Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A casing of an electronic device, comprising: a metallic housing, having a first surface and a second surface opposite to the first surface, wherein the first surface includes a rounded, “T” shaped undercut extending through the first surface and physically contacting the second surface; and a moldable material insert molded in the undercut of the metallic housing.
This invention relates to the design of electronic device casings, specifically addressing the challenge of integrating non-metallic components with metallic housings while maintaining structural integrity and aesthetic appeal. The casing includes a metallic housing with a first surface and an opposite second surface. The first surface features a rounded, T-shaped undercut that extends through the first surface and physically contacts the second surface, creating a continuous channel within the housing. A moldable material, such as plastic or polymer, is insert-molded into this undercut, forming a secure bond with the metallic housing. The T-shaped undercut design ensures mechanical interlocking, preventing detachment of the moldable material under stress or thermal expansion. This approach allows for the integration of non-metallic features, such as buttons, logos, or antenna windows, directly into the metallic housing without compromising durability or requiring additional assembly steps. The rounded edges of the undercut reduce stress concentrations, enhancing the casing's longevity. The invention is particularly useful in smartphones, tablets, or other portable electronics where a seamless, high-quality finish is desired.
2. The casing of claim 1 , wherein the undercut is created using a computer numerical control (CNC) machining of the metallic housing, and wherein the undercut is created through the first surface such that the undercut extends through the first surface and physically contacts the second surface of the metallic housing.
This invention relates to a metallic housing with an undercut feature, specifically designed for structural or functional integration within a device. The undercut is precisely machined into the housing using computer numerical control (CNC) techniques, ensuring high precision and repeatability. The undercut is formed through a first surface of the housing, extending inward to physically contact a second surface of the housing. This design allows for secure mechanical interlocking, improved load distribution, or enhanced assembly with other components. The CNC machining process ensures the undercut is accurately positioned and dimensioned, enabling reliable performance in applications where structural integrity or precise component alignment is critical. The undercut may serve purposes such as fastening, alignment, or stress distribution, depending on the specific application. The metallic housing itself is designed to provide durability and rigidity, with the undercut feature enhancing its functional capabilities. This approach eliminates the need for additional fasteners or adhesives in some cases, simplifying assembly and reducing potential failure points. The invention is particularly useful in industries requiring high-precision components, such as aerospace, automotive, or industrial machinery.
3. The casing of claim 1 , wherein the undercut is a slot with an opening that is larger at the second surface than the first surface.
This invention relates to a casing with an undercut feature designed to improve structural integrity and assembly efficiency. The casing includes a first surface and a second surface, where the undercut is formed as a slot. The slot has an opening that is wider at the second surface than at the first surface, creating a tapered or stepped profile. This design allows for easier insertion of components or fasteners while ensuring secure retention once assembled. The undercut may be used to accommodate mating parts, facilitate alignment, or enhance load distribution within the casing. The tapered slot geometry helps reduce stress concentrations and improves manufacturing precision. The casing may be part of a larger assembly, such as a housing for electronic devices, mechanical systems, or structural components, where precise fitting and durability are critical. The undercut's design ensures that components inserted from the second surface are locked in place when reaching the narrower first surface, preventing unintended disassembly. This feature is particularly useful in applications requiring quick assembly and disassembly without compromising structural stability. The invention addresses challenges in manufacturing and assembly by simplifying the insertion process while maintaining robust mechanical connections.
4. The casing of claim 1 , wherein the moldable material comprises a material selected from the group consisting of plastic and resin, and wherein the metallic housing is made of an alloy.
This invention relates to a protective casing for electronic devices, addressing the need for durable, lightweight, and customizable enclosures. The casing combines a moldable material, such as plastic or resin, with a metallic housing made of an alloy to balance strength and flexibility. The moldable material allows for custom shaping and design, while the alloy housing provides structural integrity and electromagnetic shielding. The casing is designed to protect electronic components from physical damage, environmental factors, and interference, making it suitable for devices requiring both durability and aesthetic versatility. The alloy housing ensures rigidity and thermal conductivity, while the moldable material enables easy manufacturing and adaptation to different device shapes. This combination enhances protection without significantly increasing weight, addressing limitations of traditional casings that rely solely on metal or plastic. The invention is particularly useful for consumer electronics, industrial equipment, and portable devices where both performance and design are critical. The alloy housing may include additional features like mounting points or heat dissipation elements, further improving functionality. The moldable material can be molded into intricate designs, allowing for branding, ergonomic improvements, or modular attachments. This dual-material approach optimizes protection, manufacturability, and customization in electronic device casings.
5. The casing of claim 1 , wherein the metallic housing has a thickness of about 0.5 mm to 1 mm, and wherein the undercut has a depth of about 0.2 mm to 0.4 mm.
This invention relates to a casing for electronic devices, particularly addressing the need for lightweight yet durable protective enclosures. The casing features a metallic housing with a thickness between 0.5 mm and 1 mm, providing structural rigidity while minimizing weight. An undercut is formed in the housing with a depth of 0.2 mm to 0.4 mm, which enhances grip and ergonomics for handheld devices. The undercut may be continuous or segmented along the housing's edges, improving user handling without compromising the casing's structural integrity. The metallic material, likely aluminum or stainless steel, offers resistance to impacts and environmental factors while maintaining a sleek, modern aesthetic. The undercut depth is optimized to prevent sharp edges while ensuring sufficient tactile feedback. This design balances durability, ergonomics, and lightweight construction, making it suitable for smartphones, tablets, or other portable electronics. The casing may also include additional features such as antenna windows, mounting points, or thermal management elements to support device functionality. The combination of precise thickness and undercut dimensions ensures a robust yet comfortable enclosure for electronic devices.
6. An electronic device comprising: an electronic component; and a casing to at least partially house the electronic component, wherein the casing comprises: a metallic housing having a first surface and a second surface opposite to the first surface, wherein the first surface includes a rounded, “T” undercut extending through the first surface and physically contacting the second surface; and a non-conductive layer disposed in the undercut of the metallic housing to provide a bonding force in x, y and z directions.
This invention relates to electronic devices with improved structural integrity and electromagnetic shielding. The problem addressed is the need for a robust casing that provides both mechanical strength and electromagnetic interference (EMI) shielding while maintaining structural stability in multiple directions. The device includes an electronic component housed within a casing. The casing features a metallic housing with a first surface and an opposite second surface. The first surface has a rounded, T-shaped undercut that extends through to the second surface. This undercut is filled with a non-conductive layer, which bonds the metallic housing in the x, y, and z directions, enhancing structural rigidity. The metallic housing provides EMI shielding, while the non-conductive layer ensures mechanical stability by distributing forces across the undercut. The rounded T-shape of the undercut optimizes bonding strength and stress distribution, preventing deformation or separation under mechanical loads. This design ensures the casing remains intact while maintaining electromagnetic shielding properties. The non-conductive layer also prevents electrical shorting between the metallic housing and other components. The overall structure improves durability and reliability in electronic devices.
7. The electronic device of claim 6 , wherein the metallic housing has a gap formed on the first surface, wherein the undercut is formed on a surface of the gap of the metallic housing, and wherein the non-conductive layer is substantially a strip structure disposed in the gap and extended into the undercut formed on the surface of the gap.
This invention relates to electronic devices with metallic housings, particularly addressing challenges in integrating non-conductive elements within such housings. The device includes a metallic housing with a first surface and a gap formed on that surface. An undercut is formed on the surface of the gap, creating a recessed area. A non-conductive layer, shaped as a strip, is disposed within the gap and extends into the undercut. This configuration ensures proper alignment and secure placement of the non-conductive layer within the metallic housing, preventing misalignment or detachment. The non-conductive layer may serve various functions, such as electrical insulation, structural support, or aesthetic purposes. The undercut provides additional retention, enhancing the stability of the non-conductive layer within the housing. This design is particularly useful in devices where precise positioning of non-conductive elements is critical, such as in antennas, sensors, or other components requiring insulation or structural reinforcement. The metallic housing may be part of a larger electronic device, such as a smartphone, tablet, or wearable device, where durability and precise component integration are essential. The invention improves manufacturing reliability and device performance by ensuring the non-conductive layer remains securely in place.
8. The electronic device of claim 6 , wherein the undercut is an elongated opening formed in the metallic housing.
This invention relates to electronic devices with metallic housings, addressing the challenge of integrating functional components into such housings while maintaining structural integrity and aesthetic appeal. The device includes a metallic housing with an undercut, which is an elongated opening formed directly in the housing material. This undercut serves as a mounting or alignment feature for internal components, such as circuit boards, antennas, or structural supports, without requiring additional fasteners or brackets. The undercut may also facilitate assembly by providing a precise reference for positioning components during manufacturing. The housing itself may be a unibody structure or a multi-part assembly, with the undercut formed through machining, stamping, or other metalworking processes. The design ensures that the undercut does not compromise the housing's strength or electromagnetic shielding properties, which are critical for electronic devices like smartphones, tablets, or wearable devices. The invention improves manufacturability and reduces part count by eliminating the need for separate mounting features, while maintaining the housing's protective and aesthetic functions.
9. The electronic device of claim 6 , wherein the electronic component comprises an antenna, wherein the non-conductive layer is disposed in the undercut of the metallic housing to allow transmission/reception of antenna signals from the antenna.
This invention relates to electronic devices with metallic housings that incorporate antennas for wireless communication. A common problem in such devices is that metallic housings can interfere with antenna signals, reducing signal strength and performance. The invention addresses this by integrating a non-conductive layer within an undercut region of the metallic housing. The undercut is a recessed area formed in the housing, and the non-conductive layer is placed there to prevent signal interference while maintaining structural integrity. The antenna is positioned such that its signals can pass through the non-conductive layer, ensuring reliable transmission and reception. This design allows the device to retain a sleek, metallic exterior while optimizing antenna performance. The non-conductive layer may be made of materials like plastic or ceramic, chosen for their low signal attenuation properties. The undercut and non-conductive layer are precisely engineered to avoid compromising the housing's durability or aesthetic appeal. This solution is particularly useful in smartphones, tablets, and other portable electronics where both design and wireless functionality are critical.
10. A method of manufacturing a casing of an electronic device, comprising: providing a metallic housing, wherein the metallic housing has a first surface and a second surface opposite to the first surface; creating a rounded, “T” shaped undercut through the first surface such that the undercut extends through the first surface and physically contacts the second surface of the metallic housing; and a non-conductive layer on the first surface of the metallic housing such that at least a part of the non-conductive layer is extended into the undercut to form the casing for the electronic device.
This invention relates to the manufacturing of casings for electronic devices, specifically addressing the challenge of integrating non-conductive materials with metallic housings while maintaining structural integrity and aesthetic appeal. The method involves providing a metallic housing with two opposing surfaces. A rounded, T-shaped undercut is created through the first surface, extending through the housing to physically contact the second surface. This undercut is designed to accommodate a non-conductive layer applied to the first surface, with at least part of the layer extending into the undercut. The non-conductive layer enhances insulation and aesthetic properties while the metallic housing provides structural strength. The T-shaped undercut ensures secure adhesion and prevents delamination, improving durability. This approach allows for seamless integration of conductive and non-conductive materials, addressing issues like signal interference and heat dissipation in electronic devices. The method is particularly useful for devices requiring both robust structural support and non-conductive surfaces, such as smartphones, tablets, or wearable electronics.
11. The method of claim 10 , wherein creating the undercut comprises: creating a gap on the first surface of the metallic housing; and creating the undercut on a surface of the gap of the metallic housing, wherein the non-conductive layer is substantially a strip structure disposed in the gap and extended into the undercut created on the surface of the gap.
This invention relates to the field of electronic device manufacturing, specifically to techniques for forming non-conductive layers in metallic housings to improve signal integrity. The problem addressed is the need to isolate conductive elements within a metallic housing while maintaining structural integrity and manufacturing efficiency. The method involves creating a gap on the first surface of a metallic housing and then forming an undercut on the surface of this gap. A non-conductive layer, substantially in the form of a strip structure, is disposed within the gap and extends into the undercut. This configuration ensures proper insulation between conductive components while allowing precise alignment and secure placement of the non-conductive material. The undercut provides additional mechanical stability, preventing the non-conductive layer from dislodging during device assembly or operation. The technique is particularly useful in applications where high-frequency signals are transmitted through the housing, as it minimizes signal interference and maintains electrical isolation. The process may be integrated into existing manufacturing workflows, reducing the need for additional assembly steps or components. The resulting structure enhances both the performance and reliability of electronic devices that require conductive housings with insulated regions.
12. The method of claim 10 , wherein a material of the non-conductive layer is plastic or resin, and wherein the undercut is an elongated opening formed in the metallic housing.
This invention relates to the field of electronic device manufacturing, specifically addressing the challenge of securely attaching a non-conductive layer to a metallic housing while ensuring proper alignment and structural integrity. The method involves forming an undercut, which is an elongated opening, in the metallic housing. A non-conductive layer, made of plastic or resin, is then positioned adjacent to the housing such that it engages with the undercut. This engagement helps to mechanically lock the non-conductive layer in place, preventing misalignment or detachment during assembly or use. The undercut may be formed through machining, molding, or other fabrication techniques, and its shape and dimensions are designed to complement the non-conductive layer's geometry for a secure fit. The non-conductive layer may serve as an insulating barrier, a structural support, or a decorative element, depending on the application. The method ensures reliable attachment without requiring additional fasteners or adhesives, simplifying the manufacturing process while maintaining durability. This approach is particularly useful in electronic devices where precise alignment and robust connections are critical, such as in smartphones, tablets, or wearable electronics. The use of plastic or resin for the non-conductive layer provides flexibility in design and material selection, allowing for customization based on specific performance or aesthetic requirements.
13. The method of claim 10 , wherein disposing the non-conductive layer on the first surface of the metallic housing comprises an insert mold process, and wherein creating the undercut comprises a computer numerical control (CNC) treatment of the metallic housing.
This invention relates to a method for manufacturing a metallic housing with an integrated non-conductive layer and an undercut feature. The method addresses the challenge of combining conductive and non-conductive materials in a single housing structure while ensuring precise mechanical features, such as undercuts, which are difficult to achieve with traditional manufacturing techniques. The process begins by forming a metallic housing, which serves as the primary structural component. A non-conductive layer is then applied to a first surface of the housing using an insert molding process, where the non-conductive material is injected around the metallic housing to form a secure bond. This step ensures electrical insulation where needed while maintaining structural integrity. To create an undercut in the metallic housing, a computer numerical control (CNC) machining process is employed. The CNC treatment precisely removes material to form the undercut, which is a recessed or protruding feature that enhances the housing's functionality, such as enabling snap-fit connections or improving aesthetic design. The combination of insert molding and CNC machining allows for the integration of both conductive and non-conductive materials while achieving complex geometric features in a single housing component. This method is particularly useful in electronic device housings where both electrical insulation and mechanical precision are required.
14. The method of claim 10 , wherein the undercut is a slot with an opening that is larger at the second surface than the first surface, and wherein the undercut and the part of the non-conductive layer disposed in the undercut provides a bonding force in x, y and z directions and serves as an antenna region of the casing of the electronic device.
This invention relates to electronic device casings with integrated antenna functionality. The problem addressed is improving the structural bonding and antenna performance of non-conductive layers in device casings. The solution involves creating an undercut slot in the casing that widens from a first surface to a second surface. A non-conductive layer is disposed within this undercut, where the geometry of the slot and the layer's placement provide bonding forces in all three spatial directions (x, y, and z). This design also serves as an antenna region for the device, enhancing signal transmission while maintaining structural integrity. The undercut's tapered shape ensures secure adhesion of the non-conductive layer, preventing delamination or detachment under mechanical stress. The antenna functionality is integrated into the casing structure, eliminating the need for separate antenna components while optimizing space utilization. This approach improves both the mechanical robustness and electromagnetic performance of the device casing.
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March 10, 2020
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