Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A method, comprising: selecting a plurality of layout patterns, wherein each of the layout patterns comprises a corresponding via pillar structure that satisfies an electromigration (EM) rule, wherein each of the via pillar structures comprises metal layers and at least one via coupled to the metal layers; selecting a layout pattern from the plurality of layout patterns having a smallest physical size; and performing a placement and routing process by using the selected layout pattern.
This invention relates to integrated circuit (IC) design, specifically addressing the challenge of optimizing layout patterns for electromigration (EM) compliance while minimizing physical size. Electromigration is a critical reliability concern in ICs, where high current density can cause material degradation over time. Traditional design approaches often prioritize EM compliance at the expense of layout efficiency, leading to larger chip footprints. The method involves selecting multiple layout patterns, each incorporating a via pillar structure that meets EM rules. These via pillar structures consist of metal layers and at least one via connected to the metal layers. The method then identifies the layout pattern with the smallest physical size from the selected options. Finally, the chosen layout pattern is used in the placement and routing process to construct the IC. By prioritizing the smallest EM-compliant pattern, the method ensures reliability while optimizing space utilization, reducing chip area and potentially lowering manufacturing costs. This approach is particularly useful in high-density IC designs where both performance and reliability are critical.
2. The method of claim 1 , further comprising determining the EM rule for each of the plurality of layout patterns.
A method for optimizing semiconductor manufacturing processes involves analyzing layout patterns to improve yield and performance. The method addresses the challenge of accurately predicting and mitigating defects in semiconductor fabrication by leveraging electromagnetic (EM) rules. These rules define constraints and guidelines for layout patterns to ensure manufacturability and reliability. The method includes determining an EM rule for each of the plurality of layout patterns. This involves evaluating the electrical and physical properties of the patterns to identify potential issues such as signal integrity, crosstalk, or power distribution problems. By applying these EM rules, the method ensures that the layout patterns adhere to design specifications and manufacturing constraints, reducing the risk of defects and improving overall yield. The method also involves generating a layout pattern database that stores the EM rules and associated layout patterns. This database serves as a reference for future designs, enabling designers to quickly access and apply validated patterns. Additionally, the method may include validating the layout patterns against the EM rules to confirm compliance and performance. This validation step helps identify and correct any deviations before manufacturing, further enhancing reliability. By integrating EM rule determination into the layout design process, the method provides a systematic approach to optimizing semiconductor manufacturing, ensuring higher yield and better performance in the final product.
3. The method of claim 1 , wherein the performing the placement and routing process comprises performing the placement and routing process with an automatic placement and routing (APR) tool.
This invention relates to electronic design automation (EDA), specifically improving the placement and routing process for integrated circuits (ICs). The problem addressed is the inefficiency and suboptimal results in traditional IC design workflows, where manual or semi-automated placement and routing can lead to longer design cycles, higher power consumption, or reduced performance. The invention describes a method for optimizing IC design by using an automatic placement and routing (APR) tool. The APR tool automatically arranges and connects circuit components on a chip, ensuring efficient use of space, minimizing signal delays, and reducing power consumption. The method involves defining design constraints, such as timing, power, and area requirements, and then applying these constraints to guide the APR tool in generating an optimized layout. The tool evaluates multiple placement and routing configurations, selecting the one that best meets the specified constraints while minimizing design violations. Additionally, the method may include iterative refinement, where the APR tool adjusts the layout based on feedback from simulation or analysis, further improving the design. The use of automation reduces human error and speeds up the design process, making it particularly useful for complex ICs where manual optimization is impractical. The invention aims to enhance design efficiency, reduce time-to-market, and improve overall IC performance.
4. The method of claim 1 , further comprising identified the plurality of layout patterns based on at least one of a driving load, a clock frequency or a data toggle rate of each of the plurality of layout patterns.
This invention relates to optimizing integrated circuit (IC) layout design by identifying and analyzing layout patterns based on their electrical characteristics. The method involves evaluating multiple layout patterns within an IC design to determine their suitability for specific applications. The key innovation is the ability to identify these patterns based on their driving load, clock frequency, or data toggle rate, which are critical factors in determining power consumption, performance, and signal integrity. By analyzing these parameters, the method enables designers to select or modify layout patterns to meet performance targets while minimizing power dissipation and improving reliability. The approach can be applied during the design phase to optimize standard cell libraries, memory arrays, or custom analog blocks, ensuring that the final IC meets its operational requirements efficiently. This technique is particularly useful in high-performance computing, mobile devices, and low-power applications where precise control over layout characteristics is essential for achieving desired performance and energy efficiency. The method leverages computational analysis to automate pattern identification, reducing manual effort and improving design accuracy.
5. The method of claim 1 , wherein the selecting the plurality of layout patterns comprises selecting the plurality of layout patterns from a look up table.
This invention relates to a method for selecting layout patterns in integrated circuit design, addressing the challenge of efficiently optimizing circuit layouts for performance and manufacturability. The method involves selecting a plurality of layout patterns from a predefined look-up table, which stores optimized pattern configurations. These patterns are chosen based on specific design constraints, such as performance requirements, power consumption, or manufacturing rules. The selected patterns are then integrated into the circuit layout to enhance efficiency and reliability. The look-up table serves as a repository of pre-validated patterns, reducing the need for iterative design adjustments and speeding up the overall design process. This approach ensures that the chosen patterns meet predefined criteria, improving the accuracy and consistency of the final circuit layout. The method is particularly useful in advanced semiconductor manufacturing, where precise pattern selection is critical for yield and performance optimization. By leveraging a look-up table, the method streamlines the design workflow, minimizing errors and enhancing productivity.
6. A system, comprising: a computer readable medium configured to store instructions; a processor connected to the computer readable medium, wherein the processor is configured to execute the instructions for: determining, according to at least one parameter of a cell in a semiconductor device, a plurality of layout patterns that meets an electromigration (EM) rule; selecting a layout pattern of the plurality of layout patterns that meet the EM rule having a smallest physical size, wherein the selected layout pattern includes a via pillar structure; and including, in a design file, the layout pattern indicating the via pillar structure.
This invention relates to semiconductor device design, specifically addressing electromigration (EM) reliability in integrated circuits. Electromigration is a critical failure mechanism where metal atoms migrate due to high current density, leading to voids and circuit failures. The invention provides a system to optimize metal interconnect layouts to comply with EM rules while minimizing physical size. The system includes a processor and a computer-readable medium storing instructions for layout optimization. The processor determines multiple layout patterns for a semiconductor cell that satisfy EM rules based on parameters such as current density, material properties, and geometric constraints. From these patterns, the system selects the one with the smallest physical footprint, ensuring efficient use of chip area. The selected layout includes a via pillar structure, which enhances electrical connectivity and reliability. The optimized pattern is then incorporated into a design file for further fabrication steps. By automating the selection of EM-compliant, compact layouts, the system improves design efficiency and reduces the risk of electromigration-induced failures in semiconductor devices. The focus on minimizing size while maintaining reliability is particularly valuable for advanced nodes where space constraints are critical.
7. The system of claim 6 , wherein the parameter of the cell comprises a driving load.
A system for managing cellular communication networks addresses the challenge of optimizing network performance by dynamically adjusting parameters of individual cells. The system monitors and controls a parameter of a cell, such as a driving load, to improve efficiency and reliability. The driving load parameter influences the cell's operational behavior, including power consumption, signal strength, and resource allocation. By dynamically adjusting this parameter, the system ensures that the cell operates within optimal conditions, reducing energy waste and enhancing service quality. The system may also integrate with other network management functions, such as load balancing and interference mitigation, to further optimize performance. This approach allows for real-time adaptation to varying network demands, improving overall network stability and user experience. The system is particularly useful in dense urban environments or high-traffic areas where efficient resource management is critical. By focusing on the driving load parameter, the system ensures that cells operate at peak efficiency while maintaining compliance with regulatory and operational standards.
8. The system of claim 6 , wherein the parameter of the cell comprises at least one of a clock frequency, a data toggle rate, an operating voltage or a temperature.
This invention relates to a system for optimizing performance in electronic devices, particularly in integrated circuits or memory cells. The system addresses the challenge of efficiently managing power consumption and performance by dynamically adjusting key operational parameters of a cell. These parameters include clock frequency, data toggle rate, operating voltage, and temperature. By monitoring and controlling these factors, the system ensures optimal operation under varying conditions, improving energy efficiency and reliability. The system likely integrates sensors or monitoring modules to track real-time conditions and adjust parameters accordingly, ensuring the cell operates within desired performance thresholds while minimizing power usage. This approach is particularly useful in high-performance computing, mobile devices, and other applications where power efficiency and thermal management are critical. The invention builds on prior systems by expanding the range of adjustable parameters, allowing for more granular control over cell performance. The dynamic adjustment mechanism helps maintain stability and efficiency across different operating scenarios, reducing the risk of overheating or excessive power draw.
9. The system of claim 6 , wherein the processor is configured to execute the instructions for performing a placement and routing process using an automatic placement and routing (APR) tool.
The system relates to electronic design automation (EDA) for integrated circuit (IC) design, specifically addressing the challenge of optimizing the physical layout of IC components. The system includes a processor and memory storing instructions for executing an automatic placement and routing (APR) process. The APR tool automatically arranges circuit components (placement) and connects them with conductive paths (routing) to meet design constraints such as timing, power, and area. The system may also include a user interface for inputting design specifications and a database for storing design rules and component libraries. The APR tool uses algorithms to minimize signal delays, reduce power consumption, and avoid physical conflicts between components. The system may further include verification modules to check the design for errors before fabrication. This approach improves efficiency by automating the complex and time-consuming manual layout process, reducing human error and accelerating IC development.
10. The system of claim 6 , wherein the computer readable medium is configured to store the plurality of layout patterns in a look up table.
A system for optimizing integrated circuit (IC) layout design stores multiple layout patterns in a lookup table to improve efficiency and accuracy. The system addresses the challenge of efficiently generating and managing layout patterns for IC designs, which is critical for reducing design time and improving manufacturability. By storing patterns in a lookup table, the system enables rapid retrieval and reuse of pre-validated layouts, minimizing redundant design efforts and enhancing consistency across different IC designs. The lookup table allows for quick access to standardized patterns, which can be selected and integrated into new designs based on specific requirements. This approach reduces the need for manual pattern generation, lowers the risk of errors, and ensures compliance with design rules and manufacturing constraints. The system may also include a processor that executes instructions to generate or modify layout patterns, further automating the design process. The lookup table can be dynamically updated with new patterns as needed, ensuring the system remains adaptable to evolving design requirements. This method improves overall design efficiency, reduces time-to-market, and enhances the reliability of IC manufacturing.
11. The system of claim 10 , wherein the computer readable medium is configured to store each of the plurality of layout patterns in the look up table associated with a corresponding at least one of a driving load, a clock frequency, a data toggle rate, an operating voltage or a temperature.
This invention relates to a system for optimizing integrated circuit (IC) design by dynamically selecting layout patterns based on operating conditions. The system addresses the challenge of balancing performance, power efficiency, and reliability in ICs by adapting layout configurations in real-time to varying conditions such as driving load, clock frequency, data toggle rate, operating voltage, and temperature. The system includes a lookup table storing multiple layout patterns, each associated with specific operating parameters. These patterns define physical configurations of circuit elements, such as transistor sizes, interconnect routing, or buffer placements, tailored to different performance and power requirements. By referencing the lookup table, the system selects the optimal layout pattern for current conditions, ensuring efficient operation under varying loads, frequencies, or environmental factors. The system dynamically adjusts the layout to maintain performance while minimizing power consumption or thermal effects. For example, under high clock frequencies, a layout pattern with optimized signal integrity may be chosen, while at lower frequencies, a power-efficient pattern may be selected. The lookup table enables rapid pattern selection without redesigning the circuit, improving adaptability and reducing design complexity. This approach enhances IC performance across diverse operating scenarios, making it suitable for applications requiring dynamic power management, such as mobile devices, high-performance computing, or adaptive hardware systems. The system integrates with existing design tools, allowing seamless integration into the IC development workflow.
12. A method, comprising: receiving a layout design; receiving a plurality of layout patterns, wherein each layout pattern of the plurality of layout patterns includes a via pillar structure; determining whether a driving load of a via pillar structure of a first layout pattern of the plurality of layout patterns meets an electromigration (EM) rule; determining whether a driving load of a via pillar structure of a second layout pattern of the plurality of layout patterns meets the EM rule; replacing the first layout pattern with the second layout pattern in response to a physical size of the second layout pattern being less than a physical size of the first layout pattern; updating the layout design to include the second layout pattern.
This invention relates to semiconductor layout design optimization, specifically addressing electromigration (EM) reliability in via pillar structures. Electromigration is a critical issue in integrated circuits where high current density can cause material degradation over time, leading to failures. The invention provides a method to improve EM compliance while reducing physical layout size. The method involves receiving a layout design and a set of layout patterns, each containing via pillar structures. For each pattern, the method evaluates whether the driving load of the via pillar meets predefined EM rules, which define acceptable current density limits. If a first pattern fails the EM check, the method compares it to a second pattern that passes the EM check. If the second pattern is physically smaller, it replaces the first pattern in the layout design. This ensures EM compliance while minimizing layout area, which is crucial for high-density semiconductor designs. The process iterates through multiple patterns, systematically replacing non-compliant, larger patterns with compliant, smaller alternatives. This optimization reduces the risk of electromigration failures while improving chip efficiency by conserving space. The method is particularly useful in advanced semiconductor manufacturing where EM reliability and layout density are critical.
13. The method of claim 12 , wherein the receiving the plurality of layout patterns comprises receiving the plurality of layout patterns from a computer readable medium.
The invention relates to a method for processing layout patterns in semiconductor design, addressing the challenge of efficiently managing and utilizing layout patterns for integrated circuit fabrication. The method involves receiving a plurality of layout patterns, which may include geometric shapes, features, or configurations used in semiconductor manufacturing. These patterns are obtained from a computer-readable medium, such as a storage device or database, enabling digital access and manipulation. The method further includes analyzing the received patterns to extract relevant data, such as dimensions, positions, or relationships between features. This analysis may involve comparing the patterns to predefined criteria or standards to ensure compatibility with manufacturing processes. Additionally, the method may involve generating modified or optimized versions of the patterns based on the analysis, improving efficiency or performance in subsequent fabrication steps. The invention aims to streamline the handling of layout patterns, reducing errors and enhancing productivity in semiconductor design and production workflows.
14. The method of claim 12 , further comprising maintaining the first layout pattern in the layout design in response to the physical size of the second layout pattern being greater than the physical size of the first layout pattern.
This invention relates to integrated circuit layout design, specifically addressing the challenge of optimizing layout patterns to improve manufacturability and performance. The method involves analyzing layout patterns within a design to determine their physical sizes and adjusting the layout based on these measurements. When a second layout pattern is identified as larger than a first layout pattern, the first layout pattern is preserved in its original configuration to maintain design integrity. This ensures that smaller patterns are not inadvertently modified or removed during optimization processes, which could degrade circuit performance or functionality. The method may also include comparing the sizes of multiple layout patterns and selectively retaining or adjusting them based on predefined criteria, such as manufacturability rules or performance constraints. By maintaining the first layout pattern when the second is larger, the method prevents unintended modifications that could disrupt critical design features. This approach enhances the reliability and efficiency of integrated circuit manufacturing by preserving essential layout elements while optimizing the overall design.
15. The method of claim 12 , further comprising performing placement and routing using the updated layout design.
This invention relates to integrated circuit (IC) design, specifically improving the placement and routing process to optimize performance and reduce errors. The problem addressed is the inefficiency in traditional IC design workflows, where layout adjustments often require manual corrections or iterative rework, leading to delays and suboptimal designs. The method involves generating an initial layout design for an IC, which includes defining the physical arrangement of components and interconnects. This initial design is then analyzed to identify potential issues, such as congestion, timing violations, or power integrity problems. Based on this analysis, the layout design is updated to resolve these issues, ensuring compliance with design rules and performance constraints. A key aspect of the method is the automated adjustment of the layout, which may involve modifying component positions, rerouting interconnects, or optimizing power distribution. This updated layout is then used to perform placement and routing, ensuring that the final design meets all specified requirements. The process may include iterative refinement, where the layout is repeatedly analyzed and adjusted until an optimal solution is achieved. By automating these steps, the method reduces the need for manual intervention, speeds up the design process, and improves the overall quality of the IC layout. This approach is particularly useful in advanced node designs where precision and efficiency are critical.
16. The method of claim 15 , wherein the performing placement and routing comprises performing placement and routing using an automatic placement and routing (APR) tool.
The invention relates to electronic design automation (EDA), specifically methods for optimizing the placement and routing of integrated circuit (IC) designs. The problem addressed is the inefficiency and suboptimal results in traditional IC design processes, particularly in the placement and routing phase, which can lead to increased power consumption, signal integrity issues, and longer design cycles. The method involves using an automatic placement and routing (APR) tool to optimize the physical layout of an IC design. The APR tool automates the arrangement of circuit components and the routing of interconnects between them, ensuring that design constraints such as timing, power, and area are met. This automation reduces manual effort, improves design efficiency, and enhances overall performance. The method may also include generating a netlist representing the logical connections of the IC design, which is then used by the APR tool to perform placement and routing. The APR tool may employ algorithms to minimize wirelength, reduce congestion, and optimize signal integrity. Additionally, the method may involve verifying the design against specified constraints to ensure correctness before fabrication. By leveraging an APR tool, the method accelerates the IC design process, reduces errors, and improves the quality of the final layout, making it suitable for modern high-performance and low-power IC designs.
17. The method of claim 12 , wherein replacing the first layout pattern with the second layout pattern comprises reducing a number of vias in a via structure of the layout design.
Electronics design and manufacturing. This invention addresses the problem of optimizing integrated circuit (IC) layout designs by reducing the number of vias. Specifically, a method is disclosed for modifying a layout design. This modification involves replacing an existing layout pattern with a new layout pattern. The critical aspect of this replacement is that it results in a decrease in the quantity of vias within a via structure of the layout design. This reduction in vias can lead to improved manufacturing yield, reduced parasitic capacitance, and potentially smaller chip area.
18. The method of claim 12 , further comprising generating a look up table for storing the plurality of layout patterns.
A system and method for optimizing semiconductor layout design involves generating and storing a plurality of layout patterns to improve design efficiency and accuracy. The method includes analyzing a semiconductor layout to identify repetitive or reusable design elements, such as standard cells, logic gates, or interconnect structures. These elements are then extracted and stored in a lookup table, which serves as a reference database for future design iterations. The lookup table enables rapid retrieval and reuse of validated patterns, reducing design time and minimizing errors. By leveraging pre-verified patterns, the system ensures consistency and compliance with manufacturing constraints, such as design rules and process limitations. The lookup table may also include metadata, such as performance metrics or manufacturing yield data, to assist in pattern selection. This approach enhances productivity in semiconductor design by automating pattern reuse and reducing the need for redundant design work. The system is particularly useful in advanced node semiconductor manufacturing, where design complexity and precision requirements are high. The lookup table can be dynamically updated with new patterns as design requirements evolve, ensuring continuous improvement in the design process.
19. The method of claim 18 , wherein the generating the look up table comprises generating the look up table based on at least one of a driving load, a clock frequency, a data toggle rate, an operating voltage or a temperature.
A method for generating a lookup table in electronic systems, particularly for optimizing performance in integrated circuits or memory devices. The method addresses the challenge of efficiently managing power consumption and performance trade-offs under varying operating conditions. The lookup table is used to determine optimal settings for circuit parameters, such as timing, voltage, or power states, based on real-time or predicted conditions. The method involves creating a lookup table that accounts for multiple operational factors, including driving load, clock frequency, data toggle rate, operating voltage, and temperature. By considering these variables, the lookup table provides adaptive adjustments to ensure reliable and efficient operation. For example, under high-temperature conditions, the lookup table may recommend reduced clock frequencies to prevent overheating, while under heavy data toggle rates, it may adjust voltage levels to maintain stability. The lookup table can be precomputed or dynamically updated to reflect changing conditions, enabling real-time optimization of system performance and energy efficiency. This approach is particularly useful in applications where environmental or usage conditions vary significantly, such as in mobile devices, embedded systems, or high-performance computing.
20. The method of claim 18 , wherein the generating the look up table comprises generating the look up table based on a driving load of a via structure for a corresponding layout pattern of the plurality of layout patterns.
The invention relates to semiconductor manufacturing, specifically optimizing via structures in integrated circuits. The problem addressed is ensuring reliable electrical connections in complex layouts while minimizing manufacturing defects. The method involves generating a lookup table that maps specific layout patterns to optimized via structures. This lookup table is created by analyzing the driving load of each via structure, which refers to the electrical and mechanical stress it must withstand based on its layout pattern. By considering the driving load, the method ensures that the generated lookup table provides via structures that are both electrically efficient and mechanically robust for their intended use. The lookup table is then used to select the appropriate via structure during the design phase, improving yield and performance. The method may also include validating the lookup table by simulating or testing the via structures under different conditions to confirm their reliability. This approach reduces the need for manual design adjustments and speeds up the manufacturing process while maintaining high-quality connections.
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October 27, 2020
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