{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854708","patent":{"patent_number":"US-9854708","title":"Unit for semiconductor device","assignee":null,"inventors":[],"filing_date":"2014-10-28T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit."},"analysis":{"summary":"The Unit for Semiconductor Device patent introduces a novel approach to semiconductor design that significantly improves heat dissipation and circuit integration. The core innovation lies in integrating copper blocks, an insulating substrate with a conductive pattern, IGBT and diode chips, and other essential components into a single, sealed unit. This addresses the problem of inefficient heat management in traditional semiconductor devices, which often leads to reduced performance and reliability issues.\n\nThe key technical approach involves using copper blocks for enhanced thermal conductivity, an insulating substrate for electrical isolation, and a modular design that allows for flexible circuit configurations. This single-unit design improves adhesion to cooling bodies and enhances heat dissipation performance. The modularity simplifies manufacturing and reduces costs, making it accessible for a wider range of applications.\n\nThe business value and applications of this technology are vast. It can be used in power inverters, motor drives, renewable energy systems, electric vehicles, and various other electronic devices. The improved heat dissipation capabilities enable higher power densities and more efficient operation, leading to smaller and more reliable devices. The modular design also simplifies manufacturing and reduces costs, making it an attractive option for businesses.\n\nThe market opportunity for the Unit for Semiconductor Device is substantial. As the demand for smaller, more efficient, and more reliable electronic devices continues to grow, this technology is poised to become a standard in the industry. Its modular design and efficient heat dissipation capabilities make it well-suited for emerging applications such as electric vehicles, renewable energy systems, and advanced industrial automation. This patent represents a significant advancement in semiconductor technology, offering improved performance, reliability, and cost-effectiveness.","layman_explanation":"The Unit for Semiconductor Device addresses a significant challenge in the electronics industry: heat dissipation in semiconductor devices. These devices, which are the building blocks of modern electronics, generate heat as they operate. If this heat is not effectively managed, it can lead to reduced performance, reliability issues, and even device failure.\n\nExisting solutions for heat management in semiconductor devices often fall short in high-power applications. Traditional heat sinks and cooling methods can be bulky, expensive, and not always effective at dissipating heat efficiently. This is where the Unit for Semiconductor Device comes in.\n\nThis patent describes a novel design that integrates key components into a single, sealed unit. This unit includes copper blocks, which are excellent conductors of heat, an insulating substrate to prevent electrical shorts, and the semiconductor chips themselves. By integrating these components into a single unit, the heat generated by the chips can be efficiently transferred to the copper blocks, which then dissipate the heat to the surrounding environment. This integrated design improves heat dissipation and enhances the overall performance and reliability of the device.\n\nThe impact of this technology is potentially significant. By improving heat dissipation, the Unit for Semiconductor Device can enable higher power densities and more efficient operation in a wide range of electronic devices. This could lead to smaller, more reliable, and more energy-efficient products. The modular design also simplifies manufacturing and reduces costs, making it an attractive option for businesses. This innovation matters because it addresses a fundamental challenge in the electronics industry and offers a compelling solution that can improve performance, reliability, and cost-effectiveness. \n\nLooking ahead, the Unit for Semiconductor Device could find applications in various industries, including electric vehicles, renewable energy, and industrial automation. The timeline for market adoption will depend on factors such as manufacturing costs, regulatory approvals, and customer demand. However, the potential benefits of this technology make it a promising investment opportunity for businesses and investors alike.","technical_analysis":"The Unit for Semiconductor Device patent presents a significant advancement in semiconductor technology, primarily focusing on enhancing heat dissipation and enabling flexible circuit integration. This technical analysis delves into the architectural and functional aspects of this innovation, highlighting its advantages over conventional methods.\n\nThe technical architecture of the Unit for Semiconductor Device revolves around the integration of several key components within a single, sealed unit. These components include copper blocks, an insulating substrate with a conductive pattern, IGBT (Insulated Gate Bipolar Transistor) and diode chips, implant pins, a printed circuit board (PCB), and a resin case. The copper blocks play a crucial role in heat dissipation due to their high thermal conductivity. The insulating substrate ensures electrical isolation between the components, while the conductive pattern facilitates electrical connections.\n\nImplementation details involve fixing the IGBT and diode chips to the implant pins using solder, which ensures reliable electrical and thermal contact. The implant pins are then fixed to the printed circuit board, providing a stable and organized platform for the components. The entire assembly is encapsulated within a resin case, which provides mechanical protection and environmental sealing.\n\nOne of the primary technical innovations is the modular design, which allows for flexible circuit configurations. Multiple single units can be combined using an inter-unit wiring board to form any desired circuit. This modularity simplifies manufacturing and reduces costs, as it eliminates the need for custom designs for each application.\n\nThe performance characteristics of the Unit for Semiconductor Device are significantly enhanced compared to conventional semiconductor devices. The direct thermal path provided by the copper blocks reduces thermal resistance, leading to improved heat dissipation. The sealed design also minimizes the ingress of moisture and contaminants, enhancing reliability and lifespan.\n\nCode-level implications are primarily related to the control and management of the IGBT and diode chips. Efficient control algorithms are necessary to optimize the performance of the circuit and prevent overheating. These algorithms can be implemented in software or hardware, depending on the application requirements.","business_analysis":"The Unit for Semiconductor Device patent holds significant business implications, primarily due to its potential to disrupt the semiconductor industry through enhanced efficiency, cost-effectiveness, and modular design. This business analysis explores the market opportunity, competitive advantages, revenue potential, and strategic positioning of this innovation.\n\nThe market opportunity for the Unit for Semiconductor Device is substantial. The demand for efficient and reliable semiconductor devices is growing rapidly, driven by the increasing adoption of electric vehicles, renewable energy systems, and advanced industrial automation. The Unit for Semiconductor Device addresses a critical need in these applications by providing improved heat dissipation and flexible circuit integration.\n\nThe competitive advantages of this technology are numerous. The modular design simplifies manufacturing and reduces costs, making it accessible to a wider range of customers. The improved heat dissipation capabilities enable higher power densities and more efficient operation, leading to smaller and more reliable devices. These advantages position the Unit for Semiconductor Device as a compelling alternative to conventional semiconductor devices.\n\nThe revenue potential of this technology is significant. The modular design allows for easy customization and scalability, making it adaptable to various application requirements. This versatility enables the Unit for Semiconductor Device to target a broad range of markets, including power inverters, motor drives, renewable energy systems, electric vehicles, and various other electronic devices.\n\nThe business model for this technology could involve licensing the patent to semiconductor manufacturers, selling the single units directly to customers, or offering complete circuit solutions based on the modular design. Each of these approaches offers different revenue streams and market penetration strategies.\n\nFrom a strategic positioning perspective, the Unit for Semiconductor Device can be positioned as a premium product offering superior performance, reliability, and cost-effectiveness. This positioning would appeal to customers who prioritize these factors and are willing to pay a premium for them.","faqs":null,"topics":["semiconductor device","heat dissipation","IGBT","diode","modular design","semiconductor","device","patent"],"tech_cluster":null},"seo":{"title":"Unit for Semiconductor Device - Patent US-9854708","description":"Discover the Unit for Semiconductor Device, a revolutionary patent improving heat dissipation and circuit integration. Full analysis, claims, and technical details.","keywords":["semiconductor device","heat dissipation","IGBT","diode","modular design","power electronics","circuit integration","patent","patent US-9854708"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854708","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854708","citation_suggestion":"Patentable. \"Unit for semiconductor device\" (US-9854708). https://patentable.app/patents/US-9854708","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854708","json":"https://patentable.app/api/llm-context/US-9854708","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T06:12:23.328Z"}