{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853378","patent":{"patent_number":"US-9853378","title":"Substrate and terminals for power module and power module including the same","assignee":null,"inventors":[],"filing_date":"2013-11-13T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H02M"],"num_claims":19,"abstract":"According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate."},"analysis":{"summary":"The patent titled \"Substrate and Terminals for Power Module and Power Module Including the Same\" (US-9853378) introduces a revolutionary design for power modules, focusing on enhanced compactness and thermal efficiency through an innovative substrate and terminal configuration.\n\nThe core problem this invention solves is the inherent trade-off in traditional power module designs between high power density and efficient thermal management. Existing solutions often result in bulky modules with suboptimal heat dissipation pathways, limiting miniaturization and overall performance in space-constrained applications. The increasing demand for smaller, more powerful electronic systems across industries like electric vehicles, renewable energy, and industrial automation necessitates a fundamental rethinking of power module architecture.\n\nThis technical approach centers on a uniquely structured substrate composed of first to third parts, where the third part strategically surrounds the first and second. A conductive layer is integrated across these parts. The key innovation lies in the terminals: a first polarity terminal connected to the first part and a second polarity terminal connected to the second part. Each terminal incorporates a coupling part, a body, and a contact part. Critically, the bodies of these first and second terminals are designed to overlap each other. This overlapping arrangement dramatically reduces the overall footprint, minimizes parasitic inductance, and creates more efficient thermal pathways within the module.\n\nThe business value and applications of this technology are substantial. By enabling significantly smaller and more efficient power modules, this patent unlocks opportunities for new product designs in high-growth markets. Manufacturers can develop more compact electric vehicle powertrains, lighter and more energy-dense portable electronics, and more efficient industrial power supplies. The improved thermal performance translates to higher reliability and extended product lifecycles, reducing warranty costs and enhancing customer satisfaction.\n\nThe market opportunity for this innovation is vast, spanning the global power electronics industry, which is projected for significant growth. Companies adopting this technology can gain a competitive edge by offering superior power density and thermal management solutions. This patent provides a foundational technology that can be integrated into a wide range of power conversion products, driving innovation and capturing market share in the rapidly expanding sectors reliant on advanced power modules.","layman_explanation":"### What Problem Does This Solve?\n\nImagine the engines or power units inside an electric car, a solar power system, or even a large server in a data center. These crucial components, called 'power modules,' are responsible for managing and converting electricity. The big challenge is that as we demand more power – for faster charging, longer battery life, or more powerful computers – these modules tend to get bigger and hotter. This creates a dilemma: how do you build a sleek, compact electric car or a tiny, powerful smartphone if its 'engine' needs to be large and requires massive cooling? The existing designs often waste space and struggle to efficiently get rid of the heat generated, leading to bulkier products, higher energy losses, and sometimes, even reliability issues as components overheat.\n\n### How Does It Work?\n\nThe patent \"Substrate and Terminals for Power Module and Power Module Including the Same\" addresses this fundamental problem with a clever, space-saving design. Think of the power module as a miniature city grid. In traditional designs, the main power lines (called 'terminals') might run parallel to each other, taking up a lot of land. This invention proposes a new way to lay out these power lines. It uses a special 'foundation' or 'substrate' with distinct sections. The real genius is in how the main power lines for positive and negative charges are arranged: instead of just running side-by-side, their main 'bodies' are designed to *overlap* each other, much like two highways that cross over each other at different elevations. This doesn't mean they touch and short-circuit; it means they are intelligently stacked or interwoven in a way that minimizes the overall area they consume. By doing this, the entire 'city grid' (the power module) can be made significantly smaller. This compact layout also helps electricity flow more directly and efficiently, reducing energy loss and making it easier for heat to escape, keeping the module cooler and more reliable.\n\n### Why Does This Matter?\n\nThis innovation matters because it directly impacts the bottom line and product competitiveness across multiple industries. For example, in the electric vehicle sector, a smaller, lighter, and more efficient power module means longer driving ranges, more interior space for passengers, and potentially lower manufacturing costs due to less material use. For renewable energy, more efficient and reliable power converters can maximize energy harvest from solar panels or wind turbines, leading to greater profitability. In industrial applications, compact power modules can enable smaller, more robust machinery, freeing up valuable factory floor space. Companies that adopt this technology can differentiate their products, offer superior performance, and capitalize on the growing demand for miniaturized, high-performance electronics. It's a strategic advantage that can drive market leadership and investment returns.\n\n### What's Next?\n\nThe implications of this patent are far-reaching. We can expect to see future generations of electronic devices across automotive, industrial, and consumer sectors becoming even more compact, powerful, and energy-efficient. This technology provides a foundational building block for engineers to design products that were previously impossible due to size or thermal constraints. It paves the way for faster adoption of electrification and more sustainable energy solutions, making it a key area for investment and development in the coming decade. Its modular approach also suggests it can be scaled and adapted for various power requirements, ensuring its relevance for years to come.","technical_analysis":"The patent \"Substrate and Terminals for Power Module and Power Module Including the Same\" (US-9853378) presents a novel architectural paradigm for power modules, specifically addressing the critical challenges of spatial efficiency, thermal dissipation, and electrical performance in high-power applications. This technical analysis delves into the underlying design principles and potential implications for power electronics engineers.\n\n**Technical Architecture and Substrate Design:**\nAt the heart of this innovation is a meticulously designed substrate comprising three distinct parts. The 'first part' and 'second part' are spaced apart, forming the primary connection points for the power terminals. Crucially, the 'third part' is configured to surround both the first and second parts. This tripartite division, unified by a conductive layer, suggests a sophisticated approach to electrical isolation and thermal management. The surrounding third part could serve multiple functions: providing mechanical support, acting as a ground plane, or facilitating additional thermal spreading paths. The conductive layer ensures robust electrical connectivity across these segmented regions, likely optimized for minimizing resistance and inductance.\n\n**Terminal Configuration and Overlapping Bodies:**\nPerhaps the most significant technical breakthrough described in this patent lies in the design and arrangement of the terminals. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. Each terminal is structurally defined by a 'coupling part' (for internal connection to the substrate), a 'body' (the primary current-carrying section), and a 'contact part' (for external connection). The innovation's core is the provision where the *bodies* of these first and second terminals may overlap each other. This overlapping geometry is a direct solution to the perennial problem of increasing power density within a limited footprint.\n\n**Implementation Details and Electrical Performance:**\nFrom an implementation standpoint, the overlapping terminal bodies allow for a substantial reduction in the overall planar area occupied by the high-current paths. This directly translates to a more compact power module. Beyond physical size, this configuration offers significant electrical advantages. By minimizing the physical separation between the opposing current paths, the parasitic inductance of the power loop can be drastically reduced. Lower parasitic inductance is critical for high-frequency switching applications, as it mitigates voltage overshoots, reduces switching losses, and improves electromagnetic compatibility (EMC). The precise materials for the conductive layer (e.g., copper, aluminum, or advanced composites) and the substrate (e.g., ceramic, insulated metal substrate, or direct bonded copper) would be selected based on desired thermal conductivity, electrical insulation, and mechanical robustness.\n\n**Thermal Characteristics and Performance Implications:**\nThe compact, overlapping terminal design, coupled with the intelligently partitioned substrate, inherently facilitates improved thermal management. Shorter and more direct thermal pathways can be established from the heat-generating semiconductor devices through the conductive layer and substrate to an external heatsink. The surrounding third part of the substrate could act as an extended thermal spreader, distributing heat more uniformly and reducing localized hot spots. This enhanced thermal performance is crucial for increasing the power cycling capability and long-term reliability of the power module.\n\n**Integration Patterns and Future Outlook:**\nThis architecture is highly adaptable for integration with various power semiconductor devices, including silicon IGBTs and MOSFETs, as well as wide-bandgap (WBG) devices like SiC MOSFETs and GaN HEMTs, which operate at higher temperatures and switching frequencies. The reduced parasitics are particularly beneficial for WBG devices, enabling them to realize their full potential. The patent's modular nature suggests that this substrate and terminal design can be scaled for different power levels and voltage ratings, offering a versatile platform for future power module development. Engineers can leverage this design to create more efficient, reliable, and compact power conversion systems for electric vehicles, renewable energy infrastructure, industrial motor drives, and advanced consumer electronics, pushing the boundaries of what's achievable in power electronics.","business_analysis":"The patent \"Substrate and Terminals for Power Module and Power Module Including the Same\" (US-9853378) represents a strategic asset with significant commercial implications within the burgeoning power electronics market. This innovation offers a compelling business case by directly addressing critical industry demands for increased power density, improved thermal management, and enhanced reliability.\n\n**Market Opportunity Size and Growth Drivers:**\nThe global power electronics market is experiencing robust growth, driven by the electrification of transportation (electric vehicles, charging infrastructure), the expansion of renewable energy (solar inverters, wind turbine converters), and the increasing demand for energy-efficient industrial and consumer electronics. This market is projected to reach hundreds of billions of dollars in the coming years. The core need across these sectors is for power modules that are smaller, lighter, more efficient, and more reliable. This patent positions itself perfectly to capitalize on these drivers by offering a foundational technology that enables superior performance in these key areas.\n\n**Competitive Advantages:**\nThis invention provides distinct competitive advantages. Firstly, the ability to create significantly more compact power modules through the overlapping terminal design allows manufacturers to develop smaller end-products, saving space, weight, and material costs. This is a crucial differentiator in industries like automotive and portable electronics where miniaturization is paramount. Secondly, the enhanced thermal management capabilities lead to higher reliability and extended product lifespans, reducing warranty claims and improving brand reputation. Thirdly, the reduction in parasitic inductance translates to higher system efficiency and lower power losses, offering a performance edge over competitors using conventional designs. Companies leveraging this patent can offer products that are not only smaller but also more efficient and robust.\n\n**Revenue Potential and Business Models:**\nThe revenue potential for this technology is multi-faceted. It could be licensed to existing power module manufacturers, generating significant royalty income. Alternatively, a company could integrate this design into its own product lines, gaining a competitive edge and increasing market share in high-value segments like EV inverters or high-power industrial drives. The innovation also opens doors for new business models focused on custom high-density power module solutions for niche applications. The improved performance characteristics could command premium pricing, further boosting revenue. The reduced manufacturing complexity stemming from the integrated design could also lead to cost efficiencies, improving profit margins.\n\n**Strategic Positioning:**\nStrategically, adopting this patent allows companies to position themselves as leaders in advanced power module technology. It fosters innovation and enables the development of next-generation products that meet future market demands. For automotive suppliers, it means offering crucial components for advanced EV platforms. For renewable energy companies, it translates to more efficient and reliable energy conversion systems. This technology provides a pathway to differentiate in a crowded market, attract top engineering talent, and secure long-term contracts with key industry players. It’s a foundational technology that can underpin a long-term product roadmap.\n\n**ROI Projections:**\nInvesting in or licensing this technology offers a strong return on investment (ROI). The reduced product size and weight lead to lower material and shipping costs. Enhanced reliability translates to fewer field failures and lower support costs. Most importantly, the improved performance and efficiency allow for market penetration into premium segments and the capture of significant market share in high-growth areas. The ability to innovate faster and deliver superior products will generate substantial long-term value, making this patent a valuable asset for strategic business growth in power electronics.","faqs":[{"answer":"The patent \"Substrate and Terminals for Power Module and Power Module Including the Same\" (US-9853378) describes a groundbreaking innovation in the design of power modules. Essentially, it introduces a novel way to construct the foundational 'base' (substrate) and the electrical connection points (terminals) of a power module. This new design aims to make power modules significantly more compact, efficient, and better at handling heat. It's a foundational technology for advanced power electronics.\n\nThe core of the invention involves a substrate with unique, spaced-apart sections, where one section cleverly surrounds the others. Crucially, the positive and negative electrical terminals within the module are designed with their 'bodies' overlapping each other. This physical arrangement allows for a dramatic reduction in the overall size of the power module while simultaneously improving its electrical and thermal performance.\n\nThis technology is vital for industries that require high power in very small spaces, such as electric vehicles, renewable energy systems, and advanced industrial equipment. It represents a significant step forward in optimizing the physical and electrical characteristics of power conversion and management components. The Substrate and Terminals for Power Module and Power Module Including the Same addresses long-standing challenges in power module design.","question":"What is Substrate and Terminals for Power Module and Power Module Including the Same?"},{"answer":"The Substrate and Terminals for Power Module and Power Module Including the Same patent works by redefining the internal architecture of a power module. It starts with a specialized substrate, which is the base material that holds the components. This substrate is composed of three distinct parts: a first part, a second part, and a third part, where the third part is designed to surround the first and second parts. These parts are integrated with a conductive layer.\n\nThe key to its operation lies in the terminals, which are the electrical connections. A terminal for one polarity (e.g., positive) is connected to the first part of the substrate, and a terminal for the other polarity (e.g., negative) is connected to the second part. Each terminal has a coupling part, a body, and a contact part. The innovative aspect is that the 'bodies' of these first and second terminals are configured to overlap each other.\n\nThis overlapping arrangement is crucial. It allows the electrical pathways to be much closer and more compact than in traditional designs, significantly reducing the physical space the module occupies. This proximity also minimizes 'parasitic inductance' (unwanted electrical resistance), leading to more efficient power transfer and less energy wasted as heat. Furthermore, the integrated design improves how heat is conducted away from the module, ensuring cooler and more reliable operation. This clever design of the Substrate and Terminals for Power Module and Power Module Including the Same fundamentally enhances both space utilization and performance.","question":"How does Substrate and Terminals for Power Module and Power Module Including the Same work?"},{"answer":"The Substrate and Terminals for Power Module and Power Module Including the Same patent solves several critical problems inherent in conventional power module designs. Firstly, it tackles the challenge of **limited power density and physical bulk**. Traditional power modules often require significant space due to the layout of their internal components and terminals, hindering the miniaturization of electronic devices and systems. This patent enables the creation of significantly smaller power modules without compromising power output.\n\nSecondly, the invention addresses **inefficient thermal management**. In compact power modules, heat dissipation is a major concern. Overheating can lead to reduced performance, decreased reliability, and a shorter lifespan for components. By optimizing the internal layout, this technology facilitates more effective heat transfer, keeping the module cooler and more robust.\n\nFinally, it mitigates **high parasitic inductance**. In high-frequency power switching applications, parasitic inductance in terminal connections can cause undesirable voltage spikes, increased energy losses, and electromagnetic interference (EMI). The innovative overlapping terminal design significantly reduces this parasitic inductance, leading to cleaner switching, higher efficiency, and improved overall system performance. The Substrate and Terminals for Power Module and Power Module Including the Same thus offers a comprehensive solution to these pervasive engineering challenges.","question":"What problem does Substrate and Terminals for Power Module and Power Module Including the Same solve?"},{"answer":"The patent \"Substrate and Terminals for Power Module and Power Module Including the Same\" (US-9853378) was filed by an assignee, but the specific inventors are not listed in the provided patent data. In patent filings, the inventors are typically the individuals who conceived the inventive idea, while the assignee is the entity (often a company or institution) to whom the patent rights are legally transferred or assigned.\n\nWhile the names of the individuals directly responsible for the ingenious design of the overlapping terminals and multi-part substrate are not available in this summary, their work represents a significant contribution to the field of power electronics. Innovations like the Substrate and Terminals for Power Module and Power Module Including the Same are often the result of dedicated research and development teams working within leading technology companies or academic institutions focused on advancing semiconductor and power management solutions.\n\nTo find the specific inventors, one would typically refer to the full patent document available through official patent databases, where such details are meticulously recorded for public access. The impact of their invention, regardless of their public recognition here, is poised to be substantial in shaping future power module technologies.","question":"Who invented Substrate and Terminals for Power Module and Power Module Including the Same?"},{"answer":"The Substrate and Terminals for Power Module and Power Module Including the Same patent offers several compelling benefits that are crucial for modern power electronics. A primary advantage is **unprecedented compactness and higher power density**. The innovative overlapping design of the terminal bodies dramatically reduces the physical footprint of the power module, allowing for smaller, lighter, and more integrated electronic systems across various applications.\n\nSecondly, it provides **significantly improved thermal management**. By optimizing the internal layout and conductive pathways, the invention facilitates more efficient heat dissipation. This leads to cooler operating temperatures, which in turn enhances the reliability and extends the lifespan of the power module and the devices it powers, reducing maintenance and replacement costs.\n\nFurthermore, the technology delivers **superior electrical performance** through reduced parasitic inductance. The close proximity of the overlapping current paths minimizes unwanted electrical resistance and inductance, leading to cleaner switching waveforms, lower switching losses, and improved overall energy efficiency. This is particularly beneficial for high-frequency applications. Collectively, these benefits make the Substrate and Terminals for Power Module and Power Module Including the Same a foundational technology for next-generation, high-performance power solutions.","question":"What are the key benefits of Substrate and Terminals for Power Module and Power Module Including the Same?"},{"answer":"The Substrate and Terminals for Power Module and Power Module Including the Same differentiates itself significantly from prior art power module designs primarily through its innovative terminal and substrate architecture. In conventional (prior art) designs, power terminals are typically arranged in a planar fashion, either side-by-side or in simple stacked layers that do not inherently overlap in a space-saving manner. This often results in a larger physical footprint for the power module.\n\nThe key distinction of this patent is the design where the 'bodies' of the first and second polarity terminals are configured to *overlap* each other. This is a fundamental departure from traditional layouts. This ingenious overlapping geometry allows for a dramatic reduction in the overall planar area required for high-current interconnections, something not effectively achieved by prior art. While previous designs might have attempted compactness, they rarely achieved this level of volumetric efficiency through terminal integration.\n\nBeyond just size, this overlapping design also inherently minimizes parasitic inductance more effectively than most prior art. By bringing the forward and return current paths into closer proximity, the enclosed loop area is reduced, leading to superior electrical performance. Additionally, the multi-part substrate, with one part surrounding the others, offers an optimized base for thermal spreading and electrical isolation that goes beyond simpler, monolithic substrates. Thus, the Substrate and Terminals for Power Module and Power Module Including the Same represents a paradigm shift in integration and performance over existing technologies.","question":"How is Substrate and Terminals for Power Module and Power Module Including the Same different from prior art?"},{"answer":"The Substrate and Terminals for Power Module and Power Module Including the Same patent is poised to impact a wide array of industries that rely heavily on efficient, compact, and reliable power conversion. Its core benefits directly address critical needs across several high-growth sectors.\n\nFirstly, the **automotive industry**, particularly the electric vehicle (EV) segment, stands to gain immensely. Smaller, lighter, and more efficient power modules are crucial for EV inverters, DC-DC converters, and charging systems, contributing to increased range, faster charging times, and reduced vehicle weight. This technology enables more compact powertrains and greater design flexibility for future EV platforms.\n\nSecondly, the **renewable energy sector** (solar, wind power) will benefit from more efficient and compact power converters and inverters. This can lead to higher energy yields, reduced installation footprints for solar farms, and more robust grid integration solutions. The enhanced reliability also reduces maintenance costs in remote or harsh environments.\n\nFurthermore, **industrial automation and robotics** will see improvements through smaller, more reliable motor drives and power supplies, enabling more compact machinery and increased productivity. The **data center and telecommunications industries** can also leverage this technology for higher power density servers and network equipment, optimizing space and energy consumption. Lastly, advancements in **consumer electronics** and **portable power devices** could also see benefits, enabling smaller form factors and longer battery life for high-power devices. The Substrate and Terminals for Power Module and Power Module Including the Same offers foundational improvements for all these sectors.","question":"What industries will Substrate and Terminals for Power Module and Power Module Including the Same impact?"},{"answer":"The patent for \"Substrate and Terminals for Power Module and Power Module Including the Same\" (US-9853378) has specific key dates associated with its filing and publication.\n\nThis patent was **filed** on **November 13, 2013**. The filing date marks the official submission of the patent application to the patent office, establishing the priority date for the invention. This date is crucial as it determines the novelty of the invention against prior art.\n\nThe patent was subsequently **published** (granted) on **December 26, 2017**. The publication date signifies when the patent document became publicly available, detailing the invention's claims and specifications. At this point, the patent rights are officially granted, allowing the patent holder to exclude others from making, using, or selling the invention. These dates are standard markers in the lifecycle of any patent, indicating the journey of the Substrate and Terminals for Power Module and Power Module Including the Same from conception to granted protection.","question":"When was Substrate and Terminals for Power Module and Power Module Including the Same filed/granted?"},{"answer":"The commercial applications of the Substrate and Terminals for Power Module and Power Module Including the Same patent are extensive, driven by its ability to create more compact, efficient, and reliable power modules. These applications span several high-growth industries.\n\nIn the **electric vehicle (EV) market**, this technology can be integrated into high-power inverters for traction motors, DC-DC converters for auxiliary systems, and on-board chargers. The reduced size and improved efficiency translate directly into extended vehicle range, faster charging capabilities, and lighter vehicle designs, providing a strong competitive edge for automotive manufacturers.\n\nFor **renewable energy systems**, such as solar photovoltaic (PV) inverters and wind turbine converters, the patent's benefits enable more compact and higher-efficiency power conditioning units. This leads to increased energy harvesting, reduced installation costs, and greater reliability in grid-tied or off-grid applications. It supports the global transition to sustainable energy sources.\n\nBeyond these, the innovation is highly applicable in **industrial motor drives**, where compact and robust power modules can improve the performance and reduce the footprint of robotics, factory automation equipment, and heavy machinery. In **data centers**, the need for high-density power supplies for servers is critical, and this technology can enable more powerful and energy-efficient computing infrastructure. Finally, it could also find application in **medical devices** requiring compact, reliable power, and **advanced consumer electronics** where miniaturization is a key design goal. The Substrate and Terminals for Power Module and Power Module Including the Same is a versatile foundational technology for a broad range of commercial products.","question":"What are the commercial applications of Substrate and Terminals for Power Module and Power Module Including the Same?"},{"answer":"The Substrate and Terminals for Power Module and Power Module Including the Same patent lays a robust foundation for numerous future developments in power electronics. One key area of expected advancement is the **integration with wide-bandgap (WBG) semiconductors** like Silicon Carbide (SiC) and Gallium Nitride (GaN). These materials operate at higher temperatures and switching frequencies, and the patent's low-parasitic, thermally efficient design is perfectly suited to unlock their full potential, leading to even greater power densities and efficiencies.\n\nFurther developments will likely focus on **advanced manufacturing techniques** to optimize the production of the overlapping terminal structures and multi-part substrates. This could involve innovations in 3D printing for conductive materials, advanced bonding processes (e.g., silver sintering, transient liquid phase bonding) for improved thermal and electrical interfaces, and automated assembly to reduce costs and increase yield. The goal will be to scale production efficiently while maintaining precision.\n\nWe can also anticipate **material science advancements** specifically tailored for this architecture. This might include new substrate materials with even higher thermal conductivity and dielectric strength, or novel encapsulation materials that can withstand harsher operating environments while maintaining compactness. The modularity suggested by the substrate design could also lead to highly customizable power modules for niche applications, further extending the reach of the Substrate and Terminals for Power Module and Power Module Including the Same into specialized markets. This patent is a springboard for continuous innovation in how power is managed and delivered.","question":"What are the future developments expected for Substrate and Terminals for Power Module and Power Module Including the Same?"}],"topics":["power module","substrate","terminals","power electronics","compact design","landscape","power","electronics"],"tech_cluster":null},"seo":{"title":"Power Module Innovation: Substrate & Terminals - Patent US-9853378","description":"Discover the groundbreaking 'Substrate and Terminals for Power Module and Power Module Including the Same' patent. Features overlapping terminals for compact, efficient power modules. Explore its impact on power electronics.","keywords":["power module","substrate","terminals","power electronics","compact design","thermal management","semiconductor","US-9853378","energy efficiency","power density","patent innovation"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853378","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853378","citation_suggestion":"Patentable. \"Substrate and terminals for power module and power module including the same\" (US-9853378). https://patentable.app/patents/US-9853378","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853378","json":"https://patentable.app/api/llm-context/US-9853378","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:15:10.692Z"}