{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854707","patent":{"patent_number":"US-9854707","title":"Integrated pipe heat exchanger","assignee":null,"inventors":[],"filing_date":"2014-01-10T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":11,"abstract":"A heat exchanger system may have a base, a mounting apparatus for attaching the base to a device, a gasket shelf for placing a gasket, a dissipation member for dissipating heat, and heat generator attachment sites for absorbing heat. A mounting apparatus may have finger-like extensions which flex and draw the base into contact with an underlying electronic device from which the system conducts heat. A base may also have an integrated heat pipe clamp attachment forming an aperture in the base into which a heat pipe may extend and may be clamped in thermal communication. The dissipation device may be a series of fins and troughs and a fan may direct air over the dissipation device to cool the apparatus."},"analysis":{"summary":"The Integrated Pipe Heat Exchanger patent addresses the critical need for efficient thermal management in electronic devices. As devices become increasingly compact and powerful, effective heat dissipation is essential to prevent overheating and ensure optimal performance. This innovation integrates a base, mounting apparatus, gasket shelf, dissipation member, and heat generator attachment sites to provide a comprehensive cooling solution. The key technical approach involves the use of flexible finger-like extensions in the mounting apparatus to ensure secure contact with the electronic device, along with an integrated heat pipe clamp to facilitate efficient thermal communication. The dissipation device, featuring fins and troughs, maximizes surface area for heat transfer. The business value lies in the improved performance, reliability, and longevity of electronic devices, as well as the potential for smaller and more powerful designs. The market opportunity spans across various industries, including electronics, automotive, and aerospace, where effective thermal management is crucial. The Integrated Pipe Heat Exchanger offers a competitive advantage by providing a more integrated and efficient cooling solution compared to traditional methods, reducing thermal resistance and improving overall system performance. This innovation promises to reshape thermal management strategies and enable the development of more advanced and reliable electronic devices.","layman_explanation":"The Integrated Pipe Heat Exchanger addresses the problem of overheating in electronic devices. As devices become more powerful and compact, they generate more heat, which can lead to performance throttling, reduced reliability, and even permanent damage. Existing cooling solutions often fall short in effectively managing this heat. This technology works by integrating a base, mounting apparatus, and heat pipe clamp into a single system. The mounting apparatus ensures secure contact with the electronic device, while the heat pipe clamp facilitates efficient heat transfer away from the device. The heat is then dissipated through a series of fins and troughs. This matters because it allows for smaller, more powerful, and more reliable devices. The market impact is significant, as it enables improved performance and longevity in various industries, including electronics, automotive, and aerospace. Potential ROI is high, as it reduces failure rates and enhances customer satisfaction. Future applications include integration into a wider range of electronic devices and further optimization of the cooling system. Market adoption is expected to increase as the demand for efficient thermal management continues to grow. The investment implications are positive, as this technology offers a competitive advantage and strong potential for revenue generation.","technical_analysis":"The Integrated Pipe Heat Exchanger patent details a comprehensive thermal management system designed for efficient heat dissipation in electronic devices. The technical architecture comprises several key components working in concert: a base, a mounting apparatus, a gasket shelf, a dissipation member, and heat generator attachment sites. The mounting apparatus utilizes finger-like extensions that flex to ensure optimal contact with the underlying electronic device, facilitating efficient heat conduction. The base incorporates an integrated heat pipe clamp, forming an aperture into which a heat pipe can be extended and securely clamped for enhanced thermal communication. The dissipation device typically consists of a series of fins and troughs, maximizing surface area for heat transfer. A fan may be employed to direct air over the dissipation device, further enhancing cooling efficiency. The implementation details involve careful selection of materials with high thermal conductivity to minimize thermal resistance. The design also considers the thermal contact resistance between different components, aiming to optimize heat transfer across interfaces. The performance characteristics of the Integrated Pipe Heat Exchanger are influenced by factors such as the size and shape of the dissipation fins, the airflow rate, and the thermal conductivity of the materials used. Integration patterns involve seamless connection of the heat exchanger system to the electronic device, ensuring minimal disruption to the overall system design. Code-level implications are minimal, as the Integrated Pipe Heat Exchanger primarily involves hardware design and implementation. However, software may be used to monitor and control the fan speed or other parameters to optimize cooling performance. The Integrated Pipe Heat Exchanger offers a more integrated and efficient solution compared to traditional methods, reducing thermal resistance and improving overall system performance. This innovation promises to reshape thermal management strategies and enable the development of more advanced and reliable electronic devices.","business_analysis":"The Integrated Pipe Heat Exchanger patent presents a significant market opportunity in the thermal management sector. The increasing demand for smaller, more powerful electronic devices has created a growing need for efficient and reliable cooling solutions. The Integrated Pipe Heat Exchanger offers a competitive advantage by providing a more integrated and efficient solution compared to traditional methods. The market opportunity size is substantial, spanning across various industries, including electronics, automotive, and aerospace. The competitive advantages of this technology include reduced thermal resistance, improved device performance, and enhanced reliability. The revenue potential is significant, with opportunities for licensing, manufacturing, and integration into various products. The business model can involve direct sales to manufacturers, licensing agreements, or partnerships with other companies. Strategic positioning involves targeting industries where efficient thermal management is critical, such as high-performance computing, automotive electronics, and aerospace systems. ROI projections indicate a strong return on investment, driven by increased device performance, reduced failure rates, and enhanced customer satisfaction. The Integrated Pipe Heat Exchanger offers a compelling value proposition for businesses seeking to improve the thermal management of their products. This innovation promises to reshape thermal management strategies and enable the development of more advanced and reliable electronic devices. The patent provides a strong foundation for building a successful business in the thermal management sector.","faqs":[{"answer":"The Integrated Pipe Heat Exchanger refers to a patented thermal management system designed for efficient heat dissipation in electronic devices. It integrates several key components, including a base, a mounting apparatus, a gasket shelf, a dissipation member, and heat generator attachment sites, into a single, cohesive unit. This integration aims to minimize thermal resistance and improve overall cooling performance. The design incorporates flexible mounting mechanisms and heat pipe technology to facilitate efficient heat transfer away from electronic components. This innovation represents a significant advancement in thermal management technology, offering a more integrated and efficient solution compared to traditional methods. Its potential applications span across various industries, including electronics, automotive, and aerospace. The Integrated Pipe Heat Exchanger is a comprehensive solution for addressing critical overheating issues in electronic devices. \n\n**Keywords**: heat exchanger, thermal management, cooling system, electronic devices, heat dissipation","question":"What is Integrated Pipe Heat Exchanger?"},{"answer":"The Integrated Pipe Heat Exchanger operates by efficiently transferring heat away from electronic components through","question":"How does Integrated Pipe Heat Exchanger work?"}],"topics":["heat exchanger","thermal management","electronic cooling","heat pipe","device cooling","integrated","exchanger","patent"],"tech_cluster":null},"seo":{"title":"Integrated Pipe Heat Exchanger - Patent US-9854707","description":"Discover the Integrated Pipe Heat Exchanger: a revolutionary thermal management solution. Enhanced cooling, reduced resistance, and improved device performance. Patent analysis.","keywords":["heat exchanger","thermal management","electronic cooling","heat pipe","device cooling","thermal resistance","patent","patent US-9854707"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854707","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854707","citation_suggestion":"Patentable. \"Integrated pipe heat exchanger\" (US-9854707). https://patentable.app/patents/US-9854707","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854707","json":"https://patentable.app/api/llm-context/US-9854707","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:48:12.321Z"}