Separate Inter-Die Connectors for Data and Error Correction Information and Related Systems, Methods, and Apparatuses

1. An apparatus, comprising: a master die; a target die including data storage elements; inter-die data connectors electrically coupling the master die to the target die, the inter-die data connectors configured to conduct write data bits from the master die to the target die, the write data bits to be written to the data storage elements; and inter-die error correction connectors electrically coupling the master die to the target die, the inter-die error correction connectors separate from the inter-die data connectors, the inter-die error correction connectors configured to conduct error correction information corresponding to the write data bits from the master die to the target die, wherein the target die comprises error correction circuitry configured to: generate new error correction information responsive to the write data bits received from the master die; and provide error information to the master die if the new error correction information does not match the error correction information received from the master die.

2. The apparatus of claim 1 , wherein at least a portion of the inter-die data connectors and the inter-die error correction connectors comprises through-silicon-vias (TSVs).

3. The apparatus of claim 1 , wherein at least a portion of the inter-die data connectors and the inter-die error correction connectors comprises wire bonds.

4. The apparatus of claim 1 , wherein the inter-die error correction connectors comprise two inter-die connectors for every eight inter-die connectors of the inter-die data connectors.

5. The apparatus of claim 1 , wherein the error correction information comprises cyclic redundancy check (CRC) bits.

6. The apparatus of claim 1 , wherein the error correction information comprises two error correction bits for every sixteen write data bits.

7. The apparatus of claim 1 , further comprising control circuitry operably coupled to the master die, the control circuitry configured to receive the error information from the master die and repeat a write operation responsive to the error information.

8. The apparatus of claim 1 , wherein the error correction circuitry of the target die is further configured to: receive read data from the data storage elements; generate error correction information corresponding to the read data; and provide the error correction information to be transmitted to the master die.

9. The apparatus of claim 1 , wherein: the inter-die data connectors are also configured to conduct read data bits read from the data storage elements from the target die to the master die; and the inter-die error correction connectors are configured to conduct read error correction information determined based on the read data bits by the target die from the target die to the master die.

10. The apparatus of claim 1 , wherein the master die includes clock circuitry configured to clock target data shift registers of the target die to shift the write data bits from the master die to the target die via the inter-die data connectors in two bursts of eight bits each for every nine clock cycles of a clock provided to the clock circuitry.

11. The apparatus of claim 10 , wherein the clock circuitry is further configured to clock target error shift registers of the target die to shift the error correction information from the master die to the target die via the inter-die error correction connectors in a single burst of two bits for every nine clock cycles of the clock.

12. An apparatus, comprising: a master die; a target die including data storage elements and error correction circuitry, the error correction circuitry configured to generate error correction information based on read data bits read from the data storage elements by the target die; inter-die data connectors electrically coupling the master die to the target die, the inter-die data connectors configured to conduct the read data bits from the target die to the master die; and inter-die error correction connectors electrically coupling the master die to the target die, the inter-die error correction connectors separate from the inter-die data connectors, the inter-die error correction connectors configured to conduct the error correction information from the target die to the master die; wherein the target die includes clock circuitry configured to trigger the master die to obtain the read data bits from the target die via the inter-die data connectors.

13. The apparatus of claim 12 , wherein the clock circuitry is further configured to trigger the master die to obtain the error correction information from the target die via the inter-die error correction connectors.

14. The apparatus of claim 13 , wherein the clock circuitry is configured to trigger the master die to obtain the error correction information once for every nine clock cycles to shift a single burst of two bits of the error correction information every nine clock cycles to the master die.

15. A computing system comprising a memory device, the memory device comprising: a stack of memory dies including a plurality of target dies, each of the plurality of target dies including data storage elements and error correction circuitry, the error correction circuitry of each of the plurality of target dies configured to generate error correction information corresponding to read data bits read from the data storage elements; control circuitry including error correction circuitry configured to generate error correction information corresponding to write data bits to be written to the data storage elements of one of the plurality of target dies; a master die configured to serve as an interface between the control circuitry and each of the plurality of target dies; inter-die data connectors operably coupling the master die to each of the plurality of target dies, the inter-die data connectors configured to conduct the write data bits from the master die to the plurality of target dies and the read data bits from the plurality of target dies to the master die; and inter-die error correction connectors separate from the inter-die data connectors, the inter-die error correction connectors operably coupling the master die to each of the plurality of target dies, the inter-die error correction connectors configured to conduct the error correction information corresponding to the write data bits from the master die to the plurality of target dies and the error correction information corresponding to the read data bits from the plurality of target dies to the master die.

16. The computing system of claim 15 , further comprising: one or more processors operably coupled to the memory device; one or more non-volatile data storage devices operably coupled to the one or more processors; one or more input devices operably coupled to the one or more processors; and one or more output devices operably coupled to the one or more processors.

17. The computing system of claim 15 , wherein the inter-die error correction connectors include two of the inter-die error correction connectors for every eight of the inter-die data connectors.

18. A method of operating a stack of memory dies, the method comprising: receiving, by a master die of the stack of memory dies, write data bits and error correction information associated with the write data bits from control circuitry; conducting the write data bits to a target die of the stack of memory dies through inter-die data connectors; conducting the error correction information associated with the write data bits to the target die through inter-die error correction connectors; generating, by the target die, new error correction information associated with the write data bits received by the target die from the master die; comparing, by the target die, the error correction information received from the master die to the new error correction information; generating error information responsive to a determination that the error correction information received from the master die is different from the new error correction information; and writing the write data bits to data storage elements of the target die responsive to a determination that the error correction information received from the master die matches the new error correction information.

19. A method of operating a stack of memory dies, the method comprising: reading read data bits from data storage elements of a target die of the stack of memory dies; generating, by the target die, error correction information associated with the read data bits; conducting the read data bits to a master die of the stack of memory dies through inter-die data connectors; conducting the error correction information associated with the read data bits to the master die through inter-die error correction connectors; providing, by the master die, the read data bits and the associated error correction information to control circuitry; generating, by the control circuitry, new error correction information associated with the read data bits provided by the master die; and comparing the error correction information received from the master die to the new error correction information.

20. The method of claim 19 , further comprising: repeating a read operation if the error correction information received from the master die does not match the new error correction information.