Wire Contact Inspection

1. A method of inspecting a wire contact, the method comprising: receiving, at a processor from a sensor communicatively coupled to the processor, image data of a wire contact, the image data including a particular image of the wire contact, the particular image depicting an inspection hole in the wire contact; determining, at the processor, a striation metric of the particular image; comparing, at the processor, the striation metric to a wire-in-hole detection threshold; and determining, at the processor, that a threshold number of visible wire strands are oriented along a particular axis in the inspection hole if the striation metric satisfies the wire-in-hole detection threshold.

2. The method of claim 1 , wherein determining the striation metric comprises: determining a plurality of complement values of contact colors in the particular image of the wire contact, each contact color corresponding to a pixel value of a particular portion of the wire contact in the particular image; determining a mean complement value of the plurality of complement values; subtracting the mean complement value from each pixel value in the particular image to generate a modified image; determining frequency values for each pixel of the modified image by computing an absolute value of a transform operation performed on the modified image; and determining the striation metric based at least on a maximum frequency value of the frequency values.

3. The method of claim 2 , further comprising: identifying a particular portion of pixels in the modified image that have the highest frequency values; determining a root mean square of the frequency values in the particular portion; and dividing the maximum frequency value by the root mean square to determine the striation metric.

4. The method of claim 1 , further comprising outputting a notice responsive to determining that the striation metric does not satisfy the wire-in-hole detection threshold.

5. The method of claim 1 , further comprising: rotating the sensor around the wire contact; receiving, at the processor from the sensor, second image data of a wire contact, the second image data including a second particular image of the wire contact from a different angle than the particular image, the second particular image depicting an inspection hole in the wire contact; determining, at the processor, a second striation metric of the second particular image; and comparing the second striation metric to the striation metric, wherein the striation metric is compared to the wire-in-hole detection threshold responsive to the striation metric being greater than the second striation metric.

6. The method of claim 1 , further comprising: determining pixel values for each pixel of the wire contact in the image data; determining a mean pixel value of the pixel values; subtracting the mean pixel value from each pixel value in the image data to generate a first modified image; performing a convolution operation on the first modified image and on a circular ring having a particular radius; determining an inspection hole detection metric based on a minimum value of the convolution operation; and extracting, at the processor, the particular image from the image data based on the inspection hole detection metric.

7. The method of claim 1 , further comprising, prior to determining the striation metric, rotating the particular image to align a direction of a potential wire strand in the inspection hole with an image axis.

8. An apparatus for inspecting a wire contact, the apparatus comprising: a sensor configured collect image data of a wire contact, the image data including a particular image of the wire contact, the particular image depicting an inspection hole in the wire contact; striation metric determination circuitry configured to determine a striation metric of the particular image; comparison circuitry coupled to the striation metric determination circuitry, the comparison circuitry configured to compare the striation metric to a wire-in-hole detection threshold; and crimp inspection circuitry coupled to the comparison circuitry, the crimp inspection circuitry configured to determine that a threshold number of visible wire strands are oriented along a particular axis in the inspection hole if the striation metric satisfies the wire-in-hole detection threshold.

9. The apparatus of claim 8 , further comprising: complement value determination circuitry configured to determine a plurality of complement values of contact colors in the particular image of the wire contact, each contact color corresponding to a pixel value of a particular portion of the wire contact in the particular image; average complement value determination circuitry coupled to the complement value determination circuitry, the average complement value determination circuitry configured to determine a mean complement value of the plurality of complement values; a modified image generator coupled to the average complement value determination circuitry, the modified image generator configured to subtract the mean complement value from each pixel value in the particular image to generate a modified image; and frequency value determination circuitry coupled to the modified image generator, the frequency value determination circuitry configured to determine frequency values for each pixel of the modified image by computing an absolute value of a transform operation performed on the modified image, wherein the striation metric is determined based at least on a maximum frequency value of the frequency values.

10. The apparatus of claim 9 , wherein the striation metric determination circuitry is further configured to: identify a particular portion of pixels in the modified image that have the highest frequency values; determine a root mean square of the frequency values in the particular portion; and divide the maximum frequency value by the root mean square to determine the striation metric.

11. The apparatus of claim 9 , wherein the transform operation comprises a Fast Fourier Transform (FFT) operation.

12. The apparatus of claim 8 , further comprising: rotation circuitry configured to rotate the sensor around the wire contact, wherein the sensor is further configured to collect second image data of a wire contact, the second image data including a second particular image of the wire contact from a different angle than the particular image, the second particular image depicting an inspection hole in the wire contact, and wherein the striation metric determination circuitry is further configured to determine a second striation metric of the second particular image; and striation maximum metric circuitry configured to compare the second striation metric to the striation metric, wherein the comparison circuitry is configured to compare the striation metric to a wire-in-hole detection threshold responsive to the striation metric being greater than the second striation metric.

13. The apparatus of claim 12 , further comprising inspection hole detection circuitry configured to: determine pixel values for each pixel of the wire contact in the image data; determine a mean pixel value of the pixel values; subtract the mean pixel value from each pixel value in the image data to generate a first modified image; perform a convolution operation on the first modified image and on a circular ring having a particular radius; determine a inspection hole detection metric based on a minimum value of the convolution operation; and extract the particular image from the image data based on the inspection hole detection metric.

14. The apparatus of claim 8 , further comprising rotation circuitry configured to rotate the particular image to align a direction of a potential wire strand in the inspection hole with an image axis.

15. A non-transitory computer-readable medium comprising instructions for inspecting a wire contact, the instructions, when executed by a processor, cause the processor to perform operations comprising: receiving, from a sensor, image data of a wire contact, the image data including a particular image of the wire contact, the particular image depicting an inspection hole in the wire contact; determining a striation metric of the particular image; comparing the striation metric to a wire-in-hole detection threshold; and determining that a threshold number of visible wire strands are oriented along a particular axis in the inspection hole if the striation metric satisfies the wire-in-hole detection threshold.

16. The non-transitory computer-readable medium of claim 15 , wherein the operations further comprise: determining, at a processor, a plurality of complement values of contact colors in the particular image of the wire contact, each contact color corresponding to a pixel value of a particular portion of the wire contact in the particular image; determining a mean complement value of the plurality of complement values; subtracting the mean complement value from each pixel value in the particular image to generate a modified image; determining frequency values for each pixel of the modified image by computing an absolute value of a transform operation performed on the modified image; and determining the striation metric based at least on a maximum frequency value of the frequency values.

17. The non-transitory computer-readable medium of claim 16 , wherein the operations further comprise: identifying a particular portion of pixels in the modified image that have the highest frequency values; determining a root mean square of the frequency values in the particular portion; and dividing the maximum frequency value by the root mean square to determine the striation metric.

18. The non-transitory computer-readable medium of claim 16 , wherein the transform operation comprises a Fast Fourier Transform (FFT) operation.

19. The non-transitory computer-readable medium of claim 15 , wherein the operations further comprise extracting the particular image from a first image of the wire contact based on an inspection hole detection metric.

20. The non-transitory computer-readable medium of claim 19 , wherein the operations further comprise: determining pixel values for each pixel of the wire contact in the first image; determining a mean pixel value of the pixel values; subtracting the mean pixel value from each pixel value in the first image to generate a first modified image; and performing a convolution operation on the first modified image and on a circular ring having a particular radius; and determining the inspection hole detection metric based on a minimum value of the convolution operation.

21. A wire crimp inspection system comprising: a sensor configured to generate at least one image of a wire contact; a processor configured to: identify a location of an inspection opening in the at least one image; identify a quantity and orientation of any wires visible in the inspection opening in the at least one image; and generate a notice when a threshold number of wires are oriented along a particular axis in the inspection opening.

22. The wire crimp inspection system of claim 21 further comprising rotation circuitry configured change a relative position of the sensor and the wire contact until the sensor captures an image depicting the inspection opening.