Legal claims defining the scope of protection, as filed with the USPTO.
1. A glass substrate comprising: a region having a first thickness and a puncture resistance of at least 3 Kg force; and a central region having a second thickness, extending from a first primary surface of the glass substrate to a second primary surface of the glass substrate, providing the substrate the ability to achieve a bend radius of 5 mm, wherein the first thickness is greater than the second thickness.
2. The glass substrate of claim 1 , wherein the second thickness provides the substrate the ability to achieve a bend radius of 2 mm.
3. The glass substrate of claim 1 , wherein the second thickness provides the substrate the ability to achieve a blend radius of 1 mm.
4. The glass substrate of claim 1 , wherein the second thickness is ≤30 microns.
5. The glass substrate claim 1 , wherein the second thickness is ≤25 microns.
6. The glass substrate of claim 1 , further comprising a length, and wherein the second thickness is continuously provided across the entire length.
7. The glass substrate of claim 1 , further comprising a protective member disposed so as to cover a portion of the substrate having the second thickness.
8. The glass substrate of claim 1 , wherein the first thickness is ≥100 microns.
9. The glass substrate of claim 1 , wherein the glass substrate comprises a composition that is an alkali-free, alumino-boro-silicate, glass.
10. The glass substrate of claim 1 , capable of at least 100 cycles of bending to a 5 mm radius before failure.
11. The glass substrate of claim 1 , further comprising a Young's modulus of >50 GPa.
12. The glass substrate of claim 1 , having a pencil hardness of at least 8H.
13. A display device comprising a body and a cover glass, wherein the cover glass comprises the glass substrate of claim 1 .
14. The glass substrate of claim 1 , further comprising a plurality of layers.
15. A method of etching glass comprising: obtaining a glass substrate having a first thickness region, wherein the first thickness provides the substrate with a puncture resistance of at least 3 kgf force; and removing a portion of the substrate so as to achieve a second thickness central region extending from a first primary surface of the glass substrate to a second primary surface of the glass substrate, the second thickness being less than the first, wherein the second thickness provides the substrate the ability to achieve a bend radius of 5 mm, wherein after the removing, the substrate maintains a portion having the first thickness.
16. The method of claim 15 , wherein the removing is performed by etching.
17. The method of claim 15 , wherein the second thickness provides the substrate the ability to achieve a bend radius of 2 mm.
18. The method of claim 15 , wherein the second thickness provides the substrate the ability to achieve a bend radius of 1 mm.
19. The method of claim 15 , wherein the second thickness is ≤30 microns.
20. The method of claim 15 , wherein the second thickness is ≤25 microns.
21. The method of claim 15 , wherein the substrate comprises a length, and wherein removing provides the second thickness continuously across the entire length.
22. The method of claim 15 , further comprising disposing a protective member to cover a portion of the substrate having the second thickness.
23. The method of claim 15 , wherein the first thickness is ≥130 microns.
24. The method of claim 15 , wherein the glass substrate comprises a composition that is an alkali-free, alumino-boro-silicate, glass.
25. The method of claim 15 , wherein the substrate comprises an edge, and the method further comprising etching the edge.
26. The method of claim 25 , wherein etching the edge is performed simultaneously with the removing.
27. The method of claim 15 , wherein the glass substrate comprises a Young's modulus of >50 GPa.
28. The method of claim 15 , wherein the glass substrate comprises a pencil hardness of at least 8H.
29. The method of claim 15 , the glass substrate further comprising a plurality of layers.
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October 20, 2020
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