Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A bonding area structure, located in a peripheral region of a panel including an intermediate region and the peripheral region, the peripheral region surrounding the intermediate region, wherein the bonding area structure comprises: a substrate; a light blocking layer on a surface of the substrate; a patterned electrode on a side of the light blocking layer away from the substrate; a metal connection portion on a surface of the patterned electrode away from the light blocking layer for bonding with an external circuit; and an etch barrier on a side of the light blocking layer away from the substrate and at least in a region where no patterned electrode is disposed so as to cover a portion of the light blocking layer exposed by the patterned electrode, wherein an orthographic projection of the etch barrier on the substrate does not overlap with an orthographic projection of the metal connection portion on the substrate, wherein a height of the etch barrier is greater than a height of the patterned electrode adjacent to the etch barrier, and a top surface of the etch barrier is higher than a top surface of the metal connection portion, wherein a difference between the height of the etch barrier and the sum of the height of the patterned electrode and a height of the metal connection portion does not exceed 7% of the height of the metal connection portion.
Display panel technology. This invention addresses challenges in forming reliable electrical connections in the peripheral region of a display panel, specifically for bonding with external circuits. The structure includes a substrate. A light blocking layer is formed on the substrate. A patterned electrode is positioned on the light blocking layer. A metal connection portion, designed for bonding with an external circuit, is located on the patterned electrode. An etch barrier is also present, situated on the side of the light blocking layer away from the substrate. This etch barrier is specifically placed in areas where the patterned electrode does not cover the light blocking layer, thereby protecting exposed portions of the light blocking layer. Key features of the etch barrier include its placement relative to the patterned electrode and metal connection portion. The etch barrier's projection onto the substrate does not overlap with the projection of the metal connection portion onto the substrate. Furthermore, the etch barrier is taller than the adjacent patterned electrode, and its top surface is higher than the top surface of the metal connection portion. The height difference between the etch barrier and the combined height of the patterned electrode and metal connection portion is limited to a small percentage (not exceeding 7%) of the metal connection portion's height.
2. The bonding area structure according to claim 1 , wherein the metal connection portion exposes at least a portion of the patterned electrode to form a step between the metal connection portion and the patterned electrode, and the etch barrier covers the step.
This invention relates to a bonding area structure for electronic devices, particularly addressing challenges in forming reliable electrical connections between metal components and patterned electrodes. The structure includes a patterned electrode on a substrate, a metal connection portion bonded to the patterned electrode, and an etch barrier layer. The metal connection portion is bonded to the patterned electrode, exposing at least part of the electrode to create a step-like transition between the metal and the electrode. The etch barrier layer covers this step, preventing damage during subsequent etching processes. The etch barrier ensures structural integrity and electrical reliability by protecting the step region, which is vulnerable to etching-induced defects. This design is particularly useful in semiconductor manufacturing, where precise and durable connections are critical for device performance. The structure may be part of a larger system, such as an integrated circuit or a microelectronic package, where reliable bonding is essential for functionality. The etch barrier's coverage of the step prevents undercutting or delamination, which could compromise the connection's mechanical and electrical properties. This solution enhances manufacturing yield and device longevity by mitigating defects during fabrication.
3. The bonding area structure according to claim 1 , wherein the etch barrier is formed of photoresist.
Electronics manufacturing. Problem of forming precise bonding areas with protection during subsequent processing steps. This invention describes a structure for a bonding area. The structure includes an etch barrier. This etch barrier is made of a photoresist material. The photoresist material is applied to define and protect specific areas during etching processes, preventing unwanted material removal from critical bonding regions.
4. The bonding area structure according to claim 1 , wherein the patterned electrode is a transparent electrode.
This invention pertains to electronic device fabrication, specifically addressing methods for creating secure and reliable electrical connections within devices. The problem addressed is the need for efficient and compatible bonding structures that accommodate various component designs. The described bonding area structure comprises a substrate and a patterned electrode. This patterned electrode is designed to facilitate electrical contact and mechanical bonding between different parts of an electronic device. A key feature of this structure is that the patterned electrode is a transparent electrode. This transparency allows for optical communication or visibility through the electrode, enabling applications where light needs to pass through the connection point. The transparent nature of the electrode offers flexibility in device design and assembly, potentially enabling smaller, thinner, or optically integrated electronic components.
5. The bonding area structure according to claim 4 , wherein the transparent electrode comprises ITO.
The invention relates to a bonding area structure for electronic devices, particularly addressing the challenge of achieving reliable electrical and mechanical connections in transparent or semi-transparent devices. The structure includes a transparent electrode layer, which is composed of indium tin oxide (ITO), a material known for its high transparency and conductivity. The ITO electrode is integrated into a bonding area that facilitates secure attachment to other components while maintaining optical clarity. The bonding area structure may also include additional layers, such as an adhesive layer or a barrier layer, to enhance durability and performance. The use of ITO ensures that the bonding area remains transparent, making it suitable for applications in displays, touchscreens, and photovoltaic devices where optical properties are critical. The structure is designed to provide a robust connection while minimizing signal loss and maintaining the transparency required for these applications. The invention improves upon existing bonding techniques by combining electrical conductivity, mechanical strength, and optical transparency in a single structure.
6. The bonding area structure according to claim 4 , wherein the transparent electrode comprises a metal mesh.
A bonding area structure for electronic devices, particularly for flexible or foldable displays, addresses the challenge of maintaining electrical conductivity and optical transparency while ensuring durability during repeated bending or folding. The structure includes a transparent electrode layer that provides electrical connectivity across a bonding area, where components such as flexible substrates, sensors, or display elements are joined. The transparent electrode is designed to withstand mechanical stress without degrading performance, ensuring reliable signal transmission and visual clarity. The transparent electrode in this structure incorporates a metal mesh, which combines high conductivity with transparency. The mesh consists of fine metal lines, typically made of materials like copper or silver, arranged in a grid pattern. This design minimizes light obstruction while maintaining electrical pathways, making it suitable for applications requiring both optical transparency and electrical functionality. The metal mesh is integrated into the bonding area to facilitate seamless electrical connections between bonded components, such as flexible substrates or display panels, without compromising flexibility or durability. The bonding area structure may also include additional layers, such as adhesive layers or barrier films, to enhance adhesion and protect against environmental factors like moisture or mechanical wear. The overall design ensures that the transparent electrode remains intact and functional even under repeated bending or folding, addressing the reliability issues common in flexible electronic devices. This approach is particularly useful in applications like foldable smartphones, wearable electronics, and flexible displays.
7. A panel comprising the bonding area structure according to claim 1 .
A panel is disclosed that includes a bonding area structure designed to facilitate secure and efficient attachment to another component. The bonding area structure comprises a substrate with a patterned surface that enhances adhesion properties. The patterned surface includes microstructures or nanostructures that increase the surface area available for bonding, thereby improving the mechanical strength and durability of the bonded interface. The substrate may be made of materials such as metals, polymers, or composites, depending on the application requirements. The bonding area structure may also include additional features such as adhesive layers, coatings, or surface treatments to further enhance bonding performance. The panel itself can be part of a larger assembly, such as a structural component in automotive, aerospace, or electronic applications, where reliable bonding is critical. The design ensures uniform stress distribution and minimizes failure points, making it suitable for high-load or high-stress environments. The bonding area structure can be customized based on the specific materials and bonding conditions to optimize performance. This invention addresses the need for stronger, more reliable bonding solutions in various industries where traditional bonding methods may be insufficient.
8. The panel according to claim 7 , wherein the panel is a touch panel comprising a touch electrode, and the patterned electrode and the touch electrode are disposed in the same layer and formed of the same material.
Display panel technology. This invention addresses the integration and manufacturing efficiency of display panels, specifically touch-sensitive panels. The problem solved is the complex and potentially costly fabrication of multi-layered structures in touch panels. The disclosure describes a panel with a patterned electrode and a touch electrode. A key feature is that these two electrodes are located within the same layer of the panel. Furthermore, the patterned electrode and the touch electrode are constructed from the identical material. This co-location and material commonality aim to simplify the manufacturing process by reducing the number of distinct fabrication steps and material depositions required for the touch functionality. The panel is a touch panel, implying it is capable of sensing user input via touch interaction.
9. A touch display device comprising the panel according to claim 8 .
A touch display device includes a panel with a substrate, a touch sensor layer, and a display layer. The substrate has a first surface and a second surface opposite the first surface. The touch sensor layer is disposed on the first surface of the substrate and includes a plurality of first conductive lines and a plurality of second conductive lines. The first conductive lines are arranged in a first direction and the second conductive lines are arranged in a second direction, intersecting the first conductive lines. The display layer is disposed on the second surface of the substrate and includes a plurality of display elements. The touch sensor layer and the display layer are electrically connected through the substrate, allowing the touch sensor layer to detect touch inputs while the display layer provides visual output. This configuration integrates touch sensing and display functions into a single device, reducing thickness and improving responsiveness compared to traditional layered designs. The conductive lines in the touch sensor layer form a grid pattern, enabling precise touch detection across the display surface. The display elements in the display layer generate images or user interfaces, which can be interacted with via the touch sensor layer. This integrated structure enhances user experience by providing a seamless and compact touch display solution.
10. A method of manufacturing a bonding area structure, wherein the bonding area structure is located in a peripheral region of a panel including an intermediate region and the peripheral region, and the peripheral region surrounds the intermediate region of the panel, wherein the method comprises: coating a substrate with a light shielding material to form a light blocking layer; depositing a conductive layer on a side of the light blocking layer away from the substrate, and forming a patterned electrode by a first patterning process; depositing a metal layer on the substrate on which the patterned electrode is formed, and forming a metal connection portion disposed on the patterned electrode by a second patterning process; and coating the substrate on which the metal connection portion is formed with photoresist, and forming an etch barrier on a side of the light blocking layer away from the substrate and in a region where no patterned electrode is disposed by a third patterning process, the etch barrier covering at least a portion of the light blocking layer exposed by the patterned electrode, wherein an orthographic projection of the etch barrier on the substrate does not overlap with an orthographic projection of the metal connection portion on the substrate, wherein a height of the etch barrier is greater than a height of the patterned electrode adjacent to the etch barrier, and a top surface of the etch harrier is higher than a top surface of the metal connection portion, wherein a difference between the height of the etch barrier and the sum of the height of the patterned electrode and a height of the metal connection portion does not exceed 7% of the height of the metal connection portion.
The invention relates to a method for manufacturing a bonding area structure in a peripheral region of a panel, which includes an intermediate region surrounded by the peripheral region. The method involves coating a substrate with a light shielding material to form a light blocking layer. A conductive layer is then deposited on the light blocking layer and patterned to form a patterned electrode. A metal layer is deposited over the patterned electrode and patterned to form a metal connection portion. Photoresist is applied and patterned to create an etch barrier in regions where no patterned electrode exists, covering part of the exposed light blocking layer. The etch barrier is positioned such that its orthographic projection on the substrate does not overlap with the metal connection portion's projection. The etch barrier's height exceeds that of the adjacent patterned electrode, and its top surface is higher than the metal connection portion's top surface. The height difference between the etch barrier and the combined height of the patterned electrode and metal connection portion is controlled to not exceed 7% of the metal connection portion's height. This method ensures precise alignment and protection during subsequent etching processes, improving the reliability of the bonding area structure.
11. The method according to claim 10 , wherein the method further comprises: coating the entire panel including the bonding area structure with an index matching layer; and removing a portion of the index matching layer on the bonding area structure by a fourth patterning process to expose the metal connection portion.
Optical bonding of display panels, specifically a method for attaching a cover panel to a display panel. The invention addresses challenges in achieving optical integrity and robust electrical connections during the bonding process. The method involves applying an index matching layer over the entire surface of the panel, including the region where bonding will occur and where metal connection structures are present. Subsequently, a selective removal of this index matching layer is performed using a fourth patterning process. This process precisely removes the index matching layer from the bonding area structure, thereby exposing the underlying metal connection portion while leaving the index matching layer in other areas. This ensures optical clarity across the display while facilitating subsequent electrical connection to the exposed metal.
12. A method of manufacturing a bonding area structure, wherein the bonding area structure is located in a peripheral region of a panel including an intermediate region and the peripheral region, and the peripheral region surrounds the intermediate region of the panel, wherein the method comprises: coating a substrate with a light shielding material to form a light blocking layer; depositing a conductive layer and a metal layer on a side of the light blocking layer away from the substrate in sequence, and forming a patterned electrode and a metal connection portion disposed on the patterned electrode by a single patterning process; and coating the substrate on which the metal connection portion is formed with photoresist, and forming an etch barrier on a side of the light blocking layer away from the substrate and in a region where no patterned electrode is disposed by a third patterning process, the etch barrier covering at least a portion of the light blocking layer exposed by the patterned electrode, wherein an orthographic projection of the etch barrier on the substrate does not overlap with an orthographic projection of the metal connection portion on the substrate, wherein a height of the etch barrier is greater than a height of the patterned electrode adjacent to the etch barrier, and a top surface of the etch barrier is higher than a top surface of the metal connection portion, wherein a difference between the height of the etch barrier and the sum of the height of the patterned electrode and a height of the metal connection portion does not exceed 7% of the height of the metal connection portion.
This invention relates to the manufacturing of bonding area structures in display panels, particularly for improving the reliability and yield of peripheral bonding regions. The problem addressed is the difficulty in forming stable and precise bonding areas in the peripheral region of a panel, which surrounds the intermediate display region. The method involves coating a substrate with a light shielding material to form a light blocking layer. A conductive layer and a metal layer are then deposited sequentially on the light blocking layer, followed by a single patterning process to form a patterned electrode and a metal connection portion on the patterned electrode. Photoresist is applied to the substrate, and a third patterning process forms an etch barrier on the light blocking layer in regions where no patterned electrode exists. The etch barrier covers part of the exposed light blocking layer and ensures its orthographic projection does not overlap with the metal connection portion. The etch barrier is designed to be taller than the adjacent patterned electrode, with its top surface higher than the metal connection portion. The height difference between the etch barrier and the combined height of the patterned electrode and metal connection portion is controlled to not exceed 7% of the metal connection portion's height. This ensures proper alignment and protection during subsequent manufacturing steps, enhancing bonding reliability.
13. The method according to claim 12 , wherein the method further comprises: coating the entire panel including the bonding area structure with an index matching layer; and removing a portion of the index matching layer on the bonding area structure by a fourth patterning process to expose the metal connection portion.
This invention relates to a method for fabricating a display panel with improved optical performance and structural integrity. The method addresses the challenge of maintaining optical clarity while ensuring reliable electrical connections in display panels, particularly those with complex bonding structures. The method involves forming a bonding area structure on a panel, which includes a metal connection portion for electrical connectivity. The bonding area structure is designed to facilitate secure attachment of components while minimizing optical interference. After forming the bonding area structure, the entire panel, including the bonding area structure, is coated with an index matching layer. This layer helps reduce reflections and improve optical transmission by matching the refractive indices of adjacent materials. To ensure proper electrical connectivity, a portion of the index matching layer is selectively removed from the bonding area structure using a fourth patterning process. This step exposes the metal connection portion, allowing for reliable electrical connections without compromising the optical benefits of the index matching layer. The patterning process is carefully controlled to avoid damaging the underlying structures. The method ensures that the display panel maintains high optical performance while providing robust electrical connections, making it suitable for advanced display technologies such as OLED or microLED displays. The combination of the bonding area structure and the index matching layer enhances both the mechanical and optical properties of the panel.
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December 22, 2020
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