{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854705","patent":{"patent_number":"US-9854705","title":"Sheet-type heat pipe","assignee":null,"inventors":[],"filing_date":"2014-12-17T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":8,"abstract":"Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container formed by stacking and joining together at least two etched sheet bodies formed as metal foil sheets. Particularly, etching or pressing is performed on the surface of the sheet bodies to join at least two sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the sealed container is thinly formed with its thickness not larger than, e.g. 0.5 mm. More particularly, since the thickness of the container is thinly formed, the sheet-type heat pipe of the present invention can be effortlessly installed in a thin chassis of a mobile terminal."},"analysis":{"summary":"The Sheet-type Heat Pipe patent addresses the growing need for efficient thermal management solutions in compact electronic devices. As devices become thinner and more powerful, traditional heat dissipation methods often prove inadequate. This innovation introduces a novel approach using a sealed container formed from stacked and joined etched metal foil sheets. The core innovation lies in the creation of fine concavities and convexities on the inner surface of the container, which significantly enhances heat transport capabilities, even in extremely thin form factors (e.g., less than 0.5 mm). This patent solves the problem of overheating in thin chassis, particularly in mobile terminals, by providing a compact and efficient heat dissipation mechanism. The key technical approach involves etching or pressing the surface of the sheet bodies to create the desired internal surface features. The business value of this technology lies in its potential to enable smaller, more powerful devices with improved thermal performance and longer lifespans. It also offers potential cost savings in manufacturing due to the use of existing manufacturing techniques. The market opportunity is significant, as the demand for efficient thermal management solutions continues to grow in the electronics industry. This invention is poised to capture a significant share of the market by offering a superior combination of performance, size, and cost.","layman_explanation":"The Sheet-type Heat Pipe patent addresses the problem of overheating in electronic devices, particularly those with thin designs like smartphones and laptops. As these devices become more powerful, they generate more heat, which can lead to performance slowdowns and even damage. Existing cooling solutions are often too bulky to fit within these thin devices.\n\nThis patent describes a new type of heat pipe that is very thin and efficient. Imagine a thin, sealed envelope filled with a special fluid. The inside of the envelope has tiny bumps and grooves that help the fluid move around and carry heat away from the hot parts of the device. This is similar to how your car's radiator works, but on a much smaller scale. The key is that this heat pipe is made from thin metal sheets that are etched with these tiny bumps and grooves, allowing it to be very thin and easily integrated into the device.\n\nThis technology matters because it allows manufacturers to create thinner and more powerful devices without the risk of overheating. This can lead to improved performance, longer battery life, and increased device lifespan. The market impact is significant, as the demand for thinner and more powerful devices continues to grow. The competitive advantage lies in the unique design of the heat pipe, which allows it to be both thin and efficient.\n\nIn the future, this technology could be used in a wide range of electronic devices, including wearable devices, tablets, and even electric vehicles. The market adoption timeline will depend on the cost and availability of the technology, as well as the demand for thinner and more powerful devices. The investment implications are positive, as this technology has the potential to generate significant revenue for manufacturers and investors.","technical_analysis":"The Sheet-type Heat Pipe patent details a thermal management solution designed for compact electronic devices. The technical architecture consists of a sealed container formed by stacking and joining at least two etched sheet bodies made of metal foil. The key innovation is the creation of fine concavities and convexities on the inner surface of the container, which serve to increase the surface area for heat transfer and enhance the overall heat transport capability of the device. The implementation involves precise etching or pressing techniques to form the desired surface features on the metal foil sheets. The choice of metal material is critical, with considerations such as thermal conductivity, corrosion resistance, and cost playing a significant role. The integration patterns involve incorporating the Sheet-type Heat Pipe into the thermal management system of the electronic device, typically in close proximity to heat-generating components such as processors and power amplifiers. Performance characteristics are evaluated based on factors such as thermal resistance, heat transport capacity, and response time. Code-level implications are minimal, as the Sheet-type Heat Pipe is primarily a hardware solution. However, software may be used to monitor and control the temperature of the device, optimizing performance and preventing overheating. The design allows for sufficient heat transport even when the sealed container is thinly formed with its thickness not larger than, e.g. 0.5 mm.","business_analysis":"The Sheet-type Heat Pipe patent presents a significant business opportunity in the thermal management market. The market opportunity size is substantial, driven by the increasing demand for smaller, more powerful electronic devices. Competitive advantages include the ultra-thin design of the Sheet-type Heat Pipe, which allows for easy integration into thin chassis, and its superior heat transport capability compared to traditional heat pipes. The revenue potential is significant, as the technology can be licensed to electronics manufacturers or incorporated into their products. Potential business models include licensing, direct sales, and partnerships. Strategic positioning involves targeting manufacturers of mobile devices, laptops, and other compact electronics. ROI projections are favorable, as the technology offers both improved performance and potential cost savings. The Sheet-type Heat Pipe addresses a critical need in the electronics industry by providing an efficient and compact thermal management solution. This innovation has the potential to disrupt the market by offering a superior alternative to existing heat dissipation methods. The key to success will be effective marketing and strategic partnerships with leading electronics manufacturers.","faqs":null,"topics":["heat pipe","thermal management","electronics cooling","mobile devices","thin chassis","sheet","patent","introduces"],"tech_cluster":null},"seo":{"title":"Sheet-type Heat Pipe - Efficient Thermal Management Solution","description":"Discover the Sheet-type Heat Pipe patent, a revolutionary cooling solution for thin electronic devices. Explore its design, benefits, and applications. Learn more!","keywords":["heat pipe","thermal management","electronics cooling","mobile devices","thin chassis","patent","patent US-9854705","heat dissipation","thermal conductivity","etched metal foil"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854705","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854705","citation_suggestion":"Patentable. \"Sheet-type heat pipe\" (US-9854705). https://patentable.app/patents/US-9854705","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854705","json":"https://patentable.app/api/llm-context/US-9854705","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:37:13.469Z"}