systems. AI could accelerate the design cycle, optimize antenna parameters for specific applications, and even enable self-healing or adaptive antenna functionalities.\n4.  **Higher Frequency Applications (6G and Terahertz)**: As wireless communication pushes into 6G and potentially terahertz (THz) frequencies, antenna elements become inherently smaller. This makes package-level integration even more critical. Future developments will focus on adapting the **Antenna Integrated in a Package Substrate** design for these extremely high frequencies, addressing new challenges related to material losses and fabrication tolerances.\n5.  **Advanced System-in-Package (SiP) Solutions**: The technology will further enable highly sophisticated SiP modules where multiple chips (RF transceivers, processors) are co-integrated with the antenna in a single, ultra-compact package. This will simplify module design, reduce power consumption, and improve overall system performance. We might see entire wireless front-ends, including filters, power amplifiers, and antennas, consolidated into a single package.\n6.  **Energy Harvesting Integration**: Long-term developments could explore integrating micro-energy harvesting elements (e.g., solar, RF energy harvesting) directly into the package substrate alongside the antenna. This would allow for self-powered, perpetually connected devices, particularly beneficial for remote IoT sensors. The **Antenna Integrated in a Package Substrate** is a foundational step towards a future of truly ubiquitous, intelligent, and seamlessly integrated wireless connectivity.","question":"What are the future developments expected for Antenna Integrated in a Package Substrate?"}],"topics":["Antenna Integrated in a Package Substrate","integrated antenna","package substrate antenna","wireless miniaturization","RF design","relentless","pursuit","miniaturization"],"tech_cluster":null},"seo":{"title":"Antenna Integrated in a Package Substrate - Patent US-9853359","description":"Discover Antenna Integrated in a Package Substrate, a patent revolutionizing wireless device miniaturization. Features integrated antenna elements with an aperture-coupled design for compact, high-performance RF solutions.","keywords":["Antenna Integrated in a Package Substrate","integrated antenna","package substrate antenna","wireless miniaturization","RF design","5G antenna","IoT antenna","system-in-package antenna","aperture coupled antenna","patent US-9853359","compact wireless","embedded antenna","high-density RF"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853359","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853359","citation_suggestion":"Patentable. \"Antenna integrated in a package substrate\" (US-9853359). https://patentable.app/patents/US-9853359","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853359","json":"https://patentable.app/api/llm-context/US-9853359","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:50:13.204Z"}