Electronics Board Mounting System

1. An electronic device comprising: an enclosure including a first cover and a second cover coupled to the first cover; an electronics board having a first side, a second side opposite the first side, and a conductive surface portion on the first side; and a mounting assembly to support the electronics board in the enclosure between the first cover and the second cover, the mounting assembly including an elastic support member coupled to the second side of the electronics board proximate to the conductive surface portion, the elastic support member including a first surface, a second surface, a through hole between the first surface and the second surface, and one or more deformable features extending radially on the first surface from the through hole.

2. The electronic device of claim 1 , wherein the elastic support member comprises a base portion coupled to the through hole and additional deformable features extending from the base portion toward the second side of the electronics board.

3. The electronic device of claim 1 , wherein the elastic support member comprises channels extending radially from the through hole.

4. The electronic device of claim 1 , further comprising: an additional elastic support member coupled to the first side of the electronics board and adjacent to the conductive surface portion.

5. The electronic device of claim 1 , further comprising: a grounding member coupled to the first side, the grounding member including a distal portion that projects towards the conductive surface portion to form at least a portion of a ground path from the conductive surface portion to the first cover.

6. The electronic device of claim 1 , wherein the one or more deformable features extend longitudinally along a portion of the through hole towards the second side of the electronics board.

7. The electronics device of claim 1 , wherein the first cover and the second cover at least partially form a Faraday cage around the electronics board.

8. The electronic device of claim 1 , wherein: the electronic device includes an ultrasonic imaging device; and the electronics board carries at least one processing device configured to generate one or more visual images based on ultrasonic signals received by the ultrasonic imaging device.

9. A mounting assembly for mounting an electronics board in an enclosure having a first cover and a second cover, the mounting assembly comprising: an elastic support member that is configured to be coupled to the electronics board, the elastic support member including a first surface, a second surface, a through hole between the first surface and the second surface, and a bushing portion that extends through a portion of the through hole, the bushing portion including one or more deformable features extending radially outward from the portion of the through hole.

10. The mounting assembly of claim 9 , wherein the through hole is configured to receive a fastening element to fasten the elastic support member between the electronics board and the second cover.

11. The mounting assembly of claim 9 , wherein the elastic support member comprises: a base portion coupled to the bushing portion; and additional deformable features extending from the base portion in an annular arrangement around the through hole.

12. The mounting assembly of claim 9 , wherein the elastic support member comprises channels extending radially from the through hole.

13. The mounting assembly of claim 9 , further comprising: an additional elastic support member that is configured to be coupled to the electronics board opposite to the elastic support member, the additional elastic support member including additional deformable features projecting toward the elastic support member.

14. The mounting assembly of claim 9 , further comprising: a grounding member that is configured to be coupled to the electronics board, the grounding member including a distal portion that projects towards the electronics board to at least partially form a ground path from the electronics board to the first cover.

15. The mounting assembly of claim 9 , wherein the elastic support member is configured to be coupled to the electronics board proximate to a conductive surface portion on the electronics board.

16. A mounting system to reduce shock and electromagnetic interference for an electronics board, the mounting system comprising: mounting assemblies to support the electronics board in an enclosure having a first cover and a second cover, at least one of the mounting assemblies including: a mounting feature; and an elastic support member coupled to the mounting feature, the elastic support member including a first surface, a second surface, a through hole between the first surface and the second surface, and one or more deformable features extending radially on the first surface from the through hole.

17. The mounting system of claim 16 , wherein the elastic support member comprises a base portion coupled to the through hole and additional deformable features extending from the base portion in an annular arrangement around the through hole.

18. The mounting system of claim 16 , wherein the elastic support member comprises channels extending radially from the through hole.

19. The mounting system of claim 16 , wherein the at least one of the mounting assemblies comprises an additional elastic support member that is configured to be coupled to the electronics board opposite to the elastic support member, the additional elastic support member including additional deformable features projecting toward the elastic support member.

20. The mounting system of claim 16 , wherein the at least one of the mounting assemblies comprises a grounding member that is configured to be coupled to the electronics board, the grounding member including a distal portion that projects towards the electronics board to at least partially form a ground path from the electronics board to the first cover.