{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853446","patent":{"patent_number":"US-9853446","title":"Integrated circuit (IC) package comprising electrostatic discharge (ESD) protection","assignee":null,"inventors":[],"filing_date":"2015-08-27T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":23,"abstract":"An intergrated circuit (IC) package includes a die, a package substrate coupled to the die, and a first electrostatic discharge (ESD) protection component coupled to the package substrate, where the first electrostatic discharge (ESD) protection component is configured to provide package level electrostatic discharge (ESD) protection. In some implementations, the first electrostatic discharge (ESD) protection component is embedded in the package substrate. In some implementations, the die includes an internal electrostatic discharge (ESD) protection component configured to provide die level electrostatic discharge (ESD) protection. In some implementations, the internal electrostatic discharge (ESD) protection component and the first electrostatic discharge (ESD) protection component are configured to provide cumulative electrostatic discharge (ESD) protection for the die."},"analysis":{"summary":"The patent \"Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection\" introduces a critical advancement in safeguarding integrated circuits (ICs) from damaging electrostatic discharge (ESD) events. At its core, this innovation proposes incorporating a dedicated ESD protection component directly within or coupled to the IC's package substrate, providing a robust package-level defense.\n\nThis technology addresses the growing vulnerability of modern, miniaturized ICs to ESD. While traditional ICs rely on internal, die-level ESD protection, these are often insufficient to handle the increasing energy levels of ESD events encountered during manufacturing, assembly, and real-world usage. The problem manifests as device degradation, premature failures, and significant financial losses for manufacturers.\n\nThe key technical approach involves a multi-layered, cumulative protection strategy. The first ESD protection component, situated at the package level, acts as an initial high-energy shunt, absorbing or diverting significant ESD transients before they can reach the sensitive silicon die. In parallel, the die itself still contains its own internal ESD protection. The patent emphasizes that these two distinct layers are configured to provide *cumulative* protection, meaning their combined effect offers significantly enhanced ESD withstand capabilities compared to either component acting alone.\n\nFrom a business perspective, this invention offers substantial value. It promises dramatically improved product reliability and longevity for electronic devices across various sectors, including consumer electronics, automotive, industrial, and medical. This translates to reduced warranty claims, lower manufacturing scrap rates, enhanced brand reputation, and greater customer satisfaction. The market opportunity lies in providing a foundational technology for more robust and dependable electronic components, essential for the next generation of high-performance and safety-critical applications.","layman_explanation":"### What Problem Does This Solve?\n\nImagine you're running a business that relies heavily on electronic devices, like a car manufacturer or a company making smart home gadgets. A common, invisible threat to these devices is 'Electrostatic Discharge' (ESD), simply put, static electricity. You know that little zap you get when you touch a doorknob? For tiny computer chips, that zap can be like a lightning strike, causing them to malfunction or fail completely. This leads to costly problems for businesses: products breaking down prematurely, expensive recalls, unhappy customers, and damaged brand reputation. While chips currently have some built-in protection, it's often not strong enough for the intense static events that occur during manufacturing, shipping, or even normal use. As chips get smaller and more powerful, they also become more fragile, making this problem even worse.\n\n### How Does It Work?\n\nThe patent, known as \"Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection,\" introduces a clever, two-stage defense system. Think of a valuable item, like a precious jewel (your computer chip), that needs protection. Traditionally, you might put a small, delicate box (the chip's internal protection) directly around the jewel. This patent suggests adding a much larger, tougher, and more robust outer box (the 'first ESD protection component') around that initial box. This outer box is actually integrated into the main casing (the 'package substrate') that holds the entire chip assembly.\n\nSo, when a static shock comes along, the tough outer box takes the first hit, absorbing most of the energy. Only a much weaker, safer static charge, if any, makes it past this outer defense. Then, the original, delicate inner box can easily handle that smaller residual charge. This dual-layer approach provides 'cumulative protection,' meaning the combined strength of both shields is far greater than what either could achieve alone. It's like having a strong castle wall to stop the main attack, and then a smaller, specialized guard inside to handle any stragglers.\n\n### Why Does This Matter?\n\nThis innovation is a game-changer for any business involved with electronics. For manufacturers, it means significantly higher product reliability. Your cars, phones, or medical devices will be less likely to fail due to static electricity, leading to fewer warranty claims, reduced repair costs, and a stronger reputation for quality. This can also streamline manufacturing processes, as products become more forgiving to handle. For investors, this patent points to a technology that can underpin more robust and dependable products across huge markets, from consumer electronics to critical infrastructure like automotive and industrial control systems. It offers a clear path to building more resilient products, reducing operational risks, and improving the bottom line.\n\n### What's Next?\n\nThis technology sets a new standard for electronic component reliability. We can expect to see its integration into a wide range of future products, especially those requiring high levels of dependability. As the demand for robust IoT devices, autonomous systems, and advanced consumer electronics grows, the principles behind this patent will become increasingly vital. Businesses that adopt or license this approach early could gain a significant competitive edge, establishing themselves as leaders in delivering truly reliable and durable electronic solutions.","technical_analysis":"The patent \"Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection\" (US-9853446) details a significant architectural enhancement for safeguarding integrated circuits (ICs) against electrostatic discharge (ESD) events. The core technical innovation lies in extending ESD protection beyond the traditional die level to the IC package itself, creating a multi-layered, cumulative defense system.\n\n**Technical Architecture:**\n\nThe system comprises three primary elements: an IC die, a package substrate coupled to the die, and a first ESD protection component. Critically, this first ESD component is coupled to the package substrate and is explicitly designed to provide *package level* ESD protection. This contrasts with conventional designs where ESD protection is almost exclusively confined to the silicon die. In advanced implementations, this first ESD component can be embedded directly within the package substrate, potentially reducing parasitic inductance and optimizing space.\n\n**Implementation Details:**\n\nThe first ESD protection component could be realized using various technologies, such as discrete ESD diodes, transient voltage suppressor (TVS) arrays, or even passive structures designed to dissipate energy. Its placement on or within the package substrate means it acts as the initial point of defense for external ESD events. When an ESD pulse reaches the IC package, this component is engineered to shunt the majority of the current away from the internal pins connected to the die. This reduces the peak voltage and current that the internal die-level protection components would otherwise have to handle.\n\n**Algorithm Specifics (Conceptual):**\n\nThe 'algorithm' for protection is a staged response. Upon an ESD event: \n1.  **Stage 1 (Package-Level):** The first ESD protection component on/in the package substrate triggers, diverting a high-energy transient. This component is typically designed for higher current/voltage handling capability than on-die solutions.\n2.  **Stage 2 (Die-Level):** If the die includes its own internal ESD protection component, any residual, attenuated ESD energy that bypasses the package-level protection is then handled by this internal component. The internal component, now facing a significantly reduced stress, can more effectively clamp voltages and shunt currents to ground, protecting the sensitive core circuitry of the die. The patent emphasizes that these two stages are 'configured to provide cumulative electrostatic discharge (ESD) protection,' implying a coordinated design where their characteristics complement each other.\n\n**Integration Patterns:**\n\nIntegration involves careful selection and placement of the package-level ESD component. For embedded implementations, advanced substrate manufacturing techniques (e.g., multi-layer organic substrates, ceramic substrates) would be utilized. The interconnections between the package-level ESD component, the package pins, and the die bumps/pads must be optimized for low impedance to ensure efficient current shunting during a fast-rising ESD event. This might involve specialized routing and material choices within the package structure.\n\n**Performance Characteristics:**\n\nThe primary performance benefit is a substantial increase in the overall ESD withstand voltage and current capability of the IC package. By distributing the ESD energy dissipation across two levels, the peak stress on any single protection device is reduced, leading to less degradation and higher reliability. This cumulative protection can enable ICs to meet more stringent system-level ESD standards (e.g., IEC 61000-4-2) without requiring excessive silicon area for on-die protection. It also improves robustness against various ESD models (HBM, CDM, MM).\n\n**Code-Level Implications:**\n\nWhile this patent deals with hardware architecture, the implications for software and firmware developers are indirect but significant. With enhanced hardware-level ESD protection, developers can potentially face fewer unexpected system crashes or data corruptions due to transient electrical events. This can lead to more stable software operation and reduced debugging efforts related to hardware anomalies. Furthermore, the increased reliability might enable the use of these ICs in more mission-critical applications where software integrity is paramount.","business_analysis":"The patent for \"Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection\" (US-9853446) represents a critical innovation with far-reaching business implications, particularly for the semiconductor and electronics manufacturing industries. This technology directly addresses a persistent and costly problem: the vulnerability of integrated circuits (ICs) to electrostatic discharge (ESD).\n\n**Market Opportunity Size:**\n\nThe global IC market is projected to reach over $1 trillion by the end of the decade, with virtually every electronic device relying on these components. ESD damage accounts for billions of dollars in losses annually, encompassing manufacturing scrap, field failures, warranty claims, and reputation damage. This invention taps into a massive market need for enhanced reliability across all IC-consuming sectors, including consumer electronics, automotive, industrial IoT, medical devices, and telecommunications. The market for ESD protection components alone is significant, and integrating this directly into the package expands its addressable market.\n\n**Competitive Advantages:**\n\nThis technology offers a distinct competitive advantage for licensees and implementers. By providing a cumulative ESD protection scheme—combining package-level and die-level safeguards—it delivers superior robustness compared to ICs relying solely on traditional on-die protection. This translates into:\n*   **Higher Reliability Products:** Devices using this patent will inherently be more durable, reducing failure rates and extending product lifespans.\n*   **Reduced Costs:** Lower manufacturing scrap rates due to ESD, fewer warranty claims, and decreased field service expenses directly impact the bottom line.\n*   **Enhanced Brand Reputation:** A reputation for producing highly reliable electronics is a powerful differentiator in a crowded market.\n*   **Design Flexibility:** Designers can potentially reduce the area allocated for on-die ESD protection, freeing up silicon for more features or smaller die sizes, while still achieving superior overall ESD performance.\n\n**Revenue Potential and Business Models:**\n\nRevenue potential can be realized through several business models:\n1.  **Licensing:** Semiconductor IP companies or the patent assignee can license this technology to IC manufacturers, earning royalties per unit.\n2.  **Component Sales:** Specialized manufacturers could produce and sell package substrates or discrete ESD components optimized for this integration.\n3.  **Value-Added ICs:** IC manufacturers who adopt this technology can command premium pricing for their 'ESD-hardened' components, especially in high-reliability markets (e.g., automotive grade, industrial grade).\n4.  **Foundry Services:** Foundries offering advanced packaging services could differentiate themselves by providing this integrated ESD solution as part of their manufacturing capabilities.\n\n**Strategic Positioning:**\n\nCompanies adopting this approach will be strategically positioned as leaders in reliability and quality. In an era where product longevity and sustainability are increasingly valued by consumers and regulators, this patent provides a foundational technology for future-proof electronics. It also offers a competitive edge in markets with stringent reliability requirements, such as autonomous driving systems, medical implants, and critical infrastructure.\n\n**ROI Projections:**\n\nInvesting in or licensing this technology promises a strong return on investment. The reduction in ESD-related failures alone can lead to significant cost savings, often outweighing the initial investment in design and manufacturing changes. For instance, a reduction in field failures by even a few percentage points can save millions in warranty costs for high-volume products. Furthermore, the intangible benefits of improved brand loyalty and market share in high-reliability segments contribute to long-term profitability. This patent provides a clear path to both cost reduction and market differentiation.","faqs":[{"answer":"The \"Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection\" refers to a patented invention (US-9853446) that significantly enhances the resilience of integrated circuits (ICs) against electrostatic discharge (ESD) events. This innovative technology introduces a novel approach to safeguarding delicate electronic components.\n\nUnlike traditional methods that primarily focus on protection built directly into the silicon chip (die-level), this patent proposes a multi-layered defense. It integrates a dedicated ESD protection component directly within or coupled to the IC's package substrate. This 'first' ESD component provides a robust package-level defense, acting as an initial shield against damaging static electricity.\n\nThe core concept is to create a cumulative protection system where both the package-level and die-level ESD components work in concert. This synergistic approach ensures a much higher overall ESD withstand capability for the entire IC package, leading to more reliable and longer-lasting electronic devices. It represents a critical advancement in semiconductor packaging technology.\n\nKeywords: integrated circuit protection, ESD protection, package-level ESD, cumulative ESD, semiconductor reliability, patent US-9853446.","question":"What is Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection?"},{"answer":"The Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection works by implementing a two-stage, cumulative defense mechanism against electrostatic discharge. When an ESD event occurs, the system utilizes a strategic layering of protection.\n\nFirst, a dedicated ESD protection component, situated on or embedded within the IC's package substrate, acts as the primary defense. This 'package-level' component is designed to intercept and dissipate a significant portion of the incoming ESD energy before it can reach the sensitive silicon die. It essentially 'softens' the ESD pulse, reducing its peak voltage and current magnitudes.\n\nSecond, the IC die itself still incorporates its own internal ESD protection components. These 'die-level' safeguards then handle any residual, attenuated ESD energy that might have bypassed the package-level protection. Because the initial surge has been largely mitigated by the package-level component, the internal die protection can operate more effectively and with less stress.\n\nTogether, these two layers provide 'cumulative' protection, meaning their combined strength is far greater than what either could achieve individually. This synergistic approach ensures maximum protection for the integrated circuit, significantly enhancing its robustness and extending its operational lifespan. The patent focuses on this coordinated action for superior results.\n\nKeywords: how ESD protection works, cumulative protection, package-level component, die-level protection, electrostatic discharge mechanism, IC reliability.","question":"How does Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection work?"},{"answer":"The Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection patent directly addresses the critical and costly problem of integrated circuit (IC) vulnerability to electrostatic discharge (ESD) events. In modern electronics, as ICs become smaller, more complex, and operate at lower voltages, their susceptibility to static electricity damage increases dramatically.\n\nTraditional ESD protection, typically integrated directly onto the silicon die, often proves insufficient to handle the high-energy ESD events encountered during manufacturing, assembly, or normal device usage. These events can cause immediate catastrophic failure, or insidious latent damage that leads to premature device malfunction or degradation over time. This results in significant financial losses for manufacturers through scrap, warranty claims, and damaged brand reputation.\n\nThis invention solves this by providing a more robust, multi-layered defense. By adding a primary ESD protection component at the package level, it creates a crucial first line of defense that intercepts the majority of the ESD energy. This reduces the burden on the delicate on-die protection, making the entire IC package significantly more resilient. It mitigates the risk of both immediate and latent ESD damage, thereby improving product longevity and reliability across all electronic applications.\n\nKeywords: ESD problem, IC vulnerability, semiconductor reliability challenge, device failure, manufacturing losses, latent damage, electrostatic discharge solution.","question":"What problem does Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection solve?"},{"answer":"Based on the provided patent data (US-9853446), the inventors of the Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection are not specified in the input. Similarly, the assignee, which is the entity or company to whom the patent rights are assigned, is also not provided in the given data.\n\nTypically, patent documents list the names of the inventors who conceived the invention and the assignee, which is often the company that funded the research and development or purchased the rights to the patent. This information is crucial for understanding the ownership and origin of the intellectual property.\n\nWithout this specific data, it is not possible to identify the individuals or organization responsible for the creation of this significant ESD protection technology. Further investigation of the official patent records would be required to obtain these details.\n\nKeywords: patent inventors, patent assignee, US-9853446 details, invention origin, intellectual property.","question":"Who invented Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection?"},{"answer":"The Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection patent offers several key benefits that are crucial for the modern electronics industry.\n\nFirstly, it provides **significantly enhanced reliability and longevity** for integrated circuits. By implementing a cumulative, dual-layer ESD protection system—combining package-level and die-level components—the ICs become far more robust against damaging static electricity, leading to fewer failures and extended product lifespans.\n\nSecondly, it results in **reduced manufacturing costs and warranty claims**. With superior ESD immunity, manufacturers experience lower scrap rates during assembly and testing, and fewer products failing in the field. This directly translates to substantial cost savings and improved customer satisfaction.\n\nThirdly, this technology offers **greater design flexibility** for IC engineers. By offloading some of the ESD protection burden to the package, designers can potentially reduce the silicon area dedicated to on-die ESD structures. This frees up valuable die space for more functional circuitry, or allows for smaller, more cost-effective chips without compromising reliability. It also improves robustness against various ESD models, including system-level events.\n\nFinally, it leads to **improved brand reputation and market differentiation**. Companies utilizing this advanced ESD protection can position their products as highly reliable and durable, gaining a competitive edge in markets that demand extreme dependability, such as automotive, industrial, and medical sectors.\n\nKeywords: benefits of ESD protection, IC reliability benefits, cost reduction, design flexibility, enhanced robustness, market differentiation, product longevity.","question":"What are the key benefits of Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection?"},{"answer":"The Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection differs significantly from prior art by fundamentally shifting where primary ESD protection is located and how it functions. Prior art primarily focused on integrating ESD protection directly within the silicon die itself.\n\nIn conventional prior art, on-die ESD structures (like diodes or GGNMOS devices) are the sole or main line of defense. While these have been continuously refined, they face limitations such as consuming valuable silicon area, becoming less effective as device geometries shrink, and often struggling to handle high-energy system-level ESD events that occur at the package pins.\n\nThis patent introduces a critical 'first electrostatic discharge (ESD) protection component' that is coupled to or embedded within the *package substrate*. This package-level component acts as an external, primary defense, intercepting and dissipating a substantial portion of the ESD energy before it even reaches the delicate die. This is a key differentiator, as it distributes the ESD stress across the entire package assembly.\n\nThe most significant difference is the concept of 'cumulative electrostatic discharge (ESD) protection.' The invention explicitly states that the package-level component works *in conjunction* with the die's internal protection. This synergistic, two-stage defense provides a much higher overall ESD withstand capability compared to prior art solutions that rely predominantly on a single, internal layer of protection. It represents a paradigm shift from solely internal protection to a comprehensive, multi-layered approach.\n\nKeywords: prior art comparison, package-level vs die-level ESD, cumulative protection, ESD innovation, semiconductor architecture, integrated circuit defense, US-9853446.","question":"How is Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection different from prior art?"},{"answer":"The Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection patent has the potential to impact a wide array of industries that rely heavily on integrated circuits and demand high levels of reliability.\n\n**Consumer Electronics:** Devices like smartphones, laptops, tablets, and smart home gadgets will benefit from enhanced durability and fewer static-induced failures, leading to longer product lifespans and greater customer satisfaction.\n\n**Automotive:** This is a critical sector where reliability is paramount. Electronic control units (ECUs), infotainment systems, advanced driver-assistance systems (ADAS), and autonomous driving platforms will gain significantly improved robustness against electrical transients, directly contributing to vehicle safety and dependability.\n\n**Industrial IoT (Internet of Things):** Sensors, controllers, and communication modules deployed in harsh industrial environments or remote locations require extreme reliability. This technology will make these devices more resilient to environmental static, reducing downtime and maintenance costs.\n\n**Medical Devices:** Life-critical medical equipment, from diagnostic tools to implantable devices, must operate flawlessly. Enhanced ESD protection ensures greater stability and reliability, which is vital for patient care and safety.\n\n**Telecommunications and Data Centers:** Networking equipment, servers, and data storage systems require continuous operation. Increased IC reliability from this patent will contribute to greater uptime and reduced infrastructure maintenance.\n\n**Aerospace and Defense:** Components in aircraft, spacecraft, and military equipment operate under extreme conditions and demand the highest reliability standards. This innovation offers a crucial advantage in these mission-critical applications.\n\nKeywords: industries impacted, automotive electronics, consumer electronics, industrial IoT, medical devices, telecommunications, aerospace, IC reliability applications.","question":"What industries will Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection impact?"},{"answer":"The patent for \"Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection\" (US-9853446) was filed on **August 27, 2015**. This date marks when the initial application was submitted to the patent office, establishing the priority date for the invention.\n\nFollowing the examination process, the patent was subsequently granted and published on **December 26, 2017**. The publication date signifies when the patent document became publicly available, detailing the claims, abstract, and full description of the invention.\n\nThese dates are important milestones in the lifecycle of intellectual property. The filing date is crucial for determining novelty and priority against other inventions, while the publication date makes the technical details of the Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection accessible to the public, allowing other researchers and companies to understand and potentially license or build upon the technology.\n\nKeywords: patent filing date, patent publication date, US-9853446 dates, intellectual property timeline, patent lifecycle.","question":"When was Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection filed/granted?"},{"answer":"The commercial applications of the Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection are extensive, spanning any sector that utilizes integrated circuits and benefits from enhanced reliability. This patent provides a foundational technology for a wide range of products.\n\nOne primary application is in **high-reliability electronics**, such as those found in the automotive industry (e.g., engine control units, ADAS sensors), medical devices (e.g., patient monitors, implantables), and industrial control systems (e.g., factory automation, robotics). In these fields, product failure can have severe consequences, making the cumulative ESD protection offered by this invention invaluable.\n\nAnother significant area is **consumer electronics**. Smartphones, laptops, wearables, and smart home devices can all benefit from increased durability, leading to longer product lifespans, fewer customer complaints, and reduced warranty costs for manufacturers. This translates directly to a stronger brand reputation and improved customer loyalty.\n\nFurthermore, the technology is highly applicable in **data centers and telecommunications infrastructure**, where continuous operation is critical. Servers, networking equipment, and base stations can achieve greater uptime and reduced maintenance requirements due to more robust IC components.\n\nFinally, the ability to potentially reduce the silicon area dedicated to on-die ESD protection can also lead to **more cost-effective and compact IC designs**, opening avenues for smaller, more powerful, and feature-rich devices across various markets. The commercial value lies in both cost savings through failure reduction and market differentiation through superior product quality.\n\nKeywords: commercial applications, high-reliability electronics, consumer electronics market, automotive applications, data center reliability, cost-effective ICs, market value.","question":"What are the commercial applications of Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection?"},{"answer":"Looking ahead, the Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection patent lays a robust foundation for exciting future developments in semiconductor reliability. This innovation is likely to evolve and integrate with emerging technologies.\n\nOne expected development is the **optimization of embedded ESD components**. As packaging technologies advance, we may see more sophisticated materials and integration techniques for embedding ESD protection directly within the package substrate, potentially leading to even lower parasitic inductance, faster response times, and improved thermal characteristics. This could involve novel polymer composites or advanced ceramic substrates.\n\nAnother area of future development could be **adaptive or intelligent ESD protection**. This might involve incorporating sensing capabilities within the package that can detect impending ESD threats or the characteristics of an ESD event, allowing the protection components to dynamically adjust their response. This could lead to more nuanced and effective protection tailored to specific environmental conditions.\n\nFurthermore, the principles of cumulative protection could be extended to address other forms of electromagnetic interference (EMI) or transient events, leading to **holistically ruggedized IC packages**. This would create devices that are not only resistant to static but also to a broader spectrum of electrical noise and environmental stresses.\n\nFinally, as 2.5D and 3D stacking technologies become more prevalent, the concept of package-level ESD protection will become even more critical for protecting the complex interconnections and multiple dies within a single package. Future developments will focus on seamlessly integrating this protection into these advanced packaging architectures, ensuring the continued reliability of next-generation high-density electronics.\n\nKeywords: future ESD protection, embedded components, adaptive ESD, intelligent protection, EMI protection, 3D packaging, semiconductor innovation, reliability trends.","question":"What are the future developments expected for Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection?"}],"topics":["integrated circuit protection","ESD protection","semiconductor reliability","package-level ESD","die-level ESD","pervasive","challenge","electrostatic"],"tech_cluster":null},"seo":{"title":"IC Package ESD Protection - Patent US-9853446","description":"Discover the Integrated Circuit (ic) Package Comprising Electrostatic Discharge (esd) Protection patent. Learn how package-level and die-level ESD provide cumulative defense for enhanced IC reliability.","keywords":["integrated circuit protection","ESD protection","semiconductor reliability","package-level ESD","die-level ESD","electronics reliability","cumulative ESD","IC package innovation","patent US-9853446","H01L"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853446","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853446","citation_suggestion":"Patentable. \"Integrated circuit (IC) package comprising electrostatic discharge (ESD) protection\" (US-9853446). https://patentable.app/patents/US-9853446","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853446","json":"https://patentable.app/api/llm-context/US-9853446","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:59:17.412Z"}