{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9853695","patent":{"patent_number":"US-9853695","title":"Transmitting magnetic field through metal chassis using fractal surfaces","assignee":null,"inventors":[],"filing_date":"2016-09-13T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H04B"],"num_claims":20,"abstract":"Described herein are techniques related one or more systems, apparatuses, methods, etc. for reducing induced currents in a apparatus chassis. For example, a fractal slot is constructed in the apparatus chassis to reduce the induced currents, and enhance passage of magnetic fields through the apparatus chassis. In this example, the fractal slot may include a no-self loop fractal space filling curve shape to provide high impedance to the induced currents."},"analysis":{"summary":"The patent, Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces (US-9853695), introduces a novel solution for a pervasive challenge in modern electronics: enabling efficient transmission of magnetic fields through metallic enclosures while simultaneously mitigating electromagnetic interference (EMI) caused by induced currents. The core innovation lies in the strategic integration of a fractal slot within the apparatus chassis.\n\nThis technology addresses the problem where conductive metal chassis, while providing structural integrity and external shielding, inherently block or attenuate internal magnetic fields by generating opposing eddy currents. This phenomenon severely limits the performance of wireless communication, inductive charging, and magnetic sensing applications within shielded devices.\n\nThe key technical approach involves constructing a fractal slot, specifically one designed as a no-self-loop fractal space-filling curve. This intricate geometric pattern creates an exceptionally long and tortuous electrical path within a compact area. When a magnetic field interacts with this structure, the induced currents are forced to traverse this high-impedance path, effectively reducing their magnitude. By suppressing these eddy currents, the patent enhances the passage of the desired magnetic fields through the metal chassis with significantly less attenuation.\n\nFrom a business perspective, this invention offers substantial value. It enables the design of more compact, robust, and aesthetically pleasing electronic devices without compromising wireless functionality. Industries such as consumer electronics (e.g., smartphones, wearables with wireless charging), industrial IoT (sensors in harsh environments), medical devices (implants, diagnostic tools), and automotive electronics stand to benefit immensely. The ability to seamlessly integrate wireless capabilities through metal enclosures reduces manufacturing complexity, improves product reliability, and opens new avenues for product innovation.\n\nThe market opportunity is vast, as nearly all modern electronic devices utilize some form of metallic shielding or enclosure. This technology provides a competitive advantage by allowing manufacturers to overcome long-standing design limitations, offering superior performance, extended battery life (due to reduced power loss), and enhanced user experience. It positions itself as a critical enabler for the next generation of smart, connected, and electromagnetically optimized devices.","layman_explanation":"In today's world, almost every electronic device we use is housed in some kind of casing, and often, that casing is made of metal. Metal is great for making devices strong and protecting them from bumps or interference from outside. However, metal also creates a big problem: it blocks magnetic fields. This might not sound like a big deal, but magnetic fields are essential for many modern technologies, like wireless charging, NFC payments, or even the tiny communications happening inside a device.\n\n**1. What Problem Does This Solve?**\n\nImagine you have a smartphone with a sleek metal back. You want to charge it wirelessly, but the metal gets in the way. Or perhaps you have an industrial sensor in a rugged metal box, and it needs to send data wirelessly from inside. The core problem is that when a magnetic field tries to pass through metal, it creates tiny electrical currents within the metal itself, called 'induced currents' or 'eddy currents'. These currents then generate their own magnetic fields that push back, effectively blocking the original magnetic field. It's like trying to push water through a sieve, but the water pushes back. Existing solutions often involve making parts of the casing out of plastic, adding bulky external antennas, or simply accepting weaker signals. These options can compromise the device's durability, aesthetics, or performance.\n\n**2. How Does It Work?**\n\nThe Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent offers an ingenious solution. Instead of trying to avoid the metal, this invention modifies the metal itself. It proposes creating a special kind of slot or pattern within the metal chassis – a 'fractal slot'. Think of a fractal as a pattern that repeats itself at smaller and smaller scales, like the branches of a tree or the coastline of an island. These fractal slots are designed in a very specific, intricate way, like a super-tiny, complex maze. The key is that this maze-like pattern creates an incredibly long and winding path within a very small physical area.\n\nNow, when the magnetic field tries to pass through, and those problematic induced currents try to form in the metal, they are forced to follow this incredibly long and twisty fractal path. Because the path is so long and complex, it presents a very high 'resistance' or 'impedance' to these currents. It's like trying to run a marathon through a dense, winding forest instead of a straight road. The currents get 'tired' and become very weak. With these blocking currents significantly reduced, the original magnetic field can then pass through the metal chassis with much greater ease and efficiency. The metal still protects the device, but it no longer acts as a complete barrier to magnetic fields.\n\n**3. Why Does This Matter?**\n\nThis innovation has significant implications across many industries. For consumer electronics, it means we can have devices that are both beautiful (full metal designs) and highly functional (excellent wireless charging, NFC, and Wi-Fi performance). For industrial applications, sensors can be more robust and sealed against harsh environments while still communicating wirelessly. In healthcare, it could improve the performance of medical devices or implants that need to transmit data through metal components.\n\nThis technology offers a clear competitive advantage. Companies that adopt this approach can develop products that are more durable, more aesthetically pleasing, and offer superior wireless performance compared to competitors using traditional methods. It can lead to higher customer satisfaction, reduced warranty claims (due to better signal reliability), and potentially lower manufacturing costs by simplifying antenna integration.\n\n**4. What's Next?**\n\nThe Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent paves the way for a new generation of electronic devices. We can expect to see more fully integrated, compact, and robust products that no longer have to compromise between physical protection and wireless functionality. This could accelerate the adoption of wireless power solutions, enhance the capabilities of the Internet of Things (IoT), and enable entirely new product categories that rely on seamless magnetic field interaction through metal. For businesses, investing in or licensing this technology could unlock significant market opportunities and drive innovation across their product lines.","technical_analysis":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent (US-9853695) presents a sophisticated approach to a fundamental electromagnetic challenge: facilitating the passage of magnetic fields through conductive metal while simultaneously suppressing induced currents. This technical analysis delves into the architecture, implementation details, underlying algorithms, and performance characteristics of this innovative system.\n\n**Technical Architecture and Problem Statement**\n\nThe fundamental problem addressed is the attenuation of time-varying magnetic fields (H-fields) when they encounter a conductive medium, specifically a metal chassis. This attenuation is primarily due to the generation of eddy currents (induced currents) within the conductor, which, by Lenz's Law, produce secondary magnetic fields that oppose the primary field. The goal of this patent is to create a pathway within the chassis that presents high impedance to these induced currents, thereby minimizing their magnitude and allowing the primary magnetic field to pass through with reduced loss.\n\nThe proposed architecture involves integrating a 'fractal slot' into the metal chassis. This slot is not a simple aperture but a meticulously designed geometric structure. The patent explicitly mentions a 'no-self-loop fractal space-filling curve shape' as a preferred embodiment. Examples of such curves include Hilbert curves, Peano curves, or variations thereof, modified to prevent self-intersection at critical points that could create low-impedance current paths.\n\n**Implementation Details and Algorithm Specifics**\n\nThe implementation of this technology would typically involve precision manufacturing techniques to create the fractal slot. This could include:\n\n1.  **Photolithography/Etching:** For thin metal sheets or PCBs, standard lithographic processes could define the fractal pattern, followed by chemical or plasma etching to create the physical slot.\n2.  **Laser Machining:** For thicker chassis materials, high-precision laser cutting or ablation could be used to carve the intricate fractal geometry.\n3.  **Additive Manufacturing (3D Printing):** For complex 3D chassis structures, advanced metal 3D printing could directly integrate the fractal slot during the fabrication process, potentially allowing for internal, non-visible fractal structures.\n\nThe 'algorithm' for the fractal slot design isn't a computational algorithm in the traditional sense, but rather a geometric generation process. A space-filling curve, by definition, can approximate any point in a multi-dimensional space. When applied to a 2D plane (the chassis surface), it creates an extremely long line within a finite area. The 'no-self-loop' constraint is critical to ensure that the generated fractal curve doesn't create unintended short-circuit paths for the induced currents. A self-intersecting fractal could inadvertently lower the impedance for certain current paths, defeating the purpose.\n\n**Mechanism of High Impedance:**\n\nWhen a magnetic field attempts to penetrate the chassis, it induces electromotive forces (EMF) that drive currents. In a solid metal sheet, these currents can form large loops with relatively low resistance. With the fractal slot, however, any induced current is forced to follow the tortuous, elongated path of the fractal geometry. This significantly increases the effective electrical path length, leading to a much higher resistance (R) and inductance (L) for the current loop. The impedance (Z) of such a path, Z = R + jωL (where ω is the angular frequency), becomes substantially higher. This high impedance effectively chokes off the induced currents, reducing their magnitude (I = V/Z) and consequently minimizing the strength of their opposing magnetic fields.\n\n**Integration Patterns and Performance Characteristics**\n\n*   **Integration:** The fractal slot can be integrated into specific regions of a chassis where magnetic field transmission is desired, such as near an internal antenna, a wireless charging coil, or a magnetic sensor. The rest of the chassis can remain solid for structural rigidity and broadband EMI shielding from external sources.\n*   **Performance:** The effectiveness of this system is measured by the reduction in magnetic field attenuation and the suppression of induced currents. Simulations and empirical tests would show a significant increase in magnetic field coupling efficiency through the fractal-slotted section compared to a solid metal section or a simple, non-optimized aperture. The patent claims 'enhanced passage of magnetic fields' and 'reduction in induced currents', indicating improved signal-to-noise ratio and potentially lower power consumption for internal wireless modules.\n*   **Frequency Dependence:** The design of the fractal slot (e.g., iteration depth, line width, spacing) would be optimized for specific frequency ranges. While the underlying principle is broadband, the precise impedance characteristics will vary with frequency, requiring careful design for target applications.\n*   **Material Compatibility:** The technique is applicable to various conductive materials used in chassis construction, including aluminum, steel, copper alloys, etc., provided they can be precision-machined or etched.\n\n**Code-Level Implications (for Design/Simulation)**\n\nFor engineers, this patent implies the need for advanced electromagnetic simulation tools (e.g., FEM, FDTD solvers) capable of accurately modeling complex fractal geometries and their interaction with electromagnetic fields. Designing such a slot would involve:\n\n1.  **Fractal Generation Algorithms:** Developing or utilizing code to generate various no-self-loop space-filling curves with specified parameters (e.g., iteration depth, segment length).\n2.  **Electromagnetic Simulation:** Importing these geometries into solvers to analyze S-parameters, near-field distributions, and induced current densities.\n3.  **Optimization Algorithms:** Employing genetic algorithms or other optimization techniques to fine-tune fractal parameters for specific frequency bands and chassis materials to maximize magnetic field passage and minimize induced currents.\n\nIn summary, the Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent offers a technically robust and elegant solution to a long-standing problem. By intelligently applying fractal geometry to create high-impedance paths for induced currents, it paves the way for a new generation of electronic devices with superior electromagnetic performance within metallic enclosures.","business_analysis":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent (US-9853695) represents a significant advancement in electromagnetic compatibility (EMC) and wireless signal propagation within shielded enclosures. From a business perspective, this innovation addresses critical market needs and offers substantial commercial opportunities across multiple industries.\n\n**Market Opportunity Size:**\n\nThe market for electronic devices requiring robust wireless communication and efficient power transfer, particularly those housed in metallic enclosures, is enormous and continuously expanding. This includes:\n\n*   **Consumer Electronics:** Smartphones, wearables, smart home devices, laptops, and tablets increasingly feature metal unibody designs, where wireless charging, NFC, and internal antenna performance are crucial. This segment alone is worth hundreds of billions of dollars annually.\n*   **Industrial Internet of Things (IIoT):** Sensors, actuators, and communication modules in harsh industrial environments often require rugged, sealed metal casings. The IIoT market is projected to reach over $1 trillion by 2030.\n*   **Automotive Electronics:** Modern vehicles are packed with sensors, infotainment systems, and autonomous driving components, many housed in metal. The automotive electronics market is valued at over $200 billion and growing.\n*   **Medical Devices:** Implants, diagnostic equipment, and monitoring systems often utilize biocompatible metal enclosures, where wireless data transmission is vital.\n*   **Aerospace and Defense:** High-reliability systems in aircraft, satellites, and military equipment demand robust shielding without compromising communication.\n\nThis patent targets a fundamental challenge common to all these sectors, indicating a total addressable market in the trillions of dollars, with direct applicability to hundreds of billions in hardware manufacturing.\n\n**Competitive Advantages:**\n\nThis technology offers several distinct competitive advantages:\n\n1.  **Superior Signal Integrity:** Provides a method to achieve significantly better magnetic field transmission through metal than traditional approaches, leading to enhanced wireless performance and reduced power consumption for internal modules.\n2.  **Design Flexibility and Aesthetics:** Eliminates the need for bulky external antennas, non-metallic windows, or large apertures, allowing for sleeker, more compact, and aesthetically pleasing product designs. It maintains the structural integrity and shielding benefits of a full metal chassis.\n3.  **Reduced EMI/EMC Issues:** By actively reducing induced currents, the technology inherently improves electromagnetic compatibility, leading to more reliable devices and potentially simpler certification processes.\n4.  **Cost-Efficiency:** While requiring precision manufacturing, it can reduce overall Bill of Materials (BOM) by eliminating complex external antenna assemblies, specialized RF-transparent materials, or additional EMI suppression components.\n5.  **Robustness and Environmental Sealing:** Allows for fully sealed metal enclosures, making devices more resistant to dust, water, and physical impact without compromising wireless functionality.\n\n**Revenue Potential and Business Models:**\n\nRevenue generation could come from:\n\n*   **Licensing:** Licensing the patent to major electronics manufacturers, particularly in consumer electronics, automotive, and industrial sectors.\n*   **Component Sales:** Developing and selling fractal-patterned chassis components or modules as a specialized solution.\n*   **Consulting/Design Services:** Offering expertise in integrating this technology into new product designs for various clients.\n\nGiven the broad applicability, a licensing model appears most scalable, potentially commanding significant royalties due to the fundamental nature of the problem it solves and the widespread adoption of metal enclosures.\n\n**Strategic Positioning:**\n\nCompanies adopting this technology can strategically position themselves as leaders in:\n\n*   **Advanced Wireless Integration:** Offering devices with superior wireless performance in challenging environments.\n*   **Compact and Robust Design:** Delivering highly durable and aesthetically refined products without traditional wireless compromises.\n*   **Next-Generation IoT Hardware:** Enabling truly integrated and maintenance-free IoT sensors and devices.\n\n**ROI Projections:**\n\nFor manufacturers, the ROI would be realized through:\n\n*   **Reduced Development Costs:** Shorter design cycles for wireless integration.\n*   **Lower Manufacturing Costs:** Simplified assembly and BOM reduction.\n*   **Increased Market Share:** Differentiated products with superior performance and design.\n*   **Enhanced Brand Reputation:** Known for innovative, high-performance, and reliable products.\n\nThe initial investment in R&D and precision manufacturing might be offset rapidly by the competitive advantages and market gains, especially in high-volume product categories. The ability to solve a pervasive problem with an elegant, integrated solution translates directly into tangible business value and a strong return on investment for early adopters and licensees of this technology.","faqs":[{"answer":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent (US-9853695) describes an innovative technology designed to overcome a fundamental limitation in electronics: the blocking of magnetic fields by metal enclosures. This invention proposes a method for constructing a special 'fractal slot' within an apparatus's metal chassis. This fractal slot is not just a simple opening, but an intricately designed pattern, specifically a no-self-loop fractal space-filling curve shape.\n\nThe primary purpose of this unique fractal pattern is to reduce induced currents (also known as eddy currents) that typically form in metal when a magnetic field tries to pass through it. These induced currents generate their own magnetic fields that oppose and effectively block the original field. By creating a high-impedance path for these currents, the fractal slot significantly diminishes their magnitude, thereby enhancing the passage of magnetic fields through the metal chassis with much greater efficiency.\n\nEssentially, this technology allows for a metal enclosure to maintain its structural integrity and external shielding properties, while simultaneously becoming 'transparent' to desired magnetic fields for internal wireless communication, charging, or sensing applications. It represents a clever fusion of advanced geometry and electromagnetic engineering to solve a pervasive problem in modern device design.\n\nKeywords: fractal slot, magnetic field transmission, metal chassis, induced currents, patent US-9853695, electromagnetic transparency.","question":"What is Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces?"},{"answer":"The core mechanism of the Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent revolves around intelligently manipulating the path of induced currents within a metal chassis. When a magnetic field encounters a conductive metal, it induces electrical currents (eddy currents) within it. These currents, following Lenz's Law, generate opposing magnetic fields that effectively block the original field.\n\nThis invention introduces a 'fractal slot' within the metal chassis. A fractal, like a Hilbert curve, is a shape that can pack an extremely long line into a confined space. By integrating such a fractal pattern into the chassis, the path for any induced current is forced to follow this incredibly long and tortuous geometry. This dramatically increases the electrical resistance and inductance of the current path, leading to a significantly higher impedance.\n\nBecause the impedance for the induced currents is so high, their magnitude is drastically reduced. With weaker induced currents, the opposing magnetic fields they generate are also minimized, allowing the original magnetic field to pass through the metal chassis with far less attenuation. The 'no-self-loop' characteristic of the fractal curve is crucial to ensure that no unintended short-circuit paths are created, maintaining the high impedance necessary for effective operation.\n\nKeywords: fractal slot mechanism, induced currents, eddy currents, high impedance, fractal geometry, magnetic field propagation, electromagnetic principles.","question":"How does Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces work?"},{"answer":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent primarily solves the long-standing problem of how to enable efficient magnetic field transmission through a conductive metal chassis without compromising its structural integrity, aesthetic appeal, or external electromagnetic interference (EMI) shielding capabilities. Metal enclosures, while robust and protective, inherently block or significantly attenuate magnetic fields, creating major hurdles for modern wireless technologies.\n\nThis limitation impacts numerous applications, including wireless charging (e.g., for smartphones or industrial tools), Near-Field Communication (NFC) systems, and internal wireless communication modules within shielded devices (e.g., Wi-Fi, Bluetooth in metal-bodied laptops or IoT sensors). Traditional solutions, such as creating large physical apertures, using non-metallic sections, or relying on external antennas, often introduce undesirable trade-offs in terms of durability, cost, design aesthetics, or overall performance.\n\nBy providing a method to effectively 'transparentize' sections of a metal chassis to magnetic fields, this invention eliminates these compromises. It allows designers to create devices that are both fully protected by metal and highly efficient in their wireless functionalities, thus unlocking new possibilities for compact, robust, and aesthetically pleasing electronic product designs.\n\nKeywords: problem solved, magnetic field blockage, metal chassis limitations, wireless charging issues, EMI problems, design compromises, signal attenuation.","question":"What problem does Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces solve?"},{"answer":"The patent Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces (US-9853695) was filed on September 13, 2016, and published on December 26, 2017. The inventors associated with this groundbreaking technology are not listed in the provided patent abstract data. Typically, inventor names would be found in the full patent document, which includes detailed claims and descriptions.\n\nWhile the specific individuals are not provided, the innovation itself stems from a deep understanding of electromagnetic theory, fractal geometry, and materials science. This type of invention often emerges from collaborative research and development efforts within corporate R&D departments or academic institutions focused on advanced electronics and communication systems.\n\nThe assignee, also not provided in the abstract, would be the entity that owns the patent rights, which could be a major technology company, a research institution, or an individual inventor. The innovation's impact underscores the importance of continued investment in fundamental and applied research in these fields.\n\nKeywords: inventors, patent origin, filing date, publication date, assignee, electromagnetic research, fractal technology development.","question":"Who invented Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces?"},{"answer":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent offers several significant benefits that address long-standing challenges in electronics design:\n\n1.  **Enhanced Magnetic Field Transmission:** The primary benefit is the dramatic improvement in the passage of magnetic fields through metal chassis. This directly translates to more efficient wireless charging, more reliable NFC functionality, and better performance for internal wireless communication modules in metal-encased devices.\n2.  **Reduced Induced Currents and EMI:** By creating a high-impedance path for induced currents, the technology effectively suppresses eddy currents within the chassis. This not only aids magnetic field passage but also reduces internal electromagnetic interference (EMI), leading to cleaner signals and greater device stability.\n3.  **Preservation of Chassis Integrity:** Unlike solutions that require large cutouts or non-metallic sections, this fractal-based approach allows for the maintenance of the metal chassis's structural strength, durability, and external EMI shielding capabilities. The intricate fractal slot can be integrated without compromising the overall robustness of the enclosure.\n4.  **Design Flexibility and Aesthetics:** This innovation liberates product designers from traditional constraints, enabling the creation of sleek, full-metal devices without sacrificing wireless performance. It eliminates the need for unsightly antenna lines or plastic windows, leading to more aesthetically pleasing and compact products.\n5.  **Cost and Power Efficiency:** By improving magnetic field coupling, devices can operate more efficiently, potentially requiring less power for wireless transmission and reducing manufacturing costs by simplifying antenna integration and material choices.\n\nThese benefits collectively allow for the development of superior electronic products that are both highly functional and robust, meeting the growing demands of modern consumers and industrial applications.\n\nKeywords: key benefits, signal integrity, EMI reduction, wireless charging efficiency, design flexibility, product durability, power efficiency, compact electronics.","question":"What are the key benefits of Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces?"},{"answer":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent distinguishes itself from prior art by offering a fundamentally different and more integrated approach to managing magnetic field transmission through metal. Prior art solutions typically involve either creating physical gaps in the metal or using entirely different materials.\n\nTraditional methods often include cutting simple apertures or slots into the chassis, which can weaken the structure, compromise environmental sealing, and create broadband EMI leakage pathways. Another common approach is to integrate non-metallic windows (e.g., plastic or glass) into the metal, which introduces material discontinuities, adds manufacturing complexity, and can detract from durability or aesthetics. External antennas are also used, adding bulk and vulnerability. All these methods involve a compromise between protection and connectivity.\n\nIn contrast, this invention doesn't just create a hole or replace metal with another material; it intelligently re-engineers the metal chassis itself. By embedding a 'fractal slot' that specifically creates a high-impedance path for induced currents, it actively reduces the electromagnetic forces that block magnetic fields. This means the metal chassis can largely retain its structural integrity, external shielding properties, and continuous metallic aesthetic, while selectively allowing magnetic fields to pass through efficiently. The innovation lies in this active manipulation of internal electromagnetic dynamics rather than passive material replacement or structural compromise, making it a more elegant and effective solution.\n\nKeywords: prior art comparison, fractal slot vs apertures, metal chassis innovation, EMI shielding differences, wireless technology advancements, design integration, electromagnetic manipulation.","question":"How is Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces different from prior art?"},{"answer":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent is poised to significantly impact a wide array of industries that rely on electronic devices, particularly those requiring robust performance within metallic enclosures:\n\n1.  **Consumer Electronics:** This includes smartphones, smartwatches, laptops, tablets, and smart home devices. The ability to enhance wireless charging, NFC, Wi-Fi, and Bluetooth performance through sleek, full-metal designs will be a major differentiator, improving aesthetics and functionality.\n2.  **Industrial Internet of Things (IIoT):** Sensors, actuators, and communication modules deployed in harsh industrial environments often demand rugged, hermetically sealed metal casings. This technology enables seamless and reliable wireless data transfer and power delivery, simplifying maintenance and extending device lifespan in critical infrastructure.\n3.  **Automotive and Aerospace:** Modern vehicles and aircraft are increasingly packed with sensors, infotainment systems, and communication modules housed within metallic structures. The invention can improve signal integrity, reduce cabling complexity, and enable more integrated designs within these shielded environments.\n4.  **Medical Devices:** Implantable and external medical devices frequently utilize biocompatible metal enclosures. Enhanced wireless capabilities can lead to better remote patient monitoring, more efficient diagnostics, and safer power delivery through the casing.\n5.  **Defense and Security:** Equipment requiring high reliability and robust shielding, such as communication devices or sensors in military applications, can benefit from improved signal propagation without compromising ruggedness.\n\nEssentially, any sector where electronic devices need to combine the durability and shielding of a metal chassis with efficient wireless functionality stands to benefit from this innovative approach. It will enable new product designs and performance benchmarks across these diverse markets.\n\nKeywords: industry impact, consumer electronics, industrial IoT, automotive electronics, medical devices, aerospace, defense, wireless technology applications, market transformation.","question":"What industries will Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces impact?"},{"answer":"The patent Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces, identified as US-9853695, has specific dates associated with its lifecycle.\n\nThis patent was **filed** on **September 13, 2016**. The filing date is when the patent application was officially submitted to the patent office, marking the beginning of the patent prosecution process and establishing the priority date for the invention.\n\nIt was subsequently **published** on **December 26, 2017**. The publication date is when the patent office makes the application publicly available, allowing others to review the details of the invention. While the abstract does not explicitly state the 'granted' date, the publication date typically precedes the grant date for issued patents. For US-9853695, the patent number itself indicates that it has been granted as a utility patent. The specific grant date would be December 26, 2017, as this is the publication date for an issued patent.\n\nThese dates are crucial for understanding the patent's legal standing, its position in the prior art landscape, and its effective term of protection. The relatively quick turnaround from filing to publication/grant indicates the innovation's readiness for public disclosure and potential commercialization.\n\nKeywords: patent filing date, patent publication date, patent granted, US-9853695, patent lifecycle, intellectual property, invention timeline.","question":"When was Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces filed/granted?"},{"answer":"The commercial applications of the Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent are extensive and diverse, given its ability to resolve a fundamental conflict in electronic design. This technology enables the creation of superior products across multiple market segments:\n\n1.  **Wireless Charging Devices:** Smartphones, smartwatches, laptops, and other portable electronics with full metal chassis can now achieve highly efficient wireless charging without compromising design aesthetics or durability. This extends to industrial tools and electric vehicles with inductive charging capabilities through their metallic bodies.\n2.  **Industrial IoT (IIoT) Sensors and Devices:** Rugged, hermetically sealed metal enclosures are common in harsh industrial environments. This patent allows internal sensors and communication modules to transmit data wirelessly through the metal, enabling more reliable, maintenance-free, and easily deployable IIoT solutions.\n3.  **Medical Implants and Diagnostics:** Devices requiring biocompatible metal casings, such as pacemakers or diagnostic tools, can benefit from enhanced wireless communication for remote monitoring and data transfer, improving patient care and device management.\n4.  **Automotive Electronics:** Integration of magnetic sensors, NFC systems, and wireless communication modules within a vehicle's metallic bodywork can be optimized, leading to more compact designs, reduced wiring, and improved reliability for autonomous driving and infotainment systems.\n5.  **Consumer Wearables and Smart Home Devices:** Enabling sleeker, more durable metal designs for smart rings, smart glasses, or smart speakers with seamless wireless connectivity and inductive power transfer.\n6.  **Secure Communication Devices:** In high-security applications, robust metal shielding is paramount. This technology allows for secure internal communication or data transfer through the shield without physical breaches.\n\nBy overcoming the inherent limitations of metal enclosures, this innovation opens doors for product differentiation, enhanced user experience, and significant market expansion for manufacturers in these high-growth sectors.\n\nKeywords: commercial applications, wireless charging, industrial IoT, medical devices, automotive electronics, consumer electronics, NFC, product differentiation, market expansion.","question":"What are the commercial applications of Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces?"},{"answer":"The Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces patent lays a robust foundation for numerous future developments in electromagnetic engineering and product design. The inherent versatility of fractal geometry suggests several exciting avenues for evolution:\n\n1.  **Advanced Fractal Architectures:** Future research may explore more complex or multi-layered fractal patterns, potentially incorporating 3D fractal structures within the chassis volume. This could lead to even greater control over magnetic field pathways and a broader range of frequency optimization. The 'no-self-loop' constraint might be adapted for specific 3D geometries.\n2.  **Tunable and Reconfigurable Systems:** Imagine fractal slots whose electromagnetic properties can be dynamically adjusted. Future developments could include integrating active electronic components or smart materials within the fractal patterns, allowing the chassis to adapt its magnetic transparency based on real-time needs or environmental conditions.\n3.  **Integration with Metamaterials:** Combining the principles of fractal slots with metamaterial concepts could unlock unprecedented control over electromagnetic waves. This could lead to chassis designs that not only allow specific magnetic fields to pass but also actively shape, focus, or steer them.\n4.  **Multi-Frequency Optimization:** While current designs might be optimized for specific frequency bands, future iterations could aim for broadband performance or simultaneous optimization across multiple distinct frequency ranges, catering to devices with diverse wireless communication standards.\n5.  **Self-Healing and Adaptive Materials:** The intricate nature of fractal slots could be integrated with self-healing metallic composites, ensuring that any micro-fractures in the chassis do not compromise the electromagnetic performance of the fractal pattern.\n\nThese developments promise to further blur the lines between protective enclosures and active electromagnetic components, enabling truly integrated, intelligent, and adaptive electronic devices. The fractal frontier in magnetic field management is just beginning, with potential to redefine how we interact with our connected world.\n\nKeywords: future developments, fractal technology evolution, tunable fractals, metamaterials integration, multi-frequency optimization, adaptive materials, electromagnetic control, advanced chassis design.","question":"What are the future developments expected for Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces?"}],"topics":["Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces","fractal slot","magnetic field transmission","metal chassis","induced currents","pervasive","metallic","enclosures"],"tech_cluster":null},"seo":{"title":"Fractal Surfaces for Magnetic Field Transmission - Patent US-9853695","description":"Discover how Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces reduces induced currents & enhances magnetic field passage. Full patent analysis.","keywords":["Transmitting Magnetic Field Through Metal Chassis Using Fractal Surfaces","fractal slot","magnetic field transmission","metal chassis","induced currents","EMI reduction","signal integrity","wireless charging","fractal geometry","high impedance","patent US-9853695","electronics innovation"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9853695","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9853695","citation_suggestion":"Patentable. \"Transmitting magnetic field through metal chassis using fractal surfaces\" (US-9853695). https://patentable.app/patents/US-9853695","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9853695","json":"https://patentable.app/api/llm-context/US-9853695","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:15:32.371Z"}