11059742

Thermally Stable, Flexible Substrates for Electronic Devices

PublishedJuly 13, 2021
Assigneenot available in USPTO data we have
Technical Abstract

Patent Claims
10 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A substrate for use in or with electronic devices, wherein the substrate comprises: an organo-soluble polyimide film having an out of plane birefringence of less than about ±0.002, wherein the organo-soluble polyimide has a glass transition temperature greater than about 300° C. and is comprised of: an alicyclic dianhydride selected from the group consisting of: 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, and bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride; and at least one aromatic cardo diamine selected from the group consisting of 9,9-bis(4-aminophenyl)fluorene, 9,9-bis(4-amino-3-fluorophenyl)fluorene, and 9, 9-bis(4-amino-3-methylphenyl)fluorene; and wherein: the film is flexible and has a thickness of less than about 50 microns and a transmittance of greater than about 80% at about 400 nm to about 750 nm both before the film is heated and after the film is heated to 300° C. for no longer than 60 minutes.

2

2. The substrate of claim 1 , wherein the electronic device is a flat panel display, a lighting device, a photovoltaic device, or an input/output device.

3

3. The substrate of claim 1 , wherein the film has a thickness of at least 25 microns.

4

4. The substrate of claim 1 , wherein the film has a coefficient of thermal expansion of less than about 60 ppm/° C.

5

5. The substrate of claim 1 , wherein the polyimide further comprises an aromatic dianhydride.

6

6. The substrate of claim 1 , wherein the polyimide further comprises a non-cardo, aromatic diamine.

7

7. A substrate for use in or with electronic devices, wherein the substrate consists essentially of: a single polymer layer having a thickness of less than about 50 microns comprising: an organo-soluble polyimide having a glass transition temperature greater than about 300° C. and an out of plane birefringence of less than about ±0.002, wherein the organo-soluble polyimide comprises at least one alicyclic dianhydride selected from the group consisting of 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, and bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride; and at least one aromatic cardo diamine selected from the group consisting of 9,9-bis(4-aminophenyl)fluorene, 9,9-bis(4-amino-3-fluorophenyl)fluorene, and 9, 9-bis(4-amino-3-methylphenyl)fluorene; and a glass layer; wherein the single polymer layer has a transmittance of greater than about 80% at about 400 nm to about 750 nm both before and after it has been exposed to 300° C. for no longer than 60 minutes, and is flexible.

8

8. The substrate of claim 7 , wherein the single polymer layer has a thickness of at least 2 microns.

9

9. The substrate of claim 7 , wherein the glass layer has a thickness of at least 20 microns.

10

10. The substrate of claim 7 , wherein the single polymer layer has a coefficient of thermal expansion of less than about 60 ppm/° C.

Patent Metadata

Filing Date

Unknown

Publication Date

July 13, 2021

Inventors

Limin Sun
Dong Zhang
Jiaokai Jing
Frank W. Harris
Zhikuan Lu
Xiaoliang Zheng

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Cite as: Patentable. “THERMALLY STABLE, FLEXIBLE SUBSTRATES FOR ELECTRONIC DEVICES” (11059742). https://patentable.app/patents/11059742

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