Power Module and Manufacturing Method Thereof

1. A power module, comprising: a substrate comprising a first side, a second side and a conductive wire, wherein the first side and the second side are opposite to each other; a power device disposed on the substrate, wherein the power device is electrically connected with the conductive wire; a leading component disposed on the substrate and comprising a first horizontal portion and a vertical portion connected with each other, wherein the vertical portion is electrically connected with the conductive wire of the substrate, wherein the leading component comprises a first contact surface and a second contact surface, and the first contact surface and the second contact surface are non-coplanar; and at least one molding component disposed on the substrate and covering at least a portion of the substrate and at least a portion of the leading component, wherein the first contact surface and the second contact surface of the leading component are uncovered by the molding component, wherein the power module comprises a first surface and a first lateral side, the first contact surface of the leading component is located at the first surface of the power module, and the second contact surface of the leading component is located at the first lateral side of the power module.

2. The power module according to claim 1 , wherein the first contact surface of the leading component is located at the first horizontal portion of the leading component, and the second contact surface of the leading component is located at the vertical portion of the leading component.

3. The power module according to claim 1 , wherein the first contact surface and the second contact surface of the leading component are located at the first horizontal portion of the leading component.

4. The power module according to claim 3 , wherein the molding component at least partially covers the vertical portion of the leading component.

5. The power module according to claim 3 , wherein the conductive wire is disposed on the first side of the substrate, wherein the vertical portion of the leading component has an end connected to the first horizontal portion and the other end electrically connected with the conductive wire.

6. The power module according claim 3 , wherein the substrate further comprises a connection portion disposed on a lateral wall of the substrate, wherein the connection portion is electrically connected to the conductive wire, and the vertical portion of the leading component is connected with the connection portion of the substrate.

7. The power module according to claim 6 , wherein the conductive wire comprises a first wiring layer disposed on the first side of the substrate and a second wiring layer disposed between the first side and the second side of the substrate, wherein the connection portion is electrically connected to the second wiring layer.

8. The power module according to claim 6 , wherein the power module further comprises a second surface opposite to the first surface, and the vertical portion of the leading component comprises a third contact surface, wherein the third contact surface is uncovered by the molding component and located at the second surface of the power module.

9. The power module according to claim 6 , wherein the leading component further comprise a second horizontal portion, and the vertical portion has two ends connected with the first horizontal portion and the second horizontal portion, respectively.

10. The power module according to claim 9 , wherein the power module further comprises a second surface opposite to the first surface and the second horizontal portion of the leading component comprises a fourth contact surface, wherein the fourth contact surface is uncovered by the molding component and located at the second surface of the power module.

11. The power module according to claim 10 , wherein the second horizontal portion of the leading component further comprises a fifth contact surface, wherein the fifth contact surface is uncovered by the molding component and located at the first lateral side of the power module.

12. The power module according to claim 6 , wherein the vertical portion further comprises a bonding material holding recess, wherein the bonding material holding recess is matched and engaged with the lateral wall of the substrate and connected with the connection portion of the substrate.

13. The power module according to claim 1 , wherein the vertical portion further comprises at least one looking recess, wherein the locking recess is filled with the molding component.

14. The power module according to claim 1 , further comprising at least one conductive block disposed on one of the first contact surface and the second contact surface of the leading component to electrically connect the power module to a system board, thereby forming an accommodation space between the power module and the system board.

15. The power module according to claim 1 , further comprising a magnetic component disposed on the substrate and running through the substrate.

16. A power module, comprising: a substrate comprising a first side, a second side and a conductive wire, wherein the first side and the second side are opposite to each other; a power device disposed on the substrate, wherein the power device is electrically connected with the conductive wire; a leading component disposed on the substrate and comprising a first horizontal portion and a vertical portion connected with each other, wherein the vertical portion is electrically connected with the conductive wire of the substrate, wherein the leading component comprises a first contact surface and a second contact surface, and the first contact surface and the second contact surface are non-coplanar; and at least one molding component disposed on the substrate and covering at least a portion of the substrate and at least portion of the leading component, wherein the first contact surface and the second contact surface of the leading component are uncovered by the molding component.