{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854669","patent":{"patent_number":"US-9854669","title":"Package substrate","assignee":null,"inventors":[],"filing_date":"2015-11-27T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A printed wiring board includes a first insulating layer, a first conductor layer formed on first surface of the first insulating layer, a second conductor layer formed on second surface of the first insulating layer, a first via structure formed in the first insulating layer such that the first via structure is connecting the first and second conductor layers, a second insulating layer formed on the second surface of the first insulating layer such that the second conductor layer is embedded into the second insulating layer, a third conductor layer formed on the second insulating layer, and a second via structure formed in the second insulating layer such that the second via structure is connecting the second and third conductor layers. The second conductor layer includes a dedicated wiring layer which transmits data between two electronic components to be mounted to the first surface of the first insulating layer."},"analysis":{"summary":"The Package Substrate patent introduces a novel printed wiring board (PWB) design that optimizes data transmission between electronic components. The invention addresses the problem of signal loss and interference in high-speed digital circuits by utilizing a multi-layered structure with a dedicated wiring layer. This technical approach involves embedding conductor layers within insulating layers and employing via structures to connect the layers. The business value lies in the potential to create smaller, faster, and more reliable electronic devices. This technology can be applied in a wide range of applications, including smartphones, tablets, high-performance computing systems, and networking equipment. The market opportunity is significant, as the demand for improved signal integrity and miniaturization continues to grow. By reducing signal loss and improving data transmission, the Package Substrate enables higher performance and greater design flexibility. The dedicated wiring layer is a key aspect of the invention, ensuring optimized data flow between components. This innovation represents a valuable contribution to the field of electronics packaging, offering a promising path forward for the industry. Ultimately, the Package Substrate patent aims to enhance the performance and efficiency of electronic devices by improving the underlying PWB technology. This will lead to faster, smaller and more reliable electronics.","layman_explanation":"The Package Substrate patent addresses a fundamental problem in modern electronics: the increasing demand for faster and more reliable data transmission within electronic devices. As devices become smaller and more complex, the traditional methods of connecting electronic components on a printed circuit board (PCB) are becoming inadequate. These traditional methods often result in signal loss, interference, and limitations on the speed at which data can be transmitted.\n\nThe Package Substrate patent offers a solution to this problem by introducing a new design for PCBs that optimizes the flow of data between electronic components. Instead of simply placing components on a flat board and connecting them with wires, this patent describes a multi-layered structure where the wiring is carefully embedded within insulating layers. This embedding helps to reduce interference and signal loss, allowing for faster and more reliable data transmission. One of the key innovations is a dedicated wiring layer specifically designed to transmit data between components. This dedicated layer ensures that the data flows efficiently and without bottlenecks.\n\nThis innovation matters because it has the potential to significantly improve the performance of a wide range of electronic devices. From smartphones and tablets to high-performance computers and networking equipment, any device that relies on the efficient transmission of data can benefit from this technology. The competitive advantage lies in the ability to achieve higher data transmission speeds and reduced signal loss compared to traditional PCB designs. This can translate into faster processing speeds, longer battery life, and improved overall performance for electronic devices. The market opportunity is substantial, as the demand for faster and more reliable electronics continues to grow. The implementation of a dedicated wiring layer can greatly increase the speed of data processing.\n\nLooking ahead, the Package Substrate patent could pave the way for even smaller and more powerful electronic devices. As manufacturing techniques improve and the cost of implementing this technology decreases, it is likely to become more widely adopted in a variety of applications. This could lead to a new generation of electronic devices that are faster, more efficient, and more reliable than ever before. The investment implications are also significant, as companies that develop and implement this technology could gain a competitive edge in the rapidly evolving electronics market.","technical_analysis":"The Package Substrate patent details a printed wiring board (PWB) architecture designed to enhance signal integrity and data transmission in electronic devices. The technical architecture comprises a multi-layered structure featuring alternating insulating and conductor layers. Specifically, a first insulating layer serves as the base, with a first conductor layer on its top surface and a second conductor layer on its bottom surface. Vertical connectivity between these conductor layers is achieved through a first via structure embedded within the insulating layer. A key aspect of this design is the embedding of the second conductor layer within a second insulating layer. This strategic placement minimizes crosstalk and interference, thereby improving signal quality. A third conductor layer is then formed on top of the second insulating layer, connected to the second conductor layer via a second via structure.\n\nThe implementation of the Package Substrate involves careful selection of materials and precise fabrication techniques. The insulating layers are typically made of materials with low dielectric constants to minimize signal loss. The conductor layers are made of high-conductivity materials, such as copper, to facilitate efficient data transmission. The via structures are designed to provide low-impedance connections between the conductor layers. A key feature of the Package Substrate is its dedicated wiring layer, which is specifically designed to transmit data between electronic components mounted on the top surface of the first insulating layer. This dedicated layer ensures that data transmission is optimized, reducing latency and improving overall system performance.\n\nThe integration of the Package Substrate into existing electronic systems requires careful consideration of the overall system architecture. The PWB must be designed to be compatible with the other components in the system, such as integrated circuits, connectors, and power supplies. The performance characteristics of the Package Substrate are highly dependent on the materials used and the fabrication techniques employed. The design allows for higher data transmission rates and improved signal integrity compared to traditional PWB designs.","business_analysis":"The Package Substrate patent represents a significant business opportunity within the electronics industry, particularly in the realm of advanced packaging. The market opportunity size is substantial, driven by the increasing demand for smaller, faster, and more reliable electronic devices. This technology has a wide range of applications, including smartphones, tablets, high-performance computing systems, networking equipment, and automotive electronics.\n\nThe competitive advantages of Package Substrate stem from its unique multi-layered structure and dedicated wiring layer. These features enable improved signal integrity, reduced signal loss, and optimized data transmission. This translates into higher performance and greater reliability compared to traditional printed wiring board (PWB) designs. The revenue potential is considerable, as manufacturers of electronic devices are constantly seeking ways to improve the performance and efficiency of their products. This patent offers a valuable solution that can be integrated into a variety of devices, generating revenue through licensing agreements, product sales, and service offerings.\n\nThe business model for the Package Substrate can be based on licensing the technology to PWB manufacturers and electronic device companies. This allows for widespread adoption of the technology without requiring significant capital investment in manufacturing facilities. Strategic positioning involves targeting high-growth markets, such as 5G infrastructure, artificial intelligence (AI) hardware, and electric vehicles (EVs). The return on investment (ROI) projections are favorable, given the potential for significant revenue generation and the relatively low cost of licensing the technology. The use of the dedicated wiring layer will increase the ROI.","faqs":null,"topics":["printed wiring board","signal integrity","data transmission","electronics packaging","high-speed circuits","package","substrate","patent"],"tech_cluster":null},"seo":{"title":"Package Substrate - Optimized Wiring Board Patent","description":"Explore Package Substrate: a revolutionary wiring board design that enhances data transmission and reduces signal loss. Patent analysis, technical details, and market impact.","keywords":["printed wiring board","signal integrity","data transmission","electronics packaging","high-speed circuits","patent","patent US-9854669","dedicated wiring layer"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854669","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854669","citation_suggestion":"Patentable. \"Package substrate\" (US-9854669). https://patentable.app/patents/US-9854669","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854669","json":"https://patentable.app/api/llm-context/US-9854669","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T06:11:45.241Z"}