Display Panel

1. A display panel comprising: a first substrate having a top surface and a side surface, the top surface including a display area and a non-display area outside the display area; a second substrate facing the first substrate; a first insulating structure disposed between the second substrate and the first substrate, wherein the first insulating structure overlaps the non-display area without overlapping the display area; an organic light emitting diode between the first substrate and the second substrate and overlapping the display area; a thin film encapsulation layer on the organic light emitting diode; a signal line having a side surface substantially aligned with the side surface of the first substrate, wherein the signal line is disposed on the first substrate; a second insulating structure overlapping the signal line and disposed between the first substrate and the first insulating structure, wherein the second insulating structure has a side surface substantially aligned with the side surface of the first substrate; and a connection pad being in contact with the side surface of the signal line, wherein the second insulating structure includes an organic layer overlapping the signal line and the non-display area without overlapping the display area, and wherein the first insulating structure and the second insulating structure are disposed on the thin film encapsulation layer.

2. The display panel of claim 1 , wherein the second substrate is spaced apart from the thin film encapsulation layer.

3. A display panel comprising: a first substrate having a top surface and a side surface, the top surface including a display area and a non-display area outside the display area; a second substrate facing the first substrate; a first insulating structure disposed between the second substrate and the first substrate, wherein the first insulating structure overlaps the non-display area without overlapping the display area; an organic light emitting diode between the first substrate and the second substrate and overlapping the display area; a thin film encapsulation layer on the organic light emitting diode; a signal line having a side surface substantially aligned with the side surface of the first substrate, wherein the signal line is disposed on the first substrate; a pixel defining layer on the first substrate; a second insulating structure overlapping the signal line and disposed between the first substrate and the first insulating structure, wherein the second insulating structure has a side surface substantially aligned with the side surface of the first substrate; and a connection pad being in contact with the side surface of the signal line, wherein the second insulating structure includes an organic layer overlapping the signal line and the non-display area without overlapping the display area, and wherein the first insulating structure and the second insulating structure are disposed on the pixel defining layer.

4. The display panel of claim 1 , further comprising a thin film transistor electrically connected to the organic light emitting diode, and wherein the signal line is disposed on substantially the same layer as a control electrode of the thin film transistor.

5. The display panel of claim 1 , further comprising a seal disposed between the first substrate and the second substrate and spaced apart from the organic layer of the second insulating structure.

6. A display panel comprising: a first substrate having a top surface and a side surface, the top surface including a display area and a non-display area outside the display area; a second substrate facing the first substrate; a first insulating structure disposed between the second substrate and the first substrate, wherein the first insulating structure overlaps the non-display area without overlapping the display area; an organic light emitting diode between the first substrate and the second substrate and overlapping the display area; a thin film encapsulation layer on the organic light emitting diode; a signal line having a side surface substantially aligned with the side surface of the first substrate, wherein the signal line is disposed on the first substrate; a second insulating structure overlapping the signal line and disposed between the first substrate and the first insulating structure, wherein the second insulating structure has a side surface substantially aligned with the side surface of the first substrate; a floating electrode overlapping the signal line and the second insulating structure, and a connection pad being in contact with the side surface of the signal line, wherein the second insulating structure includes an organic layer overlapping the signal line and the non-display area without overlapping the display area, and wherein the floating electrode is disposed between the signal line and the organic layer of the second insulating structure.

7. The display panel of claim 6 , wherein the floating electrode contacts the connection pad.

8. The display panel of claim 6 , further comprising a thin film transistor electrically connected to the organic light emitting diode, and wherein the floating electrode is disposed on substantially the same layer as an input electrode or an output electrode of the thin film transistor.

9. The display panel of claim 1 , further comprising a circuit substrate electrically connected to the connection pad.

10. The display panel of claim 1 , wherein the signal line comprises copper, and the connection pad comprises silver paste.

11. The display panel of claim 1 , wherein the second insulating structure contacts the first insulating structure.

12. The display panel of claim 1 , wherein the connection pad contacts the side surface of the first substrate and the side surface of the second insulating structure.