Display Panel, Display Device and Manufacturing Method of Display Panel

1. A display panel comprising: a first substrate and a second substrate opposite to each other; a bonding portion bonding a first peripheral region of the first substrate and a second peripheral region of the second substrate; a first protrusion disposed on the first peripheral region of the first substrate, wherein the first protrusion is embedded in the bonding portion; a driving circuit layer disposed between the first substrate and the first protrusion; a light emitting device disposed on a side of the first substrate facing the second substrate, the light emitting device comprising a first electrode, a light-emitting layer, and a second electrode sequentially disposed in a direction away from the first substrate, wherein a gap is located between the first electrode and the driving circuit layer and exposes the first substrate; and a pixel definition layer on the side of the first substrate facing the second substrate and located between the first substrate and the light emitting device, wherein the pixel definition layer has a first portion located between the driving circuit layer and the light-emitting layer, a second portion located between the first electrode and the light-emitting layer, and a third portion located between the first portion and the second portion and filling the gap and contacting the first substrate, and wherein the first portion extends beyond the second electrode in a direction toward the bonding portion.

2. The display panel according to claim 1 , further comprising: an encapsulation layer covering the light emitting device, wherein a projection of the bonding portion on the first substrate at least partially overlaps a projection of the encapsulation layer on the first substrate.

3. The display panel according to claim 2 , wherein a material of a portion, in contact with the bonding portion, of the encapsulation layer and a material of the bonding portion are either organic materials or inorganic materials.

4. The display panel according to claim 3 , wherein a projection of the second electrode on the first substrate overlaps a projection of the encapsulation layer on the first substrate.

5. The display panel according to claim 2 , further comprising a second protrusion provided in the second peripheral region of the second substrate, wherein the second protrusion is embedded in the bonding portion, and wherein a projection of the first protrusion on the first substrate does not overlap a projection of the second protrusion on the first substrate.

6. The display panel according to claim 1 , further comprising a second protrusion provided in the second peripheral region of the second substrate, wherein the second protrusion is embedded in the bonding portion, and wherein a projection of the first protrusion on the first substrate does not overlap a projection of the second protrusion on the first substrate.

7. The display panel according to claim 6 , wherein the first protrusion is arranged in a same layer as the pixel definition layer.

8. A display device comprising the display panel according to claim 1 .

9. A display device comprising the display panel according to claim 2 .

10. A display device comprising the display panel according to claim 3 .

11. A display device comprising the display panel according to claim 4 .

12. A display device comprising the display panel according to claim 6 .

13. A display device comprising the display panel according to claim 7 .

14. A method for manufacturing a display panel, the method comprising: providing a first substrate, wherein a first protrusion is disposed on a first peripheral region of the first substrate; forming a driving circuit layer and a first electrode on the first substrate, wherein a gap is provided between the first electrode and the driving circuit layer and exposes the first substrate; forming a pixel definition layer on the driving circuit layer, the first substrate, and first electrode; forming a light-emitting layer on the first electrode and a part of the pixel definition layer; forming a second electrode on the light-emitting layer, wherein the pixel definition layer has a first portion located between the driving circuit layer and the light-emitting layer, a second portion located between the first electrode and the light-emitting layer, and a third portion located between the first portion and the second portion and filling the gap and contacting the first substrate, and wherein the first portion extends beyond the second wherein the first electrode, the light-emitting layer, and the second electrode form a light emitting device; electrode in a direction toward the bonding portion; providing a second substrate; forming a bonding material on at least one of the first peripheral region of the first substrate and a second peripheral region of the second substrate; and bonding the first substrate and the second substrate so that the bonding material forms a bonding portion bonding the first peripheral region and the second peripheral region, wherein the first protrusion is embedded in the bonding portion.

15. The method of claim 9 , wherein providing the first substrate comprises: forming an encapsulation layer covering a the light emitting device, wherein a projection of the bonding portion on the first substrate at least partially overlaps a projection of the encapsulation layer on the first substrate.

16. The method according to claim 15 , wherein forming the pixel definition layer comprises: forming a first electrode and a driving circuit layer on the first substrate; disposing a pixel definition material layer on the first electrode, the first substrate, and the driving circuit layer; and patterning the pixel definition material layer to form the pixel definition layer and the first protrusion, wherein the pixel definition layer covers a surface of the first substrate between the first electrode and the driving circuit layer, a part of an upper surface of the first electrode, and a part of an upper surface of the driving circuit layer.