Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An electroconductive substrate, comprising: a base material; a foundation layer which is disposed on the base material and contains a catalyst and a resin; a trench formation layer disposed on the foundation layer; and an electroconductive pattern layer including metal plating, wherein: a trench including a bottom surface to which the foundation layer is exposed, and a lateral surface which includes a surface of the trench formation layer, is formed; the trench is at least partially filled with the electroconductive pattern layer; the catalyst is dispersed in the resin, as catalyst particles; the foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles containing a metal configuring the electroconductive pattern layer; and a gap is formed between at least a part of a lateral surface of the electroconductive pattern layer and the lateral surface of the trench.
This invention relates to an electroconductive substrate used in electronic devices, addressing challenges in forming precise and reliable conductive patterns on substrates. The substrate includes a base material, a foundation layer containing a catalyst and resin, a trench formation layer, and an electroconductive pattern layer with metal plating. A trench is formed through the trench formation layer, exposing the foundation layer at its bottom while the lateral surfaces of the trench are defined by the trench formation layer. The electroconductive pattern layer partially or fully fills the trench, with the catalyst dispersed as particles within the foundation layer. The foundation layer has a mixed region near the electroconductive pattern layer, containing metal particles from the plating process. A gap exists between at least part of the lateral surface of the electroconductive pattern layer and the trench's lateral surface. This design improves adhesion and conductivity while allowing precise pattern formation. The catalyst facilitates metal deposition, and the mixed region enhances bonding between the foundation and conductive layer. The gap ensures proper alignment and reduces defects during manufacturing. This structure is useful in printed circuit boards, flexible electronics, and other applications requiring fine conductive patterns.
2. The electroconductive substrate according to claim 1 , wherein a ratio of a thickness of the mixed region to a thickness of the foundation layer is 0.1 to 0.9.
This invention relates to an electroconductive substrate designed to improve electrical conductivity and structural integrity in electronic or energy storage applications. The substrate comprises a foundation layer and a mixed region. The foundation layer provides mechanical support and is typically made of a rigid or semi-rigid material, such as a polymer, ceramic, or metal. The mixed region, integrated with the foundation layer, contains a conductive material, such as carbon-based particles, metal nanoparticles, or conductive polymers, dispersed within a matrix. This mixed region enhances electrical conductivity while maintaining flexibility or adhesion to other components. The invention specifies that the ratio of the thickness of the mixed region to the thickness of the foundation layer must be between 0.1 and 0.9. This ratio ensures optimal balance between conductivity and mechanical stability. If the mixed region is too thin, conductivity may be insufficient, while an overly thick mixed region could compromise structural integrity. The substrate is particularly useful in applications requiring both electrical performance and durability, such as electrodes for batteries, sensors, or flexible electronics. The design allows for customization of the mixed region's composition and thickness to meet specific conductivity and mechanical requirements.
3. The electroconductive substrate according to claim 1 , wherein a width of the electroconductive pattern layer is 0.3 μm to 5.0 μm, and a ratio of the thickness of the electroconductive pattern layer to the width of the electroconductive pattern layer is 0.1 to 10.0.
This invention relates to an electroconductive substrate with a fine-patterned electroconductive layer, addressing the need for precise, high-resolution conductive patterns in applications like flexible electronics, sensors, and printed circuit boards. The substrate includes a base material and an electroconductive pattern layer formed on its surface. The electroconductive pattern layer has a width between 0.3 micrometers and 5.0 micrometers, ensuring fine feature resolution. Additionally, the thickness-to-width ratio of the electroconductive pattern layer is controlled within a range of 0.1 to 10.0, optimizing electrical conductivity while maintaining structural integrity. This design enables the fabrication of ultra-fine conductive traces without compromising performance, making it suitable for high-density electronic devices. The precise dimensional control of the pattern layer ensures consistent electrical properties and reliability in applications requiring miniaturization and flexibility. The invention improves upon existing conductive substrates by balancing fine patterning with robust electrical and mechanical characteristics.
4. The electroconductive substrate according to claim 1 , wherein surface roughness Ra of a surface of the electroconductive pattern layer on a side opposite to the bottom surface of the trench is less than or equal to 100 nm.
This invention relates to an electroconductive substrate with a patterned conductive layer, addressing the need for precise and smooth conductive features in microelectronic and semiconductor applications. The substrate includes a base material with a trench formed on its surface, and an electroconductive pattern layer deposited within the trench. The conductive layer has a surface roughness (Ra) of 100 nm or less on the side opposite the trench's bottom surface, ensuring high-quality electrical performance and reliability. The smooth surface minimizes signal loss, improves adhesion, and enhances compatibility with subsequent processing steps. The invention is particularly useful in applications requiring fine conductive patterns, such as printed circuit boards, sensors, and microelectromechanical systems (MEMS). The conductive layer may be formed using techniques like electroplating, sputtering, or chemical vapor deposition, depending on the material and desired properties. The low surface roughness is achieved through controlled deposition processes, surface polishing, or chemical-mechanical planarization (CMP). This refinement ensures consistent electrical conductivity and mechanical stability, addressing challenges in high-frequency signal transmission and miniaturized electronic devices.
5. The electroconductive substrate according to claim 1 , wherein the electroconductive pattern layer includes a blackened surface which configures a surface of the electroconductive pattern layer including a surface on a side opposite to the bottom surface of the trench, and surface roughness Ra of the blackened surface is 15 nm to 60 nm.
This invention relates to an electroconductive substrate with an improved electroconductive pattern layer. The substrate includes a base material with a trench formed on its surface, and an electroconductive pattern layer is formed within the trench. The electroconductive pattern layer has a blackened surface on its top side, opposite the trench bottom, with a controlled surface roughness (Ra) between 15 nm and 60 nm. The blackened surface enhances the substrate's functionality, likely improving optical properties, electrical conductivity, or adhesion. The trench structure allows precise patterning of the electroconductive layer, while the specified surface roughness range ensures optimal performance without excessive irregularities. This design is useful in applications requiring fine conductive patterns, such as printed circuit boards, sensors, or flexible electronics, where surface uniformity and conductivity are critical. The blackened surface may also reduce reflections or improve durability in high-precision devices. The invention focuses on optimizing the interface between the conductive layer and its environment, balancing smoothness and texture for reliable electrical and mechanical properties.
6. The electroconductive substrate according to claim 1 , further comprising: a protective film covering at least a part of a surface of the trench formation layer and the electroconductive pattern layer on a side opposite to the base material, wherein a refractive index of the protective film is greater than 1.0, and is less than a refractive index of the trench formation layer.
This invention relates to an electroconductive substrate with enhanced optical and protective properties. The substrate includes a base material, a trench formation layer on the base material, and an electroconductive pattern layer formed within trenches in the trench formation layer. The electroconductive pattern layer is electrically connected to the base material. The substrate further includes a protective film covering at least part of the surface of the trench formation layer and the electroconductive pattern layer on the side opposite the base material. The protective film has a refractive index greater than 1.0 but less than the refractive index of the trench formation layer. This configuration ensures optical compatibility while providing physical protection to the electroconductive pattern. The protective film prevents damage to the delicate electroconductive structures while maintaining optical performance, making the substrate suitable for applications requiring both electrical conductivity and optical transparency, such as touchscreens or flexible displays. The refractive index relationship between the protective film and the trench formation layer minimizes optical interference, ensuring clarity and functionality.
7. The electroconductive substrate according to claim 1 , wherein the electroconductive pattern layer forms a mesh-like pattern.
The invention relates to electroconductive substrates, specifically those with a patterned electroconductive layer designed to address issues such as signal interference, flexibility, and transparency in electronic applications. The substrate includes a base layer and an electroconductive pattern layer applied to it. The electroconductive pattern layer is structured to form a mesh-like configuration, which enhances electrical conductivity while maintaining optical transparency and mechanical flexibility. This mesh design allows for efficient signal transmission while minimizing material usage and reducing weight. The electroconductive material used in the pattern layer can be a metal, conductive polymer, or other suitable conductive substance, ensuring compatibility with various electronic devices. The mesh-like pattern improves performance in applications requiring both conductivity and transparency, such as touchscreens, flexible displays, and wearable electronics. The substrate's design also facilitates easier integration into complex electronic systems by providing a lightweight, durable, and efficient conductive layer. The mesh structure helps mitigate issues like signal distortion and electromagnetic interference, making it suitable for high-performance electronic components.
8. An electronic device, comprising: the electroconductive substrate according to claim 1 ; and an electronic component mounted on the electroconductive substrate.
The invention relates to an electronic device incorporating an electroconductive substrate and an electronic component mounted thereon. The electroconductive substrate is designed to provide enhanced electrical conductivity while maintaining structural integrity. It includes a base layer made of a non-conductive material, such as a polymer or ceramic, and a conductive layer applied to at least one surface of the base layer. The conductive layer is composed of a metal or metal alloy, such as copper, aluminum, or a conductive polymer, and is bonded to the base layer through a chemical or physical adhesion process. The substrate may also include additional layers, such as insulating or protective coatings, to improve durability and performance. The electronic component, which may be a semiconductor chip, resistor, capacitor, or other electronic element, is mounted on the conductive substrate using solder, conductive adhesive, or other mounting techniques. The device is particularly useful in applications requiring high electrical conductivity, such as power electronics, high-frequency circuits, or thermal management systems. The substrate's design ensures efficient heat dissipation and electrical signal transmission while providing mechanical support for the electronic component.
9. The electronic device according to claim 8 , further comprising: a connection portion disposed on the electroconductive pattern layer of the electroconductive substrate, wherein the electronic component is connected to the electroconductive substrate through the connection portion.
This invention relates to electronic devices with electroconductive substrates and integrated electronic components. The problem addressed is improving the connection between electronic components and electroconductive substrates to enhance reliability and performance. The device includes an electroconductive substrate with an electroconductive pattern layer, where an electronic component is mounted on the substrate. A connection portion is disposed on the electroconductive pattern layer to facilitate electrical and mechanical connection between the electronic component and the substrate. This connection portion ensures stable electrical conductivity and mechanical stability, reducing the risk of detachment or signal loss. The electroconductive substrate may be flexible or rigid, and the connection portion can be formed through processes like plating, printing, or deposition. The electronic component may be a sensor, processor, or other functional module, and the connection portion ensures proper interfacing with the substrate's conductive patterns. This design is particularly useful in compact or flexible electronic devices where reliable connections are critical.
10. The electronic device according to claim 8 , further comprising: an adhesion layer disposed on the electroconductive pattern layer of the electroconductive substrate; an insulating layer which is disposed on the trench formation layer and the adhesion layer, covers a surface of the trench formation layer on a side opposite to the foundation layer, and includes an opening portion to which a part of the adhesion layer is exposed; a UBM layer disposed on a surface of the adhesion layer which is exposed into the opening portion of the insulating layer; and a connection portion disposed on the UBM layer, wherein the electronic component is connected to the electroconductive substrate through the connection portion, the UBM layer, and the adhesion layer.
This invention relates to electronic devices with improved electrical connections between components and substrates. The problem addressed is ensuring reliable electrical and mechanical bonding in electronic devices, particularly where components are mounted on conductive substrates with complex structures. The device includes an electroconductive substrate with a foundation layer and an electroconductive pattern layer. A trench formation layer is disposed on the electroconductive pattern layer, creating a structured surface. An adhesion layer is applied directly onto the electroconductive pattern layer to enhance bonding. An insulating layer covers the trench formation layer and the adhesion layer, leaving part of the adhesion layer exposed through an opening. A UBM (under bump metallization) layer is deposited on the exposed adhesion layer, and a connection portion (such as a solder bump or conductive pillar) is formed on the UBM layer. The electronic component is electrically and mechanically connected to the substrate through this layered structure, ensuring robust and durable connections. The design improves adhesion and conductivity while maintaining structural integrity.
11. A display device, comprising: the electroconductive substrate according to claim 1 ; and a light emitting element mounted on the electroconductive substrate.
A display device includes an electroconductive substrate and a light-emitting element mounted on the substrate. The electroconductive substrate is designed to provide electrical conductivity while maintaining flexibility and durability. It consists of a base layer, a conductive layer, and a protective layer. The base layer is made of a flexible polymer material, such as polyimide, to support the structure. The conductive layer is formed from a metal or conductive polymer, ensuring electrical pathways for the light-emitting element. The protective layer, typically a transparent insulating material, shields the conductive layer from environmental damage while allowing light transmission. The light-emitting element, such as an organic light-emitting diode (OLED), is mounted on the conductive substrate to emit light when electrically activated. This configuration enables a flexible, lightweight display with efficient electrical conduction and robust protection, suitable for applications in foldable or rollable electronic devices. The combination of the conductive substrate and light-emitting element ensures reliable performance under mechanical stress while maintaining optical clarity.
12. The display device according to claim 11 , further comprising: a connection portion disposed on the electroconductive pattern layer of the electroconductive substrate, wherein the light emitting element is connected to the electroconductive substrate through the connection portion.
A display device includes a flexible electroconductive substrate with an electroconductive pattern layer and a light emitting element. The electroconductive pattern layer forms electrical circuits on the substrate, and the light emitting element is mounted on the substrate to emit light for display purposes. The device further includes a connection portion disposed on the electroconductive pattern layer, which electrically connects the light emitting element to the electroconductive substrate. This connection portion ensures reliable electrical contact between the light emitting element and the underlying conductive patterns, enabling proper operation of the display. The flexible nature of the substrate allows for bendable or foldable display applications, while the connection portion ensures durability and conductivity under mechanical stress. The invention addresses challenges in integrating light emitting elements with flexible substrates, particularly in maintaining stable electrical connections during repeated bending or folding. The connection portion may include conductive adhesives, solder joints, or other bonding techniques to secure the light emitting element while preserving electrical performance. This design is useful in flexible displays, wearable electronics, and other applications requiring deformable electronic components.
13. The display device according to claim 11 , further comprising: an adhesion layer disposed on the electroconductive pattern layer of the electroconductive substrate; an insulating layer which is disposed on the trench formation layer and the adhesion layer, covers a surface of the trench formation layer on a side opposite to the foundation layer, and includes an opening portion to which a part of the adhesion layer is exposed; a UBM layer disposed on a surface of the adhesion layer which is exposed into the opening portion of the insulating layer; and a connection portion disposed on the UBM layer, wherein the light emitting element is connected to the electroconductive substrate through the connection portion, the UBM layer, and the adhesion layer.
This invention relates to a display device with an improved connection structure for light emitting elements, addressing challenges in electrical and mechanical reliability in microLED displays. The device includes an electroconductive substrate with a foundation layer and a trench formation layer, where the trench formation layer has a pattern of trenches defining an electroconductive pattern layer. An adhesion layer is disposed on the electroconductive pattern layer to enhance bonding. An insulating layer covers the trench formation layer and the adhesion layer, with an opening exposing part of the adhesion layer. A UBM (under bump metallization) layer is formed on the exposed adhesion layer, and a connection portion is disposed on the UBM layer. The light emitting element is electrically and mechanically connected to the electroconductive substrate through this layered structure, ensuring stable electrical contact and robust adhesion. The design improves durability and performance by preventing delamination and ensuring reliable current flow between the light emitting element and the substrate. The insulating layer protects the underlying layers while allowing precise electrical connections through the opening. This configuration is particularly useful in high-density display applications where miniaturization and reliability are critical.
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December 15, 2020
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