{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854704","patent":{"patent_number":"US-9854704","title":"Shaped heat sinks to optimize flow","assignee":null,"inventors":[],"filing_date":"2014-07-10T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":18,"abstract":"A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins."},"analysis":{"summary":"The Shaped Heat Sinks to Optimize Flow patent presents a novel approach to thermal management, enhancing heat transfer through shape-optimized fins and synthetic jets. The invention addresses the problem of inefficient heat dissipation in electronic devices, where traditional heat sinks often struggle to balance heat removal with airflow resistance. The key technical approach involves designing fins with optimized geometries to maximize surface area and airflow contact, coupled with synthetic jets that generate vortices to disrupt the boundary layer and promote heat transfer. This combination results in improved cooling performance and reduced pressure drop. The business value lies in its potential applications across various industries, including computer hardware, power electronics, and LED lighting, where efficient cooling is crucial for performance and reliability. The market opportunity is significant, as the demand for advanced cooling solutions continues to grow with the increasing power density of electronic devices. This technology offers a competitive advantage by providing a cost-effective and scalable solution for thermal management, contributing to improved device performance, energy efficiency, and longevity.","layman_explanation":"The Shaped Heat Sinks to Optimize Flow patent addresses a critical challenge in modern electronics: managing heat. As devices become more powerful and compact, they generate more heat, which can lead to performance degradation and reduced lifespan. Existing cooling solutions often struggle to keep up with these demands, resulting in thermal bottlenecks that limit device capabilities. This patent offers a novel approach to heat dissipation by combining uniquely shaped fins with synthetic jets to enhance airflow and heat transfer. \n\nInstead of relying on traditional, uniformly shaped fins, this technology employs fins that are carefully designed to optimize airflow and maximize contact with the heat-generating components. Imagine a series of miniature airfoils, each precisely shaped to guide air across the surface and pull heat away. These fins are complemented by synthetic jets, which are essentially tiny air pumps that create localized bursts of airflow. Think of them as miniature fans that target specific areas of the heat sink to further enhance cooling. The combination of these two elements creates a synergistic effect, resulting in significantly improved heat dissipation compared to conventional methods. \n\nThis innovation matters because it has the potential to unlock new levels of performance and reliability in a wide range of electronic devices. By more effectively managing heat, manufacturers can create devices that are faster, more efficient, and longer-lasting. This could lead to breakthroughs in fields such as high-performance computing, gaming, and mobile devices. Furthermore, the technology's potential to reduce energy consumption could have a significant impact on the environment. \n\nLooking ahead, this technology could pave the way for even more advanced cooling solutions. Researchers are already exploring ways to further optimize fin shapes and synthetic jet designs. The market adoption timeline will depend on factors such as manufacturing costs and integration challenges, but the potential benefits are clear. For investors, this patent represents a compelling opportunity to capitalize on the growing demand for advanced thermal management solutions.","technical_analysis":"The Shaped Heat Sinks to Optimize Flow patent introduces a novel approach to thermal management, combining shape-optimized fins and synthetic jets to enhance heat transfer. The technical architecture involves designing fins with specific geometries to maximize surface area and airflow contact, while synthetic jets generate vortices to disrupt the boundary layer and promote heat transfer. Implementation details include using computational fluid dynamics (CFD) simulations to optimize the fin shapes and piezoelectric actuators to generate the synthetic jets. The algorithm specifics involve controlling the frequency and amplitude of the synthetic jets to optimize vortex generation and heat transfer. Integration patterns include incorporating the shaped heat sinks and synthetic jets into existing cooling systems. Performance characteristics demonstrate improved cooling efficiency and reduced pressure drop compared to conventional heat sinks. Code-level implications involve developing control algorithms for the synthetic jets and integrating them with the overall system control. This technology offers a significant improvement in thermal management for electronic devices.","business_analysis":"The Shaped Heat Sinks to Optimize Flow patent presents a significant business opportunity in the thermal management market. The market opportunity size is substantial, as the demand for advanced cooling solutions continues to grow with the increasing power density of electronic devices. Competitive advantages include improved cooling performance, reduced pressure drop, and energy efficiency compared to conventional heat sinks. Revenue potential lies in licensing the technology to manufacturers of computer hardware, power electronics, and LED lighting. Business models include licensing agreements, joint ventures, and direct sales of the technology. Strategic positioning involves targeting high-performance applications where efficient cooling is crucial for performance and reliability. ROI projections indicate a strong return on investment due to the technology's ability to improve device performance, energy efficiency, and longevity. This patent offers a compelling business opportunity for investors and entrepreneurs in the thermal management market.","faqs":null,"topics":["heat sink optimization","thermal management","synthetic jets","electronics cooling","heat transfer efficiency","shaped","sinks","optimize"],"tech_cluster":null},"seo":{"title":"Optimized Heat Transfer: Shaped Heat Sinks to Optimize Flow - Patent US-9854704","description":"Explore the Shaped Heat Sinks to Optimize Flow patent for enhanced cooling in electronics. Learn about optimized fins, synthetic jets, and improved heat transfer.","keywords":["heat sink optimization","thermal management","synthetic jets","electronics cooling","heat transfer efficiency","patent","patent US-9854704"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854704","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854704","citation_suggestion":"Patentable. \"Shaped heat sinks to optimize flow\" (US-9854704). https://patentable.app/patents/US-9854704","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854704","json":"https://patentable.app/api/llm-context/US-9854704","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:57:42.410Z"}