{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9854718","patent":{"patent_number":"US-9854718","title":"Systems and methods for cooling of power electronic devices","assignee":null,"inventors":[],"filing_date":"2016-11-01T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components."},"analysis":{"summary":"The Systems and Methods for Cooling of Power Electronic Devices patent presents an innovative approach to thermal management in high-power electronic devices. The core innovation is an optimized electromechanical structure designed to efficiently cool power electronic components by strategically placing power transistor and capacitor components on opposite sides of heat sink components, maximizing heat transfer. This addresses the problem of inefficient heat dissipation in conventional power electronic devices, which can lead to reduced performance and lifespan. The key technical approach involves optimizing the placement of heat-generating components to enhance thermal conductivity and minimize thermal resistance. This technology offers significant business value by improving the reliability, performance, and energy efficiency of power electronic devices. Potential applications span across various industries, including automotive (electric vehicles), aerospace, and high-performance computing. The market opportunity is substantial, as the demand for more powerful and efficient electronic devices continues to grow, driving the need for advanced thermal management solutions. By addressing the critical issue of heat dissipation, this patent enables the development of more compact, reliable, and energy-efficient electronic systems, offering a competitive advantage in the market.","layman_explanation":"The Systems and Methods for Cooling of Power Electronic Devices patent addresses a critical issue in modern electronics: the efficient removal of heat from power electronic devices. These devices, such as those found in electric vehicles, computers, and industrial equipment, generate a significant amount of heat during operation. If this heat is not effectively managed, it can lead to reduced performance, decreased reliability, and even complete failure of the device.\n\nThe problem this patent solves is the inefficiency of traditional cooling methods. Existing solutions often involve bulky heat sinks or complex liquid cooling systems, which can be expensive, heavy, and difficult to integrate into compact electronic devices. These traditional methods may also fail to adequately remove heat from critical components, leading to localized hot spots and reduced overall performance.\n\nThis patent provides a novel approach to cooling by strategically positioning the heat-generating components (power transistors and capacitors) on opposite sides of a heat sink. Imagine placing two hot plates on either side of a metal cooling block. This arrangement maximizes the surface area available for heat transfer, allowing for more efficient cooling. The system also includes power interconnect components that ensure seamless electrical communication between the transistors and capacitors, maintaining overall system performance. This design is more compact, efficient, and reliable than traditional cooling methods.\n\nThis technology matters because it enables the development of more powerful, efficient, and reliable electronic devices. By improving thermal management, this patent can lead to increased device lifespan, reduced energy consumption, and improved overall performance. The market impact is significant, as it can benefit a wide range of industries, including automotive, aerospace, and high-performance computing. The potential ROI is high, as it can lead to reduced maintenance costs, improved product reliability, and increased market competitiveness.\n\nLooking ahead, this technology has the potential to be further refined and adapted for use in even more demanding applications. As electronic devices continue to shrink in size and increase in power, the need for efficient cooling solutions will only grow. This patent provides a solid foundation for future advancements in thermal management technology, paving the way for more compact, reliable, and energy-efficient electronic systems. The investment implications are significant, as companies that adopt this technology can gain a competitive edge in the market and capitalize on the growing demand for advanced thermal management solutions.","technical_analysis":"The Systems and Methods for Cooling of Power Electronic Devices patent provides a detailed framework for optimizing thermal management in power electronic devices. The technical architecture centers around an electromechanical structure that strategically positions power transistor and capacitor components on opposite sides of heat sink components. This arrangement maximizes the surface area available for heat transfer, allowing for more efficient cooling. Implementation details involve careful selection of materials with high thermal conductivity for the heat sink and efficient thermal interfaces between components. Algorithmically, the system aims to minimize thermal resistance between the heat-generating components and the heat sink, ensuring rapid heat dissipation. Integration patterns would involve seamless incorporation of the cooling system into existing power electronic designs. Performance characteristics are expected to show significant improvements in thermal management, leading to lower operating temperatures and increased device lifespan. At the code level, simulations and thermal analysis software would be used to optimize the design and predict performance.","business_analysis":"The Systems and Methods for Cooling of Power Electronic Devices patent presents a significant market opportunity in the realm of thermal management for power electronics. The market size is substantial, driven by the increasing demand for efficient and reliable power electronic devices across various industries, including automotive, aerospace, and high-performance computing. The competitive advantages of this technology lie in its optimized electromechanical structure and efficient heat transfer mechanisms, which enable more compact and reliable cooling solutions. The revenue potential is high, as the technology can be licensed to manufacturers of power electronic devices or integrated into their own products. Potential business models include licensing, product integration, and service offerings related to thermal management. Strategic positioning would involve targeting industries where efficient cooling is critical, such as electric vehicles and aerospace. ROI projections are favorable, given the potential for improved device performance, increased lifespan, and reduced maintenance costs.","faqs":null,"topics":["power electronics cooling","thermal management","heat sink design","electric vehicle cooling","aerospace electronics","systems","methods","cooling"],"tech_cluster":null},"seo":{"title":"Systems and Methods for Cooling of Power Electronic Devices - Patent US-9854718","description":"Discover the Systems and Methods for Cooling of Power Electronic Devices patent: an optimized electromechanical structure for efficient thermal management. Full analysis & claims.","keywords":["power electronics cooling","thermal management","heat sink design","electric vehicle cooling","aerospace electronics","electromechanical structure","heat transfer","patent","patent US-9854718"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9854718","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9854718","citation_suggestion":"Patentable. \"Systems and methods for cooling of power electronic devices\" (US-9854718). https://patentable.app/patents/US-9854718","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9854718","json":"https://patentable.app/api/llm-context/US-9854718","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:31:28.835Z"}