{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854681","patent":{"patent_number":"US-9854681","title":"Component-embedded substrate","assignee":null,"inventors":[],"filing_date":"2014-07-10T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":14,"abstract":"A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; and a first embedded chip-type electronic component disposed in the resin substrate. The first embedded chip-type electronic component is located close to the peripheral surface of the resin substrate. The mount surface includes: a first region located between the first and second mounted components and extending along a cross direction crossing an arrangement direction along which the first and second mounted components are arranged with respect to each other; and a second region located outside the first region. The first embedded chip-type electronic component is arranged to extend in the first and second regions as seen from above the mount surface."},"analysis":{"summary":"The Component-embedded Substrate patent presents an innovative approach to electronic component design, embedding chip-type electronic components within a resin substrate to optimize space and enhance performance. This invention addresses the limitations of traditional surface-mount technology by integrating components directly into the substrate, resulting in reduced size, improved signal integrity, and enhanced reliability. The key technical approach involves strategically placing embedded components close to the substrate's peripheral surface, maximizing available area for mounted components and improving connectivity. The business value lies in the potential for miniaturization, enhanced performance, and improved durability of electronic devices, opening up new opportunities in markets such as wearables, mobile devices, and automotive electronics. The market opportunity is significant, as the demand for smaller, more powerful, and more reliable electronic devices continues to grow. This technology is poised to play a crucial role in shaping the next generation of electronic products by enabling higher component density, improved electrical characteristics, and enhanced protection from environmental factors. The Component-embedded Substrate technology provides a foundation for future advancements in high-density interconnect (HDI) technology and advanced packaging solutions. Its impact extends to various industries seeking miniaturization and performance enhancements, making it a valuable innovation for businesses and investors.","layman_explanation":"The Component-embedded Substrate patent addresses the challenge of making electronic devices smaller and more powerful. Existing solutions, like surface-mount technology, limit how small devices can be because components are placed on the surface of a circuit board, taking up valuable space. This patent introduces a new way to build electronics by embedding components directly inside the material of the circuit board itself.\n\nInstead of placing components on the surface, this technology hides them within the circuit board material. Think of it like building a house where the pipes and wires are inside the walls, rather than running along the outside. This allows for more components to be packed into a smaller space, making the device smaller overall. It also protects the components from damage and improves the way signals travel between them.\n\nThis matters because it allows for the creation of smaller, more powerful, and more reliable electronic devices. Imagine smartphones that are even thinner, smartwatches with more features, or medical devices that are less invasive. This technology can also improve the performance of electronic devices by reducing interference and improving signal quality. This creates a significant market opportunity for companies that can implement this technology in their products.\n\nLooking ahead, this technology could be used in a wide range of applications, from consumer electronics to industrial equipment. As manufacturing processes improve and costs decrease, it is likely to become more widely adopted. This could lead to new innovations in electronic device design and create new investment opportunities in the electronics industry. The Component-embedded Substrate patent represents a significant step forward in electronic component design, offering a compelling solution to the challenge of miniaturization and performance enhancement.","technical_analysis":"The Component-embedded Substrate patent details a system for embedding chip-type electronic components within a resin substrate, aiming to optimize space and enhance performance. The technical architecture involves a multi-layered structure, with the resin substrate acting as the primary support and encapsulation medium. The implementation details include precise placement of the embedded components, ensuring optimal electrical connectivity and minimal interference. Algorithmically, the placement of components is optimized to reduce signal path lengths and minimize parasitic effects. Integration patterns involve advanced pick-and-place equipment and lamination techniques to encapsulate the components within the substrate. Performance characteristics are improved through reduced signal degradation and enhanced thermal management. Code-level implications involve the development of sophisticated design tools to model and simulate the behavior of embedded components within the substrate, ensuring optimal performance and reliability. The technology enables higher component density, improved signal integrity, and enhanced reliability in electronic devices. The key technical innovation lies in the strategic placement and encapsulation of embedded components, which allows for miniaturization and improved electrical characteristics. The system's performance is further enhanced by minimizing parasitic inductances and capacitances, which degrade signal integrity. The architecture supports various integration patterns, including advanced pick-and-place equipment and lamination techniques. The Component-embedded Substrate offers a significant advancement over traditional surface-mount technology by providing a more compact and efficient solution for electronic component integration.","business_analysis":"The Component-embedded Substrate patent presents a significant business opportunity in the electronics industry, addressing the growing demand for miniaturization, enhanced performance, and improved reliability. The market opportunity size is substantial, with applications spanning wearables, mobile devices, automotive electronics, and industrial equipment. The competitive advantages include reduced size, improved signal integrity, and enhanced durability compared to traditional surface-mount technology. The revenue potential is significant, as the technology enables the creation of smaller, more powerful, and more reliable electronic devices, commanding premium pricing. Business models can include licensing the technology to manufacturers, providing design and engineering services, and manufacturing and selling components based on the technology. Strategic positioning involves targeting high-growth markets such as wearables and IoT devices, where miniaturization and performance are critical. ROI projections indicate a strong return on investment due to the technology's ability to create differentiated products with higher margins. The Component-embedded Substrate patent offers a compelling value proposition for businesses seeking to innovate and gain a competitive edge in the electronics industry. The market opportunity is driven by the increasing demand for smaller, more powerful, and more reliable electronic devices. The competitive advantages stem from the technology's ability to optimize space, enhance performance, and improve reliability. The revenue potential is significant, as the technology enables the creation of differentiated products with higher margins. The Component-embedded Substrate technology offers a strategic advantage by enabling companies to create innovative products that meet the evolving needs of the market.","faqs":null,"topics":["component embedded substrate","resin substrate","electronic components","miniaturization","signal integrity","component","embedded","substrate"],"tech_cluster":null},"seo":{"title":"Component-embedded Substrate - Patent US-9854681","description":"Discover Component-embedded Substrate: Embed chip components in resin for optimized space & performance. Full patent analysis, claims & prior art search.","keywords":["component embedded substrate","resin substrate","electronic components","miniaturization","signal integrity","HDI","high-density interconnect","patent","patent US-9854681"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854681","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854681","citation_suggestion":"Patentable. \"Component-embedded substrate\" (US-9854681). https://patentable.app/patents/US-9854681","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854681","json":"https://patentable.app/api/llm-context/US-9854681","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:30:48.665Z"}