{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854663","patent":{"patent_number":"US-9854663","title":"Radio frequency module","assignee":null,"inventors":[],"filing_date":"2017-05-22T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an IC chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies."},"analysis":{"summary":"The Radio Frequency Module patent (US 9854663) introduces an innovative approach to noise reduction in multilayer circuit boards, particularly within compact electronic devices. The core innovation lies in the strategic placement of planar ground conductive bodies within the module to minimize noise interference generated by IC chips. The problem being solved is the increasing challenge of integrating sensitive radio frequency circuits into densely packed environments where noise significantly impacts performance. This technology strategically places ground conductive bodies on a layer not exposed to the cavity's inner surface, supplemented by inter-layer connection conductive bodies protruding towards the noise source. This design effectively creates a localized Faraday cage, enhancing noise immunity and overall module performance. \n\nThe business value of this technology lies in its potential to enable smaller, more efficient, and more reliable wireless devices. The improved signal integrity and reduced power consumption translate into enhanced user experience and extended battery life, providing a competitive advantage in the market. Market opportunities exist in various sectors, including mobile communications, wireless sensor networks, and medical devices, where high-performance, low-noise RF circuits are essential. The Radio Frequency Module represents a significant advancement in addressing the challenges of RF integration in modern electronics. Its innovative design and noise reduction techniques offer a promising solution for improving the performance and reliability of various wireless devices.","layman_explanation":"The Radio Frequency Module patent addresses the growing problem of noise interference in compact electronic devices. As devices become smaller and more densely packed, the sensitive radio frequency (RF) circuits within them are increasingly susceptible to noise generated by other components, particularly integrated circuit (IC) chips. This noise can degrade signal quality, reduce data transmission rates, and shorten battery life. Existing solutions often fall short in effectively mitigating this noise, leading to compromised device performance.\n\nThis technology works by strategically positioning ground conductive bodies within the RF module to minimize noise interference. Instead of exposing these ground planes to the inner cavity where the IC chip resides (and generates noise), the innovation places them on a separate layer. This reduces the direct coupling of noise. Think of it like building a soundproof room around a noisy machine. The walls (ground planes) prevent the noise from spreading to other parts of the building (the RF module).\n\nThis technology matters because it enables the creation of smaller, more efficient, and more reliable wireless devices. By minimizing noise interference, the invention improves signal integrity, reduces power consumption, and enhances overall device performance. This translates into a better user experience, longer battery life, and increased market competitiveness. The potential ROI for companies adopting this technology is significant, as it allows them to offer superior products with a clear competitive advantage.\n\nFuture applications of this technology include integration into 5G devices, wireless sensor networks, and medical implants. As the demand for smaller, more powerful, and more reliable wireless devices continues to grow, this innovation is well-positioned to play a key role in shaping the future of RF engineering. Market adoption is expected to accelerate as manufacturers seek to differentiate their products and meet the evolving needs of consumers.","technical_analysis":"The Radio Frequency Module patent focuses on a novel approach to mitigating noise interference in multilayer circuit boards, particularly those incorporating integrated circuit (IC) chips with inherent noise generation sources. The technology centers around the strategic placement of planar ground conductive bodies within the multilayer circuit board. Unlike conventional designs where ground planes are often exposed to the inner surface of the cavity housing the IC chip, this patent proposes positioning these ground planes on a layer not directly exposed to the cavity. This design minimizes the direct coupling of noise from the IC chip to the ground planes, reducing overall interference within the module. \n\nFurthermore, the patent introduces inter-layer connection conductive bodies that protrude from the planar ground conductive bodies towards the noise generation source. These conductive bodies act as a dedicated path for shunting noise away from sensitive components. This effectively creates a localized Faraday cage around the IC chip, further enhancing noise immunity. The implementation of this technology requires careful consideration of material properties, layer stackup, and interconnect design. The choice of thermoplastic resin for the insulating base material layers is critical for achieving the desired electrical and mechanical properties. The layer stackup must be optimized to minimize parasitic capacitance and inductance, which can degrade the performance of the RF module. The design of the inter-layer connection conductive bodies must also be carefully optimized to minimize impedance discontinuities and ensure efficient noise shunting. \n\nIntegration patterns involve optimizing the layout of the ground conductive bodies and inter-layer connections to minimize electromagnetic interference (EMI). Performance characteristics are expected to show a significant improvement in signal-to-noise ratio (SNR) and a reduction in power consumption. Code-level implications primarily involve optimizing the design of the RF module to minimize noise and interference, which can be achieved through careful simulation and testing.","business_analysis":"The Radio Frequency Module patent presents a significant market opportunity in the rapidly growing field of compact electronic devices. The increasing demand for smaller, more efficient, and more reliable wireless devices is driving the need for innovative solutions to mitigate noise interference in RF modules. The competitive advantage of this technology lies in its unique approach to noise reduction, which enables the integration of sensitive RF circuits into densely packed environments. This advantage translates into improved signal integrity, reduced power consumption, and enhanced overall device performance. \n\nThe revenue potential for this technology is substantial. Companies adopting this innovation can gain a competitive edge by offering superior wireless devices with improved performance and longer battery life. This can lead to increased market share, higher profit margins, and enhanced brand reputation. Business models can include licensing the technology to other manufacturers, incorporating it into proprietary products, or offering consulting services to help companies implement the innovation. Strategic positioning involves targeting key markets such as mobile communications, wireless sensor networks, and medical devices, where high-performance, low-noise RF circuits are essential. ROI projections are expected to be favorable, given the increasing demand for compact electronic devices and the competitive advantages offered by this technology.","faqs":[{"answer":"Radio Frequency Module refers to a specific design and configuration of a radio frequency (RF) module, as described in the US patent 9854663. This module is designed to minimize noise interference in multilayer circuit boards, particularly those incorporating integrated circuit (IC) chips that generate noise. The Radio Frequency Module's core innovation involves the strategic placement of ground conductive bodies within the module. This design differs from conventional approaches by positioning these ground planes on a layer not directly exposed to the cavity where the IC chip resides. This approach reduces the direct coupling of noise from the IC chip to the ground planes, minimizing overall interference within the module. \n\nFurthermore, the Radio Frequency Module features inter-layer connection conductive bodies that protrude from the planar ground conductive bodies towards the noise generation source. These conductive bodies act as a dedicated path for shunting noise away from sensitive components. This design effectively creates a localized Faraday cage around the IC chip, further enhancing noise immunity.","question":"What is Radio Frequency Module?"}],"topics":["radio frequency module","RF module","noise reduction","circuit board","wireless communication","technical","background","radio"],"tech_cluster":null},"seo":{"title":"Radio Frequency Module - Noise Reduction Patent US-9854663","description":"Discover the Radio Frequency Module patent for noise reduction in RF circuits. Full analysis, claims, and technical details. Improve signal integrity in compact devices.","keywords":["radio frequency module","RF module","noise reduction","circuit board","wireless communication","signal integrity","patent","patent US-9854663"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854663","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854663","citation_suggestion":"Patentable. \"Radio frequency module\" (US-9854663). https://patentable.app/patents/US-9854663","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854663","json":"https://patentable.app/api/llm-context/US-9854663","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:48:29.278Z"}