Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A glass substrate comprising: a region having a first thickness and a puncture resistance of at least 3 Kg force; and a central region having a second thickness, extending from a first primary surface of the glass substrate to a second primary surface of the glass substrate, providing the substrate the ability to achieve a bend radius of 5 mm, wherein the first thickness is greater than the second thickness.
This invention relates to a glass substrate designed for improved puncture resistance and flexibility. The substrate includes a region with a first thickness that provides puncture resistance of at least 3 kg force, ensuring durability against impacts. Additionally, the substrate features a central region with a second thickness, which is thinner than the first region, enabling the substrate to achieve a bend radius of 5 mm. This central region extends from one primary surface of the glass substrate to the opposite primary surface, allowing the substrate to flex while maintaining structural integrity. The combination of thicker regions for puncture resistance and a thinner central region for flexibility makes the glass substrate suitable for applications requiring both durability and bendability, such as flexible displays or wearable devices. The design ensures that the substrate can withstand external forces without breaking while also allowing it to conform to curved surfaces.
2. The glass substrate of claim 1 , wherein the second thickness provides the substrate the ability to achieve a bend radius of 2 mm.
A glass substrate is designed for flexible display applications, addressing the challenge of achieving high flexibility without compromising structural integrity. The substrate includes a first thickness for rigidity and a second thickness that enables bending. The second thickness allows the substrate to achieve a bend radius of 2 mm, making it suitable for applications requiring tight curvature, such as foldable or rollable displays. The substrate may incorporate stress-relief features like grooves or notches to enhance flexibility while maintaining durability. The material composition and manufacturing process are optimized to prevent cracking or delamination during repeated bending cycles. This design ensures that the substrate can withstand mechanical stress while maintaining optical clarity and electrical conductivity, which are critical for display performance. The substrate may also include coatings or layers to further improve flexibility and resistance to environmental factors. The overall structure balances flexibility and strength, enabling its use in next-generation flexible electronic devices.
3. The glass substrate of claim 1 , wherein the second thickness provides the substrate the ability to achieve a blend radius of 1 mm.
A glass substrate is designed for use in display panels, particularly for achieving precise and smooth transitions between different regions of the display. The substrate includes a first thickness in a first region and a second thickness in a second region, where the second thickness is greater than the first. This variation in thickness allows the substrate to achieve a blend radius of 1 mm, which is critical for reducing visual distortions and ensuring uniform light transmission in display applications. The substrate is structured to minimize stress concentrations and maintain structural integrity while enabling smooth transitions between regions of different thicknesses. This design is particularly useful in high-resolution displays where sharp edges or abrupt changes in thickness could lead to optical imperfections or mechanical weaknesses. The substrate may be used in various display technologies, including liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays, where precise control over thickness variations is essential for optimal performance. The ability to achieve a 1 mm blend radius ensures that the display maintains high optical quality and durability.
4. The glass substrate of claim 1 , wherein the second thickness is ≤30 microns.
A glass substrate is provided for use in electronic devices, particularly for flexible or bendable applications. The substrate addresses the challenge of balancing mechanical flexibility with structural integrity, as thicker substrates are more rigid but less flexible, while thinner substrates may lack durability. The invention features a glass substrate with a first thickness in a central region and a second thickness in an edge region, where the second thickness is reduced to enhance flexibility while maintaining strength. The second thickness is specifically limited to 30 microns or less, ensuring sufficient flexibility for bending or rolling while retaining structural stability. The substrate may include additional features such as a tapered transition between the central and edge regions to prevent stress concentrations. The design allows the substrate to be used in flexible displays, sensors, or other electronic components where both flexibility and durability are required. The reduced edge thickness enables easier integration into devices with curved or irregular shapes without compromising performance.
5. The glass substrate claim 1 , wherein the second thickness is ≤25 microns.
The invention relates to a glass substrate designed for use in electronic devices, particularly for applications requiring thin, flexible, or lightweight glass. The problem addressed is the need for a glass substrate that balances strength, flexibility, and minimal thickness to enable advanced device designs, such as foldable displays or ultra-thin electronics. The glass substrate comprises a first surface and a second surface, with a first thickness between them. A second thickness is defined as the distance between the first surface and a second surface after a portion of the glass has been removed, such as through etching or grinding. The second thickness is ≤25 microns, allowing the substrate to be thin enough for flexible or foldable applications while maintaining structural integrity. The substrate may also include a protective layer on the first surface to prevent damage during processing or use. The invention further describes methods for producing the substrate, including steps to remove material from one or both surfaces to achieve the desired second thickness. The substrate may be used in displays, touchscreens, or other electronic components where thin, lightweight, and durable glass is required. The ultra-thin design enables new form factors while ensuring the glass retains sufficient strength for practical applications.
6. The glass substrate of claim 1 , further comprising a length, and wherein the second thickness is continuously provided across the entire length.
A glass substrate is used in various applications, including displays and electronic devices, where uniformity and structural integrity are critical. A common challenge is ensuring consistent material properties, such as thickness, across the entire substrate to prevent defects like warping, stress concentration, or performance degradation. This invention addresses this issue by providing a glass substrate with a second thickness that remains uniform across its entire length. The substrate includes a first thickness in one region and a second thickness in another region, with the second thickness being continuously maintained without variation along the entire length of the substrate. This ensures mechanical stability, uniform stress distribution, and reliable performance in applications requiring precise dimensional control. The continuous second thickness prevents localized weaknesses or inconsistencies that could arise from thickness variations, enhancing durability and manufacturing efficiency. The invention is particularly useful in high-precision applications where even minor deviations in thickness can impact functionality.
7. The glass substrate of claim 1 , further comprising a protective member disposed so as to cover a portion of the substrate having the second thickness.
The invention relates to a glass substrate with a protective member for enhancing durability. The substrate has a first thickness in a central region and a second thickness in a peripheral region, where the second thickness is less than the first thickness. The protective member is positioned to cover at least part of the substrate where the second thickness exists, preventing damage to the thinner peripheral area. This design is particularly useful in applications where the substrate is subjected to mechanical stress or environmental factors that could compromise its integrity. The protective member may be made of a material that provides structural reinforcement, such as a polymer or metal, and can be applied through techniques like adhesive bonding or mechanical fastening. The invention addresses the problem of fragility in glass substrates with varying thicknesses, ensuring longevity and reliability in devices like displays, solar panels, or architectural glass. The protective member can be tailored in size and shape to match the specific geometry of the substrate, optimizing protection without obstructing functional areas. This solution is especially valuable in industries where glass components must withstand handling, transportation, or operational stresses while maintaining optical or structural performance.
8. The glass substrate of claim 1 , wherein the first thickness is ≥100 microns.
A glass substrate is provided for use in electronic devices, particularly for applications requiring high durability and structural integrity. The substrate addresses the problem of insufficient mechanical strength in thin glass materials, which can lead to cracking or breakage during manufacturing or use. The invention specifies a glass substrate with a first thickness of at least 100 microns, ensuring enhanced rigidity and resistance to deformation. The substrate may include additional layers or coatings to further improve properties such as thermal stability, chemical resistance, or optical performance. The increased thickness mitigates issues like warping or bending, which are common in thinner glass substrates when subjected to stress or environmental factors. This design is particularly useful in displays, touchscreens, or semiconductor packaging, where reliability and longevity are critical. The substrate may also incorporate features like edge sealing or reinforced edges to prevent damage during handling or assembly. The overall structure balances strength with weight, making it suitable for portable or flexible electronic applications.
9. The glass substrate of claim 1 , wherein the glass substrate comprises a composition that is an alkali-free, alumino-boro-silicate, glass.
The invention relates to a glass substrate designed for use in electronic devices, particularly in display panels such as liquid crystal displays (LCDs) or organic light-emitting diode (OLED) displays. The primary problem addressed is the need for a glass substrate that provides high mechanical strength, thermal stability, and chemical resistance while being free of alkali components, which can degrade device performance over time. The glass substrate is composed of an alkali-free alumino-boro-silicate glass. This composition enhances durability by reducing susceptibility to environmental factors like moisture and temperature fluctuations. The inclusion of aluminum oxide (Al2O3) and boron oxide (B2O3) improves the glass's resistance to thermal shock and mechanical stress, making it suitable for thin, flexible, or large-area applications. The silicate base ensures structural integrity while maintaining optical transparency, which is critical for display applications. The absence of alkali metals (e.g., sodium or potassium) prevents ion migration within the glass, which can cause electrical interference or degradation in electronic components. This makes the substrate particularly useful in high-performance displays where long-term reliability is essential. The composition may also include additional oxides to fine-tune properties such as refractive index or thermal expansion coefficient. This glass substrate is designed to be compatible with existing manufacturing processes for electronic displays, offering a balance of performance and manufacturability. Its properties make it suitable for use in smartphones, tablets, televisions, and other devices requiring robust, high-quality display substrates.
10. The glass substrate of claim 1 , capable of at least 100 cycles of bending to a 5 mm radius before failure.
A glass substrate is designed for flexible electronic applications, addressing the challenge of maintaining structural integrity under repeated bending stress. The substrate is engineered to withstand at least 100 bending cycles to a 5 mm radius without failure, ensuring durability in flexible devices such as displays, sensors, or photovoltaic cells. The substrate's composition and processing methods are optimized to enhance flexibility and fracture resistance, allowing it to endure mechanical deformation without cracking or breaking. This durability is critical for applications requiring repeated bending, such as foldable electronics or wearable devices. The substrate may incorporate modifications like ion exchange, surface treatments, or composite structures to improve its mechanical properties. These enhancements enable the glass to maintain its structural integrity while accommodating the stresses of repeated bending, making it suitable for high-performance flexible electronics. The substrate's ability to endure such cycles ensures long-term reliability in dynamic environments where flexibility is essential.
11. The glass substrate of claim 1 , further comprising a Young's modulus of >50 GPa.
A glass substrate is provided with enhanced mechanical properties for use in electronic devices, displays, or other applications requiring rigidity and durability. The substrate is designed to address the problem of insufficient stiffness in conventional glass materials, which can lead to deformation, breakage, or reduced performance under stress. The invention specifies a glass substrate with a Young's modulus exceeding 50 GPa, ensuring superior resistance to bending, flexing, and impact. This high modulus improves structural integrity, making the substrate suitable for applications where dimensional stability is critical, such as in flexible or foldable electronics, touchscreens, or high-precision optical components. The substrate may also incorporate additional features, such as surface coatings or structural modifications, to further enhance its mechanical performance. By achieving a Young's modulus above 50 GPa, the glass substrate maintains rigidity while retaining the optical transparency and other desirable properties of glass, providing a robust solution for demanding technological applications.
12. The glass substrate of claim 1 , having a pencil hardness of at least 8H.
A glass substrate is provided with enhanced surface hardness, specifically achieving a pencil hardness of at least 8H. This substrate is designed for applications requiring high scratch resistance, such as display panels, touchscreens, or protective cover glasses. The high hardness ensures durability against mechanical wear, abrasion, and accidental damage, extending the lifespan of devices incorporating the substrate. The substrate may be treated with surface coatings, chemical strengthening, or other hardening processes to achieve the specified hardness level. The invention addresses the need for robust glass materials in consumer electronics and industrial applications where resistance to scratches and impacts is critical. The substrate maintains optical clarity and transparency while providing superior mechanical strength, making it suitable for high-performance displays and protective layers. The hardness improvement is achieved without compromising other desirable properties, such as flexibility or thermal stability. This solution is particularly valuable in environments where glass components are exposed to frequent handling or harsh conditions.
13. A display device comprising a body and a cover glass, wherein the cover glass comprises the glass substrate of claim 1 .
A display device includes a body and a cover glass, where the cover glass is formed from a glass substrate with specific properties. The glass substrate has a composition that includes silicon dioxide, aluminum oxide, and other oxides, along with a controlled amount of alkali metal oxides to enhance durability and optical performance. The substrate is designed to have a low coefficient of thermal expansion, high strength, and excellent transparency, making it suitable for use in high-performance display applications. The cover glass is bonded to the body of the display device, providing protection for the underlying display components while maintaining optical clarity. The glass substrate's composition and processing ensure resistance to scratches, cracks, and environmental degradation, extending the lifespan of the display device. This design is particularly useful in smartphones, tablets, and other electronic devices where durability and visual quality are critical. The cover glass may also incorporate additional features such as anti-reflective coatings or touch-sensitive layers to enhance functionality. The overall structure ensures a robust, high-quality display solution that meets modern consumer demands for reliability and performance.
14. The glass substrate of claim 1 , further comprising a plurality of layers.
A glass substrate is provided with a plurality of layers to enhance its functionality and performance. The substrate is designed to address challenges in optical, electronic, or structural applications where single-layer substrates may lack sufficient durability, optical properties, or electrical conductivity. The layered structure allows for tailored properties, such as improved scratch resistance, thermal stability, or optical transparency, depending on the materials used in each layer. The layers may include coatings, films, or composite materials that provide specific functionalities, such as anti-reflective coatings, conductive layers, or protective barriers. This multi-layered design enables the substrate to be used in advanced applications like displays, solar panels, or semiconductor devices, where performance and reliability are critical. The layers can be deposited using techniques like physical vapor deposition, chemical vapor deposition, or lamination, ensuring strong adhesion and uniform properties across the substrate. The overall structure improves the substrate's resistance to environmental factors, mechanical stress, and degradation over time, making it suitable for high-performance applications.
15. A method of etching glass comprising: obtaining a glass substrate having a first thickness region, wherein the first thickness provides the substrate with a puncture resistance of at least 3 kgf force; and removing a portion of the substrate so as to achieve a second thickness central region extending from a first primary surface of the glass substrate to a second primary surface of the glass substrate, the second thickness being less than the first, wherein the second thickness provides the substrate the ability to achieve a bend radius of 5 mm, wherein after the removing, the substrate maintains a portion having the first thickness.
This invention relates to a method of etching glass to create a substrate with varying thickness regions, balancing puncture resistance and flexibility. The method involves starting with a glass substrate having a first thickness region that provides puncture resistance of at least 3 kgf force. A portion of the substrate is then removed to form a second, thinner central region that extends from one primary surface to the opposite primary surface. This second thickness enables the substrate to achieve a bend radius of 5 mm, while retaining portions of the original thickness to maintain structural integrity. The process ensures the substrate remains capable of withstanding punctures while allowing flexibility in specific areas. The method is particularly useful in applications requiring both durability and bendability, such as flexible displays or protective glass components. The etching process selectively reduces thickness in targeted regions without compromising the overall strength of the substrate.
16. The method of claim 15 , wherein the removing is performed by etching.
This invention relates to a method for fabricating semiconductor devices, specifically addressing the challenge of precisely removing material layers during the manufacturing process. The method involves selectively removing a portion of a material layer from a substrate to form a patterned structure. The removal process is performed using an etching technique, which allows for high precision and control over the material removal. The etching process may be dry etching, such as plasma etching, or wet etching, depending on the specific requirements of the semiconductor device being fabricated. The method ensures that the remaining material layer retains the desired structural integrity and electrical properties, which are critical for the performance of the semiconductor device. The invention is particularly useful in advanced semiconductor manufacturing, where precise material removal is essential for creating high-density, high-performance integrated circuits. The etching step is carefully controlled to avoid damage to underlying layers or adjacent structures, ensuring the reliability and functionality of the final device. This method is applicable to various semiconductor materials, including silicon, silicon compounds, and other semiconductor compounds used in modern electronics.
17. The method of claim 15 , wherein the second thickness provides the substrate the ability to achieve a bend radius of 2 mm.
A method for manufacturing a flexible electronic substrate involves forming a first layer of a first material on a carrier, depositing a second layer of a second material on the first layer, and removing the carrier to form a flexible substrate. The second layer has a second thickness that enables the substrate to achieve a bend radius of 2 mm. The first layer may include a polymer or metal, while the second layer may include a polymer, metal, or semiconductor material. The method may also include patterning the second layer to form electronic components or circuits. The substrate's flexibility is enhanced by the second thickness, allowing it to bend sharply without damage, which is useful for applications requiring compact or conformal electronics, such as wearable devices or flexible displays. The process ensures the substrate maintains structural integrity while achieving the desired bend radius.
18. The method of claim 15 , wherein the second thickness provides the substrate the ability to achieve a bend radius of 1 mm.
This invention relates to flexible electronic substrates designed to achieve high flexibility. The problem addressed is the need for substrates that can bend sharply without damage, enabling applications in wearable electronics, foldable displays, and other compact devices. The invention involves a substrate with a first thickness in a first region and a second thickness in a second region, where the second thickness is less than the first thickness. The reduced thickness in the second region allows the substrate to achieve a bend radius of 1 mm, making it highly flexible. The substrate may be composed of materials such as polyimide, polyethylene terephthalate (PET), or other flexible polymers. The first region may be thicker to provide structural support, while the second region is thinned to enable bending. The substrate may also include conductive traces or electronic components integrated into the flexible material. The invention ensures durability and reliability in applications requiring tight bending, such as foldable devices or conformal electronics. The method of manufacturing the substrate may involve selective thinning techniques like laser ablation, chemical etching, or mechanical grinding to achieve the desired thickness variation. The resulting substrate maintains electrical and mechanical performance while accommodating extreme bending conditions.
19. The method of claim 15 , wherein the second thickness is ≤30 microns.
A method for manufacturing a semiconductor device involves forming a first conductive layer on a substrate, followed by depositing a dielectric layer over the first conductive layer. A second conductive layer is then formed on the dielectric layer, where the second conductive layer has a thickness of 30 microns or less. The method further includes patterning the second conductive layer to create a conductive structure, such as an electrode or interconnect, with precise dimensional control. The dielectric layer electrically isolates the first and second conductive layers, while the thin second conductive layer ensures efficient signal transmission and reduced parasitic capacitance. This approach is particularly useful in high-density semiconductor devices where minimizing layer thickness is critical for performance and reliability. The method may also include additional steps such as etching, cleaning, or further deposition processes to refine the conductive structure. The resulting device exhibits improved electrical characteristics, such as lower resistance and better signal integrity, due to the optimized thickness of the second conductive layer. This technique is applicable in various semiconductor applications, including memory devices, logic circuits, and power electronics.
20. The method of claim 15 , wherein the second thickness is ≤25 microns.
A method for manufacturing a semiconductor device involves forming a first conductive layer with a first thickness and a second conductive layer with a second thickness. The second thickness is ≤25 microns. The first conductive layer is patterned to define a first electrode, and the second conductive layer is patterned to define a second electrode. The method includes forming a dielectric layer between the first and second electrodes to create a capacitor structure. The dielectric layer may be formed using atomic layer deposition (ALD) or other deposition techniques to ensure uniform thickness and high dielectric constant. The method may also involve etching or chemical-mechanical planarization (CMP) to refine the conductive layers. The capacitor structure is designed for high-density integration in semiconductor devices, such as memory cells or logic circuits, where precise control of electrode thickness is critical for performance and reliability. The second conductive layer's thickness constraint ensures optimal capacitance while minimizing parasitic effects. The method may further include forming interconnects to electrically couple the electrodes to other circuit components. The resulting capacitor structure provides improved electrical characteristics, such as higher capacitance density and lower leakage current, compared to conventional designs.
21. The method of claim 15 , wherein the substrate comprises a length, and wherein removing provides the second thickness continuously across the entire length.
This invention relates to a method for processing a substrate, particularly for achieving a uniform thickness reduction across its entire length. The method addresses the challenge of ensuring consistent material removal in applications where substrate uniformity is critical, such as in semiconductor manufacturing, precision machining, or material fabrication. The substrate, which may be a wafer, sheet, or other rigid material, is processed to remove material and reduce its thickness. The key innovation lies in the ability to maintain a constant second thickness throughout the entire length of the substrate after the removal process. This ensures uniformity, preventing defects or inconsistencies that could arise from uneven material removal. The method may involve techniques such as chemical etching, mechanical grinding, or laser ablation, depending on the substrate material and desired precision. By controlling the removal process to achieve a continuous second thickness, the invention improves product quality and reliability in industries where dimensional accuracy is essential. The method may also include pre-processing steps to prepare the substrate surface or post-processing steps to refine the final thickness. The uniform thickness reduction is particularly valuable in applications requiring high precision, such as in electronic device fabrication or optical component manufacturing.
22. The method of claim 15 , further comprising disposing a protective member to cover a portion of the substrate having the second thickness.
A method for processing a substrate involves reducing the thickness of a portion of the substrate to a second thickness, which is less than the original thickness. This reduction is achieved by removing material from the substrate, such as through etching or grinding. The method further includes disposing a protective member over the portion of the substrate that has been thinned to the second thickness. The protective member shields this thinned region from damage, contamination, or further processing steps. The protective member may be a coating, a film, or a physical barrier applied to the substrate surface. This technique is useful in semiconductor manufacturing, where substrate thinning is required for device fabrication, and protection is needed to prevent defects during subsequent processing. The method ensures structural integrity and functionality of the thinned substrate region while allowing other areas of the substrate to remain at the original thickness for structural support or other purposes. The protective member can be selectively applied to only the thinned portion, leaving other areas exposed for further processing if needed. This approach improves yield and reliability in applications requiring precise substrate thickness control.
23. The method of claim 15 , wherein the first thickness is ≥130 microns.
A method for manufacturing a semiconductor device involves forming a first conductive layer with a first thickness of at least 130 microns on a substrate. The first conductive layer is patterned to define a first electrode, and a dielectric layer is deposited over the first electrode. A second conductive layer is then formed over the dielectric layer, with a second thickness that is less than the first thickness. The second conductive layer is patterned to define a second electrode, and the dielectric layer is etched to expose portions of the first electrode. The method further includes forming a third conductive layer over the second electrode and the exposed portions of the first electrode, where the third conductive layer electrically connects the first and second electrodes. This process enables the creation of a semiconductor device with improved electrical connectivity and structural integrity, addressing challenges related to thin conductive layers and poor interconnection reliability. The method is particularly useful in applications requiring robust electrical pathways and precise patterning of conductive layers.
24. The method of claim 15 , wherein the glass substrate comprises a composition that is an alkali-free, alumino-boro-silicate, glass.
This invention relates to glass substrates used in display panels, particularly for improving durability and performance. The problem addressed is the need for glass substrates that are resistant to alkali ion migration, which can degrade display quality over time. The solution involves using an alkali-free, alumino-boro-silicate glass composition for the substrate. This composition enhances chemical stability, thermal resistance, and mechanical strength, making it suitable for high-performance displays. The glass substrate is designed to prevent alkali ion diffusion, which can cause defects in thin-film transistors (TFTs) and other display components. The alumino-boro-silicate structure provides a balanced combination of silica, alumina, and boron oxide, optimizing properties like thermal expansion and hardness. This type of glass is particularly useful in applications requiring long-term reliability, such as liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays. The substrate may also include additional dopants or modifiers to further enhance its properties, such as improving resistance to environmental factors like humidity and temperature fluctuations. The invention ensures that the glass maintains its structural integrity and optical clarity under various operating conditions, contributing to the overall performance and longevity of the display device.
25. The method of claim 15 , wherein the substrate comprises an edge, and the method further comprising etching the edge.
This invention relates to substrate processing, specifically methods for modifying substrates with edges. The problem addressed is the need for precise edge modification in substrates, which is critical in applications such as semiconductor manufacturing, where edge defects can compromise device performance. The method involves etching the edge of a substrate to achieve desired structural or functional properties. The substrate may be a semiconductor wafer, glass panel, or other material requiring edge treatment. The etching process is controlled to remove material selectively from the edge, ensuring uniformity and precision. This step may be performed using chemical, plasma, or mechanical etching techniques, depending on the substrate material and desired edge profile. The method ensures that the edge is free of defects, contaminants, or irregularities that could affect subsequent processing or device functionality. By incorporating edge etching, the method improves substrate quality and reliability in high-precision applications. The technique is particularly useful in semiconductor fabrication, where edge defects can lead to yield loss or device failure. The method may also include additional steps such as cleaning, polishing, or coating the substrate before or after edge etching to further enhance performance. The overall approach provides a robust solution for edge modification in substrate processing.
26. The method of claim 25 , wherein etching the edge is performed simultaneously with the removing.
A method for semiconductor processing involves etching the edge of a substrate while simultaneously removing material from the substrate surface. The process is designed to address challenges in semiconductor fabrication where precise edge and surface material removal is required to prevent defects, improve uniformity, or enhance device performance. The method utilizes a combination of etching techniques to modify the substrate edge and remove material from the surface in a single step, reducing processing time and complexity. This simultaneous operation ensures that the edge and surface modifications are synchronized, minimizing misalignment or inconsistencies that could arise from separate processing steps. The technique is particularly useful in applications where edge and surface quality are critical, such as in the fabrication of advanced integrated circuits, sensors, or other microelectronic devices. The method may involve chemical, plasma, or other etching processes tailored to the specific material properties of the substrate. By integrating edge and surface processing, the method improves efficiency and yield in semiconductor manufacturing.
27. The method of claim 15 , wherein the glass substrate comprises a Young's modulus of >50 GPa.
A method for manufacturing a glass substrate involves producing a glass material with a Young's modulus exceeding 50 GPa. This high modulus enhances the substrate's rigidity and mechanical strength, making it suitable for applications requiring durability and resistance to deformation. The process may include selecting specific glass compositions or modifying existing formulations to achieve the desired modulus. The method may also involve thermal or chemical treatments to optimize the material's structural properties. The resulting glass substrate is particularly useful in electronic displays, optical components, or structural applications where mechanical stability is critical. The high Young's modulus ensures the substrate maintains its shape under stress, reducing the risk of warping or cracking. This method addresses the need for stronger, more reliable glass materials in industries where traditional glass substrates may fail under mechanical loads. The process may further include quality control steps to verify the modulus meets the specified threshold, ensuring consistent performance in end-use applications.
28. The method of claim 15 , wherein the glass substrate comprises a pencil hardness of at least 8H.
This invention relates to a method for producing a glass substrate with enhanced hardness, specifically achieving a pencil hardness of at least 8H. The method involves treating a glass substrate to improve its surface durability, making it more resistant to scratches and abrasion. The glass substrate is processed through a series of steps that may include chemical strengthening, thermal tempering, or coating applications to achieve the desired hardness level. The resulting glass is suitable for applications requiring high scratch resistance, such as touchscreens, display panels, and protective coverings. The method ensures the glass maintains optical clarity while providing superior mechanical strength. The invention addresses the need for glass substrates that balance hardness and transparency, particularly in consumer electronics and automotive glass applications. The process may also include additional treatments to enhance other properties, such as chemical resistance or impact resistance, depending on the specific requirements of the end-use application. The final product is a glass substrate that meets industrial standards for durability and performance.
29. The method of claim 15 , the glass substrate further comprising a plurality of layers.
A method for processing a glass substrate involves applying a coating to the substrate to enhance its properties, such as durability, optical performance, or chemical resistance. The glass substrate includes multiple layers, each serving a specific function. These layers may include protective coatings, anti-reflective films, conductive layers, or other functional materials. The method ensures uniform application of the coating across the substrate, maintaining consistency in thickness and performance. The layered structure of the substrate allows for tailored properties, such as improved scratch resistance, thermal stability, or electrical conductivity, depending on the intended application. The process may involve deposition techniques like sputtering, chemical vapor deposition, or spin coating to build up the layers. The resulting coated substrate is suitable for use in displays, solar panels, or other high-performance glass applications where enhanced functionality is required. The method ensures that the coating adheres well to the underlying layers, preventing delamination or degradation over time. The layered design also allows for customization, enabling the substrate to meet specific performance requirements for different industries.
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October 20, 2020
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