Legal claims defining the scope of protection, as filed with the USPTO.
2. The electronic device of claim 1, wherein the antenna includes an antenna array to be used for forming a beam corresponding to 5th generation communication.
3. The electronic device of claim 1, wherein the plating member includes a first plating member, a second plating member and a third plating member.
4. The electronic device of claim 3, wherein a portion of the first plating member and a portion of the second plating member are attached to an outer side of the third surface, and a portion of the third plating member is attached to an inner side of the third surface.
5. The electronic device of claim 4, wherein the first plating member, the second plating member and the third plating member comprise a ‘≤’ shape.
8. The electronic device of claim 1, wherein a first pad electrically connected to the first connection terminal of the first circuit board is formed on a lower portion of the first via and the second via.
9. The electronic device of claim 1, wherein a second pad electrically connected to the second connection terminal of the second circuit board is formed on an upper portion of the first via and the second via.
10. The electronic device of claim 1, wherein the interposer is separated through at least one slit.
11. The electronic device of claim 1, wherein the interposer comprises a ground region surrounding at least a part of the first via and the second via.
13. The electronic device of claim 12, wherein the antenna array is used for forming the beam corresponding to 5th generation communication.
14. The electronic device of claim 12, wherein the first plating member, the second plating member and the third plating member comprise a ‘≤’ shape.
18. The electronic device of claim 12, wherein the interposer is separated through at least one slit.
19. The electronic device of claim 12, wherein a second pad electrically connected to the second connection terminal of the second circuit board is formed on an upper portion of the first via and the second via.
20. The electronic device of claim 12, wherein the interposer comprises a ground region surrounding at least a part of the first via and the second via.
21. The electronic device of claim 12, wherein the third portion of the plating member is adjacent to and provided on an outside of the second via.
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October 25, 2022
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