Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A system, comprising: a mobile device that includes a processor, a thermally-conductive panel with a first region in direct thermal contact or in thermal communication via a thermally conductive gap filler with the processor, a case base to house the processor and the thermally-conductive panel, and a case top to slidably couple with the case base in a closed position where the thermally-conductive panel is enclosed and not exposed to an ambient environment of the mobile device, and in an open position to at least partially expose the thermally-conductive panel, including the first region, to the ambient environment of the mobile device, and wherein the mobile device includes one or more device electrical connections; and a dock that includes one or more dock electrical connections to provide one or more couplings to the one or more device electrical connections, and a thermal transfer device to engage the first region of thermally-conductive panel with the case base and case top slidably coupled in the open position, in lieu of at least partially exposing the thermally-conductive panel, including the first region, to the ambient environment of the mobile device.
2. The system of claim 1 , wherein the thermal transfer device includes a contact surface that is positioned to make contact with the first region of the thermally-conductive panel when the case base and case top are slidably coupled in the open position.
A system for thermal management in electronic devices addresses the challenge of efficiently dissipating heat generated by components within a compact enclosure. The system includes a thermally-conductive panel that spans a first region and a second region, where the first region is adjacent to heat-generating components. A thermal transfer device is integrated into the system, featuring a contact surface designed to interface directly with the first region of the panel. This contact surface ensures optimal heat transfer when the device's case base and case top are slidably coupled in an open position, allowing the thermal transfer device to engage with the panel. The system may also include a heat sink or other cooling elements to further enhance thermal dissipation. The design ensures that heat is effectively conducted away from critical components, maintaining operational stability and longevity. The slidable coupling mechanism enables precise alignment of the thermal transfer device with the panel, optimizing heat transfer efficiency in a space-constrained environment. This approach is particularly useful in portable or high-performance electronic devices where thermal management is critical.
3. The system of claim 2 , wherein the thermal transfer device includes a convective heat sink.
A thermal management system is designed to regulate temperature in electronic devices by efficiently dissipating heat. The system includes a thermal transfer device that incorporates a convective heat sink to enhance cooling performance. The convective heat sink utilizes airflow to remove heat from the device, improving thermal efficiency compared to passive conduction alone. The system may also include a heat spreader to distribute heat evenly across the heat sink, ensuring uniform cooling. Additionally, the thermal transfer device may be integrated with a phase-change material to absorb and release heat as needed, further stabilizing temperature fluctuations. The convective heat sink may feature fins or other surface structures to increase the contact area with airflow, maximizing heat dissipation. The system is particularly useful in high-performance computing, automotive electronics, and other applications where thermal management is critical. By combining convective cooling with optional phase-change materials and heat spreaders, the system provides a robust solution for maintaining optimal operating temperatures in electronic devices.
4. The system of claim 1 , wherein the thermal transfer device provides powered, active cooling.
A thermal management system is designed to regulate temperature in electronic devices or other heat-generating systems. The system includes a thermal transfer device that actively cools components by removing excess heat. This device is powered and operates dynamically to maintain optimal operating temperatures, preventing overheating and ensuring reliable performance. The active cooling mechanism may involve forced convection, liquid cooling, or other advanced techniques to efficiently dissipate heat. The system may also incorporate sensors to monitor temperature and adjust cooling operations in real-time. By providing controlled and responsive cooling, the system enhances the longevity and efficiency of the components it protects. The thermal transfer device is integrated into a broader thermal management framework, ensuring seamless heat dissipation across the system. This approach is particularly useful in high-performance computing, industrial machinery, and other applications where precise temperature control is critical. The active cooling capability distinguishes this system from passive solutions, offering superior heat management in demanding environments.
5. The system of claim 4 , wherein the powered, active cooling employs a fan.
A system for thermal management in electronic devices addresses the problem of overheating, which can degrade performance and reduce component lifespan. The system includes a cooling mechanism that actively removes heat from critical components using a powered cooling method. Specifically, the cooling mechanism employs a fan to circulate air or other cooling medium across heat-generating components, ensuring efficient heat dissipation. The fan may be integrated into the device housing or positioned near heat sources to maximize cooling efficiency. The system may also include sensors to monitor temperature and adjust cooling intensity dynamically. By using an active cooling approach, the system prevents thermal throttling and maintains optimal operating conditions for electronic devices, particularly in high-performance or compact designs where passive cooling is insufficient. The fan-based cooling solution is scalable and adaptable to various device configurations, ensuring reliable thermal management across different applications.
6. The system of claim 4 , wherein the powered, active cooling employs thermo-electric cooling.
A system for thermal management in electronic devices uses active cooling to regulate temperature. The system includes a heat-generating component, such as a processor or power module, and a cooling mechanism that actively removes heat from the component. The cooling mechanism employs thermo-electric cooling, which uses the Peltier effect to transfer heat from one side of a thermo-electric module to the other when an electric current is applied. This creates a temperature differential, allowing heat to be drawn away from the heat-generating component and dissipated. The system may also include a control unit that monitors temperature and adjusts cooling power dynamically to maintain optimal operating conditions. The thermo-electric cooling module is integrated into the device's housing or mounted directly to the heat-generating component, ensuring efficient heat transfer. This approach is particularly useful in compact or high-performance electronic devices where traditional cooling methods, such as fans or liquid cooling, are impractical or insufficient. The system may also incorporate additional features, such as heat sinks or thermal interface materials, to enhance cooling efficiency. By using thermo-electric cooling, the system provides precise temperature control without moving parts, reducing noise and increasing reliability.
7. The system of claim 1 , wherein the processor is operable in first and second operating modes, wherein the first operating mode includes a first sustained power usage, the second operating mode includes a second sustained power usage, and the first sustained power usage is greater than the second sustained power usage, and wherein the mobile device operates in the first operating mode when the dock provides the one or more couplings to the one or more device electrical connections of the mobile device and the thermal transfer device engages the first region of the thermally-conductive panel with the case base and case top slidably coupled in the open position.
A mobile device system includes a dock with a thermal transfer device and a case for the mobile device. The case has a base and a top that can slide between open and closed positions. When the case is open, the thermal transfer device engages a first region of a thermally-conductive panel on the case, improving heat dissipation. The dock provides electrical connections to the mobile device, such as power or data transfer, through one or more couplings. The mobile device operates in a high-power mode when docked and in the open case position, allowing sustained higher power usage compared to a lower-power mode when undocked or in the closed case position. This system enhances performance by managing power consumption and thermal efficiency based on the device's operational state and docking status. The thermal transfer device ensures effective heat dissipation during high-power operations, preventing overheating while maintaining optimal performance. The sliding case design allows for easy access to the device while ensuring proper thermal management when needed.
8. The system of claim 1 , wherein the case base and case top are slidably coupled via a slide track to move between the open position and the closed position.
A system for a portable electronic device case includes a case base and a case top that are slidably coupled via a slide track. The case base is configured to receive and secure the electronic device, while the case top is movable relative to the case base. The slide track allows the case top to slide between an open position, where the electronic device is accessible, and a closed position, where the case top covers and protects the electronic device. The slide track ensures smooth and stable movement between these positions, providing a secure and user-friendly mechanism for accessing the device. The system may also include additional features such as locking mechanisms to secure the case top in the closed position or alignment guides to ensure proper positioning during sliding. The design enhances portability and protection for the electronic device while maintaining ease of use.
9. A system, comprising: a mobile device that includes circuitry, including a memory to store executable instructions and a processor to execute the executable instructions, one or more device electrical connections, and heat spread means to selectively dissipate heat generated by the circuitry; wherein the heat spread means include a heat spreader panel where at least a portion of the heat spreader panel is in direct thermal contact or in thermal communication via a thermally conductive gap filler with the circuitry, wherein the mobile device further includes a case base to house the circuitry, the one or more device electrical connections and the heat spread means, and a case top to slidably couple with the case base in a closed position to enclose and not expose the heat spreader panel to an ambient environment of the mobile device, and in an open position that at least partially exposed the heat spreader panel to the ambient environment of the mobile device; and a dock to engage the mobile device, wherein the dock includes one or more dock electrical connections to provide one or more couplings to the one or more device electrical connections and heat transfer means to engage with the heat spreader panel in lieu of exposing the heat spreader panel to the ambient environment of the mobile device, and to operate with the heat spreader panel to transfer from the mobile device heat generated by the circuitry.
This invention relates to thermal management in mobile devices, specifically addressing heat dissipation challenges in compact electronic systems. The system includes a mobile device with internal circuitry, electrical connections, and a heat spreader panel that either directly contacts the circuitry or uses a thermally conductive gap filler to transfer heat. The device is housed in a case with a base and a slidable top. In the closed position, the top fully encloses the heat spreader panel, preventing exposure to the ambient environment. In the open position, the top partially exposes the heat spreader panel to allow direct heat dissipation. The system also includes a dock that engages the mobile device. The dock has electrical connections that couple with the device's electrical connections and a heat transfer mechanism that interfaces with the heat spreader panel. When docked, the heat transfer mechanism replaces the need for exposing the heat spreader panel to the ambient environment, instead facilitating heat transfer from the mobile device's circuitry to the dock. This design improves thermal management by providing flexible heat dissipation options, either through direct exposure or via the dock's heat transfer mechanism, depending on the device's operational state.
10. The system of claim 9 , further including operating mode means to operate the mobile device in one of first and second operating modes according to whether or not the mobile device is engaged with the dock, respectively, wherein the circuitry in the first operating mode employs more power than in the second operating mode.
A mobile device system includes a docking mechanism that physically and electrically connects the mobile device to a dock. The system detects whether the mobile device is engaged with the dock and adjusts its operating mode accordingly. When the mobile device is docked, it operates in a first mode, which utilizes higher power consumption for enhanced performance or additional functionality. When undocked, the device switches to a second mode, which conserves power by reducing performance or disabling certain features. The circuitry within the mobile device dynamically adjusts power usage based on the detected docking state, ensuring efficient energy management. This approach optimizes battery life when the device is portable while enabling full functionality when connected to a power source or external peripherals. The system may include sensors or connectors to determine the docking status and control power distribution to various components. The operating modes may involve adjusting processor speed, display brightness, or peripheral activation to balance performance and power consumption.
11. The system of claim 9 , wherein the heat transfer means further includes a contact surface that is positioned to make contact with a thermally-conductive panel when the case base and the case top are slidably coupled in the open position.
This invention relates to a thermal management system for electronic devices, particularly addressing the challenge of efficiently dissipating heat from enclosed electronic components. The system includes a case with a base and a top that can be slidably coupled in an open or closed position. The heat transfer mechanism within the system is designed to interface with a thermally-conductive panel, such as a heat sink or cooling plate, when the case is in the open position. This contact surface ensures direct thermal conduction between the electronic components and the panel, enhancing heat dissipation. The system may also incorporate additional heat transfer elements, such as fins or heat pipes, to further improve cooling efficiency. The sliding mechanism allows for easy access to the electronic components while maintaining a compact form factor when closed. The invention aims to provide an effective and space-efficient cooling solution for portable or enclosed electronic devices.
12. The system of claim 11 , wherein the heat transfer means includes a convective heat sink.
A system for thermal management in electronic devices addresses the problem of excessive heat generation, which can degrade performance and reliability. The system includes a heat transfer mechanism designed to efficiently dissipate heat from electronic components. This mechanism incorporates a convective heat sink, which uses airflow to remove heat from the components. The convective heat sink may include fins or other structures to increase surface area and enhance heat dissipation through natural or forced convection. The system may also include additional cooling elements, such as fans or liquid cooling loops, to further improve thermal performance. By integrating a convective heat sink, the system ensures effective heat removal, maintaining optimal operating temperatures for electronic devices. This approach is particularly useful in high-performance computing, data centers, and other applications where thermal management is critical. The convective heat sink may be optimized for specific airflow patterns or environmental conditions to maximize efficiency. The overall system provides a scalable and reliable solution for managing heat in electronic systems.
13. The system of claim 9 , wherein the case base and the case top are slidably coupled via a slide track to move between the open position and the closed position.
A system for a portable electronic device case includes a case base and a case top that are slidably coupled via a slide track. The case base is configured to receive and secure the electronic device, while the case top is movable relative to the case base. The slide track allows the case top to slide between an open position, where the electronic device is accessible, and a closed position, where the case top covers and protects the electronic device. The slide track ensures smooth and stable movement between these positions, providing a compact and protective enclosure when closed while allowing easy access when open. This design enhances portability and usability by combining protection with convenient access. The system may also include additional features such as locking mechanisms to secure the case in the closed position or alignment guides to ensure proper positioning during sliding. The slide track may be integrated into the case base and case top, or it may be a separate component that connects them. This configuration is particularly useful for devices like tablets or laptops, where frequent access is required while maintaining protection during transport.
Unknown
September 3, 2019
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